4U server capable of efficiently dissipating heat

Abstract

The utility model provides a 4U server capable of efficiently dissipating heat, which comprises a server case, a power supply module, a rear-end heat dissipation fan module, a middle upper-layer fan module, a middle lower-layer fan module, a mainboard tray, a mainboard and a GPU (Graphic Processing Unit) adapter plate, and is characterized in that the power supply module is arranged on one side of the server case through a power supply mounting frame; the rear-end cooling fan module is arranged on the other side of the server case through a rear-end fan mounting frame; the main board is arranged above the rear-end fan mounting frame through the main board tray, and the position of the main board corresponds to the position of the middle upper-layer fan module; the GPU adapter plate is arranged at the front end of the server case, and the position of the GPU adapter plate corresponds to the position of the rear-end cooling fan module and the position of the middle lower-layer fan module. According to the technical scheme of the utility model, the structure of the 4U server is optimally designed, so that the efficient and reliable heat dissipation effect is ensured, and the heat dissipation interference among the modules is avoided. And assembly and maintenance of products are facilitated, and the overall structure is more reasonable, efficient and reliable.

Description

Technical Field

[0001] This utility model relates to a 4U server, and more particularly to a 4U server capable of efficient heat dissipation. Background Technology

[0002] A 4U server is a rack-mount server size specification, where "U" stands for Unit, a standard unit for measuring server height. 1U equals 1.75 inches (approximately 44.45 mm). Therefore, the height of a 4U server is 4U × 1.75 inches = 7 inches (approximately 177.8 mm), and the width is typically 19 inches (48.26 cm). Due to its larger size, a 4U server offers more internal space, accommodating more hard drives, expansion slots, and GPU modules, supporting greater configuration flexibility and more powerful computing capabilities, resulting in a wider range of applications. This also leads to higher heat dissipation requirements. Simply utilizing existing server layout designs and cooling structures cannot adequately meet the actual needs for efficient heat dissipation. Therefore, further optimization of the 4U server structure is necessary to ensure efficient and reliable heat dissipation. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a 4U server with efficient heat dissipation. The aim is to ensure efficient and reliable heat dissipation through optimized design of the 4U server structure, and to facilitate product assembly and maintenance.

[0004] To address this issue, this utility model provides a 4U server capable of efficient heat dissipation, comprising: a server chassis, a power supply module, a rear-end cooling fan module, a middle upper-layer fan module, a middle lower-layer fan module, a motherboard tray, a motherboard, and a GPU adapter board. The server chassis has a power supply mounting frame and a rear-end fan mounting frame at its rear end. The power supply module is mounted on one side of the server chassis via the power supply mounting frame, and the rear-end cooling fan module is mounted on the other side of the server chassis via the rear-end fan mounting frame. The motherboard is mounted above the rear-end fan mounting frame via the motherboard tray, and the position of the motherboard corresponds to the position of the middle upper-layer fan module. The GPU adapter board is located at the front end of the server chassis, and the position of the GPU adapter board corresponds to the positions of the rear-end cooling fan module and the middle lower-layer fan module.

[0005] A further improvement of this utility model is that it also includes an air guide cover, which is disposed on the CPU module and memory module of the motherboard.

[0006] A further improvement of this utility model is that the CPU module is located in the middle area of ​​the motherboard, and the memory modules are symmetrically arranged on both sides of the CPU module.

[0007] A further improvement of this utility model is that it also includes an air guide plate, which is disposed between the upper middle fan module and the lower middle fan module.

[0008] A further improvement of this utility model is that the upper middle fan module and the lower middle fan module are staggered by the air guide plate, and the upper middle fan module is located on the side of the lower middle fan module near the front of the server chassis.

[0009] A further improvement of this utility model is that it also includes a hard disk enclosure and a hard disk tray, wherein the hard disk enclosure is disposed at the rear end of the server chassis via the hard disk tray.

