Wafer coating equipment

Abstract

The wafer coating equipment comprises an upper rack and a lower rack, the interior of the upper rack is divided into a processing area and an installation area which are independent from each other, the interior of the processing area is a first air pressure area, the interior of the installation area is a second air pressure area, and the exterior of the upper rack is a third air pressure area; the air pressure of the first air pressure area is greater than that of the second air pressure area, and the air pressure of the second air pressure area is greater than that of the third air pressure area; the air flow in the upper rack flows to the ventilation holes, does not generate rotation or turbulent flow, and is isolated from the mounting area, so that no foreign matter is attached to the wafer on the working plane.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer coating technical field, especially a wafer coating equipment. BACKGROUND

[0002] Coating process is a conventional process in semiconductor wafer ODF (One Drop Fill) process, and the cleanliness needs to reach more than 100 dynamic levels in the production process requirement. And in the wafer coating equipment production process, the humidity, temperature and cleanliness around the equipment are required to be extremely high, wherein the cleanliness inside the equipment will not only affect the bonding thickness when bonding, but also will affect the display area effect of the product. UTILITY MODEL CONTENTS

[0003] The utility model provides a wafer coating equipment to solve the technical problem of the existing wafer coating equipment in the production process, which cannot effectively control dust production, airflow and make foreign matter adhere to the wafer surface, resulting in the final wafer bonding thickness being too thick and the display area effect being poor.

[0004] To solve the above problems, the utility model adopts the technical scheme of:

[0005] The utility model provides a wafer coating equipment, which comprises an upper rack and a lower rack, the upper rack is internally separated into a processing area and a mounting area which are independent of each other, the processing area is a first air pressure area, the mounting area is a second air pressure, and the outside of the upper rack is a third air pressure area; the air pressure of the first air pressure area is greater than that of the second air pressure area, and the air pressure of the second air pressure area is greater than that of the third air pressure area.

[0006] Further, a plurality of ventilation holes are arranged on the upper rack and the lower rack, and the height of each ventilation hole is lower than the height of the working platform in the processing area.

[0007] Further, the mounting area is provided with an air suction port, and the air suction port is in communication with the outside through an air suction fan.

[0008] Further, a filtering device is arranged on the top of the upper rack, and the minimum distance between the air outlet surface of the filtering device and the working platform in the processing area is not less than one meter.

[0009] Further, the mounting area is sealed and isolated from the processing area by using double-mirror stainless steel plates.

[0010] Further, the upper rack comprises a visual area, and the visual area is a transparent or translucent yellow acrylic plate.

[0011] Further, the filtering device comprises a control module, the control module controls the rotating speed, and adjusts the air volume of the air outlet surface.

[0012] Compared with the prior art, the wafer coating equipment has the following beneficial effects:

[0013] The wafer coating equipment provided by the utility model has the following beneficial effects: The dust outside the upper rack body and the mounting area cannot enter the working area, and a clean environment is provided for the processing area; in addition, the ventilation holes are arranged on the upper rack and the lower rack, and the positions of the ventilation holes are lower than the height of the working platform in the processing area, so that the internal airflow does not generate swirl or turbulence, and is isolated from the mounting area, and it is ensured that there is no foreign matter attached on the working plane wafer. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions provided by the utility model, the following will be described in detail in combination with the embodiments and the drawings, and it should be understood that the drawings described below are only some embodiments of the utility model, and those skilled in the art can change the drawings under the concept of the utility model.

[0015] Figure 1 The assembly perspective view of the wafer coating equipment provided by the utility model is shown in the figure.

[0016] Figure 2 The assembly perspective view of the wafer coating equipment provided by the utility model is shown in the figure.

[0017] 1, upper rack; 11, processing area; 12, mounting area; 13, working platform; 2, lower rack; 21, ventilation hole; 3, filter device. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments will be described clearly and completely in combination with the drawings in the embodiments of the utility model, and similar components are represented by similar component signs in the drawings. Obviously, the following described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0019] It should be understood that when used in the specification and the appended claims, the terms "comprise" and "include" indicate the existence of the described features, integers, steps, operations, elements and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components and / or sets thereof.

