Heat dissipation assembly for circuit board of smart phone

Abstract

The utility model relates to the technical field of mobile phone heat dissipation, and particularly discloses a heat dissipation assembly for an intelligent mobile phone circuit board, which comprises a mobile phone shell and a circuit board, the mobile phone shell is provided with a through groove, the inner side of the through groove is fixedly connected with a conduction plate, and a contact piece is arranged below the conduction plate. When heat dissipation needs to be increased, the heat dissipation guide blocks can be inserted into the through grooves through pressing, and the bottoms of the heat dissipation guide blocks penetrate through the heat conduction intervals to be in contact with the top surface of the conduction plate, so that heat generated by the circuit board during collection and use can be transmitted to the contact pieces, and then the heat is transmitted to the conduction fins through the contact pieces; the heat is conducted to the conducting plate through the conducting fins, so that the heat can be diffused outwards through the heat dissipation guide blocks to complete heat dissipation, the surface of the partition plate is concavo-convex after the heat dissipation guide blocks are connected in an inserted mode during heat dissipation, the surface area is increased, the heat dissipation efficiency can be improved, in addition, the occupied space is small, conducting heat dissipation is conducted, and daily use is not affected.

Description

Technical Field

[0001] This utility model belongs to the field of mobile phone heat dissipation technology, specifically relating to a heat dissipation component for a smartphone circuit board. Background Technology

[0002] With the widespread use of smartphones, the heat generated by these devices is increasing, and the CPU is the primary source of heat. Overheating of the CPU often causes lag or crashes, which not only severely impacts the phone's lifespan but can also cause permanent damage. However, due to the limited internal space of smartphones, the most that can be achieved is by adding a heat dissipation module to passively exchange heat with the outside environment. This method, however, is inefficient and cannot meet the cooling needs of high-powered smartphones.

[0003] Chinese patent CN115243514A discloses a heat dissipation component for a smartphone circuit board. This invention utilizes heat conduction between a first air duct, a second air duct, a metal heat-conducting plate, and a metal heat sink, along with a first fan and a second fan, to achieve heat exchange between the phone's internal heat and the external cool air, thus rapidly dissipating heat from the phone's CPU. This invention features a simple structure, good heat dissipation effect, and high efficiency.

[0004] While the aforementioned device can quickly dissipate heat from the CPU, existing mobile phone casings already have a certain degree of heat dissipation, and the device requires the installation and operation of a fan, thus increasing the cost of use and affecting daily use. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation component for smartphone circuit boards to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A heat dissipation assembly for a smartphone circuit board includes a phone housing and a circuit board. The phone housing has a through slot, and a conductive plate is fixedly connected to the inner side of the through slot. A contact piece is disposed below the conductive plate, and the bottom of the contact piece is attached to the top of the circuit board. A partition is disposed above the conductive plate, and a heat dissipation guide block is disposed inside the partition. The heat dissipation guide block cooperates with the contact piece and the conductive plate to conduct heat dissipation.

[0008] Preferably, a sealing ring is provided around the periphery of the partition, the inner side of the sealing ring is attached to the partition, the outer side of the sealing ring is attached to the inner side of the through groove, and the partition is coplanar with the upper surface of the mobile phone casing.

[0009] Preferably, a heat-conducting gap is provided between the conductive plate and the partition plate, the partition plate has a through groove that runs vertically through it, and the heat dissipation guide block is slidably connected inside the through groove, the heat dissipation guide block fitting into the through groove.

[0010] Preferably, limit blocks are fixedly connected to both sides of the heat dissipation block, and a pull strap is connected to the top of the heat dissipation block.

[0011] Preferably, the conductive plate has evenly arranged conductive fins below it, and the contact plate has a groove above it.

