Copper polishing machine for sapphire processing

Abstract

The utility model provides a copper polishing machine for sapphire processing. The copper polishing machine comprises a polishing device and a polishing liquid dropping device. Wherein the polishing device comprises an upper base, a lower base and a polishing disc, a machining cavity is formed between the upper base and the lower base, and the polishing disc is rotatably arranged on the lower base and located in the machining cavity; the polishing liquid dropping device comprises a liquid supply assembly, a liquid pumping assembly and a liquid dropping assembly, the liquid pumping assembly is connected to the liquid supply assembly and the liquid dropping assembly, the liquid dropping assembly comprises a plurality of liquid dropping heads, and the liquid dropping heads are fixed to the upper base through a supporting assembly and extend in the direction close to the polishing disc. According to the copper polishing machine for sapphire machining, the problem that in the prior art, the sapphire polishing efficiency is low can be solved.

Description

Technical Field

[0001] This disclosure relates to the field of polishing technology, and more particularly to a copper polishing machine for sapphire processing. Background Technology

[0002] In semiconductor copper polishing processes, the polishing slurry is currently mainly sprayed using a nozzle gas method. This method can distribute the polishing slurry more evenly on the surface to be polished. At the same time, the force of the gas assists the polishing slurry in contacting and rubbing against the surface to be polished, which can improve polishing efficiency. However, there is a problem of inaccurate liquid volume control, which leads to the waste of both polishing slurry and compressed air, and directly affects the yield rate in the wafer processing process.

[0003] A patent search revealed that Chinese patent document CN221676808U discloses a polishing machine for processing sapphire crystals. The machine includes a base and a polishing disc mounted on the base and driven to rotate by a motor. A support is mounted on the base, and a robotic arm is mounted on the support. The robotic arm has an end for adhering the sapphire crystal, and the end is connected to a water tank on the support via a pipe, allowing liquid to drip downwards from the end to keep the sapphire crystal polished while wet. The end includes a connector mounted on the robotic arm, and an interface on the side of the connector connects to the pipe. The port of the connector has a drip head, and the sapphire crystal is adhered to the end face of the drip head. The drip head has a flow channel and is threaded onto the port of the connector. Multiple drainage holes are opened on the side of the drip head, and the liquid draining from the drainage holes flows down the surface of the drip head onto the sapphire crystal. Although the current method achieves its liquid-drip function by setting up a dripping end, it only involves one dripping end directly connected to the water tank. When large-area polishing is required, the dripping efficiency of a single dripping end is low. Furthermore, the liquid is directly diverted to a low-head surface through a drain hole on the dripping end before flowing onto the sapphire crystal. Due to the limitations of the dripping end's structure, only small areas can be dripped, resulting in poor dripping quality. Therefore, we propose a copper polishing machine for sapphire processing. Utility Model Content

[0004] One of the technical problems that this disclosure aims to solve is the low polishing efficiency caused by directly connecting a single dropper head to a water tank and dripping liquid through the surface of the dropper head in the sapphire copper polishing process.

[0005] To address the aforementioned technical problems, this disclosure provides a copper polishing machine for sapphire processing, comprising:

[0006] A polishing device includes an upper base, a lower base, and a polishing disc. A processing chamber is provided between the upper base and the lower base. The polishing disc is rotatably mounted on the lower base and located within the processing chamber.

[0007] The polishing slurry dripping device includes a slurry supply component, a slurry extraction component, and a dripping component. The slurry extraction component is connected to the slurry supply component and the dripping component. The dripping component includes multiple dripping heads, which are fixed to the upper base by a support component and extend towards the polishing disc.

[0008] In some embodiments, an adapter is provided between the liquid extraction assembly and the liquid dispensing assembly. The liquid extraction assembly is connected to the adapter and the liquid supply assembly respectively through a liquid extraction tube. The adapter has an input channel and multiple output channels. The input channel is connected to the liquid extraction assembly through the liquid extraction tube, and the multiple output channels are connected to multiple dispensing heads one by one.

[0009] In some embodiments, the input channel of the adapter is provided with a liquid supply regulating valve.

[0010] In some embodiments, the drip head is characterized in that it includes a collection chamber and a drip tip, the collection chamber is connected to the drip tip, the drip tip has a conical structure, and a plurality of drip holes are provided on the side of the drip tip.