[0020] It should also be understood that the terms used in the description of the present application are merely for the purpose of describing particular embodiments and are not intended to limit the present application. As used in the description of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0021] The wafer coating equipment provided by the present application comprises an upper rack 1 and a lower rack 2, the upper rack 1 is internally partitioned into a processing area 11 and a mounting area 12, the processing area 11 is a first air pressure area, and the mounting area 12 is a second air pressure area, and the outside of the upper rack 1 (atmospheric pressure) is a third air pressure area; the air pressure of the first air pressure area is greater than that of the second air pressure area, and the air pressure of the second air pressure area is greater than that of the third air pressure area. In actual use, the mounting area 12 is used for placing electrical components.

[0022] Please refer to Figure 1 In the present embodiment, the upper rack 1 is provided with a filtering device 3 at the top, the filtering device 3 comprises a filter screen, a fan and a control module, the control module of the filtering device controls the fan to suck the air outside the upper rack 1 into the processing area 11 at a set required rotating speed and air pressure, and the air is sent into the processing area 11 from the air outlet surface of the filtering device after being filtered by the filter screen. In actual use, the fan rotating speed is controlled by the control module according to the required air pressure, and the air volume of the air outlet surface is adjusted, so that the air pressure of the first air pressure area can always be kept greater than that of the second air pressure area and the third air pressure area. It should be noted that the filtering device 3 is not different from the prior art, and the specific structure and the software code of the control system do not belong to the protection scope of the present application. In addition, in the present embodiment, ventilation holes 21 are formed on the four surrounding surfaces of the upper rack 1 and the lower rack 2, so that the airflow inside the processing area 11 of the upper rack 1 flows to the ventilation holes 21 and is sent out through the ventilation holes 21. The position of the ventilation holes 21 of the upper rack 1 is lower than the working platform 13, so that the phenomena of rotation, turbulence, backflow and the like do not occur around the working platform 13.

[0023] Please refer to Figure 2In the embodiment, the installation area 12 is provided with electrical elements which must be placed inside the device, but such electrical elements become the main dust production area inside the device when operating, so the installation area 12 is sealed by double-mirror stainless steel plates, the double-mirror stainless steel plates are strong in anti-fouling, the surface is very smooth, and dust is not easy to adhere, easy to clean and maintain, and the normal operation of the electrical elements is not affected, so as to be sealed as much as possible and be completely isolated from the processing area 11; the installation area 12 is provided with an air suction port connected with an air suction fan, the air suction fan is always operated during the production process of the device, air is sucked to make the second air pressure area greater than the third air pressure area (atmospheric pressure), so as to ensure that the airflow inside the installation area 12 flows to the outside of the device, further ensure that the airflow inside the installation area 12 does not flow to the inside of the device, and more reliably prevent dust and the like inside the installation area 12 from floating to the working platform 13.

[0024] In addition, the embodiment further preferably provides that the filtering device 11 is arranged at the top of the upper rack 1, the air outlet surface faces the inside of the device, and the working platform 13 is more than one meter away from the air outlet surface, so as to avoid that the airflow of the air outlet surface directly and closely affects the wafers on the working platform 13 and the viscosity and other properties of the glue during the coating process.

[0025] Of course, in order to more conveniently observe the processing condition of the processing area and the condition of the device, the upper rack 1 includes a visual area, the visual area is a transparent or translucent yellow acrylic plate, other areas are double-mirror stainless steel plates, the yellow acrylic plate can prevent UV light and static electricity during the coating of the wafers, can meet the process requirements, and further provides that the double-mirror stainless steel plate is 1mm-1.5mm in thickness, so as to ensure the cleanliness inside the device.

[0026] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0027] The above is a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer coating apparatus characterized by comprising: The upper frame and the lower frame are provided with a plurality of ventilation holes, and the height of each ventilation hole is lower than the height of the working platform in the processing area.

2. The wafer coating apparatus of claim 1, wherein The installation area is provided with an air suction port which is communicated with the outside through an air suction fan.

3. The wafer coating apparatus as claimed in claim 2, wherein The upper frame is provided with a filtering device, and the minimum distance from the air outlet surface of the filtering device to the working platform in the processing area is not less than one meter.

4. The wafer coating apparatus as recited in claim 2, wherein The installation area is sealed and isolated from the processing area by double mirror stainless steel plates.

5. The wafer coating apparatus as recited in claim 3, wherein The upper frame comprises a visual area which is a transparent or semi-transparent yellow acrylic plate.

6. The wafer coating apparatus as recited in claim 1, wherein The filtering device comprises a control module which controls the rotating speed and adjusts the air volume of the air outlet surface.

7. The wafer coating apparatus as claimed in claim 4, wherein ​

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