Spectral chip and electronic device

Abstract

The utility model provides a spectrum chip and an electronic device, the spectrum chip comprises a light splitting unit and a plurality of light sensing units, the light splitting unit is provided with a light incident side and a light emergent side which are oppositely arranged, the plurality of light sensing units are arranged on the light emergent side of the light splitting unit, each light sensing unit is provided with a light sensing area which is oppositely arranged with the light splitting unit, the plurality of light sensing areas have different areas, so that the light splitting unit is suitable for respectively providing light signals with different luminous fluxes for the plurality of light sensing units under the condition that the light intensity of the light incident side is the same, and the light signals are converted into electric signals by the corresponding light sensing units. By setting the photosensitive areas with different areas, the plurality of photosensitive units can obtain luminous fluxes with different sizes, and the system can select the most suitable image corresponding to the photosensitive unit according to the actual illumination condition, thereby effectively reducing the overexposure or too dark condition, and improving the imaging quality problem when the illumination environment changes drastically.

Description

Technical Field

[0001] This utility model relates to the field of spectral imaging technology, specifically to spectral chips and electronic devices. Background Technology

[0002] A spectroscopic chip is a miniaturized chip integrating multiple optical components. Its main function is to detect and analyze substances by analyzing the wavelength and intensity of light. Spectroscopic chips have a wide range of applications, including but not limited to environmental protection, agriculture, weather forecasting, and medicine. For example, spectroscopic chips can accurately analyze and identify objects, gases, and water quality in the environment.

[0003] In related technologies, there is a one-to-one correspondence between beam-splitting units and photosensitive units, with one photosensitive unit under each beam-splitting unit, and the light-sensing capability of each pixel remains constant. When the lighting environment changes drastically, such as entering a bright light environment from a tunnel, or entering a dark light environment from a bright light environment into a tunnel, the constant light-sensing capability of each pixel can lead to overexposure or underexposure, affecting image quality. Utility Model Content

[0004] Embodiments of this invention provide a spectral chip and an electronic device that can improve the problem of image quality being affected by drastic changes in the lighting environment in related technologies.

[0005] In a first aspect, embodiments of the present invention provide a spectral chip, comprising:

[0006] The beam-splitting unit has an input side and an output side arranged opposite to each other; and

[0007] Multiple photosensitive units are disposed on the light-emitting side of the beam-splitting unit. Each photosensitive unit has a photosensitive area disposed opposite to the beam-splitting unit. The multiple photosensitive areas have different areas, so that under the same light intensity conditions on the light-incident side, the beam-splitting unit is adapted to provide light signals with different light fluxes to the multiple photosensitive units respectively, and the signals are converted into electrical signals by the corresponding photosensitive units.

[0008] In one embodiment, the plurality of photosensitive areas include a first photosensitive area, a second photosensitive area, and a third photosensitive area;

[0009] The area of ​​the first photosensitive area is larger than the area of ​​the second photosensitive area, and the area of ​​the second photosensitive area is larger than the area of ​​the third photosensitive area.

[0010] In one embodiment, the ratio of the area of ​​the second photosensitive area to the area of ​​the first photosensitive area is between 0.5 and 0.8; and / or;

[0011] The ratio of the area of ​​the third photosensitive area to the area of ​​the second photosensitive area is between 0.5 and 0.8.

[0012] In one embodiment, the ratio of the area of ​​the second photosensitive area to the area of ​​the first photosensitive area is 2 / 3; and / or;

[0013] The ratio of the area of ​​the third photosensitive area to the area of ​​the second photosensitive area is 2 / 3.

[0014] In one embodiment, the number of the second photosensitive area and the third photosensitive area is greater than the number of the first photosensitive area.

[0015] In one embodiment, the first photosensitive area is provided, and a plurality of second photosensitive areas and a plurality of third photosensitive areas are arranged together around the first photosensitive area.

[0016] In one embodiment, there are four second photosensitive areas and four third photosensitive areas, and the four second photosensitive areas, the four third photosensitive areas and the first photosensitive area form a 3*3 array arrangement.

[0017] In one embodiment, a plurality of second photosensitive areas and a plurality of third photosensitive areas are arranged alternately around the first photosensitive area.

[0018] In one embodiment, the spectral chip further includes a light-shielding structure;

[0019] The plurality of photosensitive units have the same area, and at least some of the photosensitive units have a light-shielding area opposite to the light-shielding structure, such that the plurality of photosensitive areas have different areas.

[0020] In one embodiment, the beam splitting unit includes a first beam splitting region and a plurality of second beam splitting regions disposed around the first beam splitting region;

[0021] The plurality of photosensitive units include a first photosensitive unit and a plurality of second photosensitive units disposed around the first photosensitive unit;

[0022] The light-shielding structure is arranged around the beam-splitting unit. The first photosensitive unit is opposite to the first beam-splitting area to form the photosensitive area of ​​the first photosensitive unit. A plurality of second photosensitive units correspond one-to-one with a plurality of second beam-splitting areas. A portion of each second photosensitive unit is opposite to the second beam-splitting area to form the photosensitive area of ​​the second photosensitive unit. A portion of each second photosensitive unit is opposite to the light-shielding structure to form the light-shielding area of ​​the second photosensitive unit.

[0023] Secondly, embodiments of this application provide an electronic device including the aforementioned spectral chip.

