Novel heat dissipation device and electronic equipment

Abstract

The utility model provides a novel heat dissipation device and electronic equipment. The novel heat dissipation device comprises an aluminum profile base, a worm wheel fan blade, a heat conduction piece and a cover plate. The upper end face of the aluminum profile base is provided with a plurality of cooling fins extending in the horizontal direction. The worm wheel fan blades are embedded in the aluminum profile base and are arranged in a manner of avoiding the heat dissipation fins. The heat conduction piece is arranged on the lower end face of the aluminum profile base. The cover plate is provided with a ventilation opening and covers the upper portion of the aluminum profile base in a matched mode. At least part of the worm wheel fan blades protrude out of the cooling fins, the ventilation opening and the worm wheel fan blades directly face each other and are longitudinally communicated, and the worm wheel fan blades are flush with the cover plate; the radiating fins arranged on the aluminum profile base extend in the horizontal direction, so that the radiating area is increased, and heat diffusion is accelerated; and the fan blades of the worm gear partially protrude out of the cooling fins and are flush with the cover plate, so that the overall structure of the device is compact, the size is reduced, the stability and anti-seismic performance of the device are ensured, and the heat dissipation requirement of the mobile equipment is met.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and more specifically, to a novel heat dissipation device and electronic device. Background Technology

[0002] In commercially available electronic devices, especially high-performance, miniaturized equipment such as industrial control computers and servers, the heat generated by processors, graphics cards, and other high-energy-consuming components has increased significantly with improved performance, leading to increasingly serious heat dissipation problems. Effective heat dissipation has become a crucial factor in ensuring stable equipment operation and extending its lifespan.

[0003] However, traditional air-cooling technology is increasingly proving inadequate in meeting the high-density, high-power consumption heat demands of modern devices. Traditional cooling methods often rely on simple combinations of down-draft axial fans and heat sink fins. While these can conduct and dissipate heat, the limited airflow due to the simple structure of the heat sink makes it difficult to effectively reduce the temperature of high-heat-generating components.

[0004] Furthermore, due to height restrictions, existing heat sinks cannot meet the needs of customers' chassis on the market, and there are few compatible cases. For high-power chips, the design space is limited, resulting in less efficient heat dissipation from the fins and a significant reduction in heat dissipation performance due to the structure. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a new type of heat dissipation device and electronic device to solve the above problems.

[0006] The present invention adopts the following solution:

[0007] This application provides a novel heat dissipation device, comprising: an aluminum profile base, a worm gear fan blade, a heat-conducting component, and a cover plate; the upper surface of the aluminum profile base is provided with a plurality of heat dissipation fins extending in a horizontal direction; the worm gear fan blade is embedded in the aluminum profile base and is arranged to avoid contact with the heat dissipation fins; the heat-conducting component is disposed on the lower surface of the aluminum profile base; the cover plate has a ventilation opening and is adapted to cover the upper part of the aluminum profile base; at least part of the worm gear fan blade protrudes from the heat dissipation fins, the ventilation opening and the worm gear fan blade are directly opposite each other and communicate longitudinally, and the worm gear fan blade is flush with the cover plate.

[0008] As a further improvement, the upper surface of the aluminum profile base forms a central mounting area with part of the heat dissipation fins hollowed out, and the worm gear fan blades are arranged within the mounting area.

[0009] As a further improvement, the worm gear fan blades are integrally formed on the mounting area of ​​the aluminum profile base and are spaced apart from the heat dissipation fins.

[0010] As a further improvement, the cover plate is detachably fitted onto the aluminum profile base to cooperate in forming a rectangular box shell.

[0011] As a further improvement, the cover plate includes a top cover and two side plates facing each other, the vent is opened on the top cover, and the side plates are respectively snapped onto the side edges of the aluminum profile base.

[0012] As a further improvement, the top cover is also provided with a plurality of bolt holes facing each other, and the top cover is connected to the aluminum profile base by fasteners inserted into the bolt holes.

[0013] As a further improvement, each of the four corners of the lower end face of the aluminum profile base is provided with a column foot, and the thickness of the heat-conducting component is less than the height of the column foot.

[0014] As a further improvement, the heat-conducting element is configured as a silicone pad or a ceramic pad.

[0015] This application also provides an electronic device, including the novel heat dissipation device described above.

