Device for detecting plastic package failure parameters
The device for detecting molding failure parameters automatically detects failure images, thickness, and surface roughness of the packaging structure, solving the problems of low detection efficiency and wasted manpower caused by unbalanced molding mold pressure, and achieving efficient parameter detection and process improvement.
Patent Information
- Application Number
- CN202423300304.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing technologies, the failure of the encapsulation structure and appearance quality problems caused by unbalanced pressure in the molding die are characterized by low detection efficiency and high manpower waste.
A device for detecting failure parameters of plastic packaging is provided, including a base, an integrated detection unit, a first driving unit, a roughness measurement unit, and a second driving unit, which can automatically detect failure images, thickness, and surface roughness of the packaging structure.
It improves testing efficiency, reduces labor waste, and provides detailed parameter references to improve the sealing process.
Smart Images
Figure CN223623579U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing, and more particularly to an apparatus for detecting parameters of plastic encapsulation failure. Background Technology
[0002] In the current semiconductor packaging process, the balance of stamping pressure of the molding die directly affects the quality of the packaged structure (or product) to be tested. If the pressure of the molding die is unbalanced, it will cause microcracks in the chip in the packaged structure to be tested or affect the appearance quality of the package, thereby greatly reducing the product yield.
[0003] Testing relevant parameters of failed packaging structures (or products) is of great reference value for improving the molding process. However, the parameters currently used to test failed packaging structures (or products) include thickness, morphology, and roughness. These parameters all require different testing equipment and manual inspection, resulting in low testing efficiency, long processing time, and significant waste of manpower. Utility Model Content
[0004] The technical problem to be solved by this application is to provide a device for detecting plastic seal failure parameters, so as to improve the detection efficiency and reduce the waste of manpower.
[0005] Therefore, this application provides an apparatus for detecting molding failure parameters, comprising:
[0006] The base is used to fix the package structure to be tested.
[0007] An integrated detection unit is disposed above the base, used to capture failure images of the surface of the package structure to be inspected and to measure the thickness of the package structure to be inspected.
[0008] A first driving unit, connected to the integrated detection unit, is used to drive the integrated detection unit to move in a plane parallel to the upper surface of the base during measurement.
[0009] A roughness measuring unit is disposed on one side of the base and is used to measure and obtain the surface roughness of the packaging structure to be inspected;
[0010] The second driving unit is connected to the roughness measuring unit and is used to drive the roughness measuring unit to move during measurement, thereby contacting the surface of the packaging structure to be inspected.
[0011] In an optional embodiment, the system further includes a control unit electrically connected to the first driving unit and the second driving unit, for providing driving control signals to the first driving unit and the second driving unit respectively, and the control unit also electrically connected to the integrated detection unit and the roughness measurement unit, for providing detection control signals to the integrated detection unit and the roughness measurement unit respectively.
[0012] In one optional embodiment, the control unit is a PLC control system.
[0013] In an optional embodiment, the integrated detection unit includes a main support, an imaging unit, and a distance detection unit. The imaging unit and the distance detection unit are respectively fixed on the main support. The main support is also fixedly connected to the first driving unit. The imaging unit is used to capture a failure image of the surface of the packaging structure to be inspected, and the distance detection unit is used to measure the thickness of the packaging structure to be inspected.
[0014] In an optional embodiment, the shooting unit is fixed to the main bracket by a rotatable bracket.
[0015] In one optional embodiment, the shooting unit includes a camera, and the distance detection unit includes an infrared rangefinder or a laser rangefinder.
[0016] In an optional embodiment, the distance detection unit is further configured to draw a thickness distribution map based on the measured thickness and obtain a curve showing the change between the thickness and the molding parameters.
[0017] In an optional embodiment, the first driving unit includes two parallel guide rails, a first slide rail, a second slide rail, a first driving source, and a second driving source. The two ends of the first slide rail are respectively disposed on the two parallel guide rails, and the first slide rail is connected to the first driving source. The first driving source drives the first slide rail to move along a first direction. The second slide rail is straddled on the first slide rail and is connected to the second driving source. The second driving source drives the second slide rail to move along a second direction, which is perpendicular to the first direction.