[0024] In one embodiment, the electronic device further includes an analog-to-digital converter disposed on the side of the plurality of photosensitive units opposite to the beam splitting unit, for converting the electrical signal into a grayscale digital image.

[0025] The beneficial effects of the embodiments of this utility model are as follows:

[0026] In embodiments of this invention, multiple photosensitive units are disposed on the light-emitting side of the beam-splitting unit. Each photosensitive unit has a photosensitive area disposed opposite to the beam-splitting unit, and the multiple photosensitive areas have different areas. This allows the beam-splitting unit to provide light signals with different luminous flux to the multiple photosensitive units under the same light intensity on the incident side, and these signals are converted into electrical signals by the corresponding photosensitive units. In low-light environments, photosensitive units with large photosensitive areas are used to ensure sufficient luminous flux, improving image brightness and clarity. In strong-light environments, photosensitive units with small photosensitive areas are used to avoid excessive light entering the photosensitive units and prevent overexposure. Since multiple photosensitive units can obtain different luminous fluxes, the system can select the most suitable photosensitive unit according to the actual lighting conditions, effectively reducing overexposure or underexposure and improving the overall imaging quality. Photosensitive units with different photosensitive areas can cover different lighting conditions from weak light to strong light, expanding the dynamic range of the imaging system and ensuring that the image maintains good contrast and detail under various lighting conditions. That is, in the embodiments of this utility model, by setting photosensitive areas of different sizes, multiple photosensitive units can obtain different amounts of light flux. The system can select the image corresponding to the most suitable photosensitive unit according to the actual lighting conditions, effectively reducing overexposure or underexposure and improving the imaging quality problem when the lighting environment changes drastically. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a three-dimensional schematic diagram of the spectral chip provided in an embodiment of the present invention;

[0029] Figure 2 yes Figure 1 A top view of the spectral chip in the image;

[0030] Figure 3 yes Figure 2 A cross-sectional view of the spectral chip at point AA;

[0031] Figure 4 yes Figure 1 A top-view schematic diagram of multiple photosensitive units in the image;

[0032] Figure 5 yes Figure 1 A top view of the beam-splitting unit;

[0033] Figure 6 This is a schematic diagram of the structure of the electronic device provided in an embodiment of this utility model;

[0034] Figure 7 This is a flowchart of the spectral imaging method provided in an embodiment of the present invention.

[0035] Explanation of icon numbers:

[0036] 1000, Electronic device; 100, Spectral chip; 10, Spectral splitting unit; 101, Light input side; 102, Light output side; 11, First spectral splitting area; 12, Second spectral splitting area; 20, Photosensitive unit; 201, Photosensitive area; 2011, First photosensitive area; 2012, Second photosensitive area; 2013, Third photosensitive area; 202, Light-shielding area; 21, First photosensitive unit; 22, Second photosensitive unit; 30, Light-shielding structure; 40, Substrate; 200, Analog-to-digital converter. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0038] The following is combined with Figures 1 to 5 Describing the spectral chip of this application, Figure 1 This is a three-dimensional schematic diagram of the spectral chip provided in an embodiment of the present invention. Figure 2 This is a top view schematic diagram of the spectral chip provided in an embodiment of this utility model. Figure 3 This is a cross-sectional schematic diagram of the spectral chip provided in an embodiment of the present invention. Figure 4 This is a top view schematic diagram of multiple photosensitive units provided in an embodiment of this utility model. Figure 5A top view of the beam splitting unit provided in an embodiment of this utility model.

[0039] Reference Figure 1 , Figure 2 and Figure 3 ( Figure 3 In the diagram, dashed lines represent the boundary between the first beam-splitting region 11 and the second beam-splitting region 12 in the beam-splitting unit 10, and dashed lines represent the boundary between the photosensitive region 201 and the light-blocking region 202 in the photosensitive unit 20. To avoid confusion with the boundary lines, Figure 3 (Cross-section lines not shown in the image) The spectral chip 100 includes a beam splitting unit 10 and a plurality of photosensitive units 20. The beam splitting unit 10 has an incident light side 101 and an exit light side 102 disposed opposite to each other. The plurality of photosensitive units 20 are disposed on the exit light side 102 of the beam splitting unit 10. Each photosensitive unit 20 has a photosensitive area 201 disposed opposite to the beam splitting unit 10. The plurality of photosensitive areas 201 have different areas, so that under the same light intensity condition on the incident light side 101, the beam splitting unit 10 is adapted to provide light signals with different light fluxes to the plurality of photosensitive units 20 respectively, and the signals are converted into electrical signals by the corresponding photosensitive units 20.

[0040] In the spectral chip 100 of this invention, a plurality of photosensitive units 20 are disposed on the light-emitting side 102 of the beam-splitting unit 10. Each photosensitive unit 20 has a photosensitive area 201 disposed opposite to the beam-splitting unit 10. The plurality of photosensitive areas 201 have different areas, so that under the same light intensity conditions on the incident side 101, the beam-splitting unit 10 is adapted to provide light signals with different light fluxes to the plurality of photosensitive units 20 respectively, and the signals are converted into electrical signals by the corresponding photosensitive units 20. In low-light environments, the use of photosensitive units 20 with large-area photosensitive areas 201 ensures that the photosensitive units 20 have sufficient light flux, thereby improving image quality. Regarding brightness and clarity, in strong light environments, using photosensitive units 20 with small photosensitive areas 201 avoids excessive light entering the photosensitive unit 20, preventing overexposure. Since multiple photosensitive units 20 can obtain different amounts of luminous flux, the system can select the most suitable photosensitive unit 20 according to actual lighting conditions, effectively reducing overexposure or underexposure and improving overall image quality. Photosensitive units 20 with different photosensitive areas 201 can cover different lighting conditions from low light to strong light, expanding the dynamic range of the imaging system and ensuring good contrast and detail in images under various lighting conditions. In other words, in this embodiment of the invention, by setting photosensitive areas 201 of different sizes, multiple photosensitive units 20 can obtain different amounts of luminous flux. The system can select the image corresponding to the most suitable photosensitive unit 20 according to actual lighting conditions, effectively reducing overexposure or underexposure and improving image quality when the lighting environment changes drastically.