[0012] Preferably, the conductive fins are fixedly connected to the conductive plate, and the bottom end of the conductive fins fits into the interior of the groove.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] I. When increased heat dissipation is required, the heat dissipation guide block can be inserted into the through groove by pressing, and the bottom of the heat dissipation guide block can pass through the heat conduction interval and contact the top surface of the conduction plate. This allows the heat generated by the circuit board during collection and use to be transferred to the contact piece, then to the conduction fins, and finally to the conduction plate. Thus, the heat can be diffused to the outside through the heat dissipation guide block to complete the heat dissipation. Since the heat dissipation guide block creates unevenness on the surface of the partition plate during heat dissipation, the surface area is increased, thereby increasing the heat dissipation efficiency.

[0015] Second, when no additional heat dissipation is needed, the heat dissipation guide block can be prevented from contacting the conductive plate by pulling the pull strap, thereby allowing the phone casing to dissipate heat on its own. Since the contact piece, conductive plate, heat dissipation guide block and partition are stacked one after another, the space occupied is small and heat dissipation is carried out by conduction, so as not to affect daily use. Attached Figure Description

[0016] Figure 1 This is a perspective view of the entire utility model;

[0017] Figure 2 This is a schematic diagram of the overall separated cross-sectional structure of this utility model;

[0018] Figure 3 This utility model Figure 2 A schematic diagram of the middle section;

[0019] Figure 4 This utility model Figure 2 A schematic diagram of the middle section.

[0020] In the picture:

[0021] 1. Mobile phone casing; 2. Through slot; 3. Contact piece; 4. Groove; 5. Conductive plate; 6. Conductive fins; 7. Partition; 8. Sealing ring; 9. Through slot; 10. Heat dissipation block; 11. Limiting block; 12. Heat conduction interval; 13. Circuit board; 14. Pull strap. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Reference Figures 1-4 As shown, this utility model provides a heat dissipation component for a smartphone circuit board, including a phone housing 1 and a circuit board 13. The phone housing 1 has a through groove 2, and a conductive plate 5 is fixedly connected to the inner side of the through groove 2. A contact piece 3 is provided below the conductive plate 5, and the bottom of the contact piece 3 is attached to the top of the circuit board 13. A partition 7 is provided above the conductive plate 5, and a heat dissipation guide block 10 is provided inside the partition 7. The heat dissipation guide block 10 works with the contact piece 3 and the conductive plate 5 to conduct heat dissipation. The phone housing 1 is the back housing of a common mobile phone; the circuit board 13 is a circuit board portion collected in the prior art.

[0024] In a further embodiment, a sealing ring 8 is provided around the partition 7, the inner side of the sealing ring 8 is attached to the partition 7, the outer side of the sealing ring 8 is attached to the inner side of the through groove 2, and the partition 7 is coplanar with the upper end surface of the mobile phone housing 1.

[0025] In this embodiment, the sealing ring 8 can be disassembled to replace the filling material inside the thermally conductive space 12.

[0026] In a further embodiment, a heat-conducting gap 12 is provided between the conductive plate 5 and the partition plate 7. The partition plate 7 has a through groove 9 that runs vertically through the partition plate. The heat dissipation block 10 is slidably connected inside the through groove 9 and fits the through groove 9.

[0027] In this embodiment, the cross-sections of the through groove 9 and the heat dissipation block 10 are fitted together, allowing the heat dissipation block 10 to slide. The cross-section consists of a vertical block and multiple horizontal blocks. Thermal grease is punched inside the thermally conductive space 12, which can better conduct heat.

[0028] In a further embodiment, limit blocks 11 are fixedly connected to both sides of the heat dissipation guide block 10, and a pull strap 14 is connected to the top of the heat dissipation guide block 10.

[0029] In this embodiment, the inner wall of the through groove 9 is provided with a sliding groove of the common limiting block 11, so as to facilitate the up and down sliding of the heat dissipation guide block 10; the pull strap 14 is used to facilitate the pulling of the heat dissipation guide block 10, so that the upper surface of the heat dissipation guide block 10 is coplanar with the partition 7 and the mobile phone shell 1.