[0010] A further improvement of this utility model is that a tray mounting frame is provided at the rear end of the server chassis, the height of the tray mounting frame is the same as the height of the rear fan mounting frame, and the tray mounting frame is disposed between the power supply mounting frame and the rear fan mounting frame.

[0011] A further improvement of this utility model is that the hard disk tray is vertically positioned within the tray mounting frame.

[0012] A further improvement of this utility model is that it also includes a power adapter board, which is disposed on the side of the server chassis near the power module, and the power adapter board is connected to the power module, the motherboard and the GPU adapter board respectively.

[0013] A further improvement of this utility model is that it also includes a power distribution board, wherein the power adapter board is plugged into the power module via the power distribution board.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: A power supply mounting frame and a rear fan mounting frame are provided at the rear of the server chassis. The power supply module is mounted on one side of the server chassis via the power supply mounting frame, and the rear cooling fan module is mounted on the other side of the server chassis via the rear fan mounting frame. The motherboard is mounted above the rear fan mounting frame via the motherboard tray, and the position of the motherboard corresponds to the position of the upper middle fan module. This allows for independent heat dissipation of the motherboard in the upper part of the server chassis and effectively avoids heat dissipation interference with the power supply module. Furthermore, a GPU adapter board is provided at the front of the server chassis, and the position of the GPU adapter board corresponds to the positions of the rear cooling fan module and the lower middle fan module. This utilizes the lower space of the server chassis to achieve independent heat dissipation of the GPU module and avoids interference with the heat dissipation of the motherboard and the power supply module.

[0015] Therefore, this utility model sets up a power supply mounting frame and a rear fan mounting frame at the rear of the server chassis. This not only ensures efficient and reliable heat dissipation through structural optimization of the 4U server and avoids heat dissipation interference between modules, but also enables the installation and fixation of corresponding modules using the overall power supply mounting frame and rear fan mounting frame. It also provides support and isolation for the motherboard tray and its motherboard, which is beneficial for product assembly and maintenance. The overall structure is more reasonable, efficient and reliable. Attached Figure Description

[0016] Figure 1 This is an exploded structural diagram of one embodiment of the present invention;

[0017] Figure 2 This is a partial structural schematic diagram of one embodiment of the present invention;

[0018] Figure 3 This is a rear view diagram of an embodiment of the present invention after the top cover has been removed.

[0019] Figure 4 This is a rear view of one embodiment of the present invention after removing the top cover and the air guide cover.

[0020] Figure 5 This is a front view of one embodiment of the present invention after the top cover has been removed;

[0021] Figure 6 This is a front view of one embodiment of the present invention after removing the top cover and the air guide cover.

[0022] Figure labels: 1-Server chassis; 101-Power supply mounting frame; 102-Rear fan mounting frame; 103-Tray mounting frame; 104-Middle fan mounting frame; 2-Power supply module; 3-Rear cooling fan module; 4-Upper middle fan module; 401-First fan plate; 5-Lower middle fan module; 501-Second fan plate; 6-Motherboard tray; 7-Motherboard; 701-CPU module; 702-Memory module; 8-GPU adapter board; 9-Air guide shroud; 10-Air guide plate; 11-Hard drive enclosure; 12-Hard drive tray; 13-Power adapter board; 14-Power distribution board; 15-Hard drive backplate. Detailed Implementation

[0023] In the description of this utility model, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing this utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. If a certain technical feature is referred to as "set," "fixed," "connected," or "installed" on another technical feature, it can be directly set, fixed, or connected to the other technical feature, or it can be indirectly set, fixed, connected, or installed on the other technical feature.

[0024] In the description of this utility model, the term "several" means one or more; the term "multiple" means two or more; the terms "greater than," "less than," and "exceeding" should be understood as excluding the stated number; and the terms "above," "below," and "within" should be understood as including the stated number. The terms "first," "second," etc., should be understood as being used only to distinguish identical or similar technical feature names, and should not be interpreted as implying / indicating the relative importance of the technical features, the number of technical features, or the sequential relationship between the technical features.

