Eutectic welding clamp and eutectic welding equipment for laser

Abstract

The utility model discloses a laser eutectic welding clamp and eutectic welding equipment. The laser eutectic welding clamp comprises a heat conduction bottom plate, a limiting plate and a balancing weight. A plurality of product limiting grooves are formed in the heat conduction bottom plate, the limiting plate is installed above the heat conduction bottom plate, the limiting plate and the heat conduction bottom plate are connected through a plurality of supporting pieces, a plurality of limiting holes are formed in the limiting plate, the positions of the limiting holes are matched with the product limiting grooves, the balancing weight is of a columnar structure, and the balancing weight is movably arranged in the limiting holes in a penetrating mode. The axis direction of the balancing weight is perpendicular to the heat conduction bottom plate, and the end of the balancing weight can abut against a target product placed in the product limiting groove in the self-weight state. According to the eutectic welding device, the heating uniformity and the pressure applying stability can be improved, so that the eutectic welding efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing technology, and in particular to a laser eutectic bonding fixture and eutectic bonding equipment. Background Technology

[0002] Vacuum eutectic furnace welding is one method of eutectic welding for laser chips. This method requires customized independent fixtures to position the chip and apply a certain pressure. However, due to the different placement positions in the eutectic furnace, each independent fixture is heated differently, making it impossible to uniformly control the welding temperature and time of eutectic welding. Moreover, the stability of such independent fixtures in terms of counterweight fixation is not high, and they are prone to tipping over, resulting in unstable applied pressure, reducing the welding success rate, and increasing production costs. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a laser eutectic welding fixture and eutectic welding equipment, which can improve heating uniformity and pressure stability, thereby improving eutectic welding efficiency.

[0004] On one hand, this utility model embodiment provides a laser eutectic bonding fixture, comprising:

[0005] The heat-conducting base plate is equipped with multiple product limiting grooves;

[0006] A limiting plate is installed above the heat-conducting base plate. The limiting plate and the heat-conducting base plate are connected by multiple support members. The limiting plate is provided with multiple limiting holes, and the positions of the limiting holes are adapted to the product limiting groove.

[0007] The counterweight has a columnar structure and is movably inserted through the limiting hole. The axis of the counterweight is perpendicular to the heat-conducting base plate, and the end of the counterweight can abut against the target product placed in the product limiting groove under its own weight.

[0008] According to some embodiments of this utility model, the heat-conducting base plate is a graphite base plate.

[0009] According to some embodiments of this utility model, the heat-conducting base plate is a modular graphite base plate.

[0010] According to some embodiments of the present invention, the heat-conducting base plate is provided with mounting holes at its corners, and the support member is installed in the mounting holes.

[0011] According to some embodiments of this utility model, the product limiting groove is provided with symmetrical clearance holes on both sides of its opposite edges.

[0012] According to some embodiments of the present invention, a lead wire groove is provided on the adjacent side of the product limiting groove, and the lead wire groove is connected to the product limiting groove.

[0013] According to some embodiments of the present invention, the counterweight includes a main body and an abutment part connected to each other. The main body has a cylindrical structure, and the abutment part has a conical structure. The main body and the abutment part are coaxial.

[0014] According to some embodiments of the present invention, the abutting part is a heat insulation component; or, the abutting surface of the abutting part is provided with a heat insulation coating; or, the abutting part is equipped with a heat insulation component.

[0015] According to some embodiments of this utility model, the support member is a non-thermal conductive support member.

[0016] On the other hand, this utility model embodiment provides a eutectic welding device, including the above-mentioned laser eutectic welding fixture.

[0017] The embodiments of this utility model have at least the following beneficial effects:

[0018] During use, the heat-conducting base plate evenly conducts heat to the product limiting groove, so that the target product placed in the product limiting groove is heated evenly. The counterweight is inserted through the limiting hole, which can maintain the stability of the pressure under the limiting action of the limiting plate. In this way, by improving the uniformity of heating and the stability of pressure, the success rate of eutectic welding is improved, thereby improving the efficiency of eutectic welding.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the structure of the laser eutectic welding fixture according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure at position AA in the middle;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of the heat-conducting base plate of the laser eutectic welding fixture is shown;

[0024] Figure 4 for Figure 3 The center circle shows a magnified view of position B.

[0025] Figure label:

[0026] Heat-conducting base plate 100, product limiting groove 101, assembly hole 102, clearance hole 103, lead wire groove 104, limiting plate 200, limiting hole 201, support component 210, counterweight block 300, main body 310, and abutment part 320. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first," "second," etc., are used in the description, they are only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0030] In the description of this utility model, unless otherwise explicitly defined, the terms "setting", "installation", "connection", etc. should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in combination with the specific content of the technical solution.