[0041] In some embodiments of this application, the spectral chip 100 further includes a substrate 40 disposed on the side of the plurality of photosensitive units 20 opposite to the beam splitting unit 10. In these embodiments, the substrate 40 serves as the basic structure of the entire spectral chip 100, providing necessary mechanical support. It ensures that the beam splitting unit 10, photosensitive units 20, and other components can be stably assembled together, preventing deformation or damage during manufacturing, installation, or use. The substrate 40 typically contains pre-designed circuit wiring for connecting the photosensitive units 20 and other electronic components (such as analog-to-digital converters 200, control devices, etc.). These circuit wirings are responsible for transmitting the electrical signals generated by the photosensitive units 20 to subsequent processing units, ensuring efficient signal transmission. The substrate 40 can also provide a good grounding path, reducing electromagnetic interference (EMI) and improving the system's noise immunity and stability. In addition, the substrate 40 can also provide a certain degree of shielding, protecting the internal circuitry from the influence of the external electromagnetic environment. The photosensitive units 20 and electronic components generate heat during operation. The substrate 40 typically has good thermal conductivity, effectively dissipating the heat and maintaining the operating temperature of the spectral chip 100 within a reasonable range. This is crucial for maintaining the long-term stability and reliability of the spectral chip 100. The substrate 40, as part of the package, provides additional physical protection, preventing dust, moisture, and other contaminants from entering the spectral chip 100 and extending its lifespan. The design of the substrate 40 typically also considers integration requirements with other systems or devices, providing standardized interfaces and mounting methods, simplifying the overall system assembly process. The selection of substrate 40 materials and surface treatment can also reduce unnecessary light reflection and interference, ensuring that incident light can efficiently pass through the beam splitter 10 to the photosensitive unit 20, improving imaging quality and the accuracy of spectral analysis.

[0042] In some embodiments of this application, Figure 4 ( Figure 4(The dashed lines in the diagram represent the orthographic projection boundaries of the beam-splitting unit 10 onto the plurality of photosensitive units 20). The plurality of photosensitive areas 201 include a first photosensitive area 2011, a second photosensitive area 2012, and a third photosensitive area 2013; the area of ​​the first photosensitive area 2011 is larger than the area of ​​the second photosensitive area 2012, and the area of ​​the second photosensitive area 2012 is larger than the area of ​​the third photosensitive area 2013. In these embodiments, three photosensitive areas 201 of different sizes are provided, enabling the plurality of photosensitive units 20 to adapt to a wide range of lighting conditions and achieve multi-scale luminous flux management. Specifically, the photosensitive unit 20 with a large first photosensitive area 2011 is suitable for operation under low-light conditions, capturing more light and ensuring clear visibility of details in dark areas. The photosensitive unit 20 with a medium-sized second photosensitive area 2012 is suitable for medium-light conditions, providing a balanced luminous flux that is neither overexposed nor underexposed. The small-area third photosensitive area 2013 of the photosensitive unit 20 is specifically designed for high-light conditions, reducing excessive light entering the photosensitive unit 20 and preventing image overexposure. The three photosensitive areas 201 of different sizes cover a wide range of lighting conditions, from low to high light, enabling the system to maintain good image quality under a broader spectrum of illumination. This contributes to a higher dynamic range, allowing for the simultaneous capture of details in both the brightest and darkest areas. By setting three photosensitive areas 201 of different sizes, the system can select the most suitable photosensitive unit 20 to operate based on actual lighting conditions. This hierarchical design allows for finer control over the light sensitivity of each pixel, improving the overall resolution and sensitivity of the image.

[0043] Understandably, multiple photosensitive units 20 can include more photosensitive areas 201 of different sizes, such as four, five, six, or more photosensitive areas 201 of different sizes. Increasing the number of photosensitive areas 201 of different sizes allows the system to cover a wider range of lighting conditions, from extremely dark to extremely bright, providing a higher dynamic range. Each newly added photosensitive area 201 can provide optimal luminous flux within a specific lighting range, thus adapting more precisely to different environments. More photosensitive areas 201 of different sizes mean that the light sensitivity of each pixel can be adjusted more finely, improving the overall resolution and sensitivity of the image. Especially under extreme lighting conditions (such as very dark or very bright), more photosensitive areas 201 can ensure that details are not lost, improving image quality. More flexible adaptive capabilities are achieved through a more sophisticated intelligent selection mechanism. The system can more accurately select the most suitable photosensitive unit 20 according to lighting conditions, further reducing overexposure or underexposure and improving imaging results. Photosensitive units 20 with more photosensitive areas 201 of different sizes can provide more customized solutions for these special needs. However, introducing more photosensitive areas 201 of varying sizes increases the complexity of the algorithm, as the system needs to process more preset configurations and make the optimal choice in a short time. This may require more powerful processors and more efficient algorithms for real-time processing, increasing hardware costs and technical difficulty. Furthermore, the manufacturing process requires more precise design and higher-level manufacturing processes to ensure that the size and position of the photosensitive area 201 of each photosensitive unit 20 meet design requirements. This may lead to increased production costs and place higher demands on mass production and quality control. As the number of photosensitive units 20 increases, how to rationally arrange these photosensitive units 20 within a limited space becomes an important issue, making compact and efficient array arrangements even more critical.

