Built-in notebook computer heat dissipation device with high heat dissipation performance
By introducing independent upper vapor channel and lower return channel into the laptop, combined with heat insulation cotton to isolate heat exchange, the problem of poor heat transfer in traditional laptop cooling systems is solved, achieving efficient heat dissipation and stable heat dissipation.
Patent Information
- Application Number
- CN202422181653.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-09-05
AI Technical Summary
In traditional laptop cooling systems, the direct heat exchange between the heat transfer fluid vapor and the cooling medium leads to obstructed heat transfer paths, affecting cooling efficiency.
It adopts an independent upper steam channel and lower return channel design, utilizes heat transfer fluid to circulate in the channel, and combines heat insulation cotton to isolate heat exchange, forming an efficient heat transfer path, and dissipates heat to the outside through a cooling fan.
It improves heat dissipation efficiency, reduces heat loss, ensures efficient heat transfer and dissipation, and enhances the heat dissipation performance and stability of laptops.
Smart Images
Figure CN223624578U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of laptop cooling technology, and in particular relates to a built-in laptop cooling device with high heat dissipation performance. Background Technology
[0002] As a compact, enclosed design, laptops generate significant heat from their core components—the CPU, GPU, and PCH—due to heavy workloads. If this heat is not properly dissipated, it can not only cause a decline in processor performance but, in extreme cases, may also cause irreversible damage to the CPU and GPU, significantly shortening their lifespan. Therefore, an efficient cooling mechanism is crucial for ensuring the stable operation of laptops.
[0003] Traditional heat dissipation systems rely on the combined action of heat transfer fluid pipes, heat sinks, fans, and the heat transfer fluid. However, due to the design of a single heat transfer fluid channel, the system faces significant limitations: the evaporated heat transfer fluid mixes and flows with the unevaporated portion within the same channel, inevitably causing direct heat exchange between the hot vapor and the cooling medium (i.e., the heat transfer fluid). This process not only increases unnecessary heat dissipation but also hinders the smooth and efficient circulation of heat transfer paths, thus affecting the overall heat dissipation performance.
[0004] Therefore, it is essential to invent a built-in laptop cooling device with high heat dissipation performance. Utility Model Content
[0005] To solve the above-mentioned technical problems, this utility model provides a built-in laptop cooling device with high heat dissipation performance, including a heat dissipation base, a cooling fan and a heat source cooling component. The cooling fan is fixedly installed on the heat dissipation base, and the cooling fan is located on one side of one end of the heat source cooling component. One end of the heat source cooling component is fixedly installed inside the heat dissipation base.
[0006] The heat source heat dissipation assembly includes a heat source plate, a fixing plate, an upper steam channel, a lower return channel, heat insulation cotton, and a heat dissipation channel. The fixing plate is fixedly installed on the heat source plate in a mirror-symmetrical manner. The heat source plate is connected to one end of the upper steam channel and the lower return channel, respectively. The other end of the upper steam channel and the lower return channel is connected to the heat dissipation channel. The heat insulation cotton is bonded between the upper steam channel and the lower return channel. The heat dissipation channel is installed in the heat dissipation base and is located on one side of the heat dissipation fan.
[0007] The heat source plate is bonded to the heat source of the laptop computer using thermal adhesive.
[0008] Preferably, the heat source plate is a rectangular hollow structure, the heat source plate contains a heat-conducting liquid, and the heat dissipation base and the fixing plate fixedly installed on the heat source plate are connected to the main body of the laptop computer by screws.
[0009] Preferably, the upper steam channel is located above the lower return channel, and the heat insulation cotton is located between the upper steam channel and the lower return channel. The heat insulation cotton is used to isolate heat transfer between the upper steam channel and the lower return channel.
[0010] Preferably, the upper steam channel is parallel to both ends of the lower return channel. The two ends of the lower return channel are horizontal sections and the middle section is an inclined section. One end of the lower return channel has a heat-conducting liquid in the horizontal section, while the other end does not have a heat-conducting liquid in the horizontal section and the inclined section. The horizontal section with heat-conducting liquid is directly connected to the heat source platen. The heat-conducting liquid inside the horizontal section is used to realize the water seal principle.
