Cathode and gate pole leading-out device of integrated semiconductor module
By using ultrasonic welding equipment to fix the gate and cathode leads, the problem of poor contact caused by adhesive fixation during the packaging process of low-current power semiconductor module devices was solved, thereby improving production efficiency and module reliability.
Patent Information
- Application Number
- CN202422933359.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In the packaging process of existing low-current power semiconductor modules, poor contact can easily occur when the gate leads and cathode leads are glued together, leading to open circuits in the module and affecting production efficiency and quality.
The gate lead is ultrasonically welded and fixed to the gate insulating substrate slot using ultrasonic equipment, and the cathode lead is ultrasonically welded and fixed to the positioning post, eliminating the glue application process and replacing it with ultrasonic welding.
It improved the module production yield, reduced production costs, and enhanced the reliability of module gate triggering.
Smart Images
Figure CN223624989U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of power device manufacturing technology, and relates to the design and packaging of semiconductor press-fit power devices. Specifically, it is a gate trigger lead-out device for a low-current power semiconductor module. Background Technology
[0002] Currently, most low-current power semiconductor module devices consist of main components such as a base plate 1, insulating heat-conducting sheet 2, electrode A3, chip 4, pressure block 5, electrode AK 6, electrode K 7, insulating gate lead-out device (insulating plate body 10, gate lead-out component 9 and cathode lead-out component 8), elastic plate 11, and fastening screws 12. Figure 1 As shown, to enable the module product to function as a switch by leading out the gate and cathode of the chip, two lead-out methods are generally used: Method 1 involves ultrasonically spot-welding an aluminum wire to the gate position of the chip, inserting it into an insulating sleeve, assembling a pressure block, and then passing the aluminum wire through the central hole and lead slot of the pressure block to lead out the chip's gate. A copper or silver cathode sheet with a thickness of 0.1-0.2mm is used to contact the pressure block above the chip to lead out the chip's cathode; Method 2 involves integrating the cathode lead-out component 8 and the gate lead-out component 9 with the main body of the insulating board 10, such as... Figure 2 and Figure 4 As shown, the cathode lead-out component 8 is equipped with a snap-fit cathode copper sheet 18 and positioning holes. The cathode copper sheet is snapped into the cathode copper sheet slot and positioning holes of the insulating plate, and then the positioning post of the insulating plate is fitted in. Afterwards, the positioning post of the insulating plate is manually heat-fused, and then insulating glue 14 is applied for fixation. The gate lead-out component 9 is equipped with a snap-fit insulating substrate 15. The insulating substrate is snapped into the gate insulating substrate slot of the insulating plate, and then insulating glue 13 is applied for fixation. In the integrated device of the second method, during the encapsulation and pressure bearing process, the insulating substrate 15 of the gate lead-out component 9 often becomes loose or falls off after pressure bearing, or the insulating glue 13 of the substrate is mistakenly adhered to the gate spring probe 16, affecting the gate contact and causing the gate to be open circuit. The insulating glue 14 on the positioning post of the cathode lead-out component often adheres to the cathode copper sheet due to uneven coating, resulting in a cathode open circuit after the module is encapsulated. Both gate and cathode open circuits will cause the module to fail to turn on, resulting in rework and repair in production. This not only affects production efficiency and increases production costs, but also causes a lot of waste of resources and increases the potential quality risk of the module. Utility Model Content
[0003] The purpose of this invention is to address the shortcomings described in Method 2 of the background art above by providing a practical and reliable integrated semiconductor module cathode and gate lead-out device. It can solve the problem of poor contact after module encapsulation caused by adhesive fixing of the gate lead-out component and the cathode lead-out component, resulting in open circuit between the gate and cathode and module failure. This improves module production yield, reduces production costs, and enhances the reliability of module gate triggering.
[0004] The technical solution of this utility model is: an integrated semiconductor module cathode gate lead-out device for a low-current power semiconductor module, comprising an insulating plate body, a gate lead-out component, and a cathode lead-out component. The insulating plate body consists of an insulating plate, fastening screw positioning holes, a gate insulating substrate slot, a cathode copper sheet slot, and a cathode copper sheet positioning post. The feature is that the gate lead-out component is ultrasonically welded and fixed in the gate insulating substrate slot; the cathode lead-out component is embedded in the cathode copper sheet slot and ultrasonically welded and fixed on the positioning post.
[0005] The gate lead-out component in the technical solution of this utility model includes a gate insulating substrate; the gate insulating substrate is ultrasonically welded and fixed in the gate insulating substrate slot.
[0006] In the technical solution of this utility model, the gate insulating substrate is cylindrical; a ring of insulating substrate solder joints is formed between the upper edge of the gate insulating substrate and the insulating plate.
[0007] The current-carrying capacity of the low-current power semiconductor module in the technical solution of this utility model is 26A-250A.
[0008] The cathode lead-out component in the technical solution of this utility model includes a cathode copper sheet, which has a cathode copper sheet positioning hole that cooperates with the positioning post; the cathode copper sheet is ultrasonically welded and fixed on the positioning post.
