Solder strip assembly, preparation device thereof and photovoltaic assembly

Abstract

The embodiment of the utility model discloses a solder strip assembly, a preparation device thereof and a photovoltaic assembly. The solder strip assembly comprises a solder strip body with a circular cross section and a reflective structure, the solder strip body and the reflective structure are prepared respectively; the welding strip body is provided with a first connecting face. The reflective structure and the solder strip body extend in the same direction, the reflective structure comprises a second connecting surface and two reflective surfaces, and a set included angle is formed between the two reflective surfaces. According to the embodiment of the invention, the reflective structure and the solder strip body are arranged to be two independent structures which are respectively processed and formed, and then are connected through the second connecting surface and the first connecting surface to form the solder strip assembly with the reflective function, so that the processing difficulty of the solder strip assembly is reduced, and the cost is reduced. Moreover, based on the independent arrangement, the reflective structure and the solder strip body do not need to be made of the same material, the reflective structure only needs to be selected based on the reflective function, electric conduction does not need to be achieved, and therefore the materials of the reflective structure and the solder strip body can be selected reasonably.

Description

Technical Field

[0001] This application relates to the field of photovoltaic module technology, and in particular to a ribbon module, its preparation apparatus, and a photovoltaic module. Background Technology

[0002] To improve the photoelectric conversion efficiency of photovoltaic modules, many manufacturers have begun to install reflective structures on the grid lines of the solar cells. These reflective structures can effectively reflect sunlight that shines on the solder ribbon area of ​​the solar cells, making full use of sunlight and thus improving the photoelectric conversion efficiency.

[0003] Currently, after integrating the reflective structure with the battery cell into a single structure, this reflective solder strip needs to achieve both efficient reflection and reliable welding. This places extremely high demands on the solder strip structure, which in turn leads to high cost and low yield of such solder strips. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a solder ribbon assembly, its preparation apparatus, and a photovoltaic module to solve the problems of high cost and low yield of reflective solder ribbons.

[0005] In a first aspect, this application provides a solder ribbon assembly, comprising: a solder ribbon body and a reflective structure; wherein the solder ribbon body and the reflective structure are respectively fabricated.

[0006] The welding strip body has a first connecting surface;

[0007] The reflective structure extends in the same direction as the welding strip body. The reflective structure includes a second connecting surface and two reflective surfaces. A set angle is formed between the two reflective surfaces. The second connecting surface is connected to the first connecting surface.

[0008] Based on the aforementioned solder ribbon assembly, the reflective structure and the solder ribbon body are designed as two separate structures, processed and formed separately, and then connected to the first connecting surface via a second connecting surface to form a solder ribbon assembly with reflective function. This design reduces the processing difficulty and cost of the solder ribbon assembly. Furthermore, due to the independent design, the reflective structure and the solder ribbon body do not need to be made of the same material. The reflective structure only needs to be selected based on its reflective function and does not need to be conductive, thus allowing for the separate and appropriate selection of materials for the reflective structure and the solder ribbon body.

[0009] Optionally, the cross-section of the welding strip body is circular, a portion of the arcuate surface of the welding strip body forms the first connecting surface, and the second connecting surface is an arcuate surface that matches the curvature of the first connecting surface.

[0010] Furthermore, based on the cooperation between the second connecting surface and the first connecting surface, the contact area between the reflective structure and the solder strip body is increased, further improving the connection stability and reliability between the two, and making it easier to maintain their relative position.

[0011] Optionally, the second connecting surface is connected to the first connecting surface by an adhesive layer.

[0012] Furthermore, based on the adhesive layer, when the second connecting surface is connected to the first connecting surface through the adhesive layer, not only can the reflective structure and the solder ribbon body be reliably and stably connected and fixed, but also the fluidity or extensibility of the adhesive layer when it is not fixed can be used to fill the gap between the second connecting surface and the first connecting surface when they are close to each other. At this time, there is no need to process the second connecting surface and the first connecting surface to match the curvature to achieve a reliable connection between them.