[0031] This embodiment discloses a eutectic bonding apparatus, including a laser eutectic bonding fixture. Please refer to... Figure 1 and Figure 2The laser eutectic welding fixture includes a heat-conducting base plate 100, a limiting plate 200, and a counterweight 300. The heat-conducting base plate 100 is provided with multiple product limiting grooves 101, which are evenly distributed on the heat-conducting base plate 100. For example, there are 9 product limiting grooves 101 arranged in a three-row, three-column array on the heat-conducting base plate 100. Or, for example, there are 4 product limiting grooves 101 arranged in a linear array on the heat-conducting base plate 100. The limiting plate 200 is installed above the heat-conducting base plate 100. The limiting plate 200 and the heat-conducting base plate 100 are connected by multiple support members 210. The limiting plate 200 is provided with multiple limiting holes 201. The position of the limiting holes 201 is adapted to the product limiting groove 101. The counterweight 300 has a columnar structure. The counterweight 300 is movably inserted through the limiting hole 201. The axis of the counterweight 300 is perpendicular to the heat-conducting base plate 100, and the end of the counterweight 300 can abut against the target product placed in the product limiting groove 101 under its own weight.

[0032] During use, the target product is placed in the product limiting groove 101. The heat-conducting base plate 100 evenly conducts heat to the product limiting groove 101, so that the target product placed in the product limiting groove 101 is heated evenly. The counterweight 300 is inserted through the limiting hole 201, which can maintain the stability of the pressure under the limiting action of the limiting plate 200. In this way, by improving the uniformity of heating and the stability of pressure, the success rate of eutectic welding is improved, thereby improving the efficiency of eutectic welding.

[0033] In some application examples, the thermally conductive base plate 100 is a graphite base plate. Graphite has excellent thermal conductivity, with a thermal conductivity between 700-1300 W / m·K, equivalent to 2 to 3 times that of copper and 3 to 5 times that of aluminum. Using a graphite base plate can effectively transfer heat to the target product, improving the heat uniformity of eutectic bonding. Furthermore, the thermally conductive base plate 100 is a modular graphite base plate. Through modular design, it can be adapted to the processing of different product models, facilitating replacement.

[0034] The heat-conducting base plate 100 has mounting holes 102 at its corners, and the support members 210 are installed in the mounting holes 102. For example, the support members 210 are columnar structures, and there are four support members 210 evenly distributed at the four corners of the heat-conducting base plate 100. The heat-conducting base plate 100 has mounting holes 102 whose number, position, shape, and size are adapted to the support members 210. The support members 210 are detachably installed in the mounting holes 102. For different models of heat-conducting base plates 100, the position of the product limiting groove 101 is the same but the size is different. This allows for modular design of different models of heat-conducting base plates 100, achieving the goal of sharing the limiting plate 200 and the counterweight block 300 for different models of heat-conducting base plates 100.

[0035] Because the dimensions of the product limiting groove 101 are adapted to the substrate of the target product, that is, the dimensions of the product limiting groove 101 just accommodate the substrate of the target product, displacement of the substrate within the product limiting groove 101 is avoided, thus improving the limiting reliability of eutectic bonding. Please refer to... Figure 3 and Figure 4 To facilitate the handling of the substrate, symmetrical clearance holes 103 are provided on opposite sides of the product limiting groove 101. For example, there are two clearance holes 103 symmetrically distributed on the long side edge of the product limiting groove 101, allowing the substrate to be picked up with tweezers during use. Alternatively, there are four clearance holes 103, with two clearance holes 103 forming a group, and two groups of clearance holes 103 symmetrically distributed on opposite sides of the product limiting groove 101, facilitating the handling of the substrate. The clearance holes 103 extend inward from the surface of the heat-conducting base plate 100. Viewed from the direction of extension, the opening of the clearance hole 103 is a notched circle, thus enabling communication between the clearance hole 103 and the product limiting groove 101.

[0036] Please continue to refer to Figure 3 and Figure 4 A lead groove 104 is provided on the adjacent side of the product limiting groove 101, and the lead groove 104 is connected to the product limiting groove 101. Since the clamping tolerance of the target product chip is small, a certain length of lead wire needs to be reserved at the tail of the chip to avoid lead wire jamming during eutectic bonding. Therefore, by setting the lead groove 104 to accommodate the chip lead wire, the reliability of eutectic bonding can be further improved.

[0037] Please refer to Figure 1 and Figure 2The counterweight 300 includes a main body 310 and an abutment 320 connected to each other. The main body 310 has a cylindrical structure, and the abutment 320 has a conical structure. The main body 310 and the abutment 320 are coaxial. In actual production, the machining accuracy of the cylindrical structure is easier to control, and it is easier to ensure that the main body 310 and the abutment 320 are coaxial (concentric), thereby ensuring that the contact point between the counterweight 300 and the chip of the target product is within the required positional accuracy range.