[0018] In an optional embodiment, the second driving unit includes a third driving source and a fourth driving source, the third driving source being connected to the fourth driving source and the fourth driving source being connected to the roughness measuring unit, the third driving source driving the roughness measuring unit to move in a direction perpendicular to the upper surface of the base, and the fourth driving unit driving the roughness measuring unit to move in a direction parallel to the upper surface of the base.
[0019] In an optional embodiment, the roughness measuring unit includes a roughness measuring instrument; the roughness measuring unit is further configured to draw a roughness distribution map of the product based on the surface roughness obtained from the measurement.
[0020] Compared with the prior art, the advantages of the technical solution of this application are as follows:
[0021] The apparatus for detecting molding compound failure parameters disclosed in this application includes: a base for fixing the packaging structure to be tested; an integrated detection unit disposed above the base for capturing failure images of the surface of the packaging structure to be tested and measuring the thickness of the packaging structure to be tested; a first driving unit connected to the integrated detection unit for driving the integrated detection unit to move along a plane parallel to the upper surface of the base during measurement; a roughness measuring unit disposed on one side of the base for measuring the surface roughness of the packaging structure to be tested; and a second driving unit connected to the roughness measuring unit for driving the roughness measuring unit to move during measurement to contact the surface of the packaging structure to be tested. The aforementioned apparatus for detecting molding compound failure parameters can automatically detect multiple parameters (such as failure images, thickness, and roughness) of the packaging structure to be tested, thereby improving detection efficiency, reducing labor waste, and providing detailed and important reference data for improving the molding compound process. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a device for detecting molding failure parameters in one embodiment of this application;
[0023] Figure 2 As shown in one embodiment of this application Figure 2 The diagram shows a schematic of the integrated detection unit in the device for detecting molding failure parameters.
[0024] Figure 3 As shown in one embodiment of this application Figure 2 The diagram shows the connection structure of each unit in the device used to detect plastic seal failure parameters. Detailed Implementation
[0025] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of this application in detail, for ease of explanation, the schematic diagrams may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this application. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.
[0026] This application provides an apparatus for detecting molding failure parameters.
[0027] Figure 1 This is a schematic diagram of the structure of a device for detecting molding failure parameters in one embodiment of this application; Figure 2 As shown in one embodiment of this application Figure 2 The diagram shows a schematic of the integrated detection unit in the device for detecting molding failure parameters. Figure 3 As shown in one embodiment of this application Figure 2 The diagram shows the connection structure of each unit in the device used to detect plastic seal failure parameters.
[0028] Reference Figure 1 and Figure 3 The device for detecting molding failure parameters includes:
[0029] Base 2, used to fix the package structure to be tested;
[0030] An integrated detection unit 3 is disposed above the base 2 and is used to capture failure images of the surface of the package structure to be inspected and to measure the thickness of the package structure to be inspected.
[0031] The first driving unit 4 is connected to the integrated detection unit 3 and is used to drive the integrated detection unit 3 to move in a plane parallel to the upper surface of the base 2 when performing measurement.
[0032] A roughness measuring unit 5 is disposed on one side of the base 2 and is used to measure and obtain the surface roughness of the packaging structure to be inspected.
[0033] The second driving unit 9 is connected to the roughness measuring unit 5 and is used to drive the roughness measuring unit 5 to move during measurement, thereby contacting the surface of the packaging structure to be tested.
[0034] Specifically, the base 2 has a flat upper surface, and the packaged structure to be tested is fixed to the upper surface of the base 2. The base 2 can fix the packaged structure to be tested by vacuum adsorption or mechanical clamping. In one embodiment, when the base 2 can fix the packaged structure to be tested by vacuum adsorption, the base 2 includes a vacuum suction platform. In one embodiment, the base 2 can also be connected to a driving device, and under the drive of the driving device, the base 2 can move up and down and / or move back and forth and left and right.