[0011] In some embodiments, the drip head is connected to the adapter via a drip tube, the drip tube is fixed to the support assembly, one end of the support assembly is fixedly connected to the upper base, and the other end extends toward the polishing disc, and there is a drip gap between the drip head and the lower base.

[0012] In some embodiments, the diameter of the drip tube is smaller than the diameter of the suction tube.

[0013] In some embodiments, the liquid extraction assembly includes a peristaltic pump, the liquid extraction tubing includes a peristaltic pump tube, and the peristaltic pump is connected to the peristaltic pump tube.

[0014] In some embodiments, the copper polishing machine further includes a rotating shaft, which is fixedly connected to the polishing disc and rotatably connected to the lower base.

[0015] In some embodiments, the copper polishing machine includes a motor, which is driven to a rotating shaft.

[0016] In some embodiments, an annular cover is further provided between the upper base and the lower base, and the upper base, the lower base, and the annular cover together form a processing chamber. Through the above technical solution, the copper polishing machine for sapphire processing provided in this disclosure, by designing a polishing slurry dripping device containing multiple dripping heads and fixing it to the upper base extending towards the polishing disc, achieves uniform and efficient dripping of polishing slurry onto a large area of ​​sapphire crystal, improving the polishing efficiency when polishing sapphire using a copper polishing machine, and helping to improve the yield rate of wafer processing. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the copper polishing machine for sapphire processing disclosed in this embodiment;

[0019] Figure 2 yes Figure 1 An enlarged view of part M in the image;

[0020] Figure 3 This is a schematic diagram of the polishing liquid droplet device disclosed in this embodiment;

[0021] Figure 4 This is a schematic diagram of the structure of the dripping head disclosed in this embodiment.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Polishing device; 11. Upper base; 12. Lower base; 13. Polishing disc; 14. Processing chamber; 15. Rotating shaft; 16. Annular cover; 2. Polishing liquid dripping device; 21. Liquid supply assembly; 22. Liquid extraction assembly; 23. Drip assembly; 231. Drip head; 232. Liquid collection chamber; 233. Drip nozzle; 2331. Drip hole; 24. Support assembly; 25. Adapter; 251. Input channel; 252. Output channel; 253. Liquid supply regulating valve; 26. Liquid extraction pipe; 27. Drip pipe. Detailed Implementation

[0024] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0025] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0026] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0028] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0029] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0030] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0031] See Figures 1 to 4As shown in the embodiment of this application, a copper polishing machine for sapphire processing is provided, including a polishing device 1 and a polishing slurry dripping device 2. The polishing device 1 includes an upper base 11, a lower base 12, and a polishing disc 13. A processing chamber 14 is disposed between the upper base 11 and the lower base 12. The polishing disc 13 is rotatably disposed on the lower base 12 and located within the processing chamber 14. The polishing slurry dripping device 2 includes a supply component 21, a suction component 22, and a dripping component 23. The suction component 22 is connected to both the supply component 21 and the dripping component 23. The dripping component 23 includes multiple dripping heads 231, which are fixed to the upper base 11 by a support component 24 and extend towards the polishing disc 13.

[0032] The rotatable design of the polishing disc 13 ensures that the sapphire workpiece can make uniform and efficient contact with the surface of the polishing disc 13 during processing, thereby achieving efficient polishing, improving polishing efficiency and quality, and making the sapphire surface smoother and more delicate. The design of the polishing slurry dripping device 2, especially the dripping assembly 23 which includes multiple dripping heads 231, enables precise control of the polishing slurry. This ensures that the polishing slurry is evenly distributed between the polishing disc 13 and the sapphire workpiece, thereby improving the polishing effect and reducing polishing slurry waste.

[0033] In some embodiments, an adapter 25 is provided between the liquid extraction assembly 22 and the liquid dispensing assembly 23. The liquid extraction assembly 22 is connected to the adapter 25 and the liquid supply assembly 21 via a liquid extraction tube 26. The adapter 25 has an input channel 251 and multiple output channels 252. The input channel 251 is connected to the liquid extraction assembly 22 via the liquid extraction tube 26, and the multiple output channels 252 are connected to multiple dispensing heads 231 in a one-to-one correspondence. That is, the number of output channels 251 of the adapter 25 is the same as the number of dispensing heads 231, and they are connected in a one-to-one correspondence, so that the polishing liquid extracted by the liquid extraction assembly 22 from the liquid supply assembly 21 is distributed to the multiple dispensing heads 231 after passing through the adapter 25. Since the adapter 25 can evenly distribute the polishing liquid to each dispensing head 231, the polishing liquid can more evenly cover the polishing disk 13 and the sapphire workpiece, which helps to improve the polishing effect and make the sapphire surface smoother.