[0009] In the technical solution of this utility model, a cathode positioning post solder joint is formed between the cathode copper sheet and the positioning post.
[0010] In the technical solution of this utility model, the insulating plate and the gate insulating substrate are both made of PA66 or PPS material and are respectively injection molded by mold.
[0011] In the technical solution of this utility model, the gate lead is ultrasonically welded and fixed in the gate insulating substrate slot by ultrasonic equipment; the cathode lead is embedded in the cathode copper sheet slot and ultrasonically welded and fixed on the positioning post by ultrasonic equipment.
[0012] The ultrasonic equipment described in the technical solution of this utility model includes a component positioning device, an ultrasonic welding head, and an ultrasonic device.
[0013] The component positioning device in the technical solution of the utility model consists of a positioning slot made of aluminum alloy, an auxiliary positioning push-pull rod made of aluminum alloy, and a toggle handle; the ultrasonic welding head is made of titanium alloy; the ultrasonic device includes an electrically controlled intelligent ultrasonic generator, a steel frame base, and a mechanical transmission pressure mechanism.
[0014] The advantages of this utility model are as follows: the gate lead-out and the gate insulating substrate are fixed by ultrasonic welding, and the cathode lead-out is embedded in the cathode copper sheet slot and ultrasonically welded to the positioning post. This can solve the problem of poor contact after module encapsulation caused by the gate lead-out and cathode lead-out being fixed by applying insulating glue separately, resulting in open circuit between the gate and cathode and module failure. This improves the module production yield, reduces production costs, and improves the reliability of module gate triggering. Attached Figure Description
[0015] Figure 1 This is a longitudinal cross-sectional view of the low-current power semiconductor module device of this utility model.
[0016] Figure 2 This is a top view of the original design of the insulated gate lead-out device.
[0017] Figure 3 This is a top view of the insulating gate lead-out device of this utility model.
[0018] Figure 4 This is a front view of the original design of the insulating gate lead-out device.
[0019] Figure 5 This is a front view of the insulating gate lead-out device of this utility model.
[0020] In the diagram: 1-Base plate; 2-Insulating heat-conducting sheet; 3-Electrode A; 4-Chip; 5-Pressure block; 6-Electrode AK; 7-Electrode K; 8-Cathode lead-out component; 9-Gate lead-out component; 10-Insulating plate body; 11-Elastic plate; 12-Fasting screw; 13-First insulating adhesive; 14-Second insulating adhesive; 15-Gate insulating substrate; 16-Spring probe; 17-Gate lead; 18-Cathode copper sheet; 19-Cathode lead; 20-Fasting screw positioning hole; 21-Cathode positioning post solder joint; 22-Insulating substrate solder joint; 23-Insulating plate. Detailed Implementation
[0021] The embodiments of this utility model will now be described in full with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Any other embodiments based on the embodiments of this utility model, obtained by those skilled in the art without inventive effort, are within the scope of protection of this utility model.
[0022] The following examples illustrate the implementation of this utility model.
[0023] like Figure 1 , Figure 3 and Figure 5As shown, one embodiment of the novel integrated semiconductor module cathode and gate lead-out device of this utility model includes an insulating plate body 10, a gate lead-out member 9, and a cathode lead-out member 8.
[0024] The insulating board body 10 consists of an insulating board 23, fastening screw positioning holes 20, gate insulating substrate slots, cathode copper sheet slots, and cathode copper sheet positioning posts, and is the same as the existing insulating board body 10. The insulating board 23 is made of PA66, but can also be made of PPS material, and is injection molded. The insulating board 23 has fastening screw positioning holes 20 in the middle, and a gate insulating substrate slot is provided on each side of the fastening screw positioning hole 20. A cathode copper sheet slot and a cathode copper sheet positioning post are provided on the outer side of each of the two gate insulating substrate slots.
[0025] There are two gate leads 9, each consisting of a gate insulating substrate 15, a spring probe 16, and a gate lead 17, identical to gate leads 9 in the prior art. The gate insulating substrate 15 is cylindrical, made of PA66 (or PPS), and is injection molded. The upper edge of the gate insulating substrate 15 is ultrasonically welded to the gate insulating substrate slot using ultrasonic equipment, forming a ring of insulating substrate solder joints 22 between the upper edge of the gate insulating substrate 15 and the insulating plate 23.
[0026] There are two cathode leads 8, each consisting of a cathode copper sheet 18 and a cathode lead 19. The cathode copper sheet 18 has a cathode copper sheet positioning hole that mates with the positioning post, similar to the cathode lead 8 in the prior art. The cathode lead 8 is inserted into the cathode copper sheet slot and the cathode copper sheet positioning post through the cathode copper sheet positioning hole, and is ultrasonically welded to the positioning post using ultrasonic equipment. A cathode positioning post weld point 21 is formed between the cathode copper sheet 18 and the positioning post. The cathode positioning post weld point 21 is firm, rounded, and aesthetically pleasing.