[0013] Optionally, the adhesive layer may be a thermosetting adhesive, a UV adhesive, or an EVA adhesive.

[0014] Furthermore, based on existing uniform dispersion printing and dispensing techniques, thermosetting adhesives, UV adhesives, or EVA adhesives can be used to form a reliable adhesive layer between the solder ribbon body and the reflective structure.

[0015] Optionally, the first connecting surface is provided with a first limiting structure to restrict the reflective structure from sliding along the rotation direction of the welding strip body;

[0016] and / or;

[0017] The second connecting surface is provided with a second limiting structure to restrict the reflective structure from sliding along the rotation direction of the welding strip body.

[0018] Furthermore, based on the aforementioned first and second limiting structures, the reflective structure can be limited, positioned, and fixed to prevent it from sliding uncontrollably on the arc-shaped surface of the welding strip body.

[0019] Optionally, the first limiting structure includes two and is arranged along the rotation direction of the welding strip body; the second connecting surface is located between the two first limiting structures;

[0020] or,

[0021] The first limiting structure is a groove opened along the axial direction of the welding strip body, and the second limiting structure is a protrusion opened along the axial direction of the reflective structure.

[0022] Optionally, the reflective structure is made of aluminum, aluminum alloy, silver, or silver alloy.

[0023] and / or;

[0024] The material of the welding strip body is copper.

[0025] Furthermore, based on the aforementioned reflective structure and the material of the solder ribbon body, the reflective structure can be more easily processed by drawing and rolling, and the preparation of the solder ribbon body is also simpler, thereby ensuring the yield rate while reducing costs.

[0026] Optionally, the reflective structure is formed by a wire drawing or calendering process.

[0027] Optionally, the length of the cross-section of the second connecting surface is 0.05mm to 0.3mm.

[0028] Optionally, the length of the cross-section of the second connecting surface is 0.1 mm to 0.2 mm.

[0029] Optionally, the length of the cross-section of the second connecting surface is less than or equal to the length of the cross-section of the welding strip body.

[0030] Furthermore, based on the aforementioned size limitations of the second connecting surface and the welding strip body, the ratio between the two can be made more reasonable, ensuring working effect while reducing material waste. The second connecting surface only needs to be reliably connected to the first connecting surface formed on the outer surface of the welding strip body.

[0031] Optionally, the second connecting surface is connected to the ends of the two reflective surfaces at both ends along the rotation direction of the welding strip body;

[0032] The junction between the two reflective surfaces is rounded.

[0033] And / or,

[0034] At least one of the reflective surfaces has a rounded corner at the junction with the second connecting surface.

[0035] Furthermore, based on the above-mentioned reflective structure, the reflective structure can be made more reliable and its own strength can be improved.

[0036] Optionally, the two reflective surfaces are symmetrically arranged on both sides of the axis of the welding strip body, and the included angle is 50° to 70°.

[0037] And / or,

[0038] The reflective surface is provided with a reflective layer, and the reflectivity of the reflective layer is greater than or equal to 80%.

[0039] And / or,

[0040] The thickness of the reflective layer is 0.1 μm to 2 μm.

[0041] Furthermore, based on the above-mentioned reflective structure, the reflection angle of the reflective structure can be optimized, thereby further improving the photoelectric conversion efficiency. Based on the above-mentioned reflective layer, the reflectivity of the reflective surface can be further improved, thereby further improving the photoelectric conversion efficiency. Based on the thickness of the above-mentioned reflective layer, it is not only easy to process and has low cost, but also achieves high reflectivity and improves the photoelectric conversion efficiency.

[0042] Secondly, this application provides an apparatus for preparing the above-mentioned solder ribbon assembly, the apparatus comprising:

[0043] A regularizing component having a regularizing groove, the shape of which matches the second connecting surface, wherein the reflective structure is regularized by passing through the regularizing groove.

[0044] Optionally, the preform has a first mating surface on the side facing the second connecting surface, and the shape of the first mating surface matches that of the second connecting surface.