[0034] In some embodiments, the input channel 251 of the adapter 25 is provided with a liquid supply regulating valve 253. Providing the liquid supply regulating valve 253 in the input channel 251 enables global flow control of the entire polishing slurry dispensing device 2, helping to ensure that the polishing slurry enters the adapter 25 at an appropriate flow rate and is then distributed to each dispensing head 231.

[0035] In some embodiments, the fluid supply regulating valve 253 can also be provided on each output channel 252, which can realize independent control of the polishing fluid flow rate of each adapter 25, which helps to accurately adjust the flow rate of polishing fluid according to different areas or processing requirements of sapphire workpieces, thereby improving the polishing effect.

[0036] In some embodiments, the liquid supply regulating valve 253 of this embodiment includes, but is not limited to, a pneumatic regulating valve, an electric regulating valve, a self-operated regulating valve, a manual regulating valve, and an intelligent regulating valve.

[0037] In some embodiments, the dispensing head 231 includes a collection chamber 232 and a nozzle 233, the collection chamber 232 being in communication with the nozzle 233. The nozzle 233 has a conical structure, and multiple dispensing holes 2331 are provided on its side. The collection chamber 232 collects and stores polishing fluid from the adapter 25, and then uniformly delivers it to the surface of the sapphire workpiece through the nozzle 233, ensuring stable flow of the polishing fluid inside the dispensing head 231 and avoiding differences in polishing effect caused by uneven flow. The conical structure of the nozzle 233 increases the outflow velocity and pressure of the polishing fluid in the middle position, helping to spray the polishing fluid more evenly onto the surface of the sapphire workpiece and improve the polishing effect. The multiple dispensing holes 2331 provided on the side of the nozzle 233 allow the polishing fluid to cover the surface of the sapphire workpiece more evenly, helping to reduce polishing fluid waste and improve polishing efficiency.

[0038] In some embodiments, the drip head 231 is connected to the adapter 25 via a drip tube 27. The drip tube 27 is fixed to the support assembly 24. One end of the support assembly 24 is fixedly connected to the upper base 11, and the other end extends towards the polishing disc 13. A drip gap exists between the drip head 231 and the lower base 12. In this embodiment, the drip tube 27 is a flexible tube, which has higher toughness and stability. By fixing the drip tube 27 with the support assembly 24, uneven flow or leakage of polishing fluid caused by shaking of the drip tube 27 during sapphire polishing is avoided.

[0039] In some embodiments, the diameter of the drip tube 27 is smaller than the diameter of the suction tube 26. Since one suction tube 26 is connected to multiple drip tubes 27 via an adapter 25, the flow rate of the polishing fluid will decrease after passing through the adapter 25. However, the hydraulic pressure of the polishing fluid will be maintained in the smaller diameter drip tube 27. Therefore, by designing the diameter of the drip tube 27 to be smaller than the diameter of the suction tube 26, the delivery of polishing fluid from the drip tube 27 to the drip head 231 can be made more stable.

[0040] In some embodiments, the pumping assembly 22 includes a peristaltic pump, and the pumping tube 26 includes a peristaltic pump tube, with the peristaltic pump connected to the peristaltic pump tube. During operation, the peristaltic pump exerts low shear force on the polishing fluid and has strong self-priming capability, easily drawing the polishing fluid from the supply assembly 21 and delivering it to the dripping tube 27. Since the polishing fluid may contain solid particles or sensitive substances, the low shear force protects these particles or substances from damage, thereby ensuring the stability of the polishing fluid's composition and performance, and improving the polishing effect.

[0041] In some embodiments, the copper polishing machine further includes a rotating shaft 15, which is fixedly connected to the polishing disc 13 and rotatably connected to the lower base 12. The rotating shaft 15 can drive the polishing disc 13 to rotate at a certain speed, thereby achieving rapid polishing.