[0025] The preferred embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] like Figures 1 to 6As shown, this embodiment provides a 4U server capable of efficient heat dissipation, including: a server chassis 1, a power supply module 2, a rear cooling fan module 3, a middle upper fan module 4, a middle lower fan module 5, a motherboard tray 6, a motherboard 7, and a GPU adapter board 8. The server chassis 1 has a power supply mounting frame 101 and a rear fan mounting frame 102 at its rear end. The power supply module 2 is mounted on one side of the server chassis 1 via the power supply mounting frame 101, and the rear cooling fan module 3 is mounted on the other side of the server chassis 1 via the rear fan mounting frame 102. The motherboard 7 is mounted above the rear fan mounting frame 102 via the motherboard tray 6, and the position of the motherboard 7 corresponds to the position of the middle upper fan module 4. The GPU adapter board 8 is located at the front end of the server chassis 1, preferably on the bottom shell of the front end of the server chassis 1, and the position of the GPU adapter board 8 corresponds to the positions of the rear cooling fan module 3 and the middle lower fan module 5.

[0027] It should be noted that in this embodiment, a power supply mounting frame 101 and a rear fan mounting frame 102 are provided at the rear of the server chassis 1. The power supply mounting frame 101 serves both as the mounting and fixing structure for the power supply module 2 and as a power supply fan shield to prevent hot air from the GPU module from directly blowing onto the power supply module 2, thereby protecting the power supply module 2 and reducing the impact on the overall power supply. The power supply mounting frame 101 and the rear fan mounting frame 102 can be an integrated structure within the server chassis 1, meaning that the power supply mounting frame 101 and the rear fan mounting frame 102 are part of the frame structure of the integrated server chassis 1; alternatively, they can be detachable frame structures to improve product flexibility. The power supply mounting frame 101 and the rear fan mounting frame 102 facilitate the installation and fixing of their respective modules, and provide each installed module with an independent space to effectively avoid mutual interference during the heat dissipation process. The power supply module 2 preferably includes four stacked power supplies; the rear cooling fan module 3 is a cooling fan module that utilizes the rear space of the server chassis 1; the middle upper fan module 4 and the middle lower fan module 5 refer to cooling fan modules that are set in the middle of the server chassis 1 and are isolated in the upper and lower spaces; the motherboard tray 6 is used to set the motherboard 7; the GPU adapter board 8 is used to set the GPU module. In this embodiment, 10 GPU modules can be set. Therefore, the 4U server is also called a 4U10 card server.

[0028] In this embodiment, the motherboard 7 is positioned above the rear fan mounting frame 102 via the motherboard tray 6. The position of the motherboard 7 corresponds to the position of the upper middle fan module 4. Thus, the upper middle fan module 4 provides independent heat dissipation for the motherboard 7 on the upper layer of the server chassis 1. This independent heat dissipation means isolating it from the heat dissipation of the power supply module 2 on one side to avoid heat dissipation interference from the left and right sides; and isolating it from the lower GPU module to avoid heat dissipation interference between the upper and lower layers. Therefore, it effectively avoids heat dissipation interference between the various modules, improving heat dissipation efficiency. Furthermore, the GPU adapter board 8 is positioned at the front end of the server chassis 1. The position of the GPU adapter board 8 corresponds to the positions of the rear cooling fan module 3 and the lower middle fan module 5. This utilizes the lower space of the server chassis 1 to achieve independent heat dissipation for the GPU module, avoiding interference with the heat dissipation of the motherboard 7 and the power supply module 2.

[0029] Therefore, in this embodiment, a power supply mounting frame 101 and a rear fan mounting frame 102 are provided at the rear of the server chassis 1. This not only ensures efficient and reliable heat dissipation through the structural optimization design of the 4U server and avoids heat dissipation interference between the modules, but also enables the installation and fixation of the corresponding modules using the overall power supply mounting frame 101 and rear fan mounting frame 102. It also provides support and isolation for the motherboard tray 6 and its motherboard 7, which is beneficial for product assembly and maintenance. The overall structure is more reasonable, efficient and reliable.

