Stacked crystal optocoupler packaging structure

Abstract

The utility model relates to the technical field of stacked crystal optocouplers, in particular to a stacked crystal optocoupler packaging structure. By arranging the first insulating colloid for fixing the relative positions of the plurality of pins before the photosensitive chip is installed, the plurality of pins are relatively fixed under the action of the first insulating colloid, so that the positions of the plurality of pins are relatively firmer and more stable in the subsequent production process, the yield of each process is improved, and the production efficiency is improved. The cost is lower than that of an existing mode, the second insulating colloid used for fixing the relative positions among the photosensitive chip, the light-emitting body, the light-transmitting body and the plurality of pins after wire bonding is arranged in the light-shielding colloid, further reinforcement of the relative positions of all the elements is achieved, and the stability of a finished product is improved; the problems that the stability between the input end and the output end pin of an existing optocoupler is relatively low and the cost is relatively high due to the fact that the stability between the input end and the output end pin of the optocoupler is improved by adding a connecting block procedure are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of stacked crystal photoelectric coupling, in particular to a stacked crystal photoelectric coupling packaging structure. BACKGROUND

[0002] In the application of the accumulation photoelectric coupling, all the LEDs of the accumulation photoelectric coupling are horizontal structure bottom light emitting chips, in order to realize the electrical connection of the LED, the positive and negative poles of the LED need to be connected from the output end to the inner lead of the input end, since the lead frame input end and the output end are not supported by the connecting rib, it will cause poor mechanical strength after bonding, and the fracture phenomenon is easy to occur, the current industry method is to fix the input end and the output end by using the connecting block, and since the length of the connecting block is too long, it is easy to cause the corner in the die bonding process, which causes poor stability, and at the same time, an additional process of fixing the connecting block is needed, so the manufacturing cost and the labor cost will be increased. CONTENT OF THE UTILITY MODEL

[0003] In view of the defects of the prior art, the utility model provides a stacked crystal photoelectric coupling packaging structure, which solves the problems of relatively low stability and relatively high cost of the existing photoelectric coupling by increasing the connecting block process to increase the stability between the input end and the output end lead of the photoelectric coupling.

[0004] To achieve the above purpose, the utility model provides the following technical scheme:

[0005] A stacked crystal photoelectric coupling packaging structure comprises a plurality of pins for conducting electricity, at least one pin is electrically connected with a photosensitive chip, a luminescent body cooperating with the photosensitive chip to emit light is arranged above the photosensitive chip, a light-transmitting body is arranged between the photosensitive chip and the luminescent body, and light-proof glue is used to package the photosensitive chip, the luminescent body, the light-transmitting body and the plurality of pins, and a first insulating glue body is arranged in the light-proof glue to fix the relative positions of the plurality of pins before the photosensitive chip is installed.

[0006] A second insulating glue body is further arranged in the light-proof glue to fix the relative positions of the photosensitive chip, the luminescent body, the light-transmitting body and the plurality of pins after the wire bonding.

[0007] Preferably, the first insulating glue body is arranged in the gap between the plurality of pins.

[0008] Preferably, the photosensitive chip, the luminescent body, the light-transmitting body and the wire harness for conducting electricity are all located in the second insulating glue body.

[0009] Preferably, the center of the second insulating glue body is located at the center position of the light-proof glue, and is fixed relative to each pin.

[0010] Preferably, a plurality of glue grabbing holes are arranged on the pins and located in the light-proof glue.

[0011] Compared with the prior art, the stacked crystal optical coupling packaging structure has the following advantages

[0012] Beneficial effects:

[0013] 1. The first insulating glue body is arranged for fixing the relative positions of the plurality of pins before the photosensitive chip is installed, and the plurality of pins are fixed relatively by the first insulating glue body, so that the relative positions of the plurality of pins are more stable in the subsequent production process, thereby improving the yield of each process and reducing the cost.

[0014] 2. The second insulating glue body is arranged in the light-proof glue for fixing the relative positions of the photosensitive chip, the light emitter, the light transmitter and the plurality of pins after the welding line, thereby further reinforcing the relative positions of the elements and improving the stability of the finished product.

[0015] 3. The plurality of glue holes are arranged in the pins and located in the light-proof glue, so that the light-proof glue of the finished product optical coupling packaging can enter the glue holes, thereby further improving the relative stability of the positions of the plurality of pins by the light-proof glue solidified in the glue holes. BRIEF DESCRIPTION OF DRAWINGS

[0016] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and the description thereof are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 is a schematic view of the three-dimensional structure of the present application;

[0018] Figure 2 is a front view of the present application;

[0019] Figure 3 is a production process schematic view of the present application.