[0045] And / or,

[0046] The regular component has a second mating surface on the side facing the first connecting surface, and the shape of the second mating surface matches that of the first connecting surface.

[0047] Furthermore, based on the aforementioned aligning component, while aligning the reflective structure, it also supports the reflective structure and the welding strip body. By setting the first mating surface and the second mating surface, the contact area between the reflective structure and the welding strip body and the aligning component is increased, further improving the stability and reliability of the aligning component in supporting the two.

[0048] Optionally, the second connecting surface is connected to the regularizing groove via an adhesive layer.

[0049] And / or,

[0050] The alignment component is connected to the first connecting surface via an adhesive layer.

[0051] Furthermore, based on the above-mentioned aligning groove, the aligning groove can be coated with adhesive on the first mating surface and the second mating surface, and then connected to the second connecting surface and the first connecting surface respectively.

[0052] Optionally, the straightening component has an adhesive-filled hole, one end of which is connected to the straightening groove, and the other end is opened towards the first connecting surface.

[0053] Furthermore, based on the aforementioned preform, adhesive can be applied to the preform groove located at the top in the direction of gravity, covering the area around the adhesive passage hole. Then, the reflective structure is gently placed in the preform groove to prevent excessive pressure on the adhesive below. After the preform is placed on the first connecting surface and adjusted to the precise position, pressure is applied to the reflective structure to force all the adhesive around the adhesive passage hole through the hole to the area between the second mating surface and the first connecting surface, thereby forming an adhesive bond between the three. The entire process is more convenient, controllable, and yields a high product rate.

[0054] Optionally, the device further includes:

[0055] Circular solder strip preparation equipment for preparing the solder strip body;

[0056] Reflective structure preparation equipment used to prepare the reflective structure.

[0057] Thirdly, this application provides a photovoltaic module, including at least two solar cells, the at least two solar cells being arranged at intervals, and a ribbon assembly as described above or the ribbon assembly prepared by the above-described preparation apparatus being provided between each two adjacent solar cells.

[0058] Furthermore, by setting the reflective structure and the solder ribbon body as two separate structures, processing them separately, and then connecting them with the first connecting surface through the second connecting surface to form a solder ribbon assembly with reflective function, this setting reduces the processing difficulty of the solder ribbon assembly and lowers the cost.

[0059] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects:

[0060] By designing the reflective structure and the solder ribbon body as two separate structures, which are processed and formed separately, and then connected to the first connecting surface via a second connecting surface, a solder ribbon assembly with reflective function is formed. This design reduces the processing difficulty and cost of the solder ribbon assembly. Furthermore, due to the independent design, the reflective structure and the solder ribbon body do not need to be made of the same material. The reflective structure only needs to be selected based on its reflective function and does not need to be conductive, thus allowing for the separate and appropriate selection of materials for the reflective structure and the solder ribbon body.

[0061] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0062] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein:

[0063] Figure 1 This is a schematic diagram of the structure of the solder strip assembly according to one embodiment of this application;

[0064] Figure 2 for Figure 1 Cross-sectional view of the solder strip assembly described in the embodiment;

[0065] Figure 3 This is a schematic diagram of the structure of the solder strip assembly according to one embodiment of this application;

[0066] Figure 4 for Figure 3 Cross-sectional view of the solder strip assembly described in the embodiment;

[0067] Figure 5 This is a schematic diagram of the structure of the solder strip assembly according to one embodiment of this application;

[0068] Figure 6 for Figure 5 Cross-sectional view of the solder strip assembly described in the embodiment;

[0069] Figure 7 This is a schematic diagram of the structure of the solder strip assembly according to one embodiment of this application;

[0070] Figure 8 for Figure 7 Cross-sectional view of the solder strip assembly described in the embodiment;

[0071] Figure 9 for Figure 7 A schematic diagram of the structure of the welding strip body described in the embodiment;

[0072] Figure 10 This is a schematic diagram of the structure of the solder strip assembly according to one embodiment of this application;

[0073] Figure 11 for Figure 10 Cross-sectional view of the solder strip assembly described in the embodiment;

[0074] Figure 12 for Figure 10 A schematic diagram of the structure of the regularizing component described in the embodiment.