[0016] By adopting the above technical solution, the present invention can achieve the following technical effects:

[0017] 1. The novel heat dissipation device of this application has heat dissipation fins on the aluminum profile base that extend horizontally, increasing the heat dissipation area and accelerating the diffusion of heat. In addition, the worm gear fan blades can promote airflow, so that heat can be quickly conducted from the aluminum profile base to the surrounding environment, thereby improving the overall heat dissipation efficiency.

[0018] 2. The worm gear fan blades protrude from the heat dissipation fins and are flush with the cover plate, making the overall structure of the device compact and reducing its size. Furthermore, the tight connection between the worm gear fan blades and the mounting area of ​​the aluminum profile base ensures the stability and shock resistance of the device, making it suitable for the heat dissipation needs of mobile devices such as laptops.

[0019] 3. The vents and worm gear fan blades face each other to form a longitudinal airflow channel. The worm gear fan blades further propel the airflow, ensuring that air can smoothly pass through the heat dissipation fins and base area, preventing heat accumulation and effectively reducing the equipment temperature. In addition, heat-conducting components are located on the lower end face of the base to ensure rapid heat transfer. Attached Figure Description

[0020] Figure 1 This is a disassembly diagram of the novel heat dissipation device according to an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the novel heat dissipation device according to an embodiment of the present utility model;

[0022] Figure 3This is a schematic diagram of the novel heat dissipation device according to an embodiment of the present invention from another perspective.

[0023] Icons: 1-Aluminum profile base; 2-Worm gear fan blade; 3-Heat conduction component; 4-Cover plate; 5-Heat dissipation fins; 6-Ventilation opening; 7-Top cover; 8-Side plate; 9-Bolt hole; 10-Column foot. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0025] Example

[0026] Combination Figure 1 As shown in the figure, this embodiment provides a novel heat dissipation device, including: an aluminum profile base 1, a worm gear fan blade 2, a heat-conducting component 3, and a cover plate 4. The upper surface of the aluminum profile base 1 is provided with multiple heat dissipation fins 5 extending horizontally. The worm gear fan blade 2 is embedded in the aluminum profile base 1 and is arranged to avoid contact with the heat dissipation fins. The heat-conducting component 3 is disposed on the lower surface of the aluminum profile base 1. The cover plate 4 has a ventilation opening 6 and is adapted to cover the top of the aluminum profile base 1. The worm gear fan blade 2 at least partially protrudes from the heat dissipation fins, the ventilation opening 6 and the worm gear fan blade 2 are directly opposite each other and longitudinally connected, and the worm gear fan blade 2 is flush with the cover plate 4.

[0027] The novel heat dissipation device described above features heat dissipation fins 5 on the aluminum profile base 1 that extend horizontally, increasing the heat dissipation area and accelerating heat diffusion. Furthermore, the worm gear fan blades 2 promote airflow, enabling heat to be quickly conducted from the aluminum profile base 1 to the surrounding environment, thereby improving the overall heat dissipation efficiency.

[0028] The worm gear fan blade 2 protrudes from the heat dissipation fins 5 and is flush with the cover plate 4, making the overall structure of the device compact and reducing its size. Furthermore, the worm gear fan blade 2 is tightly integrated with the mounting area of ​​the aluminum profile base 1, ensuring the stability and shock resistance of the device, which is suitable for the heat dissipation needs of mobile devices such as laptops.

[0029] In particular, the vent 6 and the worm gear fan blade 2 face each other to form a longitudinal airflow channel. The worm gear fan blade 2 further promotes airflow, ensuring that air can pass smoothly through the heat dissipation fins 5 and the base area, avoiding heat accumulation and effectively reducing the equipment temperature. In addition, the heat-conducting component 3 is located on the lower end face of the base to ensure rapid heat transfer.

[0030] In this embodiment, the upper surface of the aluminum profile base 1 forms a central mounting area with a portion of the heat dissipation fins hollowed out, and the worm gear fan blade 2 is disposed within this mounting area. Preferably, the worm gear fan blade 2 is integrally formed on the mounting area of ​​the aluminum profile base 1 and is spaced apart from the heat dissipation fins. Thus, through the integral forming design, the worm gear fan blade 2 is tightly integrated with the mounting area of ​​the aluminum profile base 1, thereby better meeting the installation requirements of height-restricted environments.