[0038] In some applications, the contact portion 320 is a heat insulation component. For example, the heat insulation component is made of a non-thermal-conductive material, the details of which can be found below and will not be repeated here. By designing the contact portion 320 as a heat insulation component, heat conduction from the target product to the counterweight 300 can be reduced, thereby reducing heat loss. This allows heat to be concentrated on the chip and substrate of the target product during the entire eutectic bonding process, thus improving the efficiency and quality of the eutectic bonding. Alternatively, in other application examples, the contact surface of the contact portion 320 is provided with a heat-insulating coating. For example, the heat-insulating coating can be a Teflon coating, or existing heat-insulating materials can be used to achieve the coating's heat insulation effect. Or, in still other application examples, the contact portion 320 is fitted with a heat insulation component, for example, the shape and size of which are adapted to the contact portion 320. This allows the heat insulation component to be installed on the contact portion 320, thus concentrating the heat of the eutectic bonding on the chip and substrate of the target product.

[0039] The support component 210 is a non-thermal-conducting support component, which can be made of a non-thermal-conducting material. Non-thermal-conducting materials refer to materials with low thermal conductivity that can effectively isolate heat transfer, such as rock wool or ceramics. The non-thermal-conducting component can achieve heat isolation between the thermally conductive base plate 100 and the limiting plate 200, thereby concentrating the heat during the eutectic welding process and improving the efficiency and quality of the eutectic welding.

[0040] Please refer to the above as well. Figures 1 to 4The target products include a substrate, solder pads, and chips. One product positioning groove 101 in the thermally conductive base plate 100 corresponds to one target product, enabling rapid positioning. Before eutectic bonding, the substrate is placed into the product positioning groove 101 of the thermally conductive base plate 100. The size of the product positioning groove 101 is just right to accommodate the substrate, preventing displacement within the groove. Next, the solder pad is placed on the substrate, and then the chip is placed on the solder pad, with the side of the chip to be eutectic bonded facing the solder pad. The positioning plate 200 has multiple positioning holes 201, the positions of which are adapted to the product positioning grooves 101. A counterweight 300 passes through the positioning holes 201 and abuts against the chip. Under its own weight, the counterweight 300 applies pressure to the chip, ensuring a tight fit between the chip and the substrate on a horizontal plane. The degree of tightness of the fit can be precisely controlled by the weight of the counterweight 300. During the eutectic bonding process, the heat-conducting base plate 100 can evenly conduct heat to the substrate and the chip. The heat insulation structure design (heat insulation component or heat insulation coating) of the counterweight 300 can concentrate heat more between the substrate and the chip. The limiting plate 200 can limit the counterweight 300 and ensure the stability of the counterweight 300.

[0041] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A laser eutectic bonding fixture, characterized in that, include: The heat-conducting base plate (100) is provided with multiple product limiting grooves (101); A limiting plate (200) is installed above the heat-conducting base plate (100). The limiting plate (200) and the heat-conducting base plate (100) are connected by multiple support members (210). The limiting plate (200) is provided with multiple limiting holes (201). The position of the limiting holes (201) is adapted to the product limiting groove (101). The counterweight (300) has a columnar structure. The counterweight (300) is movably inserted through the limiting hole (201). The axial direction of the counterweight (300) is perpendicular to the heat-conducting base plate (100). The end of the counterweight (300) can abut against the target product placed in the product limiting groove (101) under its own weight.

2. The laser eutectic bonding fixture according to claim 1, characterized in that, The heat-conducting base plate (100) is a graphite base plate.

3. The laser eutectic bonding fixture according to claim 2, characterized in that, The heat-conducting base plate (100) is a modular graphite base plate.

4. The laser eutectic bonding fixture according to any one of claims 1 to 3, characterized in that, The heat-conducting base plate (100) has mounting holes (102) at its corners, and the support member (210) is installed in the mounting holes (102).

5. The laser eutectic bonding fixture according to claim 1, characterized in that, The product limiting groove (101) has symmetrically arranged clearance holes (103) on its opposite two sides.

6. The laser eutectic bonding fixture according to claim 1 or 5, characterized in that, A lead wire groove (104) is provided on the adjacent side of the product limiting groove (101), and the lead wire groove (104) is connected to the product limiting groove (101).

7. The laser eutectic bonding fixture according to claim 1, characterized in that, The counterweight (300) includes a main body (310) and an abutment (320) connected to each other. The main body (310) has a cylindrical structure, and the abutment (320) has a conical structure. The main body (310) and the abutment (320) are coaxial.

8. The laser eutectic bonding fixture according to claim 7, characterized in that, The contact portion (320) is a heat insulation component; Alternatively, the contact surface of the contact portion (320) is provided with a heat-insulating coating; Alternatively, the contact portion (320) may be fitted with a heat insulation component.

9. The laser eutectic bonding fixture according to claim 1 or 7, characterized in that, The support member (210) is a non-thermal-conducting support member.

10. A eutectic bonding apparatus, characterized in that, Including the laser eutectic bonding fixture as described in any one of claims 1 to 9.

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