Packaging sealing structure

By combining multi-directional positioning and fused sealing structure design, the problem of insufficient airtightness of sensor packaging structure in harsh environments is solved, realizing sensor packaging with high airtightness and low leakage risk, reducing production costs and extending service life.

CN223622190UActive Publication Date: 2025-12-02JIANGSU BOYINGTE ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202423137242.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-12-02
Estimated Expiration
2034-12-19

AI Technical Summary

Technical Problem

Traditional sensor packaging structures lack sufficient airtightness in harsh environments, resulting in high leakage risk, high production defect rate, and difficulty in meeting stringent usage requirements.

Method used

Employing a multi-directional positioning structure and a fusion sealing structure, combined with the design of components such as sensor mounting base, NTC, wires, and chips, the fusion sealing structure is integrated with the mold to form multi-directional positioning, thereby improving airtightness.

Benefits of technology

This effectively improves the airtightness level of the sensor, reduces the risk of leakage and the production defect rate, extends the service life of the sensor in harsh environments, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of new energy automobiles, and discloses a packaging and sealing structure, which comprises a sensor fixing seat, an NTC (Negative Temperature Coefficient) is fixedly connected to the front side of the upper surface of the sensor fixing seat, a lead is arranged at the rear end of the sensor fixing seat, and the front end of the lead penetrates through the outer side surface of the sensor fixing seat. According to the packaging sealing structure, the fusion sealing structure is additionally arranged, so that the problem of poor airtightness of positioning point positions can be effectively solved during packaging by workers in the later period, meanwhile, the arrangement of the positioning points can be effectively reduced, leakage points are correspondingly reduced, and the leakage risk can be effectively reduced; in addition, the packaging and implanting process of the device by workers is smoother, the reject ratio of assembled products is greatly reduced, the production cost is indirectly reduced, compared with a traditional structure after one-way positioning packaging, the air tightness grade is effectively improved, the use requirement is met, and the service life of a sensor applied to a severe environment is effectively prolonged.
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Description

Technical Field

[0001] This utility model relates to the field of new energy vehicle technology, specifically to a packaging and sealing structure. Background Technology

[0002] New energy vehicles refer to automobiles that use unconventional vehicle fuels as a power source and integrate advanced technologies in vehicle power control and drive, forming automobiles with advanced technical principles, new technologies, and new structures. The rise of the new energy vehicle industry and the accelerated development of intelligent vehicles have placed more stringent requirements on the performance of automotive sensors. Due to the harsh application environment of sensors, the airtightness level of traditional unidirectional positioning packaging structures cannot meet the requirements. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a sealing structure that solves the problems mentioned in the background section.

[0005] (II) Technical Solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a sealing structure, including a sensor mounting base, an NTC fixedly connected to the front side of the upper surface of the sensor mounting base, a wire provided at the rear end of the sensor mounting base, the front end of the wire penetrating through the outer side of the sensor mounting base, a welding area opened in the middle of the outer side of the sensor mounting base, a strong magnet fixedly connected inside the sensor mounting base, a multi-directional positioning structure fixedly connected to the outer side of the sensor mounting base, a fusion sealing structure fixedly sleeved on the outer side of the multi-directional positioning structure, a chip fixedly connected inside the front end of the sensor mounting base, and a terminal provided on the front side of the upper surface of the sensor mounting base, the rear end of the terminal penetrating through the outer side of the NTC.

[0007] Preferably, a wire fixing sleeve is fitted onto the right side of the outer surface of the wire.

[0008] Preferably, the number of the multi-directional positioning structure and the fusion sealing structure is set to three sets.

[0009] Preferably, a first mounting groove is provided on the front side of the lower surface of the sensor mounting base, and the inner diameter of the first mounting groove is adapted to the outer diameter of the strong magnet.

[0010] Preferably, the rear end of the terminal is located directly below the front end of the wire, and the rear end of the terminal and the front end of the wire are both located inside the welding area.

[0011] Preferably, a second mounting groove is provided on the front side of the upper surface of the sensor mounting base, and the inner diameter of the second mounting groove is adapted to the outer diameter of the chip.