[0044] In some embodiments, as Figure 4 As shown, the photosensitive area 201 includes only a first photosensitive area 2011, a second photosensitive area 2012, and a third photosensitive area 2013. By introducing three photosensitive areas 201 of different sizes, the design of the intelligent selection mechanism can be simplified. The system only needs to select one of three preset configurations based on the lighting conditions, instead of processing countless possible situations, thus reducing the complexity of the algorithm and improving the response speed. For most common applications, three photosensitive areas 201 of different sizes can meet a wide range of needs while maintaining low algorithm complexity and cost, achieving a balance between flexibility and complexity.

[0045] In some embodiments of this application, the ratio of the area of ​​the second photosensitive area 2012 to the area of ​​the first photosensitive area 2011 is between 0.5 and 0.8. In these embodiments, the area of ​​the second photosensitive area 2012 is 0.5 to 0.8 times that of the first photosensitive area 2011, which means that the photosensitive unit 20 corresponding to the second photosensitive area 2012 can obtain an appropriate amount of light flux under moderate lighting conditions. If the ratio is less than 0.5, the photosensitive unit 20 corresponding to the second photosensitive area 2012 may not be able to capture enough light, resulting in a dim image; if the ratio is greater than 0.8, the difference is too small, weakening its ability to adapt to different lighting conditions. This ratio range ensures that the second photosensitive area 2012 does not introduce too much noise due to its small area. The smaller second photosensitive area 2012 needs to maintain a certain area to collect enough photons, thereby reducing the influence of random noise and improving image quality. Setting the ratio between 0.5 and 0.8 allows the system to flexibly adjust according to lighting conditions, avoiding both overly conservative and overly aggressive approaches. This reduces algorithm complexity and improves response speed. This ratio range is relatively easy to achieve using existing manufacturing processes, requiring no extremely precise machining, while also avoiding design challenges caused by ratios that are too large or too small, thus ensuring production stability and cost-effectiveness.

[0046] In some embodiments of this application, the ratio of the area of ​​the third photosensitive area 2013 to the area of ​​the second photosensitive area 2012 is between 0.5 and 0.8. In these embodiments, the area of ​​the third photosensitive area 2013 is 0.5 to 0.8 times that of the second photosensitive area 2012. If the ratio is less than 0.5, the third photosensitive area 2013 may not work effectively due to its small area; if the ratio is greater than 0.8, it may lead to insufficient light throughput control, affecting image quality. Setting the ratio between 0.5 and 0.8 allows the system to more accurately select the most suitable area configuration of the photosensitive area 201 according to actual lighting conditions, further reducing overexposure or underexposure. This ratio range is also applicable to existing manufacturing processes, ensuring stability and cost-effectiveness in the production process, while also facilitating quality control.

[0047] In some embodiments of this application, the area ratio of the second photosensitive area 2012 to the area of ​​the first photosensitive area 2011 is 2 / 3. In these embodiments, this 2 / 3 ratio ensures that the second photosensitive area 2012 can provide adequate luminous flux under moderate lighting conditions. It avoids being too small to capture enough light, or too large to cause functional overlap with the first photosensitive area 2011. This fixed ratio ensures that the second photosensitive area 2012 maintains a certain area to collect enough photons, thereby reducing the impact of random noise and maintaining a good signal-to-noise ratio. The 2 / 3 ratio is a clear and easily implemented standard, allowing the system to quickly and accurately select the most suitable area configuration of the photosensitive area 201 according to lighting conditions, reducing algorithm complexity and improving response speed. The 2 / 3 ratio is relatively easy to achieve using existing manufacturing processes, requiring no extremely precise machining, while ensuring production stability and cost-effectiveness. Furthermore, the standard ratio facilitates mass production and quality control.

[0048] In some embodiments of this application, the area of ​​the third photosensitive area 2013 is in a 2 / 3 ratio with the area of ​​the second photosensitive area 2012. This 2 / 3 ratio ensures that the third photosensitive area 2013 can operate effectively in low-light environments, preventing insufficient light intake by the photosensitive unit 20 and avoiding underexposure. The 2 / 3 ratio allows the system to more accurately select the most suitable area configuration of the photosensitive area 201 based on actual lighting conditions, further reducing overexposure or underexposure and improving imaging quality. The 2 / 3 ratio is also applicable to existing manufacturing processes, ensuring stability and cost-effectiveness in production while facilitating quality control.