[0035] The packaging structure to be tested is a packaging structure that has failed after molding, and the failure includes warping, surface damage, surface unevenness, etc. The device for detecting molding failure parameters of this application can automatically detect multiple parameters of the packaging structure to be tested, thereby improving detection efficiency, reducing labor waste, and providing detailed and important reference information for improving the molding process.
[0036] In one embodiment, the package structure to be tested includes a semiconductor chip and a molding compound covering the semiconductor chip.
[0037] In another embodiment, the package structure to be tested includes: a substrate, a semiconductor chip mounted on the surface of the substrate, and a molding compound covering the semiconductor chip. The substrate can be one of a resin substrate, a silicon substrate, a printed circuit board (PCB), a redistribution layer (RDL), a ceramic substrate, a glass substrate, or a flexible printed circuit board (FPC). The substrate can also be a metal frame or an alloy frame. In a specific example, the material of the molding compound can be a filler-containing epoxy resin, polyimide resin, benzocyclobutene resin, or polybenzoxazole resin; or it can be a filler-containing polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyimide, ethylene-vinyl acetate copolymer, or polyvinyl alcohol. The filler can be an inorganic filler or an organic filler. The process for forming the molding compound includes compression molding or transfer molding.
[0038] The integrated detection unit 3 is disposed above the base 2 and is used to capture failure images of the surface of the package structure to be inspected and to measure the thickness of the package structure to be inspected. In order to obtain failure images and / or thicknesses at different locations of the package structure to be inspected, the integrated detection unit 3 can move above the base. Specifically, the integrated detection unit 3 is connected to the first driving unit 4, and the first driving unit 4 can drive the integrated detection unit 3 to move along a plane parallel to the upper surface of the base 2 during measurement.
[0039] In one embodiment, in conjunction with reference Figure 1 and Figure 2 The integrated detection unit 3 includes a main support 10, an imaging unit 6, and a distance detection unit 8. The imaging unit 6 and the distance detection unit 8 are respectively fixed on the main support 10. The main support 10 is also fixedly connected to the first driving unit 4. The imaging unit 6 is used to capture failure images of the surface of the package structure to be inspected, and the distance detection unit 8 is used to measure the thickness of the package structure to be inspected. The imaging unit can obtain images corresponding to different sized areas of the surface of the package structure to be inspected by focusing. The distance detection unit 8 can obtain the thickness corresponding to a position of the package structure to be inspected by sequentially detecting. In a specific example, the imaging unit 6 includes a camera, and the distance detection unit 8 includes an infrared rangefinder or a laser rangefinder.
[0040] In one embodiment, the process of the imaging unit 6 capturing a failure image of the surface of the package structure to be inspected and the process of the distance detection unit 8 measuring the thickness of the package structure to be inspected can be performed simultaneously to further improve efficiency.
[0041] In one embodiment, reference continues Figure 2 The imaging unit 6 is fixed to the main support 10 by a rotatable bracket 7. That is, the imaging unit 6 can be rotated to different angles under the action of the rotatable bracket 7 and then take pictures of a certain area of the packaging structure to be tested, so as to obtain multiple pictures of a certain failure area of the packaging structure to be tested from different angles, thereby providing more and more detailed reference for the improvement of the molding process.
[0042] The distance detection unit 8 can be one or more. In one embodiment, when the distance detection unit 8 is multiple (at least two), the multiple distance detection units 8 can be distributed equally or symmetrically on the main support 10.
[0043] In one embodiment, the distance detection unit 8 is further configured to draw a thickness distribution map based on the measured thickness and obtain a curve showing the change between the thickness and the molding parameters, so as to provide more detailed or more reference data for improving the molding process.