[0075] Explanation of reference numerals in the attached figures

[0076] 1. Welding strip body; 11. First connecting surface; 12. First limiting structure; 2. Reflective structure; 21. Second connecting surface; 22. Reflective surface; 3. Adhesive layer; 4. Regularizing component; 41. Regularizing groove; 411. Adhesive through hole; 421. First mating surface; 422. Second mating surface. Detailed Implementation

[0077] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0078] Currently, after integrating the reflective structure with the battery cell into a single structure, this reflective solder strip needs to achieve both efficient reflection and reliable conductivity. This places extremely high demands on the solder strip structure, which in turn leads to high cost and low yield of such solder strips.

[0079] Based on this, this application provides a ribbon assembly, its fabrication apparatus, and a photovoltaic module. The reflective structure and the ribbon body are two separate structures, which are processed and formed separately. They are then connected to the first connecting surface through a second connecting surface to form a ribbon assembly with reflective function. This design can reduce the processing difficulty and cost of the ribbon assembly, and improve the overall yield of the ribbon assembly. Furthermore, the reflective structure and the ribbon body do not need to be made of the same material. The reflective structure only needs to perform efficient reflection and does not need to conduct electricity. This allows for the rational selection of materials for the reflective structure and the ribbon body, further reducing costs.

[0080] The present application will be described in detail below through specific embodiments.

[0081] Reference Figures 1 to 12 As shown, this embodiment provides a solder ribbon assembly, including: a solder ribbon body 1 and a reflective structure 2; the solder ribbon body 1 and the reflective structure 2 are respectively prepared; the solder ribbon body 1 has a first connecting surface 11; the reflective structure 2 extends in the same direction as the solder ribbon body 1, and the reflective structure 2 includes a second connecting surface 21 and two reflective surfaces 22, with a set angle between the two reflective surfaces 22, so that when light from different angles shines on the two reflective surfaces 22, the reflective structure 2 can always provide a high reflective effect, reducing the probability that light is completely reflected by the reflective surfaces 22 along the original path. The second connecting surface 21 is connected to the first connecting surface 11. It should be understood that both the solder ribbon body 1 and the reflective structure 2 are strip structures extending in the first direction.

[0082] The solder ribbon assembly provided in this embodiment sets the reflective structure 2 and the solder ribbon body 1 as two separate structures, which are processed and formed separately. They are then connected to the first connecting surface 11 via the second connecting surface 21 to form a solder ribbon assembly with reflective function. This design reduces the processing difficulty and cost of the solder ribbon assembly. Furthermore, due to the independent design, the reflective structure 2 and the solder ribbon body 1 do not need to be made of the same material. The reflective structure 2 only needs to be selected based on its reflective function and does not need to be conductive, thus allowing for the separate and appropriate selection of materials for the reflective structure 2 and the solder ribbon body 1.

[0083] In some embodiments, the cross-section of the welding strip body 1 is circular. It should be noted that the cross-section of the welding strip body 1 can be a perfect circle, an ellipse, or a near-circular shape with protrusions or depressions. It can also be a shape close to a circle formed by regular polygons such as regular pentagons, regular hexagons, and regular heptagons, as long as it can meet the welding requirements. A portion of the arc-shaped surface of the welding strip body 1 forms a first connecting surface 11, and the second connecting surface 21 is an arc-shaped surface that matches the curvature of the first connecting surface 11.

[0084] Furthermore, based on the aforementioned ribbon body 1, the circular cross-section of the ribbon body 1 not only has low processing costs, but also makes it easier to weld two battery cells. In the first direction, the same reflective structure 2 is placed on multiple ribbon bodies 1 located on the grid lines of the battery cells, further reducing the assembly difficulty of the entire ribbon assembly. Moreover, the cooperation between the second connecting surface 21 and the first connecting surface 11 increases the contact area between the reflective structure 2 and the ribbon body 1, further improving the connection stability and reliability between the two, and making it easier to maintain the relative position between them.