[0049] In some embodiments of this application, the ratio of the area of ​​the second photosensitive area 2012 to the area of ​​the first photosensitive area 2011 is 2 / 3; and the ratio of the area of ​​the third photosensitive area 2013 to the area of ​​the second photosensitive area 2012 is 2 / 3. In these embodiments, setting the area of ​​the second photosensitive area 2012 to 2 / 3 of the area of ​​the first photosensitive area 2011, and the area of ​​the third photosensitive area 2013 to 2 / 3 of the area of ​​the second photosensitive area 2012 (i.e., the area of ​​each subsequent photosensitive area 201 is 2 / 3 of the area of ​​the previous photosensitive area 201), this design brings several advantages. Using a fixed 2 / 3 ratio can greatly simplify the chip design process. Design and manufacturing only need to follow this ratio rule to ensure that the relative size relationship between different photosensitive areas 201 is consistent, reducing design complexity. Standardized ratios facilitate the implementation of manufacturing processes. Existing semiconductor manufacturing technologies can relatively easily produce photosensitive areas 201 that conform to this ratio, reducing production difficulty, improving yield, and facilitating large-scale production and quality control. By gradually reducing the area of ​​the photosensitive area 201 by 2 / 3, progressive luminous flux management can be provided under different lighting conditions. The large first photosensitive area 2011 is suitable for low-light environments, the medium-sized second photosensitive area 2012 is suitable for medium lighting conditions, and the small third photosensitive area 2013 is suitable for strong light environments, thus achieving progressive luminous flux management. This progressive area change avoids extreme situations, such as luminous flux imbalance caused by a photosensitive area 201 being too large or too small. Each photosensitive area 201 corresponds to a photosensitive unit 20 that can operate under its most suitable lighting conditions, ensuring the stability and reliability of the system. The fixed 2 / 3 ratio also simplifies the design of the intelligent selection mechanism, reduces algorithm complexity, and improves response speed and adaptability.

[0050] In some embodiments of this application, the number of second photosensitive areas 2012 and third photosensitive areas 2013 is greater than the number of first photosensitive areas 2011. In these embodiments, the greater number of second photosensitive areas 2012 and third photosensitive areas 2013 means that more pixels can be used to capture the mid-brightness and high-brightness areas of the image. This helps to improve the overall resolution of the image, especially under complex lighting conditions, and better preserves details. More second photosensitive areas 2012 and third photosensitive areas 2013 can provide denser data points, making spectral analysis more refined and suitable for applications requiring high-precision spectral information. More second photosensitive areas 2012 (medium area) and third photosensitive areas 2013 (small area) can provide a wider range of luminous flux management under different lighting conditions. The large area of ​​the first photosensitive area 2011 ensures good performance of the photosensitive unit 20 under low-light conditions, while more second photosensitive areas 2012 and third photosensitive areas 2013 enhance adaptability to medium and strong light conditions, thereby expanding the dynamic range of the entire system. By increasing the number of second photosensitive areas 2012 and third photosensitive areas 2013 (that is, increasing the number of corresponding photosensitive units 20), the system can more flexibly adjust the light throughput under different lighting conditions, reducing overexposure or underexposure and improving image quality. Increasing the number of second photosensitive areas 2012 and third photosensitive areas 2013 can provide data redundancy, improving the system's reliability and fault tolerance. Even if some photosensitive units 20 fail or their performance degrades, other photosensitive units 20 can still function normally, ensuring that image quality is not affected.

[0051] In some embodiments of this application, as Figure 4 As shown, a first photosensitive area 2011 is provided, and multiple second photosensitive areas 2012 and multiple third photosensitive areas 2013 are arranged around the first photosensitive area 2011. In these embodiments, the single first photosensitive area 2011 is located in the center, and the corresponding photosensitive unit 20 can focus on capturing image information or spectral data within a specific wavelength range in low-light environments. Due to its large area, it can provide sufficient light flux under low-light conditions, ensuring clear visibility of details in dark areas. The multiple second photosensitive areas 2012 and third photosensitive areas 2013 are arranged around the first photosensitive area 2011, which can flexibly adapt to different lighting conditions. The large area of ​​the first photosensitive area 2011 ensures the performance of the corresponding photosensitive unit 20 under low-light conditions, while the peripheral second photosensitive areas 2012 and third photosensitive areas 2013 can provide finer light flux control under medium and strong light conditions. This layout forms a compact and efficient arrangement, maximizing space utilization and helping to achieve a compact design, reducing the size of the spectral chip 100.

[0052] In some embodiments of this application, as Figure 4As shown, there are four second photosensitive areas 2012 and four third photosensitive areas 2013, forming a 3x3 array arrangement with four second photosensitive areas 2012, four third photosensitive areas 2013, and one first photosensitive area 2011. In these embodiments, the 3x3 array arrangement allows all photosensitive units 20 to be tightly arranged in a small area, maximizing the utilization of the area of ​​the spectral chip 100. This compact design not only improves space utilization but also facilitates subsequent data processing and image reconstruction. The four second photosensitive areas 2012 and four third photosensitive areas 2013 surround a single first photosensitive area 2011, forming a symmetrical and uniform layout that ensures uniform light distribution, reduces shadow effects, and improves image consistency and quality. The 3x3 array arrangement is a standardized design that facilitates implementation during the design and manufacturing process. Fixed layout rules reduce design complexity while ensuring stability and cost-effectiveness during production. The standardized 3x3 array simplifies the design of intelligent selection mechanisms and data processing algorithms, reducing algorithm complexity and improving response speed.