[0030] like Figure 1 and Figure 2 As shown, this embodiment preferably includes a fan shroud 9, which is disposed on the CPU module 701 and memory module 702 of the motherboard 7. In this embodiment, the CPU module 701 is disposed in the middle area of ​​the motherboard 7, preferably two in number, with the two CPU modules 701 respectively disposed at the front and rear ends of the motherboard 7; the memory modules 702 are symmetrically disposed on both sides of the CPU module 701 to facilitate better assembly and ensure that the direction of the memory modules 702 is consistent with the heat dissipation direction of the CPU module 701, thereby guaranteeing its heat dissipation efficiency.

[0031] like Figure 1 and Figure 2As shown, this embodiment preferably also includes an air guide plate 10, which is disposed between the upper middle fan module 4 and the lower middle fan module 5. Therefore, through the function of the air guide plate 10, the heat from the upper CPU module 701 and memory module 702 can be guided to the upper middle fan module 4, effectively isolating it from the lower structure. The air guide plate 10 preferably adopts a bent, upward-sloping structural design, which better conforms to the characteristic that hot air rises, thus quickly achieving the guiding effect of hot air.

[0032] Preferably, in this embodiment, the upper middle fan module 4 and the lower middle fan module 5 are staggered by the air guide plate 10. This staggered arrangement refers to the staggered arrangement of the upper and lower layers, as well as the staggered arrangement of the front and rear sections of the server chassis 1. This more effectively achieves the separation of heat dissipation spaces, ensuring the heat dissipation efficiency of each component. Optionally, the upper middle fan module 4 is located on the side of the lower middle fan module 5 closer to the front end of the server chassis 1; that is, the upper middle fan module 4 is closer to the front end of the server chassis 1 to meet the upward tilting structural design requirements of the air guide plate 10, facilitating rapid product assembly and maintenance.

[0033] like Figure 2 As shown, in a more preferred embodiment, this embodiment also includes a first fan plate 401 and a second fan plate 501. A central fan mounting frame 104 is provided in the middle position of the server chassis 1. The first fan plate 401 and the second fan plate 501 are respectively disposed at the bottom of the upper and lower layers of the central fan mounting frame 104, and are used to realize the insertion of the upper central fan module 4 and the lower central fan module 5, respectively. This provides a good foundation for the wireless connection of the central cooling fan, so as to improve the assembly efficiency of the product and reduce its maintenance difficulty.

[0034] like Figure 1 and Figure 2As shown, this embodiment also includes a hard drive enclosure 11 and a hard drive tray 12. The hard drive enclosure 11 is disposed at the rear end of the server chassis 1 via the hard drive tray 12, preferably disposed between the power supply mounting frame 101 and the rear fan mounting frame 102, so as to make more efficient use of the rear space of the server chassis 1. In this embodiment, the rear end of the server chassis 1 is also provided with a tray mounting frame 103. The height of the tray mounting frame 103 is the same as the height of the rear fan mounting frame 102. The tray mounting frame 103 is disposed between the power supply mounting frame 101 and the rear fan mounting frame 102, so that the tray mounting frame 103 can not only fix and install the hard drive tray 12, but also, together with the rear fan mounting frame 102, provide support for the motherboard tray 6, providing more space for the motherboard tray 6. This embodiment also preferably includes a hard drive backplate 15, and the hard drive in the hard drive enclosure 11 is preferably inserted into the hard drive backplate 15.

[0035] Preferably, in this embodiment, the hard disk tray 12 is vertically positioned within the tray mounting frame 103, meaning the hard disk enclosure 11 is vertically positioned so that its heat dissipation direction is consistent with that of the power supply module 2, the rear cooling fan module 3, and the lower middle fan module 5.