[0085] Optionally, the second connecting surface 21 is connected to the first connecting surface 11 via the adhesive layer 3. The second connecting surface 21 can also be connected by welding or other methods, as long as a reliable connection between the reflective structure 2 and the solder ribbon body 1 can be achieved. Optionally, the adhesive layer 3 is a thermosetting adhesive, a UV adhesive, or an EVA adhesive. Based on existing uniform dispersion printing and dispensing techniques, a reliable adhesive layer can be formed between the solder ribbon body 1 and the reflective structure 2 using thermosetting adhesive, UV adhesive, or EVA adhesive. In other words, using existing techniques, the adhesive layer 3 can be selected as one of thermosetting adhesive, UV adhesive, or EVA adhesive and formed through uniform dispersion printing or dispensing.

[0086] Furthermore, based on the setting of adhesive layer 3, when the second connecting surface 21 is connected to the first connecting surface 11 through adhesive layer 3, not only can the reflective structure 2 and the welding strip body 1 be reliably and stably connected and fixed, but also the fluidity or extensibility of adhesive layer 3 when it is not fixed can be used to fill the gap between the second connecting surface 21 and the first connecting surface 11 by aligning and squeezing when the second connecting surface 21 and the first connecting surface 11 are close to each other. At this time, there is no need to process the second connecting surface 21 and the first connecting surface 11 to match the curvature, and a reliable connection between the two can be achieved.

[0087] Optionally, the first connecting surface 11 is provided with a first limiting structure 12 to restrict the reflective structure 2 from sliding along the rotation direction of the welding strip body 1. The first limiting structure 12 can be formed by slotting at the first connecting surface 11 or by protruding radially from the first connecting surface 11 along the welding strip body 1. Continuing to refer to... Figures 7 to 9As shown, a recessed groove is formed on the top of the welding strip body 1, and the bottom surface of the recessed groove forms a first connecting surface 11. Two first limiting structures 12 are formed at both ends of the recessed groove along the rotation direction of the welding strip body 1; and / or; the second connecting surface 21 is provided with a second limiting structure to restrict the reflective structure 2 from sliding along the rotation direction of the welding strip body 1. The second limiting structure can be a structure that magnetically clamps the reflective structure 2 to the surface of the welding strip body 1, or it can be a strip structure that cooperates with the recessed groove. Further, the first limiting structure 12 includes two and is arranged along the rotation direction of the welding strip body 1; the second connecting surface 21 is located between the two first limiting structures 12; or, the first limiting structure 12 is a groove formed along the axial direction of the welding strip body 1, and the second limiting structure is a protrusion formed along the axial direction of the reflective structure 2.

[0088] Based on the first limiting structure 12 and the second limiting structure, the reflective structure 2 can be limited, positioned and fixed to prevent it from sliding uncontrollably on the arc-shaped surface of the welding strip body 1.

[0089] Optionally, the reflective structure 2 may be made of aluminum, aluminum alloy, silver or silver alloy; and / or the solder strip body 1 may be made of copper.

[0090] Furthermore, based on the materials of the aforementioned reflective structure 2 and the solder ribbon body 1, the reflective structure 2 can be more easily manufactured through wire drawing and calendering. The wire drawing and calendering process can form a narrow bottom surface to fit the solder ribbon body 1, which has a small cross-sectional length. In the existing technology, the reflective film process formed by PET uses a cutting blade, which cannot achieve such a narrow bottom surface. The preparation of the solder ribbon body 1 is also simpler, thereby ensuring a high yield rate while reducing costs.

[0091] Optionally, the reflective structure is formed by a drawing or calendering process.

[0092] Optionally, the length of the cross-section of the second connecting surface 21 is 0.05mm to 0.3mm.