[0053] In some embodiments of this application, multiple second photosensitive areas 2012 and multiple third photosensitive areas 2013 are alternately arranged around a first photosensitive area 2011. In these embodiments, the first photosensitive area 2011 is located in the center, and four second photosensitive areas 2012 and four third photosensitive areas 2013 surround the first photosensitive area 2011, forming a 3*3 array. The second photosensitive areas 2012 and third photosensitive areas 2013 are alternately distributed around the perimeter. This alternating arrangement allows each photosensitive unit 20 to receive light more evenly, reducing shadow effects caused by uneven distribution. This symmetrical and uniform layout helps improve image consistency and quality. The alternating arrangement forms a regular and symmetrical layout, facilitating subsequent data processing and image reconstruction algorithm design. This standardized arrangement reduces algorithm complexity and improves response speed. Specifically, the four corners can be the second photosensitive area 2012, while the middle of the four sides is the third photosensitive area 2013, or conversely, the four corners can be the third photosensitive area 2013, while the middle of the four sides is the second photosensitive area 2012.

[0054] In some embodiments of this application, multiple second photosensitive areas 2012 and multiple third photosensitive areas 2013 are alternately arranged around a first photosensitive area 2011, with the four third photosensitive areas 2013 located at the four corners of the array. In these embodiments, the four corner positions are chosen to be the locations of the third photosensitive areas 2013 (small area), while the middle positions of the four sides are chosen to be the locations of the second photosensitive areas 2012 (medium area). This arrangement allows the light flux to gradually decrease from the first photosensitive area 2011 (large area) to the periphery, forming a natural gradient. This helps to more finely control the distribution of light flux, especially in strong light environments, and can better prevent overexposure. The medium-sized second photosensitive areas 2012, located in the middle of the edges, can balance the light flux, ensuring that appropriate light intensity is provided under medium lighting conditions, and avoiding abrupt changes between corners and edges. Placing the smaller third photosensitive areas 2013 in the corner positions allows the light to be distributed more evenly across the entire array. Corner positions are typically where light is most easily blocked, so using a smaller third photosensitive area 2013 can reduce the impact of shadow effects and ensure that each photosensitive unit 20 receives relatively uniform light. The second photosensitive area 2012, located at the edge, has a larger area and can collect light more effectively under medium lighting conditions, improving the overall luminous flux utilization rate.

[0055] This application does not limit how multiple photosensitive units 20 have different photosensitive areas 201. In some examples, the multiple photosensitive units 20 themselves have different areas, and the entire area of ​​each photosensitive unit 20 forms its photosensitive area 201, obtaining different luminous flux from the beam-splitting unit 10 under the same light intensity. In low-light environments, larger photosensitive units 20 can capture more light, thereby improving the brightness and clarity of the image. In bright light environments, smaller photosensitive units 20 can prevent excessive light from entering, thus preventing overexposure.

[0056] In some embodiments of this application, the spectral chip 100 further includes a light-shielding structure 30; multiple photosensitive units 20 have the same area, and at least some photosensitive units 20 have a light-shielding region 202 opposite to the light-shielding structure 30, so that the multiple photosensitive regions 201 have different areas. In these embodiments, the multiple photosensitive units 20 initially have the same area, but the light-shielding structure 30 enables some photosensitive units 20 to have a light-shielding region 202, thereby making the areas of the photosensitive regions 201 different. The light-shielding structure 30 changes the effective area of ​​the photosensitive unit 20 that actually receives light, thus affecting the luminous flux. This design has great flexibility. The light-shielding structure 30 can be adjusted according to specific needs and application scenarios to achieve different configurations of the area of ​​the photosensitive region 201. For example, in different models of electronic devices 1000, the light-shielding structure 30 can be flexibly adjusted according to the usage environment and imaging requirements of the device to optimize the performance of the spectral chip 100. Compared with directly setting photosensitive units 20 with different areas, the size of the area of ​​the photosensitive region 201 can be controlled more precisely. In some devices that require extremely high image quality, this precise adjustment capability helps improve the resolution and accuracy of detection.

[0057] In some embodiments of this application, see Figure 4 and Figure 5 ( Figure 5(The boundary between the first beam-splitting region 11 and the second beam-splitting region 12 in the beam-splitting unit 10 is indicated by a dashed line.) The beam-splitting unit 10 includes a first beam-splitting region 11 and a plurality of second beam-splitting regions 12 arranged around the first beam-splitting region 11. The plurality of photosensitive units 20 include a first photosensitive unit 21 and a plurality of second photosensitive units 22 arranged around the first photosensitive unit 21. The light-shielding structure 30 is arranged around the beam-splitting unit 10. The first photosensitive unit 21 is opposite to the first beam-splitting region 11 to form the photosensitive region 201 of the first photosensitive unit 21. The plurality of second photosensitive units 22 are respectively corresponding one-to-one with the plurality of second beam-splitting regions 12. A portion of each second photosensitive unit 22 is opposite to the second beam-splitting region 12 to form the photosensitive region 201 of the second photosensitive unit 22. A portion of each second photosensitive unit 22 is opposite to the light-shielding structure 30 to form the light-shielding region 202 of the second photosensitive unit 22. In these embodiments, the first photosensitive unit 21 is opposite to the first beam-splitting region 11. This relative relationship allows the light signal emitted by the first beam-splitting region 11 to be directly received by the first photosensitive unit 21, and the entire first photosensitive unit 21 forms its photosensitive area 201. Multiple second photosensitive units 22 correspond one-to-one with multiple second beam-splitting regions 12. Each second photosensitive unit 22 partially faces a second beam-splitting region 12, forming its photosensitive area 201. Simultaneously, a portion of each second photosensitive unit 22 faces a light-shielding structure 30, forming its light-shielding area 202. Since multiple photosensitive units 20 have the same area, only one beam-splitting unit 10 and one light-shielding structure 30 are needed to define the light-shielding area 202 and photosensitive area 201 of the multiple photosensitive units 20, achieving photosensitive areas 201 of different areas. Compared to other designs that may require multiple complex components or multiple independent light-shielding and beam-splitting structures, this design greatly reduces the number of components required. Due to the simple structure, the complexity of the manufacturing process is also reduced accordingly. It is not necessary to design complex light-shielding and beam-splitting structures for each photosensitive unit 20, reducing the number of steps in the manufacturing process, improving production efficiency, and reducing manufacturing costs. A simple structure usually means higher stability and reliability. Fewer components and relatively simple connections make the entire system less prone to failure due to too many components during operation. For example, during long-term use, problems such as loosening of the light-shielding structure 30 and misalignment between the beam-splitting unit 10 and the photosensitive unit 20 are less likely to occur, ensuring the long-term stable operation of the spectral chip 100 and reducing equipment maintenance costs.

