Power supply network circuit with low ground noise

By introducing a voltage isolation module into the power network of the microphone amplifier, the problem of background noise interference between the power supply module and the microphone and Bluetooth modules was solved, achieving low background noise voltage power supply, improving product yield and reducing customer return rate.

CN223625974UActive Publication Date: 2025-12-02GUANGDONG DESHENG ELECTROACOUSTIC CO LTD
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Patent Information

Application Number
CN202423314094.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-02
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

In existing microphone amplifiers, there is background noise interference between the power supply module and the wired microphone module, and between the power supply module and the Bluetooth main chip, resulting in low product yield.

Method used

By introducing a voltage isolation module into the power network of the microphone amplifier, including a first voltage isolation module, a second voltage isolation module, a third voltage isolation module, and a fourth voltage isolation module, the power supply module is isolated from the wired microphone module, the Bluetooth module, the wireless microphone module, and the signal processing module, respectively. Components such as resistors, capacitors, inductors, and diodes are used to buffer voltage drops and filter voltage interference.

Benefits of technology

It effectively reduced background noise, improved product yield, and lowered customer return rates.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of microphones and loudspeakers, and discloses a low ground noise power supply network circuit, which comprises a power supply module, a wired microphone module and a Bluetooth module, and is characterized in that the power supply module is electrically connected with the wired microphone module and the Bluetooth module; the Bluetooth module comprises a Bluetooth main chip; the power network circuit further comprises a first power insulation module and a second power insulation module, the first power insulation module is connected between the power supply module and the wired microphone module, and the second power insulation module is connected between the power supply module and the Bluetooth main chip. According to the application, through the design of the power insulation module, direct current power supply between the wired microphone module and the Bluetooth main chip is separated, so that bottom noise can be effectively reduced, and the factory yield of products is improved.
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Description

Technical Field

[0001] This application belongs to the field of microphone amplifier technology, specifically relating to a low-noise power network circuit. Background Technology

[0002] A microphone amplifier is a device used to amplify sound, typically consisting of a microphone and an amplifier. Its main function is to capture and amplify sound signals so that they can be propagated over a larger space.

[0003] In the existing technology, most microphone amplifiers suffer from various problems such as unreasonable design framework of circuit components, resulting in background noise interference between the power supply module and the wired microphone module, and between the power supply module and the Bluetooth main chip, which reduces the product yield. Utility Model Content

[0004] To address the shortcomings of the prior art, this application provides a low-noise power network circuit. By designing an isolation module, the DC power supply between the wired microphone module and the Bluetooth main chip is separated, thereby effectively reducing background noise and improving product yield.

[0005] The technical effects to be achieved in this application are realized through the following aspects:

[0006] This application provides a low-noise power network circuit, including a power supply module, a wired microphone module, and a Bluetooth module. The power supply module is electrically connected to both the wired microphone module and the Bluetooth module. The Bluetooth module includes a Bluetooth main chip.

[0007] The power network circuit further includes a first isolation module and a second isolation module. The first isolation module is connected between the power supply module and the wired microphone module, and the second isolation module is connected between the power supply module and the Bluetooth main chip.

[0008] In some implementations, the first electrical isolation module includes resistors R3, R4, and R5 connected in series.

[0009] In some implementations, the low-noise power supply network circuit also includes capacitors C2 and C3 connected in parallel;

[0010] One end of the capacitor C2 is connected to one end of the resistor R4 and grounded;

[0011] The capacitor C3 is connected to the other end of the resistor R4.

[0012] In some implementations, the second electrical isolation module includes a diode D1, a resistor R1, and an inductor L1 connected in series.

[0013] In some implementations, the second electrical isolation module further includes a filter group, one end of which is connected between the inductor L1 and the Bluetooth main chip, and the other end of which is grounded.

[0014] The filter group includes capacitors C11 and C50 connected in parallel.

[0015] In some implementations, a wireless microphone module and a third electrical isolation module are also included, wherein the third electrical isolation module is connected between the wireless microphone module and the power supply module.

[0016] In some implementations, the third electrical isolation module includes a resistor R2, an inductor L3, a capacitor C15, and a capacitor C43. The resistor R2 and the inductor L3 are connected in series, and the capacitors C15 and C43 are connected in parallel. One end of each capacitor C15 and C43 is connected between the inductor L3 and the wireless microphone module, and the other end of each capacitor C15 and C43 is grounded.

[0017] In some implementations, a signal processing module and a fourth electrical isolation module are also included, wherein the fourth electrical isolation module is connected between the signal processing module and the power supply module.

[0018] In some implementations, the fourth electrical isolation module includes transistor Q7, resistor R40, resistor R68, and capacitor C70;

[0019] The resistor R40 is connected in series with the resistor R68;

[0020] The base of transistor Q7 is connected to resistor R68, the collector of transistor Q7 is connected between resistor R40 and resistor R68, and the emitter of transistor Q7 is connected to the signal processing module.