[0012] (III) Beneficial Effects

[0013] Compared with the prior art, the present invention provides a sealing structure with the following advantages:

[0014] 1. This encapsulation and sealing structure, by adding a fusion sealing structure, effectively solves the problem of poor airtightness at the positioning points during later encapsulation. At the same time, it effectively reduces the number of positioning points, thereby reducing leakage points and effectively reducing leakage risk. It also makes the encapsulation and implantation process of the device smoother, significantly reducing the defect rate of the assembled product and indirectly reducing production costs. Compared with the traditional unidirectional positioning encapsulation structure, the airtightness level is effectively improved to meet the usage requirements and effectively extend the service life of the sensor in harsh environments. Attached Figure Description

[0015] Figure 1 This is a top view schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a bottom view of the overall structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the overall structure of this utility model being assembled with the bushing to form the finished sensor product.

[0018] In the diagram: 1. Sensor mounting base; 2. NTC; 3. Wire; 4. Wire fixing sleeve; 5. Welding area; 6. Strong magnet; 7. Multi-directional positioning structure; 8. Fusion sealing structure; 9. Chip; 10. Terminal. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-3This utility model provides a technical solution: a sealing structure, including a sensor mounting base 1, an NTC 2 fixedly connected to the front side of the upper surface of the sensor mounting base 1, a wire 3 provided at the rear end of the sensor mounting base 1, the front end of the wire 3 penetrating through the outer side of the sensor mounting base 1, a welding area 5 opened in the middle of the outer side of the sensor mounting base 1, a strong magnet 6 fixedly connected inside the sensor mounting base 1, a multi-directional positioning structure 7 fixedly connected to the outer side of the sensor mounting base 1, a fusion sealing structure 8 fixedly sleeved on the outer side of the multi-directional positioning structure 7, the outer end of the fusion sealing structure 8 having a sharp corner around its perimeter, after being implanted into a mold and encapsulated with glue, effectively reducing the high failure rate caused by large airtight leakage, a chip 9 fixedly connected inside the front end of the sensor mounting base 1, a terminal 10 provided at the front side of the upper surface of the sensor mounting base 1, the rear end of the terminal 10 penetrating through the outer side of the NTC 2, and the front end of the terminal 10 electrically connected to the chip 9.

[0021] By adding the fusion sealing structure 8, the problem of poor airtightness at the positioning point can be effectively solved during the later packaging process. At the same time, the number of positioning points can be reduced, thereby reducing leakage points and effectively lowering the risk of leakage. This also makes the packaging and implantation process of the device smoother, significantly reducing the defect rate of the assembled product and indirectly reducing production costs. Compared with the traditional unidirectional positioning packaging structure, the airtightness level is effectively improved to meet the usage requirements and effectively extend the service life of the sensor in harsh environments.

[0022] In order to prevent the wire 3 from becoming too tangled, this utility model has a wire fixing sleeve 4 fitted on the right side of the outer surface of the wire 3. The wire fixing sleeve 4 can effectively bind the wire 3 and prevent it from becoming too tangled.

[0023] To reduce the number of leakage points, this invention sets three sets of both the multi-directional positioning structure 7 and the fusion sealing structure 8. After assembling the insert containing the fusion sealing structure 8 and the multi-directional positioning structure 7, it is implanted into the encapsulation mold. Through the melting temperature of the injection-molded plastic, it fuses with the outer encapsulation. The use of the multi-directional positioning structure 7 and the fusion sealing structure 8 can eliminate the need for independent unidirectional positioning structures, effectively reducing the high defect rate caused by large airtight leakage, reducing the number of leakage points, and also allowing for smoother implantation into the encapsulation mold.

[0024] In order to facilitate the installation of the strong magnet 6 inside the sensor mounting base 1, the present invention provides a first mounting groove on the front side of the lower surface of the sensor mounting base 1. The inner diameter of the first mounting groove is adapted to the outer diameter of the strong magnet 6. Because of the size matching design, the strong magnet 6 can be placed inside the sensor mounting base 1, which makes it convenient for the staff to install the strong magnet 6 inside the sensor mounting base 1 later.

