Wafer product edge detection device

Abstract

The utility model discloses a wafer product edge detection device, which comprises a marble platform and a marble cantilever, four corners below the marble platform are fixedly connected with air floating pads, the middle part of one end of the marble platform is fixedly connected with the marble cantilever, and the marble cantilever is fixedly connected with the air floating pads. A wafer rotating platform is fixedly connected to the middle of the upper portion of the marble platform, a wafer body is arranged above the rotating output end of the wafer rotating platform, and positioning air cylinder sets are arranged at the quartering positions, below the wafer body, of the wafer rotating platform. According to the utility model, the wafer rotating platform and the positioning air cylinder group are arranged, three groups of air cylinders for jacking are designed at the edge of the platform and are matched with corresponding conical heads, so that glass is positioned to the center and then stably falls onto the platform for measurement, and the center of the wafer is positioned, so that large eccentricity is avoided; therefore, the visual field of the camera group can be greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to a wafer product edge inspection device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer. Glass wafers are typically used as carriers for silicon wafers, playing an auxiliary role in semiconductor processes, such as helping to transport thin silicon integrated circuit wafers.

[0003] In the field of glass wafer processing and manufacturing, it is often necessary to inspect the edges of the glass, such as edge defects. In addition, the diameter of the glass product and the size of the chamfer at the edge also need to be measured. The existing inspection method is to take pictures of the entire wafer with a camera to measure the dimensions. This method is highly dependent on the accuracy of the camera and lens, and the measurement accuracy cannot be guaranteed, leaving room for further improvement. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a wafer product edge detection device that can quickly and in real time measure the diameter, chamfer, chipping, etc. of glass wafers and record the measurement results, thus solving the above-mentioned problems.

[0005] To achieve the above objectives, a wafer product edge inspection device is provided, comprising a marble platform and a marble cantilever. Air floats are fixedly connected to the four lower corners of the marble platform. A marble cantilever is fixedly connected to the middle of one end of the marble platform. A wafer rotation platform is fixedly connected to the middle of the upper part of the marble platform. A wafer body is positioned above the rotation output end of the wafer rotation platform. Positioning cylinder assemblies are provided at four equal divisions below the wafer body on the wafer rotation platform. A dimension inspection hanger is fixedly connected to the lower part of the marble cantilever at a position corresponding to the center of the wafer body. Multiple dimension inspection cameras are fixedly connected to the lower part of the dimension inspection hanger at a position corresponding to the edge of the wafer body. Dimension camera light source lenses are fixedly connected to the bottom lenses of the multiple dimension inspection cameras. Camera light source reflectors are fixedly connected to the upper part of the platform support of the wafer rotation platform at positions corresponding to the multiple dimension camera light source lenses.

[0006] An upper defect detection bracket is fixedly connected to one side of the marble platform. An upper defect detection camera is fixedly connected to the side of the upper defect detection bracket closer to the wafer body above the wafer body. A lower defect detection bracket is fixedly connected to the side of the marble platform away from the upper defect detection bracket. An upper defect detection light source is fixedly connected to the side of the upper and lower defect detection brackets closer to the wafer body below the upper defect detection camera. A lower defect detection camera is fixedly connected to the side of the lower defect detection bracket closer to the wafer body below the wafer body. A lower defect detection light source is fixedly connected to the side of the lower defect detection bracket closer to the wafer body above the wafer body.

[0007] According to the wafer product edge detection device, the positioning cylinder group has three sets of cylinders equidistantly arranged at the wafer body and the corresponding circular edge, and the output end of each cylinder is provided with a rotatable conical head.

[0008] According to the wafer product edge detection device, the bottom of the wafer rotation platform is provided with a rotary motor that is drivenly connected to the rotation output end.

[0009] According to the wafer product edge detection device, the plurality of size detection cameras are symmetrically arranged in pairs with the center of the wafer body as the base point.

[0010] According to the wafer product edge detection device, each of the multiple size camera light source lenses is provided with a telecentric lens, and a coaxial light source is installed on the telecentric lens.

[0011] According to the wafer product edge detection device, the upper light source for defect detection corresponds to the lower camera for defect detection.

[0012] According to the wafer product edge detection device, the upper defect detection camera corresponds to the lower defect detection light source.

[0013] The above solution has at least one of the following beneficial effects:

[0014] 1. This utility model is equipped with a wafer rotation platform and a positioning cylinder group. Three sets of lifting cylinders are designed on the edge of the platform, which are used in conjunction with corresponding conical heads to position the glass to the center and then smoothly lower it onto the platform for measurement. Because the wafer center is positioned, there will be no large eccentricity. Therefore, the field of view of the camera group can be greatly reduced. The measurement of size is carried out by the edge. Compared with the method of taking pictures of the entire wafer for size measurement, the dependence on the camera and lens is greatly reduced, so the measurement accuracy can be more precise and the practicality of the device is enhanced.