[0011] Compared with the prior art, the present invention has the following beneficial effects:
[0012] This invention connects the heat source plate to two independent channels (an upper steam channel and a lower return channel) and cleverly utilizes a heat-conducting fluid (such as water or other suitable liquid) circulating within these channels. This effectively absorbs and removes more heat, reduces thermal resistance, and improves overall heat dissipation efficiency. This design optimizes the heat transfer path, avoids direct contact between hot steam and the cooling medium (heat transfer fluid), reduces unnecessary heat exchange losses, and allows heat to be transferred to the outside of the heat dissipation system more efficiently. The addition of a heat-insulating foam board between the upper and lower channels effectively isolates the hot steam in the upper channel from the low-temperature heat transfer fluid in the lower channel, preventing premature heat loss in the lower channel and further enhancing the overall insulation and heat dissipation performance of the heat dissipation system. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0014] Figure 2 This is a partial cross-sectional structural diagram of the present invention.
[0015] Figure 3 This is a cross-sectional structural diagram of the heat source heat dissipation component of this utility model.
[0016] In the picture:
[0017] 1. Heat dissipation base; 2. Heat dissipation fan; 3. Heat source heat dissipation component; 31. Heat source pressure plate; 32. Fixing plate; 33. Upper steam channel; 34. Lower return channel; 35. Insulation cotton; 36. Heat dissipation channel. Detailed Implementation
[0018] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0019] In the description of the embodiments, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of the utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in the present utility model based on the specific circumstances.
[0020] As attached Figure 1 To be continued Figure 3 As shown:
[0021] This utility model provides a built-in laptop cooling device with high heat dissipation performance, including a heat dissipation base 1, a heat dissipation fan 2 and a heat source heat dissipation component 3. The heat dissipation fan 2 is fixedly installed on the heat dissipation base 1, and the heat dissipation fan 2 is located on one side of one end of the heat source heat dissipation component 3. One end of the heat source heat dissipation component 3 is fixedly installed inside the heat dissipation base 1.
[0022] The heat source heat dissipation assembly 3 includes a heat source pressure plate 31, a fixing plate 32, an upper steam channel 33, a lower return channel 34, heat insulation cotton 35, and a heat dissipation channel 36. The fixing plate 32 is fixedly installed on the heat source pressure plate 31 in a mirror-symmetrical manner. The heat source pressure plate 31 is connected to one end of the upper steam channel 33 and the lower return channel 34, respectively. The other end of the upper steam channel 33 and the lower return channel 34 is connected to the heat dissipation channel 36. The heat insulation cotton 35 is bonded between the upper steam channel 33 and the lower return channel 34. The heat dissipation channel 36 is installed in the heat dissipation base 1 and is located on one side of the heat dissipation fan 2.
[0023] The heat source plate 31 is bonded to the heat source of the laptop computer with thermal adhesive.
[0024] Example 1:
[0025] Specifically, the heat source plate 31 is designed as a rectangular hollow structure. This hollow design is intended to accommodate and effectively conduct heat from the core heat sources inside the laptop (such as the CPU and GPU). It is filled with a thermally conductive fluid, which can quickly absorb and disperse the heat generated by the heat source, providing a foundation for subsequent heat dissipation. The heat dissipation base 1 and the mounting plate 32 fixedly mounted on the heat source plate 31 are tightly connected to the laptop body with screws, ensuring that the heat dissipation device is securely installed near the heat source, achieving efficient heat conduction.
[0026] Specifically, the upper steam channel 33 is cleverly positioned above the lower return channel 34, forming a clear vertical separation that facilitates directional heat flow. To further isolate heat transfer between the upper and lower channels, insulation cotton 35 is placed between them. This insulation material effectively reduces unnecessary heat exchange between the upper steam channel 33 and the lower return channel 34, improving heat dissipation efficiency.