[0025] To facilitate welding of the front end of the wire 3 and the rear end of the terminal 10, this invention positions the rear end of the terminal 10 directly below the front end of the wire 3. Both the rear end of the terminal 10 and the front end of the wire 3 are located within the welding area 5. The welding area 5 allows workers to clearly see the positions of the rear end of the terminal 10 and the front end of the wire 3, and also facilitates the contact of the output end of the welding equipment with the rear end of the terminal 10 and the front end of the wire 3. Therefore, it is convenient for workers to weld the front end of the wire 3 and the rear end of the terminal 10.

[0026] In order to facilitate the installation of chip 9 inside the sensor mounting base 1, the present invention provides a second mounting groove on the front side of the upper surface of the sensor mounting base 1. The inner diameter of the second mounting groove is adapted to the outer diameter of chip 9. Because of the size compatibility, the operator can place chip 9 inside the sensor mounting base 1, which facilitates the installation of chip 9 inside the sensor mounting base 1.

[0027] In use, the NTC2, chip 9, and terminal 10 are all assembled onto the sensor mounting base 1. Then, the wires 3, equipped with wire fixing sleeves 4, are inserted into the sensor mounting base 1. The front end of the wires 3 and the rear end of the terminal 10 are then soldered through the soldering area 5. Next, the strong magnet 6 is inserted into the sensor mounting base 1. This completes the assembly of the sensor mounting base 1. The assembled sensor mounting base 1 and bushing structure are then inserted as inserts into the encapsulation mold, finally yielding the finished sensor product. Figure 3 As shown, Figure 3 This is only used to demonstrate the final assembly of the device and bushing into a finished sensor product. It will not affect the structural lead-out or structural positional relationship of the device. In this process, because the multi-directional positioning structure 7 adds Y-directional positioning on the basis of Z-directional positioning and removes the independent Y-directional positioning structure, it prevents the problem of too many leakage points caused by too many positioning structures in the previous production process, reduces the risk of leakage, and makes the multi-directional positioning structure 7 reduce the unnecessary independent positioning structures, making it smoother when implanted into the encapsulation mold, thus improving production efficiency.

[0028] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0029] The dimensions and shapes of all components in this structure are not specifically limited here and need to be produced according to the actual situation.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sealing and encapsulating structure, comprising a sensor mounting base (1), characterized in that: The front side of the upper surface of the sensor mounting base (1) is fixed with an NTC (2). The rear end of the sensor mounting base (1) is provided with a wire (3). The front end of the wire (3) passes through the outer side of the sensor mounting base (1). A welding area (5) is opened in the middle of the outer side of the sensor mounting base (1). A strong magnet (6) is fixed inside the sensor mounting base (1). A multi-directional positioning structure (7) is fixed to the outer side of the sensor mounting base (1). A fusion sealing structure (8) is fixedly sleeved on the outer side of the multi-directional positioning structure (7). A chip (9) is fixed inside the front end of the sensor mounting base (1). A terminal (10) is provided on the front side of the upper surface of the sensor mounting base (1). The rear end of the terminal (10) passes through the outer side of the NTC (2).

2. The encapsulation and sealing structure according to claim 1, characterized in that: A wire fixing sleeve (4) is fitted onto the right side of the outer surface of the wire (3).

3. The encapsulation and sealing structure according to claim 1, characterized in that: The number of the multi-directional positioning structure (7) and the fusion sealing structure (8) is set to three sets.

4. The encapsulation and sealing structure according to claim 1, characterized in that: The sensor mounting base (1) has a first mounting groove on the front side of its lower surface, and the inner diameter of the first mounting groove is adapted to the outer diameter of the strong magnet (6).

5. The encapsulation and sealing structure according to claim 1, characterized in that: The rear end of the terminal (10) is directly below the front end of the wire (3), and the rear end of the terminal (10) and the front end of the wire (3) are both inside the welding area (5).

6. The encapsulation and sealing structure according to claim 1, characterized in that: The sensor mounting base (1) has a second mounting groove on the front side of its upper surface, and the inner diameter of the second mounting groove is adapted to the outer diameter of the chip (9).