[0021] One end of the capacitor C70 is connected between the resistor R40 and the resistor R68, and the other end of the capacitor C70 is connected to ground.

[0022] In some implementations, the fourth electrical isolation module further includes capacitors C10 and C1 connected in parallel. One end of each capacitor C10 and C1 is connected between the transistor Q7 and the signal processing module, and the other end of each capacitor C10 and C1 is connected to ground.

[0023] In summary, this application has at least the following advantages:

[0024] The low-noise power supply network circuit provided in this application isolates the power supply to the wired microphone module from the power supply to the Bluetooth module by setting a first isolation module and a second isolation module, thereby achieving low-noise voltage for both the microphone module and the Bluetooth module, effectively improving product yield, reducing after-sales work, and lowering the return rate for users. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the low noise power network circuit in Embodiment 1 of this application.

[0026] Figure 2 This is a schematic diagram of the low noise floor power network circuit in Embodiment 1 of this application.

[0027] Figure 3 This is a schematic diagram of the low-noise power network circuit in Embodiment 2 of this application.

[0028] Figure 4 This is a schematic diagram of the low-noise power network circuit in Embodiment 3 of this application.

[0029] Marked in the image:

[0030] 1. Power supply module; 2. Wired microphone module; 3. Bluetooth module; 4. First isolation module; 5. Second isolation module; 6. Wireless microphone module; 7. Third isolation module; 8. Signal processing module; 9. Fourth isolation module. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments.

[0032] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0033] Example 1:

[0034] Please see the appendix Figure 1-2The low-noise power network circuit of this application includes a power supply module 1, a wired microphone module 2, and a Bluetooth module 3. The power supply module 1 is electrically connected to both the wired microphone module 2 and the Bluetooth module 3. The Bluetooth module 3 includes a Bluetooth main chip. The power network circuit also includes a first isolation module 4 and a second isolation module 5. The first isolation module 4 is connected between the power supply module 1 and the wired microphone module 2, and the second isolation module 5 is connected between the power supply module 1 and the Bluetooth main chip.

[0035] Specifically, power supply module 1 includes a battery and a step-down stabilizing component. The battery uses a DC voltage of 7.4V, and the step-down stabilizing component reduces the voltage from DC 7.4V to DC 5V.

[0036] In this embodiment, the low-noise power network circuit isolates the power supply module 1 and the wired microphone module 2 by placing a first isolation module 4 between them, thus buffering the voltage drop and ensuring the wired microphone module 2 receives a low-noise 5V voltage. Similarly, by placing a second isolation module 5 between the power supply module 1 and the Bluetooth main chip, the circuit filters the voltage drop, ensuring the Bluetooth main chip receives a low-noise 5V voltage. This configuration effectively reduces background noise and improves product yield.

[0037] In some embodiments, the first electrical isolation module 4 is specifically designed as follows: the first electrical isolation module 4 includes resistors R3, R4, and R5 connected in series. The low-noise power supply network circuit also includes capacitors C2 and C3 connected in parallel; one end of capacitor C2 is connected to one end of resistor R4 and grounded; capacitor C3 is connected to the other end of resistor R4. After buffering and filtering the voltage drop using resistors R3, R4, R5, and capacitors C2 and C3, the wired microphone module 2 can obtain a low-noise 5V voltage.

[0038] In some embodiments, the second isolation module 5 includes a diode D1, a resistor R1, and an inductor L1 connected in series. This configuration uses diode D1 for rectification and voltage regulation. Additionally, the second isolation module 5 includes a filter group. One end of the filter group is connected between the inductor L1 and the Bluetooth main chip, and the other end is grounded. The filter group includes capacitors C11 and C50 connected in parallel. Filtering through the filter group isolates the power supply module 1 from the Bluetooth main chip, effectively reducing background noise and allowing the Bluetooth main chip to receive a low-noise 5V voltage, thus improving product yield.

[0039] Example 2:

[0040] The difference between this embodiment and Embodiment 1 is that, please refer to... Figure 3This embodiment also includes a wireless microphone module 6 and a third electrical isolation module 7, which is connected between the wireless microphone module 6 and the power supply module 1.

[0041] In this embodiment, the low noise power network circuit separates the power supply module 1 and the wireless microphone module 6 through the third isolation module 7, so that the wireless microphone module 6 receives a low noise 5V voltage.

[0042] Specifically, the third isolation module 7 includes a resistor R2, an inductor L3, a capacitor C15, and a capacitor C43. Resistor R2 and inductor L3 are connected in series, and capacitors C15 and C43 are connected in parallel. One end of each capacitor (C15 and C43) is connected between inductor L3 and the wireless microphone module 6, and the other end of each capacitor (C15 and C43) is grounded. Voltage drop is achieved through resistor R2, and filtering is performed through capacitors C15 and C43, effectively isolating the power supply module 1 and the wireless microphone module 6, reducing background noise, and enabling the wireless microphone module 6 to receive a low-noise 5V voltage.