[0042] In some embodiments, the copper polishing machine includes a motor, which is driven to a rotating shaft 15. This drive connection between the motor and the rotating shaft 15 allows for smooth rotation of the shaft, further enhancing the polishing effect.

[0043] In some embodiments, an annular cover 16 is further provided between the upper base 11 and the lower base 12, and the upper base 11, lower base 12, and annular cover 16 together form a processing chamber 14. The processing chamber 14 formed between the annular cover 16 and the upper base 11 and lower base 12 allows the polishing process to be carried out in a relatively enclosed space, enabling the polishing slurry and polishing abrasive to act more concentratedly on the workpiece surface, reducing splashing and waste of the polishing slurry, thereby improving polishing efficiency. The annular cover 16 effectively isolates external air, dust, and other impurities from interfering with the polishing process, ensuring a clean polishing environment and contributing to higher quality polishing results. The enclosed nature of the processing chamber 14 reduces the risk of injury to operators from splashes generated during polishing, improving the safety of the polishing process.

[0044] In some embodiments, the liquid supply assembly 21 includes, but is not limited to, a liquid cylinder, and is located at any position that can meet the suction requirements of the liquid extraction assembly 22 without affecting the operation of the copper polishing machine.

[0045] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0046] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A copper polishing machine for sapphire processing, characterized in that, include: Polishing device (1), the polishing device (1) includes an upper base (11), a lower base (12) and a polishing disc (13), a processing chamber (14) is provided between the upper base (11) and the lower base (12), and the polishing disc (13) is rotatably disposed on the lower base (12) and located in the processing chamber (14); The polishing slurry dripping device includes a liquid supply component (21), a liquid extraction component (22), and a dripping component (23). The liquid extraction component (22) is connected to the liquid supply component (21) and the dripping component (23). The dripping component (23) includes a plurality of dripping heads (231). The plurality of dripping heads (231) are fixed to the upper base (11) by a support component (24) and extend toward the polishing disk (13).

2. The copper polishing machine for sapphire processing according to claim 1, characterized in that, An adapter (25) is provided between the liquid extraction assembly (22) and the liquid dispensing assembly (23). The liquid extraction assembly (22) is connected to the adapter (25) and the liquid supply assembly (21) respectively through the liquid extraction tube (26). The adapter (25) has an input channel (251) and multiple output channels (252). The input channel (251) is connected to the liquid extraction assembly (22) through the liquid extraction tube (26). The multiple output channels (252) are connected to multiple liquid dispensing heads (231) one by one.

3. The copper polishing machine for sapphire processing according to claim 2, characterized in that, The input channel (251) of the adapter (25) is equipped with a liquid supply regulating valve (253).

4. The copper polishing machine for sapphire processing according to claim 2, characterized in that, The drip head (231) includes a collection chamber (232) and a drip tip (233). The collection chamber (232) is connected to the drip tip (233). The drip tip (233) has a conical structure and multiple drip holes (2331) are provided on the side of the drip tip (233).

5. The copper polishing machine for sapphire processing according to claim 2, characterized in that, The drip head (231) is connected to the adapter (25) through the drip tube (27). The drip tube (27) is fixed on the support assembly (24). One end of the support assembly (24) is fixedly connected to the upper base (11), and the other end extends towards the polishing disc (13). There is a drip gap between the drip head (231) and the lower base (12).

6. The copper polishing machine for sapphire processing according to claim 5, characterized in that, The diameter of the drip tube (27) is smaller than the diameter of the suction tube (26).

7. The copper polishing machine for sapphire processing according to claim 2, characterized in that, The liquid extraction assembly (22) includes a peristaltic pump, and the liquid extraction tube (26) includes a peristaltic pump tube, with the peristaltic pump connected to the peristaltic pump tube.

8. The copper polishing machine for sapphire processing according to claim 1, characterized in that, The copper polishing machine also includes a rotating shaft (15), which is fixedly connected to the polishing disc (13) and rotatably connected to the lower base (12).

9. The copper polishing machine for sapphire processing according to claim 8, characterized in that, The copper polishing machine includes a motor, which is drivenly connected to the rotating shaft (15).

10. The copper polishing machine for sapphire processing according to any one of claims 1 to 9, characterized in that, An annular cover (16) is also provided between the upper base (11) and the lower base (12), and the upper base (11), the lower base (12) and the annular cover (16) surround to form the processing chamber (14).

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