[0015] 2. The dimension inspection camera of this utility model utilizes marble cantilever arms installed in pairs on the upper edge of the wafer body. The dimensions are measured by two pairs of corresponding cameras. One set of cameras in a 180-degree direction calculates the wafer size by capturing the positional offset of the wafer edge and the deviation from the standard wafer. The camera can use coaxial light mounted on a telecentric lens for light source compensation. The light source shines down onto the glass being measured and is reflected back to the surface of the glass being measured by a glass reflector below. Through these changes in light, the chamfered edges of the glass wafer are made clearer, making it easier for the camera to collect the size of the chamfered edges, thus enhancing the practicality of the device.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0018] Figure 1 This is a three-dimensional structural diagram of the left side of a wafer product edge detection device according to the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of the right side of a wafer product edge detection device according to the present invention;

[0020] Figure 3 This is a front structural diagram of a wafer product edge detection device according to the present invention.

[0021] Legend:

[0022] 1. Marble platform; 2. Air cushion; 3. Marble cantilever; 4. Wafer rotation platform; 5. Positioning cylinder assembly; 6. Dimension inspection hanger; 7. Dimension inspection camera; 8. Dimension camera light source lens; 9. Upper defect inspection bracket; 10. Upper defect inspection light source; 11. Upper defect inspection camera; 12. Lower defect inspection bracket; 13. Lower defect inspection light source; 14. Lower defect inspection camera; 15. Wafer body; 16. Camera light source reflector. Detailed Implementation

[0023] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0024] Reference Figure 1-3This utility model provides a wafer product edge detection device, including a marble platform 1 and a marble cantilever 3. Air floats 2 are fixedly connected to the four lower corners of the marble platform 1. A marble cantilever 3 is fixedly connected to the middle of one end of the marble platform 1. A wafer rotating platform 4 is fixedly connected to the middle of the upper part of the marble platform 1. A wafer body 15 is provided above the rotating output end of the wafer rotating platform 4. A rotary motor connected to the rotating output end is provided at the bottom of the wafer rotating platform 4. Positioning cylinder groups 5 are provided at four equal divisions below the wafer body 15. The positioning cylinder groups 5 have three sets of cylinders equidistantly arranged at the wafer body 15 and the corresponding circular edge. The output end of each cylinder is provided with a rotatable conical head. By designing three sets of lifting cylinders at the edge of the wafer rotating platform 4, in conjunction with the corresponding conical heads, the glass is positioned to the center and then smoothly lowered onto the platform for measurement. Because the center of the wafer body 15 is positioned, there will be no large eccentricity. Therefore, the field of view of the camera group can be greatly reduced, and the size is measured by using the edge method.

[0025] A dimension inspection hanger 6 is fixedly connected to the bottom of the marble cantilever 3 at a position corresponding to the center of the wafer body 15. Multiple dimension inspection cameras 7 are fixedly connected to the bottom of the dimension inspection hanger 6 at positions corresponding to the edge of the wafer body 15. These cameras are symmetrically arranged in pairs with the center of the wafer body 15 as the reference point, primarily to improve inspection efficiency and reduce the wafer rotation angle, thus shortening inspection time. Dimension camera light source lenses 8 are fixedly connected to the bottom lenses of each of the multiple dimension inspection cameras 7. Each dimension camera light source lens 8 contains a telecentric lens, and a coaxial light source is mounted on the telecentric lens. Camera light source reflectors 16 are fixedly connected to the platform support of the wafer rotation platform 4 at positions corresponding to the multiple dimension camera light source lenses 8. The dimension inspection cameras 7 utilize large... The marble cantilever 3 and the dimension inspection hanger 6 are installed in pairs on the upper edge of the wafer body 15. The dimensions are measured by two pairs of corresponding cameras. One set of cameras in a 180-degree direction calculates the wafer size by capturing the positional offset of the wafer edge and the deviation from the standard wafer. The camera can be compensated for by the light source through the coaxial light mounted on the telecentric lens. The light source shines down onto the glass being measured and is reflected back to the surface of the glass being measured by the camera light source reflector 16 below. Through these changes in light, the chamfered edge of the glass wafer is made clearer, making it easier for the camera to capture the size of the chamfer. Measuring the size by using the edge method greatly reduces the dependence on the camera and lens compared to measuring the size of the entire wafer. This makes the measurement accuracy more precise.