[0093] Furthermore, the length of the cross-section of the second connecting surface 21 is 0.1mm to 0.2mm.

[0094] Continue to refer to Figures 1 to 12 As shown, the length of the cross-section of the second connecting surface 21 is less than or equal to the length of the cross-section of the solder strip body 1. That is to say, the projection of the second connecting surface 21 in the vertical direction will not exceed the projection range of the solder strip body 1. The solder strip body 1 can be a copper wire or copper-clad aluminum wire with a diameter of 0.1 to 0.5 mm. Specifically, it can be made by wire drawing process. In this case, the length of the cross-section of the solder strip body 1 is 0.1 to 0.5 mm.

[0095] Furthermore, based on the size limitations of the second connecting surface 21 and the welding strip body 1, the ratio between the two can be made more reasonable, ensuring the working effect while reducing material waste. The second connecting surface 21 only needs to be reliably connected to the first connecting surface 11 formed on the outer surface of the welding strip body 1.

[0096] Optionally, the second connecting surface 21 is connected to the ends of the two reflective surfaces 22 at both ends along the rotation direction of the welding strip body 1; the connection between the two reflective surfaces 22 is rounded, and / or, at least one reflective surface 22 is rounded at the connection with the second connecting surface 21; in other embodiments, the connection between the reflective surface 22 and the other reflective surface 22 is chamfered, and / or, the connection between the reflective surface 22 and the second connecting surface 21 is chamfered.

[0097] Furthermore, based on the above-mentioned reflective structure 2, the structure of reflective structure 2 can be made more reliable, and the strength of reflective structure 2 itself can be improved.

[0098] Optionally, two reflective surfaces 22 are symmetrically arranged on both sides of the axis of the solder strip body 1, with the included angle set to 50° to 70°. Further, the included angle can be set to 55° to 65°. It should be understood that the cross-sections of the two reflective surfaces 22 form two sides of an isosceles triangle with the axis of symmetry perpendicular to the axis of the solder strip body 1. When the included angle is set to 60°, the cross-sections of the two reflective surfaces 22 form two sides of an equilateral triangle with the axis of symmetry perpendicular to the axis of the solder strip body 1. And / or, a reflective layer is provided on the reflective surface 22, the reflectivity of the reflective layer is greater than or equal to 80%, and the material can be aluminum, aluminum alloy, silver or silver alloy. The reflective layer can be a high reflectivity coating plated on the reflective surface 22, and the coating material is usually aluminum, silver, tin or an alloy of the aforementioned three pure metals. And / or, the thickness of the reflective layer is 0.1μm to 2μm.

[0099] Furthermore, based on the aforementioned reflective structure 2, the reflection angle of the reflective structure 2 can be optimized, thereby further improving the photoelectric conversion efficiency. Based on the aforementioned reflective layer, the reflectivity of the reflective surface 22 can be further improved, thereby further improving the photoelectric conversion efficiency. Based on the thickness of the aforementioned reflective layer, it is not only easy to process and has low cost, but also achieves high reflectivity and improves the photoelectric conversion efficiency.

[0100] Secondly, this application provides a preparation apparatus for the above-mentioned solder ribbon assembly. The apparatus includes: a straightening member 4 having a straightening groove 41, the shape of which matches the shape of the straightening groove 41 with the shape of the second connecting surface 21; and a reflective structure 2 which is straightened by passing through the straightening groove 41. Specifically, the straightening groove 41 is used to straighten at least two apex corners of the second connecting surface 21 into a plane located parallel to the axis of the solder ribbon body 1. After the reflective structure 2 is processed, due to its long length and small width, it lacks stability and it is difficult to place it stably on the first connecting surface 11 in the set manner.

