Miniaturized chip ceramic Hall integrated circuit packaging structure

Abstract

The utility model relates to the technical field of integrated circuit packaging, and discloses a miniaturized chip ceramic Hall integrated circuit packaging structure, which comprises an integrated circuit board, a packaging box, a packaging shell and a top cover plate, the integrated circuit board realizes Hall effect function conversion, metal pins at two ends are electrically connected with an external circuit, and the packaging box is connected with the packaging shell. Pin inserting grooves which are accurately inserted into the packaging box guarantee stable transmission of signals, the packaging box protects the integrated circuit board and achieves relative movement through sliding fit of rectangular sliding blocks and rectangular sliding grooves of the packaging shell, internal rectangular ventilation holes facilitate air circulation and stabilize the working temperature, the packaging shell provides external protection, and the packaging effect is good. An internal negative pole magnet is magnetically connected with a positive pole magnet of the packaging box, mounting and dismounting are convenient, position stability is ensured, heat dissipation and air pressure balance are optimized through circular vent holes, and sealing and stable connection of the top cover plate are achieved through cooperation of a sliding rod and a spring in a circular groove, cooperation of a rectangular stretching block and a rectangular stretching groove and cooperation of a clamping block and a clamping groove.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging technology, specifically a miniaturized chip ceramic Hall integrated circuit packaging structure. Background Technology

[0002] Miniaturized chip ceramic Hall integrated circuits are micro-semiconductor devices that integrate Hall effect sensors and electronic circuits on a ceramic substrate. They can convert magnetic fields into voltage signals and are widely used in various measurement and control systems, such as the measurement of angle, speed, displacement and force.

[0003] Traditional packaging structures offer good sealing, but also suffer from poor heat dissipation. The heat generated by the chip during operation is difficult to dissipate effectively, easily leading to overheating and affecting performance and lifespan. To ensure sealing and reliable electrical connections, traditional packaging structures often require more auxiliary materials and larger housings, resulting in a larger overall package size, which is unsuitable for space-constrained miniaturized electronic devices. This invention effectively solves the problems of complex structure, poor heat dissipation, signal interference, and inconvenient packaging inherent in traditional technologies through unique magnetic connections, vent design, precise pin insertion, and ingenious cover plate fixing methods. This improves the performance and reliability of integrated circuits and makes them more suitable for miniaturized, high-performance electronic device applications. Therefore, we propose a miniaturized chip ceramic Hall effect integrated circuit packaging structure. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a miniaturized chip ceramic Hall effect integrated circuit packaging structure, which solves the aforementioned problems.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a miniaturized chip ceramic Hall effect integrated circuit packaging structure, comprising an integrated circuit board, a packaging box, a packaging shell, and a top cover plate. Multiple metal pins are fixed at both ends of the integrated circuit board. The integrated circuit board is inserted and installed inside the packaging box. Symmetrical positive magnets are fixed on the back of the packaging box. Symmetrical negative magnets are installed on the back of the inner side of the packaging shell. The packaging box is slidably installed inside the packaging shell. The positive and negative magnets are magnetically connected. Circular grooves are formed at the four ends of the top of the packaging shell. Multiple sliding rods are fixed at the bottom of the top cover plate, and the ends of the sliding rods and springs are installed inside the circular grooves.

[0008] Preferably, the package has a rectangular vent hole inside, a mounting groove on the rectangular vent hole, and rectangular pin insertion grooves on both ends of the mounting groove. Multiple equally spaced metal pins are fixed at both ends of the integrated circuit board. The bottom of the integrated circuit board is inserted into the mounting groove, and the metal pins are inserted into the corresponding pin insertion grooves.

[0009] Preferably, the two ends of the packaging box are fixed with rectangular sliding blocks that are symmetrical and rectangular, the inside of the packaging shell is provided with a placement groove, the bottom end of the placement groove is provided with a circular vent hole, and the two ends of the inside of the packaging shell are provided with rectangular sliding grooves that are symmetrical and rectangular, and the rectangular sliding blocks are slidably connected to the rectangular sliding grooves.

[0010] Preferably, a cylindrical handle is fixed to the front end of the packaging box, and symmetrical cylindrical positive magnets are fixedly installed on the back of the packaging box. A circular insertion groove is opened on the back of the inner side of the packaging shell, and a negative magnet is installed inside the insertion groove. The positive magnets are magnetically connected to the negative magnets to fix the packaging box inside the packaging shell.