[0031] In this embodiment, the cover plate 4 is detachably mounted on the aluminum profile base 1 to form a rectangular box shell. The cover plate 4 includes a top cover 7 and two opposing side plates 8. The ventilation opening 6 is located on the top cover 7, and the side plates 8 are respectively snapped onto the side edges of the aluminum profile base 1. On one hand, the cover plate 4 is detachable and can be easily mounted on the aluminum profile base 1 to form a unified rectangular box shell, facilitating quick assembly and disassembly, and simplifying maintenance, cleaning, or replacement of internal components, thus improving usage and maintenance efficiency. On the other hand, the cover plate 4, composed of the top cover 7 and the opposing side plates 8, is fixed to the side edges of the aluminum profile base 1 by snapping the side plates 8 together. This significantly enhances the robustness of the connection between the cover plate 4 and the base, contributing to improved overall vibration resistance and durability.

[0032] Furthermore, the top cover 7 is also provided with a plurality of bolt holes 9 facing each other, and the top cover 7 is connected to the aluminum profile base 1 by fasteners inserted into the bolt holes 9. Thus, the top cover 7 is connected to the aluminum profile base 1 through a plurality of bolt holes 9 facing each other, so that the entire device can be firmly assembled together, avoiding loosening or displacement during use, and significantly improving the structural stability of the device.

[0033] In this embodiment, each of the four corners of the lower end face of the aluminum profile base 1 is provided with a column foot 10, and the thickness of the heat-conducting component 3 is less than the height of the column foot 10. After the heat sink is installed, a certain distance is maintained between the heat-conducting component 3 and the placement surface, preventing heat from being directly conducted to the placement surface and improving the safety of the equipment. The column foot 10 raises the bottom of the heat sink, forming a certain heat dissipation gap, which is conducive to air circulation at the bottom of the equipment and promotes the natural dissipation of heat, thereby further improving the heat dissipation efficiency. Preferably, the heat-conducting component 3 is configured as a silicone pad or a ceramic pad.

[0034] In addition, this embodiment also provides an electronic device, including the novel heat dissipation device described above. This electronic device can be, but is not limited to, industrial control computers, servers, etc.

[0035] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions that fall within the scope of this utility model's concept are protected by this utility model.

Claims

1. A novel heat dissipation device, characterized in that, include: The aluminum profile base has multiple heat dissipation fins extending horizontally on its upper surface; The worm gear fan blades are embedded in the aluminum profile base and are arranged to avoid each other with the heat dissipation fins; A heat-conducting component is disposed on the lower end face of the aluminum profile base; The cover plate has ventilation openings and fits to cover the top of the aluminum profile base; The worm gear fan blades at least partially protrude from the heat dissipation fins, the vents and the worm gear fan blades are directly opposite each other and longitudinally connected, and the worm gear fan blades are flush with the cover plate.

2. The novel heat dissipation device according to claim 1, characterized in that, The upper surface of the aluminum profile base forms a central mounting area with part of the heat dissipation fins hollowed out, and the worm gear fan blades are arranged within the mounting area.

3. The novel heat dissipation device according to claim 2, characterized in that, The worm gear fan blades are integrally formed on the mounting area of ​​the aluminum profile base and are spaced apart from each other with the heat dissipation fins.

4. The novel heat dissipation device according to claim 1, characterized in that, The cover plate is detachably attached to the aluminum profile base to form a rectangular box shell.

5. The novel heat dissipation device according to claim 1, characterized in that, The cover plate includes a top cover and two side plates facing each other. The ventilation opening is opened on the top cover, and the side plates are respectively snapped onto the side edges of the aluminum profile base.

6. The novel heat dissipation device according to claim 5, characterized in that, The top cover is also provided with a number of bolt holes facing each other, and the top cover is connected to the aluminum profile base by fasteners inserted into the bolt holes.

7. The novel heat dissipation device according to claim 1, characterized in that, The aluminum profile base has four corners at its lower end, and the thickness of the heat-conducting component is less than the height of the corner.

8. The novel heat dissipation device according to claim 7, characterized in that, The heat-conducting component is configured as a silicone pad or a ceramic pad.

9. An electronic device, characterized in that, Including the novel heat dissipation device as described in any one of claims 1 to 8.

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