[0027] Specifically, the upper steam channel 33 and the lower return channel 34 are parallel at both ends. This design is not only aesthetically pleasing but also helps maintain the stability of heat flow. The design of the lower return channel 34 is particularly unique, with horizontal sections at both ends and an inclined section in the middle. This design facilitates the natural flow of the heat transfer fluid during the return process and rapid return under gravity assistance. One horizontal section of the lower return channel 34 is filled with heat transfer fluid, while the other horizontal and inclined sections remain empty. This end is directly connected to the heat source platen 31. Utilizing the water seal effect formed by the heat transfer fluid at this point, steam is effectively prevented from escaping directly into the return channel, ensuring the continuity and efficiency of the heat transfer path. Through the application of the water seal principle, efficient circulation of heat is achieved in the evaporation, conduction, condensation, and return processes, thereby significantly improving the heat dissipation effect.
[0028] Example 2:
[0029] First, when the core heat sources inside the laptop, such as the CPU and GPU, generate heat, this heat is efficiently absorbed by the heat source platen 31 through the thermal adhesive. The thermally conductive liquid filled inside the heat source platen 31 further disperses the heat rapidly and evaporates. The evaporation carries a large amount of heat into the upper vapor channel 33, and then into the heat dissipation channel 36, where it releases heat. The released heat is dissipated into the air by the powerful airflow generated by the cooling fan 2, and condenses inside the heat dissipation channel 36. At the same time, the condensed thermally conductive liquid flows back naturally under the action of gravity, returning to the heat source platen 31, forming a heat dissipation cold circulation. During the flow of steam and condensed thermally conductive liquid, the heat insulation cotton 35 effectively isolates the heat transfer between the upper and lower channels, ensuring the efficiency and continuity of the heat transfer path.
[0030] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.
Claims
1. A built-in laptop cooling device with high heat dissipation performance, characterized in that, It includes a heat dissipation base (1), a heat dissipation fan (2) and a heat source heat dissipation component (3). The heat dissipation base (1) is fixedly installed with the heat dissipation fan (2). The heat dissipation fan (2) is located on one side of one end of the heat source heat dissipation component (3). One end of the heat source heat dissipation component (3) is fixedly installed inside the heat dissipation base (1). The heat source heat dissipation assembly (3) includes a heat source plate (31), a fixing plate (32), an upper steam channel (33), a lower return channel (34), heat insulation cotton (35), and a heat dissipation channel (36). The fixing plate (32) is fixedly installed on the heat source plate (31) in a mirror-symmetrical manner. The heat source plate (31) is connected to one end of the upper steam channel (33) and the lower return channel (34), respectively. The other end of the upper steam channel (33) and the lower return channel (34) is connected to the heat dissipation channel (36). The heat insulation cotton (35) is bonded between the upper steam channel (33) and the lower return channel (34). The heat dissipation channel (36) is installed in the heat dissipation base (1) and is located on one side of the heat dissipation fan (2). The heat source plate (31) is bonded to the heat source of the laptop computer with thermal adhesive.
2. The built-in laptop cooling device with high heat dissipation performance as described in claim 1, characterized in that: The heat source plate (31) has a rectangular hollow structure and contains a heat-conducting liquid inside. The heat dissipation base (1) and the fixing plate (32) fixedly installed on the heat source plate (31) are connected to the main body of the laptop computer by screws.
3. The built-in laptop cooling device with high heat dissipation performance as described in claim 1, characterized in that: The upper steam channel (33) is located above the lower return channel (34), and the heat insulation cotton (35) is located between the upper steam channel (33) and the lower return channel (34). The heat insulation cotton (35) is used to isolate the heat transfer between the upper steam channel (33) and the lower return channel (34).
4. The built-in laptop cooling device with high heat dissipation performance as described in claim 1, characterized in that: The upper steam channel (33) is parallel to both ends of the lower return channel (34). The two ends of the lower return channel (34) are horizontal and the middle section is inclined. One end of the lower return channel (34) contains heat-conducting liquid in the horizontal section, while the other end does not contain heat-conducting liquid in the horizontal and inclined sections. The horizontal section containing heat-conducting liquid is directly connected to the heat source platen (31). The heat-conducting liquid inside the horizontal section is used to realize the water seal principle.