[0058] Reference Figure 6 , Figure 5 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present invention. According to an embodiment of the second aspect of this application, the electronic device 1000 includes the above-described spectral chip 100.

[0059] In the electronic device 1000 of this invention, the spectral chip 100 includes a beam splitting unit 10 and a plurality of photosensitive units 20. The beam splitting unit 10 has an incident light side 101 and an exit light side 102 disposed opposite to each other. The plurality of photosensitive units 20 are disposed on the exit light side 102 of the beam splitting unit 10. Each photosensitive unit 20 has a photosensitive area 201 disposed opposite to the beam splitting unit 10. The plurality of photosensitive areas 201 have different areas, so that under the same light intensity condition on the incident light side 101, the beam splitting unit 10 is suitable for providing light signals with different luminous flux to the plurality of photosensitive units 20 respectively, and the signals are converted into electrical signals by the corresponding photosensitive units 20. In a dark light environment, the photosensitive area of ​​the large-area photosensitive area 201 is used. Unit 20 ensures that the photosensitive unit 20 has sufficient light flux, improving image brightness and clarity. In strong light environments, using photosensitive units 20 with small photosensitive areas 201 avoids excessive light entering the photosensitive unit 20, preventing overexposure. Since multiple photosensitive units 20 can obtain different amounts of light flux, the system can select the most suitable photosensitive unit 20 according to actual lighting conditions, effectively reducing overexposure or underexposure and improving overall image quality. Photosensitive units 20 with different photosensitive areas 201 can cover different lighting conditions from weak to strong light, expanding the dynamic range of the imaging system, allowing images to maintain good contrast and detail under various lighting conditions. That is, in the embodiments of this utility model, by setting photosensitive areas 201 of different sizes, multiple photosensitive units 20 can obtain different amounts of light flux. The system can select the image corresponding to the most suitable photosensitive unit 20 according to actual lighting conditions, effectively reducing overexposure or underexposure and improving image quality when the lighting environment changes drastically.

[0060] Reference Figure 6In some embodiments of this application, the electronic device 1000 further includes an analog-to-digital converter (ADC) 200. The ADC 200 is located on the side of the plurality of photosensitive units 20 opposite to the beam splitting unit 10, and is used to convert electrical signals from analog to digital to obtain a grayscale digital image. Through the ADC 200, the electrical signals are converted into digital signals, which facilitates subsequent digital image processing. Digital signals are easier to store, transmit, and analyze, thereby improving the efficiency of image processing. The ADC 200 can provide high-precision and stable digital representation, ensuring that the converted grayscale digital image retains the detailed information of the original image, improving the accuracy of image processing. Digital image formats have better compatibility and scalability. The grayscale digital image after analog-to-digital conversion can easily interact with various digital devices and software, broadening the application scenarios of the image. After the ADC 200 converts the analog electrical signals into digital images, they can be efficiently stored in the memory of the electronic device 1000 or remotely transmitted via a network. The introduction of the analog-to-digital converter 200 makes the signal processing flow of the entire electronic device 1000 more digital and automated, reducing the need for manual intervention and thus improving the overall performance and stability of the system.

[0061] Reference Figure 7 , Figure 7 This is a flowchart of a spectral imaging method provided by an embodiment of this application. According to an embodiment of a third aspect of this application, the spectral imaging method is based on the electronic device 1000 as described above, and includes the following steps:

[0062] Step S10: Acquire multiple grayscale digital images provided by the analog-to-digital converter 200.

[0063] In this step, under the same light intensity conditions on the incident light side 101, the beam splitting unit 10 can provide light signals with different luminous flux to the multiple photosensitive units 20. After passing through the analog-to-digital converter 200, multiple grayscale digital images with different grayscale levels can be obtained. Specifically, the photosensitive unit 20 in the first photosensitive area 2011 (large area) receives a larger luminous flux, corresponding to a higher grayscale level image (first grayscale level). The photosensitive unit 20 in the second photosensitive area 2012 (medium area) receives a moderate luminous flux, corresponding to a medium grayscale level image (second grayscale level). The photosensitive unit 20 in the third photosensitive area 2013 (small area) receives a smaller luminous flux, corresponding to a lower grayscale level image (third grayscale level).