[0027] The ultrasonic equipment includes a component positioning device, an ultrasonic welding head, and an ultrasonic device, and is a specialized ultrasonic device. The component positioning device consists of an aluminum alloy positioning slot, an aluminum alloy auxiliary positioning push-pull rod, and a lever handle. It accurately positions the cathode copper sheet positioning post, ensuring the cathode copper sheet 18 is precisely embedded in the cathode copper sheet slot and the cathode copper sheet positioning hole is accurately fitted into the cathode copper sheet positioning post. The ultrasonic welding head is a key component in the ultrasonic welding process, made of titanium alloy and machined using specialized high-precision machining equipment. The ultrasonic device includes an electrically controlled intelligent ultrasonic generator, a steel frame base, and a mechanical transmission pressure mechanism. The welding frequency of the ultrasonic generator can be set from 20-150kHz, the welding power from 150-1000W, and the welding time from 0.1-10s according to the welding volume of the component, controlling the size of the welding point to ensure a strong weld and reliable fit between components. Ultrasonic welding process:
[0028] ① Ultrasonic settings: Set the ultrasonic frequency, welding power, and welding time;
[0029] ② Component positioning: The component is placed into the positioning slot of the positioning device, and the handle is moved to assist in precise positioning of the push-pull rod;
[0030] ③ Start ultrasonic welding, the welding head drops and the ultrasonic welding is performed automatically to ensure welding quality, and the welding is completed.
[0031] This utility model embodiment includes two gate leads 9 and two cathode leads 8, but it can also be designed as one gate lead 9 and one cathode lead 8, which can be changed by the assembly structure of the modular product.
[0032] This invention eliminates the adhesive bonding process between the gate and cathode leads in the original device structure, replacing it with welding using specialized ultrasonic equipment. Its advantages include: 1. A more robust fit between the cathode and gate leads and the main insulating plate, reducing gate and cathode failure rates during module packaging; 2. Reduced defect rate and production losses, saving production costs; 3. Improved gate triggering reliability in the module product.
[0033] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Therefore, any modifications, equivalent substitutions, equivalent changes, and alterations made to the above embodiments based on the technical essence of this utility model without departing from its scope shall still fall within the protection scope of this utility model.
Claims
1. An integrated semiconductor module cathode gate lead-out device for a low-current power semiconductor module, comprising an insulating plate body (10), a gate lead-out component (9), and a cathode lead-out component (8), wherein the insulating plate body (10) is composed of an insulating plate (23), fastening screw positioning holes (20), a gate insulating substrate slot, a cathode copper sheet slot, and a cathode copper sheet positioning post, characterized in that: The gate lead-out (9) is ultrasonically welded and fixed in the gate insulating substrate slot; the cathode lead-out (8) is embedded in the cathode copper sheet slot and ultrasonically welded and fixed on the positioning post.
2. The integrated semiconductor module cathode gate lead-out device according to claim 1, characterized in that: The gate lead-out (9) includes a gate insulating substrate (15); the gate insulating substrate (15) is ultrasonically welded and fixed in the gate insulating substrate slot.
3. The integrated semiconductor module cathode gate lead-out device according to claim 2, characterized in that: The gate insulating substrate (15) is cylindrical; a ring of insulating substrate solder joints (22) is formed between the upper edge of the gate insulating substrate (15) and the insulating plate (23).
4. An integrated semiconductor module cathode gate lead-out device according to claim 1, 2 or 3, characterized in that: The current carrying capacity of the low-current power semiconductor module is 26A-250A.
5. An integrated semiconductor module cathode gate lead-out device according to claim 1, 2 or 3, characterized in that: The cathode lead-out component (8) includes a cathode copper sheet (18), which has a cathode copper sheet positioning hole that cooperates with the positioning post; the cathode copper sheet (18) is ultrasonically welded and fixed to the positioning post.
6. The integrated semiconductor module cathode gate lead-out device according to claim 5, characterized in that: A cathode positioning post solder joint (21) is formed between the cathode copper sheet (18) and the positioning post.
7. The integrated semiconductor module cathode gate lead-out device according to claim 4, characterized in that: The insulating plate (23) and the gate insulating substrate (15) are both made of PA66 or PPS material and are respectively injection molded by mold.
8. An integrated semiconductor module cathode gate lead-out device according to any one of claims 1-3, 6, and 7, characterized in that: The gate lead-out (9) is ultrasonically welded and fixed in the gate insulating substrate slot by ultrasonic equipment; the cathode lead-out (8) is embedded in the cathode copper sheet slot and ultrasonically welded and fixed on the positioning post by ultrasonic equipment.
9. The integrated semiconductor module cathode gate lead-out device according to claim 8, characterized in that: The ultrasonic equipment includes a component positioning device, an ultrasonic welding head, and an ultrasonic device.
10. The integrated semiconductor module cathode gate lead-out device according to claim 9, characterized in that: The component positioning device consists of an aluminum alloy positioning slot, an aluminum alloy auxiliary positioning push-pull rod, and a toggle handle; the ultrasonic welding head is made of titanium alloy; the ultrasonic device includes an electrically controlled intelligent ultrasonic generator, a steel frame base, and a mechanical transmission pressure mechanism.