[0011] Preferably, the top four ends of the encapsulation shell are provided with circular grooves in the shape of an annulus, and springs are installed inside the circular grooves. Sliding rods are fixed at the bottom four ends of the top cover plate, and the bottom ends of the sliding rods are inserted into the interior of the circular grooves, with the bottom end face of the sliding rods fitting against the top end of the springs.

[0012] Preferably, rectangular stretching grooves are provided on both sides of the top of the encapsulation shell, and a slot is provided on the outer side of the rectangular stretching grooves. Rectangular stretching blocks are fixed on both sides of the bottom of the top cover, and a slot is fixed on the outer side of the rectangular stretching blocks. The rectangular stretching blocks are slidably inserted into the rectangular stretching grooves. The encapsulation structure body is fixed at the central axis of the bottom of the top cover.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, this utility model provides a miniaturized chip ceramic Hall integrated circuit packaging structure, which has the following advantages:

[0015] 1. This miniaturized chip ceramic Hall effect integrated circuit package structure uses the integrated circuit board as the core component. The circuits on the board realize the functional conversion related to the Hall effect. When the external magnetic field changes, the integrated circuit board can convert the change in magnetic field into a change in electrical signal. Multiple metal pins at both ends are used for electrical connection with external circuits to transmit and receive signals. These metal pins are precisely connected to the pin insertion slots in the package box to ensure the stability and reliability of signal transmission. The package box protects the integrated circuit board and provides connection and relative movement with the package shell. The rectangular vent holes inside facilitate internal air circulation, ensuring the working stability of the integrated circuit board under different ambient temperatures and avoiding performance impact due to heat accumulation.

[0016] 2. This miniaturized chip ceramic Hall effect integrated circuit packaging structure features a rectangular sliding block that slides smoothly into a rectangular sliding groove within the packaging housing. This allows the packaging box to slide smoothly within the housing, thereby adjusting the relative positions of the internal components. The packaging housing not only provides external protection for the entire packaging structure but also achieves magnetic connection and relative fixation with the packaging box through its internal structural design. The negative magnet inside the housing magnetically engages with the positive magnet on the back of the packaging box. This magnetic connection method facilitates the installation and removal of the packaging box within the housing and, to a certain extent, ensures the relative positional stability of the packaging box during normal operation, preventing excessive displacement due to external vibrations or other factors.

[0017] 3. This miniaturized chip ceramic Hall effect integrated circuit package structure features a circular vent that facilitates gas exchange between the package's interior and the external environment, further optimizing heat dissipation and pressure balance. The top cover seals the top opening of the package housing, protecting internal components from external dust, moisture, and other contaminants. A sliding rod at its bottom engages with a spring in a circular groove at the top of the package housing, maintaining pressure after installation to ensure a tight seal. This also allows for easy removal of the top cover when maintenance or repair is needed, by applying appropriate external force to overcome the spring's elasticity. The rectangular stretching block, the rectangular stretching groove on the package housing, and the locking block and slot further enhance the stability and reliability of the connection between the top cover and the package housing, preventing accidental loosening or detachment of the top cover during use. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram showing the structural breakdown of this utility model;

[0020] Figure 3 This is a schematic diagram of the packaging box structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the packaging shell structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the top cover structure of this utility model.

[0023] In the diagram: 1. Integrated circuit board; 2. Metal pins; 3. Package box; 4. Package shell; 5. Spring; 6. Top cover; 7. Cylindrical handle; 8. Positive magnet; 9. Rectangular slider; 10. Rectangular vent; 11. Mounting slot; 12. Pin insertion slot; 13. Placement slot; 14. Circular vent; 15. Rectangular sliding slot; 16. Negative magnet; 17. Rectangular stretching slot; 18. Slot; 19. Circular slot; 20. Rectangular stretching block; 21. Slot; 22. Package structure body; 23. Sliding rod. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-5 A miniaturized chip ceramic Hall effect integrated circuit packaging structure includes an integrated circuit board 1, a packaging box 3, a packaging shell 4, and a top cover 6. Multiple metal pins 2 are fixed at both ends of the integrated circuit board 1. The integrated circuit board 1 is inserted and installed inside the packaging box 3. Symmetrical positive magnets 8 are fixed on the back of the packaging box 3. Symmetrical negative magnets 16 are installed on the back of the inside of the packaging shell 4. The packaging box 3 is slidably installed inside the packaging shell 4. The positive magnets 8 and the negative magnets 16 are magnetically connected. Circular grooves 19 are opened at the four ends of the top of the packaging shell 4. Multiple sliding rods 23 are fixed at the bottom of the top cover 6. The ends of the sliding rods 23 and springs 5 ​​are installed inside the circular grooves 19.