[0020] In the drawings: 1, pin; 2, photosensitive chip; 3, light emitter; 4, light transmitter; 5, light-proof glue; 6, first insulating glue body; 7, second insulating glue body; 8, glue hole. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below with reference to the drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0022] In order to solve the problems of the existing optical coupling that the stability is relatively low and the cost is relatively high by increasing the connection block process to increase the stability between the input end and the output end pins of the optical coupling, the present application provides a stacked crystal optical coupling packaging structure, as shown inFigure 1 and Figure 2 As shown in the figure, it comprises several pins 1 for conducting electricity, at least one pin 1 is electrically connected with a photosensitive chip 2, a light-emitting body 3 is arranged above the photosensitive chip 2 to cooperate with it to emit light, a light-transmitting body 4 is arranged between the photosensitive chip 2 and the light-emitting body 3, and it further comprises a light-proof glue 5 for packaging the photosensitive chip 2, the light-emitting body 3, the light-transmitting body 4 and the several pins 1, and a first insulating glue 6 is arranged in the light-proof glue 5 to fix the relative positions of the several pins 1 before the photosensitive chip 2 is installed. Through the effect of the first insulating glue 6, the several pins 1 are first fixed relatively, so that the relative positions of the several pins 1 are more stable in the subsequent production process, thereby improving the yield of each process.

[0023] In order to ensure the stability of the relative positions of the photosensitive chip 2, the light-emitting body 3, the light-transmitting body 4 and the several pins 1 in the finished product optical coupling, thereby greatly reducing the occurrence of wire breakage and the like, a second insulating glue 7 is further arranged in the light-proof glue 5 to fix the relative positions of the photosensitive chip 2, the light-emitting body 3, the light-transmitting body 4 and the several pins 1 after wire welding, thereby further reinforcing the relative positions of the elements and improving the stability of the finished product.

[0024] In order to prevent the first insulating glue 6 from overflowing onto the mounting surface of the several pins 1, the first insulating glue 6 is arranged in the gap between the several pins 1, so that the relative fixation of the several pins 6 can be realized, and the subsequent production process can be prevented from being affected.

[0025] In order to avoid the influence of the fixing effect caused by the partial elements located outside the second insulating glue 7, the photosensitive chip 2, the light-emitting body 3, the light-transmitting body 4 and the wire harness for conducting electricity are all located in the second insulating glue 7, and the elements are wrapped by the second insulating glue 7, thereby having the functions of protection and fixation.

[0026] In order to ensure the relative fixation of the second insulating glue 7 to the several pins 1 in the finished product optical coupling, the center of the second insulating glue 7 is located at the center position of the light-proof glue 5, and is relatively fixed with the several pins 1.

[0027] In order to further improve the fixing effect of the light-proof glue 5 to the several pins 1, a plurality of glue grabbing holes 8 are arranged on the pins 1 and located in the light-proof glue 5, so that the light-proof glue 5 of the packaged finished product optical coupling can enter the glue grabbing holes 8, thereby further improving the relative stability of the positions of the several pins 1 through the light-proof glue 5 solidified in the glue grabbing holes 8.

[0028] As shown in the figure, it is a production process flow diagram of the product, which shows the structural changes of the product in each process. Figure 3

[0029] ​It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0030] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A stacked photonic coupling package structure, comprising a plurality of pins (1) for conducting electricity, wherein at least one pin (1) is electrically connected with a photosensitive chip (2), a light emitter (3) is arranged above the photosensitive chip (2) to emit light in cooperation with the photosensitive chip (2), a light-transmitting body (4) is arranged between the photosensitive chip (2) and the light emitter (3), and a light-proof glue (5) is used to encapsulate the photosensitive chip (2), the light emitter (3), the light-transmitting body (4) and the plurality of pins (1), characterized in that, The light-proof glue (5) is provided with a first insulating glue (6) for fixing the relative positions of the pins (1) before the photosensitive chip (2) is installed. The light-proof glue (5) is further provided with a second insulating glue (7) for fixing the relative positions between the photosensitive chip (2), the light emitter (3), the light-transmitting body (4) and the pins (1) after the wire is welded.

2. The twin-junction light coupling package structure of claim 1, wherein, The first insulating glue (6) is arranged in the gap between the pins (1).

3. The twin-junction light coupling package structure of claim 1, wherein, The photosensitive chip (2), the light emitter (3), the light-transmitting body (4) and the wire harness for conducting electricity are all located in the second insulating glue (7).

4. The twin-junction light coupling package structure of claim 1, wherein, The center of the second insulating glue (7) is located at the center position of the light-proof glue (5) and is fixed relative to each pin (1).

5. The twin-junction light coupling package structure of claim 1, wherein, The pins (1) are all provided with a plurality of glue grabbing holes (8) located in the light-proof glue (5).

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