[0036] like Figure 1 and Figure 2 As shown, this embodiment also includes a power adapter board 13, which is disposed on the side of the server chassis 1 near the power module 2. The power adapter board 13 is connected to the power module 2, the motherboard 7 and the GPU adapter board 8 respectively. The connection structure preferably adopts a plug-in socket, thereby realizing the cable conversion between the motherboard 7 and the GPU adapter board 8 through the power adapter board 13, which effectively improves the product assembly efficiency and reduces the product maintenance difficulty.

[0037] More preferably, this embodiment also includes a power distribution board 14, through which the power adapter board 13 is plugged into the power module 2. In this embodiment, the power adapter board 13 is plugged into the power distribution board 14 via a connector. Since the PSU gold fingers are horizontally placed, the power distribution board 14 preferably has four sets of horizontally arranged power slots. The power adapter board 13 is responsible for supplying power to the motherboard 7 and the GPU adapter board 8. The use of a cable-free connection is more conducive to product assembly and maintenance.

[0038] The specific embodiments described above are preferred embodiments of this utility model, and are not intended to limit the specific scope of this utility model. The scope of this utility model includes, but is not limited to, these specific embodiments. All equivalent changes made in accordance with the shape and structure of this utility model are within the protection scope of this utility model.

Claims

1. A 4U server capable of efficient heat dissipation, characterized in that, include: The server chassis comprises a power supply module, a rear-end cooling fan module, a middle upper-layer fan module, a middle lower-layer fan module, a motherboard tray, a motherboard, and a GPU adapter board. The server chassis has a power supply mounting frame and a rear-end fan mounting frame at its rear end. The power supply module is mounted on one side of the server chassis via the power supply mounting frame, and the rear-end cooling fan module is mounted on the other side of the server chassis via the rear-end fan mounting frame. The motherboard is mounted on the motherboard tray above the rear-end fan mounting frame, and its position corresponds to the position of the middle upper-layer fan module. The GPU adapter board is located at the front end of the server chassis, and its position corresponds to the positions of the rear-end cooling fan module and the middle lower-layer fan module.

2. The 4U server with efficient heat dissipation according to claim 1, characterized in that, It also includes an air guide shroud, which is disposed on the CPU module and memory module of the motherboard.

3. The 4U server with efficient heat dissipation according to claim 2, characterized in that, The CPU module is located in the middle area of ​​the motherboard, and the memory modules are symmetrically arranged on both sides of the CPU module.

4. The 4U server with efficient heat dissipation according to claim 1, characterized in that, It also includes an air guide plate, which is disposed between the upper middle fan module and the lower middle fan module.

5. The 4U server with efficient heat dissipation according to claim 4, characterized in that, The upper middle fan module and the lower middle fan module are staggered by the air guide plate, with the upper middle fan module located on the side of the lower middle fan module closer to the front of the server chassis.

6. The 4U server with efficient heat dissipation according to any one of claims 1 to 5, characterized in that, It also includes a hard drive enclosure and a hard drive tray, wherein the hard drive enclosure is disposed at the rear end of the server chassis via the hard drive tray.

7. The 4U server with efficient heat dissipation according to claim 6, characterized in that, The server chassis also has a tray mounting frame at the rear, the height of which is the same as the height of the rear fan mounting frame, and the tray mounting frame is located between the power supply mounting frame and the rear fan mounting frame.

8. The 4U server with efficient heat dissipation according to claim 7, characterized in that, The hard drive tray is vertically positioned within the tray mounting frame.

9. The 4U server with efficient heat dissipation according to any one of claims 1 to 5, characterized in that, It also includes a power adapter board, which is located on the side of the server chassis near the power module. The power adapter board is connected to the power module, the motherboard and the GPU adapter board respectively.

10. The 4U server with efficient heat dissipation according to claim 9, characterized in that, It also includes a power distribution board, which is connected to the power module via a plug-in connection.

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