[0044] In one embodiment, the first driving unit 4 includes two parallel guide rails, a first slide rail, a second slide rail, a first driving source, and a second driving source. The two ends of the first slide rail are respectively disposed on the two parallel guide rails, and the first slide rail is connected to the first driving source. The first driving source drives the first slide rail to move along a first direction (guide rail direction). The second slide rail straddles the first slide rail and is connected to the second driving source. The second driving source drives the second slide rail to move along a second direction (first slide rail direction), the second direction being perpendicular to the first direction. The first and second driving sources include stepper motors. In a specific embodiment, when the packaging structure to be tested is fixed on the upper surface of the base 2, the horizontal direction parallel to the upper surface of the base 2 has an X-axis direction and a Y-axis direction. The X-axis direction is perpendicular to the Y-axis direction, the first direction is parallel to the X-axis direction, and the second direction is parallel to the Y-axis direction. Therefore, driven by the first driving unit 4, the integrated detection unit 3 can reach any position directly above the package structure to be detected, thus enabling the integrated detection unit 3 to take a picture of any position of the package structure to be detected to obtain a failure image corresponding to that position and to measure the thickness corresponding to that position.
[0045] The roughness measuring unit 5 is disposed on one side of the base 2. The roughness measuring unit 5 is connected to the second driving unit 9. During measurement, the second driving unit 9 drives the roughness measuring unit 5 to move, thereby contacting the surface of the packaging structure to be tested. Then, the roughness measuring unit 5 measures the surface roughness of the packaging structure to be tested.
[0046] In one embodiment, the roughness measuring unit 5 includes a roughness measuring instrument. In another embodiment, the roughness measuring unit 5 is further configured to plot a product roughness distribution map based on the surface roughness obtained from the measurement, so as to provide more detailed or more reference data for improving the molding process.
[0047] In one embodiment, the second driving unit 9 includes a third driving source and a fourth driving source. The third driving source is connected to the fourth driving source, and the fourth driving source is connected to the roughness measuring unit 5. The third driving source drives the roughness measuring unit 5 to move in a direction perpendicular to the upper surface of the base 2, and the fourth driving unit drives the roughness measuring unit 5 to move in a direction parallel to the upper surface of the base 2.
[0048] In a specific embodiment, the fourth driving unit drives the roughness measuring unit 5 to move along a direction parallel to the upper surface of the base 2, including moving along a first direction (e.g., a direction parallel to the X-axis) and a second direction (e.g., a direction parallel to the Y-axis), so that the roughness measuring unit 5 contacts different positions of the surface of the package structure to be tested, thereby obtaining the surface roughness of the package structure surface at different positions.
[0049] In another specific embodiment, the fourth driving unit drives the roughness measuring unit 5 to move in a direction parallel to the upper surface of the base 2. This includes first driving the roughness measuring unit 5 to move in a direction parallel to the upper surface of the base 2 to a certain set position. When the roughness measuring unit 5 moves to contact the surface of the package structure to be tested, the base 2 can be moved back and forth, left and right, so that the roughness measuring unit 5 contacts different positions on the surface of the package structure to be tested, thereby obtaining the surface roughness at different positions on the surface of the package structure to be tested.
[0050] In one embodiment, in conjunction with reference Figure 1 and Figure 3The device for detecting molding failure parameters further includes: a control unit 1, which is electrically connected to the first drive unit 4 and the second drive unit 9, and is used to provide drive control signals to the first drive unit 4 and the second drive unit 9 respectively. The control signals may include a first control signal and a second control signal. The first control signal is provided to the first drive unit 4 and includes at least a signal that drives the integrated detection unit 3 to move. The second control signal is provided to the second drive unit 9 and includes at least a signal that drives the roughness measuring unit 5 to move. The control unit 1 is also electrically connected to the integrated detection unit 3 and the roughness measuring unit 5, and is used to provide detection control signals to the integrated detection unit 3 and the roughness measuring unit 5 respectively. The detection control signals include a first detection control signal and a second detection control signal. The first detection control signal is provided to the integrated detection unit 3 and includes at least a signal that controls the integrated detection unit 3 to perform detection. The second detection control signal is provided to the roughness measuring unit 5 and includes at least a signal that controls the roughness measuring unit 5 to perform measurement.