[0030] In a further embodiment, conductive fins 6 are evenly arranged below the conductive plate 5, and a groove 4 is provided above the contact piece 3.

[0031] In this embodiment, the interior of the groove 4 is filled with silicone grease for better heat conduction; the contact piece 3, the conductive plate 5, the conductive fins 6, the partition 7, and the heat dissipation block 10 are all made of thermally conductive aluminum for heat conduction.

[0032] In a further embodiment, the conductive fin 6 is fixedly connected to the conductive plate 5, and the bottom end of the conductive fin 6 fits into the interior of the groove 4.

[0033] In this embodiment, silicone grease is applied to the contact patch 3 where it contacts the circuit board 13.

[0034] The working principle of this utility model is as follows:

[0035] When heat dissipation is required, the heat dissipation guide block 10 can be pressed to insert into the through slot 9, and the bottom of the heat dissipation guide block 10 can pass through the heat conduction interval 12 and contact the top surface of the conduction plate 5. This allows the heat generated by the circuit board 13 during collection and use to be transferred to the contact piece 3, and then from the contact piece 3 to the conduction fin 6, and then from the conduction fin 6 to the conduction plate 5. Thus, the heat can be diffused to the outside through the heat dissipation guide block 10 to complete the heat dissipation. Since the heat dissipation guide block 10 creates unevenness on the surface of the partition plate 7 after insertion, the surface area is increased, thereby increasing the heat dissipation efficiency.

[0036] When no additional heat dissipation is needed, the heat dissipation block 10 can be prevented from contacting the conductive plate 5 by pulling the pull strap 14, thereby allowing the phone casing 1 to dissipate heat on its own. Since the contact piece 3, conductive plate 5, heat dissipation block 10 and partition 7 are stacked one after another, they occupy little space and conduct heat dissipation, thus not affecting daily use.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation assembly for a smartphone circuit board, comprising a phone housing (1) and a circuit board (13), characterized in that, The mobile phone casing (1) has a through groove (2), and a conductive plate (5) is fixedly connected to the inner side of the through groove (2). A contact piece (3) is provided below the conductive plate (5). The bottom of the contact piece (3) is attached to the top of the circuit board (13). A partition (7) is provided above the conductive plate (5). A heat dissipation guide block (10) is provided inside the partition (7). The heat dissipation guide block (10) works with the contact piece (3) and the conductive plate (5) to conduct heat dissipation.

2. A heat dissipation assembly for a smartphone circuit board according to claim 1, characterized in that: A sealing ring adhesive (8) is provided around the partition (7). The inner side of the sealing ring adhesive (8) is attached to the partition (7), and the outer side of the sealing ring adhesive (8) is attached to the inner side of the through groove (2). The partition (7) is coplanar with the upper end surface of the mobile phone housing (1).

3. A heat dissipation assembly for a smartphone circuit board according to claim 1, characterized in that: A heat-conducting gap (12) is provided between the conductive plate (5) and the partition plate (7). The partition plate (7) has a through groove (9) that runs vertically through the partition plate. The heat dissipation block (10) is slidably connected inside the through groove (9) and fits into the through groove (9).

4. A heat dissipation assembly for a smartphone circuit board according to claim 1, characterized in that: Limiting blocks (11) are fixedly connected to both sides of the heat dissipation guide block (10), and a pull strap (14) is connected to the top of the heat dissipation guide block (10).

5. A heat dissipation assembly for a smartphone circuit board according to claim 1, characterized in that: The conductive plate (5) is provided with uniformly arranged conductive fins (6) below it, and the contact plate (3) is provided with a groove (4) above it.

6. A heat dissipation assembly for a smartphone circuit board according to claim 5, characterized in that: The conductive fin (6) is fixedly connected to the conductive plate (5), and the bottom end of the conductive fin (6) fits into the inside of the groove (4).

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