[0043] Example 3:

[0044] The difference between this embodiment and Embodiment 2 is that, please refer to... Figure 4 This embodiment also includes a signal processing module 8 and a fourth electrical isolation module 9, which is connected between the signal processing module 8 and the power supply module 1.

[0045] In this embodiment, the low-noise power network circuit separates the power supply module 1 and the signal processing module 8 through the fourth isolation module 9, so that the signal processing module 8 receives a low-noise 5V voltage.

[0046] Specifically, the fourth electrical isolation module 9 includes transistor Q7, resistor R40, resistor R68, and capacitor C70; resistor R40 and resistor R68 are connected in series; the base of transistor Q7 is connected to resistor R68, the collector of transistor Q7 is connected between resistor R40 and resistor R68, and the emitter of transistor Q7 is connected to signal processing module 8; one end of capacitor C70 is connected between resistor R40 and resistor R68, and the other end of capacitor C70 is grounded.

[0047] The fourth electrical isolation module 9 also includes capacitors C10 and C1 connected in parallel. One end of capacitors C10 and C1 is connected between transistor Q7 and signal processing module 8, and the other end of capacitors C10 and C1 is connected to ground.

[0048] With the above settings, the voltage drop through resistor R40 enters the base and collector of transistor Q7 respectively. When the current passes through resistor R68, transistor Q7 is turned on. Then, the current is filtered by capacitors C10 and C1, thereby isolating power supply module 1 and signal processing module 8, effectively reducing the noise floor. Signal processing module 8 obtains a low-noise 5V voltage.

[0049] In addition, the first power isolation module 4, the second power isolation module 5, the third power isolation module 7 and the fourth power isolation module 9 are all set on the power network circuit of the microphone amplifier. The wired microphone module 2, the Bluetooth module 3, the wireless microphone module 6 and the signal processing module 8 can all obtain a low noise 5V voltage, which greatly reduces the noise floor, effectively improves the product yield, reduces after-sales work and reduces the return rate of users.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0052] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0053] In this application, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" a first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" a first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] Although the description of this application has been made in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.

Claims

1. A low-noise-floor power supply network circuit, characterized in that, It includes a power supply module, a wired microphone module, and a Bluetooth module, wherein the power supply module is electrically connected to both the wired microphone module and the Bluetooth module; the Bluetooth module includes a Bluetooth main chip; The power network circuit further includes a first isolation module and a second isolation module. The first isolation module is connected between the power supply module and the wired microphone module, and the second isolation module is connected between the power supply module and the Bluetooth main chip.

2. The low-noise power supply network circuit according to claim 1, characterized in that, The first electrical isolation module includes resistors R3, R4, and R5 connected in series.

3. The low-noise power supply network circuit according to claim 2, characterized in that, The low-noise power supply network circuit also includes capacitors C2 and C3 connected in parallel. One end of the capacitor C2 is connected to one end of the resistor R4 and grounded; The capacitor C3 is connected to the other end of the resistor R4.

4. The low-noise power supply network circuit according to claim 1, characterized in that, The second electrical isolation module includes a diode D1, a resistor R1, and an inductor L1 connected in series.

5. The low-noise power supply network circuit according to claim 4, characterized in that... The second electrical isolation module also includes a filter group, one end of which is connected between the inductor L1 and the Bluetooth main chip, and the other end of which is grounded. The filter group includes capacitors C11 and C50 connected in parallel.

6. The low-noise power supply network circuit according to claim 1, characterized in that, It also includes a wireless microphone module and a third electrical isolation module, wherein the third electrical isolation module is connected between the wireless microphone module and the power supply module.

7. The low-noise power supply network circuit according to claim 6, characterized in that, The third electrical isolation module includes a resistor R2, an inductor L3, a capacitor C15, and a capacitor C43. The resistor R2 and the inductor L3 are connected in series, and the capacitors C15 and C43 are connected in parallel. One end of each capacitor C15 and C43 is connected between the inductor L3 and the wireless microphone module, and the other end of each capacitor C15 and C43 is connected to ground.

8. The low-noise power supply network circuit according to claim 1, characterized in that, It also includes a signal processing module and a fourth electrical isolation module, the fourth electrical isolation module being connected between the signal processing module and the power supply module.

9. The low-noise power supply network circuit according to claim 8, characterized in that, The fourth electrical isolation module includes transistor Q7, resistor R40, resistor R68, and capacitor C70; The resistor R40 is connected in series with the resistor R68; The base of transistor Q7 is connected to resistor R68, the collector of transistor Q7 is connected between resistor R40 and resistor R68, and the emitter of transistor Q7 is connected to the signal processing module. One end of the capacitor C70 is connected between the resistor R40 and the resistor R68, and the other end of the capacitor C70 is connected to ground.

10. The low-noise power supply network circuit according to claim 9, characterized in that, The fourth electrical isolation module also includes capacitors C10 and C1 connected in parallel. One end of each capacitor C10 and C1 is connected between the transistor Q7 and the signal processing module, and the other end of each capacitor C10 and C1 is connected to ground.