[0051] In one embodiment, the control unit is a PLC control system.
[0052] Although this application has been disclosed above with reference to preferred embodiments, it is not intended to limit this application. Any person skilled in the art can make possible changes and modifications to the technical solutions of this application by utilizing the methods and techniques disclosed above without departing from the spirit and scope of this application. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the protection scope of the technical solutions of this application.
Claims
1. A device for detecting plastic seal failure parameters, characterized in that, include: The base is used to fix the package structure to be tested. An integrated detection unit is disposed above the base, used to capture failure images of the surface of the package structure to be inspected and to measure the thickness of the package structure to be inspected. A first driving unit, connected to the integrated detection unit, is used to drive the integrated detection unit to move in a plane parallel to the upper surface of the base during measurement. A roughness measuring unit is disposed on one side of the base and is used to measure and obtain the surface roughness of the packaging structure to be inspected; The second driving unit is connected to the roughness measuring unit and is used to drive the roughness measuring unit to move during measurement, thereby contacting the surface of the packaging structure to be inspected.
2. The apparatus for detecting molding failure parameters as described in claim 1, characterized in that, Also includes: The control unit is electrically connected to the first drive unit and the second drive unit, and is used to provide drive control signals to the first drive unit and the second drive unit respectively. The control unit is also electrically connected to the integrated detection unit and the roughness measurement unit, and is used to provide detection control signals to the integrated detection unit and the roughness measurement unit respectively.
3. The apparatus for detecting molding failure parameters as described in claim 2, characterized in that, The control unit is a PLC control system.
4. The apparatus for detecting molding failure parameters as described in claim 1, characterized in that, The integrated detection unit includes a main support, an imaging unit, and a distance detection unit. The imaging unit and the distance detection unit are respectively fixed on the main support. The main support is also fixedly connected to the first driving unit. The imaging unit is used to capture a failure image of the surface of the packaging structure to be inspected. The distance detection unit is used to measure the thickness of the packaging structure to be inspected.
5. The apparatus for detecting molding failure parameters as described in claim 4, characterized in that, The shooting unit is fixed to the main bracket by a rotatable bracket.
6. The apparatus for detecting molding failure parameters as described in claim 4, characterized in that, The shooting unit includes a camera, and the distance detection unit includes an infrared rangefinder or a laser rangefinder.
7. The apparatus for detecting molding failure parameters as described in claim 4, characterized in that, The distance detection unit is also used to draw a thickness distribution map based on the measured thickness and to obtain a curve showing the change between the thickness and the molding parameters.
8. The apparatus for detecting molding failure parameters as described in claim 1 or 4, characterized in that, The first driving unit includes two parallel guide rails, a first slide rail, a second slide rail, a first driving source, and a second driving source. The two ends of the first slide rail are respectively disposed on the two parallel guide rails, and the first slide rail is connected to the first driving source. The first driving source drives the first slide rail to move along a first direction. The second slide rail is straddled on the first slide rail and is connected to the second driving source. The second driving source drives the second slide rail to move along a second direction, which is perpendicular to the first direction.
9. The apparatus for detecting molding failure parameters as described in claim 1, characterized in that, The second driving unit includes a third driving source and a fourth driving source. The third driving source is connected to the fourth driving source, and the fourth driving source is connected to the roughness measuring unit. The third driving source drives the roughness measuring unit to move in a direction perpendicular to the upper surface of the base, and the fourth driving source drives the roughness measuring unit to move in a direction parallel to the upper surface of the base.
10. The apparatus for detecting molding failure parameters as described in claim 1 or 9, characterized in that, The roughness measurement unit includes a roughness measuring instrument; the roughness measurement unit is also used to draw a roughness distribution map of the product based on the surface roughness obtained by the measurement.