[0026] An upper defect detection bracket 9 is fixedly connected to one side of the upper marble platform 1. An upper defect detection camera 11 is fixedly connected to the side of the upper defect detection bracket 9 near the wafer body 15 above the wafer body 15. A lower defect detection bracket 12 is fixedly connected to the side of the upper marble platform 1 away from the upper defect detection bracket 9. An upper defect detection light source 10 is fixedly connected to the side of the upper defect detection bracket 9 and the lower defect detection bracket 12 near the wafer body 15 below the upper defect detection camera 11. A lower defect detection camera 14 is fixedly connected to the side of the lower defect detection bracket 12 near the wafer body 15 below the wafer body 15. The upper defect detection light source 10 corresponds to the lower defect detection camera 14. A lower defect detection light source 13 is fixedly connected to the side of the lower defect detection bracket 12 near the wafer body 15 above the wafer body 15. The upper defect detection camera 11 corresponds to the lower defect detection light source 13. The defect detection is mainly used for edge chipping detection and consists of an upper surface camera group and a light source installed below and a lower surface camera group and a light source installed above, used to detect defects on the upper and lower surfaces.

[0027] Working Principle: In use, this invention employs three sets of lifting cylinders designed along the edge of the wafer rotating platform 4, along with corresponding conical heads, to smoothly lower the glass onto the platform for measurement after centering it. Because the wafer body 15 is centered, there is no significant eccentricity, thus greatly reducing the field of view of the camera group. Simultaneously, the dimension inspection cameras 7, using the marble cantilever 3 and dimension inspection hanger 6, are installed in pairs along the upper edge of the wafer body 15. Dimensions are measured through two pairs of corresponding cameras. One set of cameras in a 180-degree direction captures images of the wafer... The offset of the circular edge relative to the standard wafer is used to calculate the wafer size. The camera can compensate for the light source by using coaxial light mounted on the telecentric lens. The light source shines down onto the glass being measured and is reflected back to the surface of the glass being measured by the glass reflector below. Through these changes in light, the chamfered edges of the glass wafer are made clearer, making it easier for the camera to capture the size of the chamfer. Measuring the size by using the edge method greatly reduces the dependence on the camera and lens compared to measuring the size of the entire wafer, making the measurement accuracy more precise.

[0028] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wafer product edge detection device, comprising a marble platform (1) and a marble cantilever (3), characterized in that: Air cushions (2) are fixedly connected to the four corners below the marble platform (1). A marble cantilever (3) is fixedly connected to the middle of one end of the marble platform (1). A wafer rotating platform (4) is fixedly connected to the middle of the upper part of the marble platform (1). A wafer body (15) is set above the rotating output end of the wafer rotating platform (4). Positioning cylinder groups (5) are set at four equal parts below the wafer body (15) on the wafer rotating platform (4). The top of the marble cantilever (3) is connected to the wafer body. A size detection hanger (6) is fixedly connected at the position corresponding to the center of the circular body (15). Multiple size detection cameras (7) are fixedly connected at the position corresponding to the edge of the wafer body (15) below the size detection hanger (6). Size camera light source lenses (8) are fixedly connected at the bottom lenses of the multiple size detection cameras (7). Camera light source reflectors (16) are fixedly connected at the position corresponding to the multiple size camera light source lenses (8) above the platform support of the wafer rotating platform (4). An upper defect detection bracket (9) is fixedly connected to one side of the marble platform (1). An upper defect detection camera (11) is fixedly connected above the wafer body (15) on the side of the upper defect detection bracket (9) that is close to the wafer body (15). A lower defect detection bracket (12) is fixedly connected to the side of the marble platform (1) that is away from the upper defect detection bracket (9). An upper defect detection light source (10) is fixedly connected below the upper defect detection camera (11) on the side of the upper defect detection bracket (9) and the lower defect detection bracket (12) that are close to the wafer body (15). A lower defect detection camera (14) is fixedly connected below the wafer body (15) on the side of the lower defect detection bracket (12) that is close to the wafer body (15). A lower defect detection light source (13) is fixedly connected above the wafer body (15) on the side of the lower defect detection bracket (12) that is close to the wafer body (15).

2. The wafer product edge detection device according to claim 1, characterized in that, The positioning cylinder group (5) has three sets of cylinders equidistantly arranged on the wafer body (15) and the corresponding circular edge, and the output end of each cylinder is provided with a rotatable conical head.

3. The wafer product edge detection device according to claim 1, characterized in that, The bottom of the wafer rotation platform (4) is equipped with a rotary motor that is connected to the rotation output end.

4. The wafer product edge detection device according to claim 1, characterized in that, The multiple size detection cameras (7) are symmetrically arranged in pairs with the center of the wafer body (15) as the base point.

5. The wafer product edge detection device according to claim 1, characterized in that, Each of the multiple camera light source lenses (8) of the aforementioned size is equipped with a telecentric lens, and a coaxial light source is installed on the telecentric lens.

6. The wafer product edge detection device according to claim 1, characterized in that, The upper light source (10) for defect detection corresponds to the lower camera (14) for defect detection.

7. The wafer product edge detection device according to claim 1, characterized in that, The defect detection upper camera (11) corresponds to the defect detection lower light source (13).

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