[0026] Furthermore, the encapsulation box 3 has a rectangular vent hole 10 inside, and a mounting groove 11 is provided on the rectangular vent hole 10. Rectangular pin insertion grooves 12 are provided on both ends of the mounting groove 11. Multiple metal pins 2 are fixed at both ends of the integrated circuit board 1. The bottom of the integrated circuit board 1 is inserted into the mounting groove 11, and the metal pins 2 are inserted into the pin insertion grooves 12. The precise insertion and mating ensures the stability and reliability of signal transmission.

[0027] Furthermore, the two ends of the encapsulation box 3 are fixed with symmetrical rectangular sliding blocks 9. The inside of the encapsulation shell 4 is provided with a placement groove 13. The bottom end of the placement groove 13 is provided with a circular vent hole 14. The two ends of the inside of the encapsulation shell 4 are provided with symmetrical rectangular sliding grooves 15. The rectangular sliding blocks 9 are slidably connected to the rectangular sliding grooves 15, so that the encapsulation box 3 can slide smoothly inside the encapsulation shell 4, thereby adjusting the relative position of the internal components. The encapsulation shell 4 not only provides external protection for the entire encapsulation structure.

[0028] Furthermore, a cylindrical handle 7 is fixed to the front end of the encapsulation box 3, and symmetrical cylindrical positive magnets 8 are fixedly installed on the back of the encapsulation box 3. A circular insertion groove is opened on the back of the inner side of the encapsulation shell 4, and a negative magnet 16 is installed inside the insertion groove. The positive magnet 8 and the negative magnet 16 are magnetically connected to each other, so that the encapsulation box 3 is fixedly installed inside the encapsulation shell 4. This facilitates the installation and removal of the encapsulation box 3 inside the encapsulation shell 4, and can also ensure the relative positional stability of the encapsulation box 3 during normal operation to a certain extent, preventing it from being excessively displaced due to external vibrations or other factors.

[0029] Furthermore, the top of the housing 4 has four circular grooves 19 in the shape of an annulus. A spring 5 is installed inside the circular groove 19. A sliding rod 23 is fixed at the bottom of the top cover plate 6. The bottom end of the sliding rod 23 is inserted into the inside of the circular groove 19, and the bottom end face of the sliding rod 23 fits against the top end of the spring 5.

[0030] Furthermore, rectangular stretching grooves 17 are provided on both sides of the top of the encapsulation shell 4, and slots 18 are provided on the outer side of the rectangular stretching grooves 17. Rectangular stretching blocks 20 are fixed on both sides of the bottom of the top cover plate 6, and slots 21 are fixed on the outer side of the rectangular stretching blocks 20. The rectangular stretching blocks 20 are slidably inserted into the rectangular stretching grooves 17. The encapsulation structure body 22 is fixed at the central axis of the bottom of the top cover plate 6.