[0101] Furthermore, based on the aforementioned alignment component 4, after the reflective structure 2 is processed, it can be adjusted so that the second connecting surface 21 faces the alignment groove 41 and is placed inside the alignment groove 41. At this time, the alignment groove 41 can make the two sides of the second connecting surface 21 lie on the same plane. Specifically, this plane is perpendicular to the plane containing the line connecting the two reflective surfaces 22 and the axis of the welding strip body 1. It should be noted that the width of the alignment groove 41 can match the width of the second connecting surface 21. That is to say, after the second connecting surface 21 is placed in the alignment groove 41, the two ends of the alignment groove 41 have the effect of limiting the reflective structure 2 in the rotation direction of the welding strip body 1.

[0102] Optionally, the preform 4 has a first mating surface 421 on the side facing the second connecting surface 21, and the shape of the first mating surface 421 matches the shape of the second connecting surface 21; and / or, the preform 4 has a second mating surface 422 on the side facing the first connecting surface 11, and the shape of the second mating surface 422 matches the shape of the first connecting surface 11; it is understood that the first mating surface 421 and the second mating surface 422 can be planar or curved.

[0103] Furthermore, based on the aforementioned aligning component 4, while aligning the reflective structure 2, the aligning component 4 also supports the reflective structure 2 and the welding strip body 1. By setting the first mating surface 421 and the second mating surface 422, the contact area between the reflective structure 2 and the welding strip body 1 and the aligning component 4 is increased, further improving the stability and reliability of the aligning component 4 in supporting the two.

[0104] In some embodiments, the second connecting surface 21 is connected to the sizing groove 41 via the adhesive layer 3, and / or the sizing component 4 is connected to the first connecting surface 11 via the adhesive layer 3. The second connecting surface 21 can also be connected to the sizing groove 41 by means of snap-fitting, welding, etc., and the first connecting surface 11 can also be connected to the sizing component 4 by means of welding, etc.

[0105] Furthermore, based on the above-mentioned regularizing groove 41, the regularizing groove 41 can be coated with adhesive on the first mating surface 421 and the second mating surface 422, and then connected to the second connecting surface 21 and the first connecting surface 11 respectively.

[0106] Continue to refer to Figure 11 and Figure 12 As shown, the preform 4 has a glue-passing hole 411. One end of the glue-passing hole 411 is connected to the preform groove 41, and the other end is opened towards the first connecting surface 11. It should be understood that the glue-passing hole 411 is a through hole, and the glue-passing hole 411 can extend along the axis perpendicular to the axis of the solder strip body 1. The axis of the glue-passing hole 411 can intersect perpendicularly with the axis of the solder strip body 1.

[0107] Furthermore, based on the aforementioned preform 4, adhesive can be applied to the preform groove 41 located at the top in the direction of gravity, covering the area around the adhesive passage hole 411. Then, the reflective structure 2 is gently placed in the preform groove 41 to prevent excessive pressure on the adhesive below. After the preform 4 is placed on the first connecting surface 11 and adjusted to the precise position, pressure is applied to the reflective structure 2 to squeeze all the adhesive around the adhesive passage hole 411 through the adhesive passage hole 411 between the second mating surface 422 and the first connecting surface 11, thereby forming an adhesive bond between the three. The entire process is more convenient, controllable, and has a high yield rate.

[0108] Optionally, the apparatus further includes: a circular solder strip preparation device for preparing the solder strip body 1, wherein the solder strip body 1 can be obtained by a wire drawing process; and a reflective structure preparation device for preparing the reflective structure 2, wherein the reflective structure 2 can be obtained by a wire drawing and calendering process.

[0109] Thirdly, this application provides a photovoltaic module, including a cell, wherein the grid lines of the cell are provided with the above-described ribbon assembly or the ribbon assembly prepared by the above-described preparation apparatus.

[0110] Furthermore, based on the aforementioned photovoltaic module, the reflective structure 2 and the ribbon body 1 are set as two separate structures, processed and formed separately, and then connected to the first connecting surface 11 through the second connecting surface 21 to form a ribbon assembly with reflective function. This setting reduces the processing difficulty of the ribbon assembly and lowers the cost.