[0064] Step S20: Output a grayscale digital image that conforms to the preset grayscale level.

[0065] In this step, based on multiple grayscale digital images with different grayscale levels provided by the analog-to-digital converter 200, a grayscale digital image that conforms to the preset grayscale level is intelligently selected and output. This process simplifies the user's operation and provides a more intelligent selection mechanism. Since multiple photosensitive units 20 receive light signals with different light fluxes, the system can select images that are neither too overexposed nor too dark. Specifically, the system evaluates the brightness distribution of each grayscale digital image and selects the grayscale digital image that is closest to the preset grayscale level, thereby ensuring that the final output grayscale digital image will not lose details due to overexposure, nor will it be blurry due to underexposure. Specifically, in a strong light environment, the third grayscale level (lower grayscale level) corresponding to the photosensitive unit 20 in the third photosensitive area 2013 (small area) conforms to the preset grayscale level, ensuring that the output image is not too bright and avoiding overexposure. In a medium-intensity light environment, the second grayscale level (medium grayscale level) corresponding to the photosensitive unit 20 in the second photosensitive area 2012 (medium area) conforms to the preset grayscale level, ensuring that the output image maintains good contrast and detail. In low-light environments, the first gray level (higher gray level) corresponding to the photosensitive unit 20 in the first photosensitive area 2011 (large area) conforms to the preset gray level, ensuring the brightness and clarity of the output image. This ensures the optimal performance of the electronic device 1000 under various lighting conditions, effectively selecting the best quality image that is neither too overexposed nor too underexposed.

[0066] It should be noted that the above embodiments are only illustrated by the example of multiple photosensitive areas 201 having three different areas. Of course, in other embodiments, the multiple photosensitive areas 201 may also have four, five, six or more different areas, which can be set as needed. This application does not limit this.

[0067] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A spectral chip, characterized in that, include: The beam splitter has an input side and an output side that are arranged opposite to each other; as well as, Multiple photosensitive units are disposed on the light-emitting side of the beam-splitting unit. Each photosensitive unit has a photosensitive area disposed opposite to the beam-splitting unit. The multiple photosensitive areas have different areas, so that under the same light intensity conditions on the light-incident side, the beam-splitting unit is adapted to provide light signals with different light fluxes to the multiple photosensitive units respectively, and the signals are converted into electrical signals by the corresponding photosensitive units.

2. The spectral chip according to claim 1, characterized in that, The plurality of photosensitive areas include a first photosensitive area, a second photosensitive area, and a third photosensitive area; The area of ​​the first photosensitive area is larger than the area of ​​the second photosensitive area, and the area of ​​the second photosensitive area is larger than the area of ​​the third photosensitive area.

3. The spectral chip according to claim 2, characterized in that, The ratio of the area of ​​the second photosensitive area to the area of ​​the first photosensitive area is between 0.5 and 0.8; and / or; The ratio of the area of ​​the third photosensitive area to the area of ​​the second photosensitive area is between 0.5 and 0.

8.

4. The spectral chip according to claim 3, characterized in that, The ratio of the area of ​​the second photosensitive area to the area of ​​the first photosensitive area is 2 / 3; and / or; The ratio of the area of ​​the third photosensitive area to the area of ​​the second photosensitive area is 2 / 3.

5. The spectral chip according to claim 2, characterized in that, The number of the second and third photosensitive areas is greater than the number of the first photosensitive areas.

6. The spectral chip according to claim 5, characterized in that, The first photosensitive area has one portion, and a plurality of second photosensitive areas and a plurality of third photosensitive areas are arranged together around the first photosensitive area.

7. The spectral chip according to claim 6, characterized in that, There are four second photosensitive areas and four third photosensitive areas. The four second photosensitive areas, the four third photosensitive areas and one first photosensitive area form a 3*3 array arrangement.

8. The spectral chip according to claim 7, characterized in that, Multiple second photosensitive areas and multiple third photosensitive areas are arranged alternately around the first photosensitive area.

9. The spectral chip according to any one of claims 1 to 8, characterized in that, The spectral chip also includes a light-shielding structure; The plurality of photosensitive units have the same area, and at least some of the photosensitive units have a light-shielding area opposite to the light-shielding structure, such that the plurality of photosensitive areas have different areas.

10. The spectral chip according to claim 9, characterized in that, The beam splitting unit includes a first beam splitting region and a plurality of second beam splitting regions arranged around the first beam splitting region; The plurality of photosensitive units include a first photosensitive unit and a plurality of second photosensitive units disposed around the first photosensitive unit; The light-shielding structure is arranged around the beam-splitting unit. The first photosensitive unit is opposite to the first beam-splitting area to form the photosensitive area of ​​the first photosensitive unit. A plurality of second photosensitive units correspond one-to-one with a plurality of second beam-splitting areas. A portion of each second photosensitive unit is opposite to the second beam-splitting area to form the photosensitive area of ​​the second photosensitive unit. A portion of each second photosensitive unit is opposite to the light-shielding structure to form the light-shielding area of ​​the second photosensitive unit.

11. An electronic device, characterized in that, Includes the spectral chip as described in any one of claims 1 to 10.

12. The electronic device according to claim 11, characterized in that, The electronic device further includes an analog-to-digital converter, which is located on the side of the plurality of photosensitive units away from the beam splitting unit, for converting the electrical signal into a grayscale digital image.

Images