[0031] Working Principle: The integrated circuit board 1, as the core component, implements Hall effect-related functional conversion. When the external magnetic field changes, the integrated circuit board 1 converts the change in magnetic field into a change in electrical signal. Multiple metal pins 2 at its two ends are used for electrical connection with external circuits to transmit and receive signals. These metal pins 2 are precisely engaged with the pin insertion slots 12 inside the package 3, ensuring the stability and reliability of signal transmission. The package 3 protects the integrated circuit board 1 and provides connection and relative movement with the package housing 4. Its internal rectangular vent 10 facilitates internal air circulation, ensuring the working stability of the integrated circuit board 1 under different ambient temperatures and preventing performance degradation due to heat accumulation. The rectangular sliding block 9 slides and engages with the rectangular sliding groove 15 inside the package housing 4, allowing the package 3 to slide smoothly within the package housing 4, thereby adjusting the relative positions of the internal components. The package housing 4 not only provides external protection for the entire package structure but also achieves magnetic connection and relative fixation with the package 3 through its internal structural design. Its internal negative magnet 16 is connected to the package 3... The positive magnet 8 on the back is magnetically connected. This magnetic connection method facilitates the installation and removal of the encapsulation box 3 inside the encapsulation shell 4, and also ensures the relative positional stability of the encapsulation box 3 during normal operation, preventing excessive displacement due to external vibrations and other factors. The circular vent 14 also helps the gas exchange between the encapsulation and the external environment, further optimizing heat dissipation and air pressure balance. The top cover 6 is used to close the top opening of the encapsulation shell 4, protecting the internal components from external dust, moisture and other contaminants. The sliding rod 23 at its bottom cooperates with the spring 5 in the circular groove 19 at the top of the encapsulation shell 4, so that the top cover 6 can maintain a certain pressure after installation, ensuring the sealing effect. At the same time, it is also convenient to open the encapsulation for maintenance or repair by applying appropriate external force to overcome the elasticity of the spring 5 and realize the removal of the top cover 6. The cooperation between the rectangular stretching block 20 and the rectangular stretching groove 17 on the encapsulation shell 4, as well as the cooperation between the locking block 21 and the locking groove 18, further enhances the stability and reliability of the connection between the top cover 6 and the encapsulation shell 4, preventing the top cover 6 from accidentally loosening or falling off during use.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A miniaturized chip ceramic Hall effect integrated circuit packaging structure, comprising an integrated circuit board (1), a package box (3), a package housing (4), and a top cover plate (6), characterized in that: The integrated circuit board (1) has multiple metal pins (2) fixed at both ends. The integrated circuit board (1) is inserted into the inside of the package box (3). The back of the package box (3) is fixed with mutually symmetrical positive magnets (8). The back of the package shell (4) is installed with mutually symmetrical negative magnets (16). The package box (3) is slidably installed inside the package shell (4). The positive magnets (8) and negative magnets (16) are magnetically connected. The top of the package shell (4) has four circular grooves (19) at its four ends. The bottom of the top cover plate (6) is fixed with multiple sliding rods (23). The ends of the sliding rods (23) and springs (5) are installed inside the circular grooves (19).

2. The miniaturized chip ceramic Hall integrated circuit packaging structure according to claim 1, characterized in that: The encapsulation box (3) has a rectangular vent hole (10) inside, and a mounting groove (11) is provided on the rectangular vent hole (10). Rectangular pin insertion grooves (12) are provided on both ends of the mounting groove (11). Multiple metal pins (2) are fixed at both ends of the integrated circuit board (1). The bottom of the integrated circuit board (1) is inserted into the mounting groove (11), and the metal pins (2) are inserted into the pin insertion grooves (12).

3. The miniaturized chip ceramic Hall effect integrated circuit packaging structure according to claim 2, characterized in that: The two ends of the encapsulation box (3) are fixed with rectangular sliding blocks (9) that are symmetrical and rectangular. The encapsulation shell (4) has a placement groove (13) inside. The bottom end of the placement groove (13) has a circular vent hole (14). The two ends of the encapsulation shell (4) have rectangular sliding grooves (15) that are symmetrical and rectangular. The rectangular sliding blocks (9) are slidably connected to the rectangular sliding grooves (15).

4. The miniaturized chip ceramic Hall integrated circuit packaging structure according to claim 3, characterized in that: The front end of the encapsulation box (3) is fixed with a cylindrical handle (7), and the back of the encapsulation box (3) is fixed with symmetrical and cylindrical positive magnets (8). The back of the encapsulation shell (4) is provided with a ring-shaped insertion groove, and a negative magnet (16) is installed inside the insertion groove. The positive magnet (8) and the negative magnet (16) are magnetically connected to each other, so that the encapsulation box (3) is fixedly installed inside the encapsulation shell (4).

5. The miniaturized chip ceramic Hall effect integrated circuit packaging structure according to claim 1, characterized in that: The top of the encapsulation shell (4) has four circular grooves (19) at its top four ends. A spring (5) is installed inside the circular groove (19). A sliding rod (23) is fixed at the bottom four ends of the top cover plate (6). The bottom end of the sliding rod (23) is inserted into the inside of the circular groove (19), and the bottom end face of the sliding rod (23) fits against the top end of the spring (5).

6. The miniaturized chip ceramic Hall integrated circuit packaging structure according to claim 5, characterized in that: The top of the encapsulation shell (4) has rectangular stretching grooves (17) on both sides, and slots (18) are provided on the outer side of the rectangular stretching grooves (17). Rectangular stretching blocks (20) are fixed on both sides of the bottom of the top cover plate (6). Slots (21) are fixed on the outer side of the rectangular stretching blocks (20). The rectangular stretching blocks (20) are slidably inserted into the rectangular stretching grooves (17). The encapsulation structure body (22) is fixed at the bottom center axis of the top cover plate (6).

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