[0111] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0112] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0113] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A solder strip assembly, characterized in that, include: A solder ribbon body and a reflective structure; the solder ribbon body and the reflective structure are respectively prepared. The welding strip body has a first connecting surface; The reflective structure extends in the same direction as the welding strip body. The reflective structure includes a second connecting surface and two reflective surfaces. A set angle is formed between the two reflective surfaces. The second connecting surface is connected to the first connecting surface. The first connecting surface is provided with a first limiting structure to restrict the reflective structure from sliding along the rotation direction of the welding strip body; and / or; The second connecting surface is provided with a second limiting structure to restrict the reflective structure from sliding along the rotation direction of the welding strip body.

2. The solder strip assembly according to claim 1, characterized in that, The cross-section of the welding strip body is circular, and a portion of the arc-shaped surface of the welding strip body forms the first connecting surface. The second connecting surface is an arc-shaped surface whose curvature matches that of the first connecting surface.

3. The solder strip assembly according to claim 1, characterized in that, The second connecting surface is connected to the first connecting surface through an adhesive layer.

4. The solder strip assembly according to claim 3, characterized in that, The adhesive layer is a thermosetting adhesive, a UV adhesive, or an EVA adhesive.

5. The solder strip assembly according to claim 1, characterized in that, The first limiting structure comprises two and is arranged along the rotation direction of the welding strip body; the second connecting surface is located between the two first limiting structures; or, The first limiting structure is a groove opened along the axial direction of the welding strip body, and the second limiting structure is a protrusion opened along the axial direction of the reflective structure.

6. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The material of the reflective structure is aluminum, aluminum alloy, silver, or silver alloy; and / or; The material of the welding strip body is copper.

7. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The reflective structure is formed by a wire drawing or calendering process.

8. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The length of the cross-section of the second connecting surface is 0.05mm to 0.3mm.

9. The solder strip assembly according to claim 8, characterized in that, The length of the cross-section of the second connecting surface is 0.1mm to 0.2mm.

10. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The length of the cross-section of the second connecting surface is less than or equal to the length of the cross-section of the welding strip body.

11. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The second connecting surface is connected to the ends of the two reflective surfaces at both ends along the rotation direction of the welding strip body; The junction between the two reflective surfaces is rounded. And / or, At least one of the reflective surfaces has a rounded corner at the junction with the second connecting surface.

12. The solder strip assembly according to any one of claims 1 to 4, characterized in that, The angle between the two reflective surfaces is 50° to 70°. And / or, The reflective surface is provided with a reflective layer, and the reflectivity of the reflective layer is greater than or equal to 80%. And / or, The thickness of the reflective layer is 0.1 μm to 2 μm.

13. An apparatus for preparing a solder strip assembly as described in any one of claims 1 to 12, characterized in that, The device includes: A regularizing component having a regularizing groove, the shape of which matches the second connecting surface, wherein the reflective structure is regularized by passing through the regularizing groove.

14. The apparatus for preparing a solder strip assembly according to claim 13, characterized in that, The preform has a first mating surface on the side facing the second connecting surface, and the shape of the first mating surface matches that of the second connecting surface. And / or, The regular component has a second mating surface on the side facing the first connecting surface, and the shape of the second mating surface matches that of the first connecting surface.

15. The apparatus for preparing a solder strip assembly according to claim 14, characterized in that, The second connecting surface is connected to the regularized groove through an adhesive layer. And / or, The alignment component is connected to the first connecting surface via an adhesive layer.

16. The apparatus for preparing a solder strip assembly according to claim 15, characterized in that, The preform has an adhesive-filled hole, one end of which is connected to the preformed groove, and the other end is opened towards the first connecting surface.

17. The apparatus for preparing a solder strip assembly according to claim 13, characterized in that, The device further includes: Circular solder strip preparation equipment for preparing the solder strip body; Reflective structure preparation equipment used to prepare the reflective structure.

18. A photovoltaic module, characterized in that, include: A solar cell, wherein the grid lines of the solar cell are provided with a ribbon assembly as described in any one of claims 1 to 12 or the ribbon assembly prepared as described in any one of claims 13 to 17.

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