Degreasing and cleaning equipment for semiconductor parts

Abstract

The utility model discloses semiconductor part degreasing and cleaning equipment which comprises a liquid collecting tray, the supporting frame is connected into the liquid collecting tray; the degreasing tank assembly is connected to the supporting frame; the first soaking tank assembly is connected to the supporting frame and arranged on one side of the degreasing tank assembly; the second soaking tank assembly is connected to the supporting frame and arranged on one side of the first soaking tank assembly; the waste liquid collecting box is arranged on one side of the liquid collecting tray and is spaced from the supporting frame; the pipeline assembly is used for guiding cleaning liquid, soaking liquid and gas into the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly and guiding waste liquid in the degreasing tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collecting tray into the waste liquid collecting box; the electric appliance control system is used for timing and alarming, electrically heating the cleaning liquid in the degreasing tank assembly and ultrasonically cleaning the semiconductor parts; therefore, the technical problem that the cleanliness is relatively poor is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technology field, specifically a kind of semiconductor parts degreasing cleaning equipment. BACKGROUND

[0002] With the rapid development of semiconductor industry, the proportion of semiconductor parts is also higher and higher, and cleanliness is an important indicator of semiconductor parts.

[0003] The commonly used method is to use degreasing cleaning method to clean semiconductor parts. Degreasing cleaning not only provides the basis for subsequent chemical cleaning and precision cleaning, achieving the cleanliness of semiconductor parts at the level of thousands or hundreds, but also enables some semiconductor parts to be used directly as finished products after degreasing cleaning. Therefore, degreasing cleaning is particularly important.

[0004] However, the traditional degreasing cleaning method has relatively poor cleanliness due to the influence of environment and cleaning carrier. Therefore, a semiconductor parts degreasing cleaning equipment is needed. UTILITY MODEL CONTENT

[0005] To solve the problem of relatively poor cleanliness in related technology, a semiconductor parts degreasing cleaning equipment is provided to solve the problem of relatively poor cleanliness in related technology.

[0006] The technical solution to achieve the purpose is: a semiconductor parts degreasing cleaning equipment, comprising:

[0007] A liquid collection tray;

[0008] A support frame connected in the liquid collection tray;

[0009] At least one degreasing tank assembly connected to the support frame;

[0010] At least one first soaking tank assembly connected to the support frame and arranged on one side of the degreasing tank assembly;

[0011] At least one second soaking tank assembly connected to the support frame and arranged on one side of the first soaking tank assembly;

[0012] A waste liquid collection tank arranged on one side of the liquid collection tray and spaced apart from the support frame;

[0013] A pipeline assembly for introducing cleaning liquid, soaking liquid and gas into the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly, and for guiding the waste liquid in the degreasing tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collection tray into the waste liquid collection tank;

[0014] And an electric control system for timing alarm and for electric heating the cleaning liquid in the degreasing tank assembly and for ultrasonic cleaning of semiconductor parts in the degreasing tank assembly.

[0015] Further, the support frame comprises a main frame body arranged in the collecting tray, the main frame body having a first support surface and a second support surface, the second support surface being higher than the first support surface, the first support surface being arranged with the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly;

[0016] A glass fiber reinforced plastic plate is arranged on the first support surface and is arranged at the bottom of the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly;

[0017] A rectangular grid empty plate is arranged on the second support surface;

[0018] A guardrail is connected to the edge of the second support surface and is arranged in a spaced manner with the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly;

[0019] And two walkway stairs are symmetrically arranged and connected between the collecting tray and the second support surface.

[0020] Further, the degreasing tank assembly comprises a first tank body, the first tank body having a first inner space;

[0021] At least two first reinforcing members are connected to the outer wall of the first tank body;

[0022] A first water baffle is connected to the top of the first tank body;

[0023] A filter is arranged in the collecting tray and is arranged on one side of the first tank body for circulating filtration of the cleaning liquid in the first inner space;

[0024] And a cover plate is arranged to cover the first inner space.

[0025] Further, the first soaking tank assembly and the second soaking tank assembly have the same structure and both comprise:

[0026] A second tank body, the second tank body having a second inner space;

[0027] At least two second reinforcing members are connected to the outer wall of the second tank body;

[0028] A second water baffle is connected to the top of the second tank body;

[0029] and an overflow dam connected to the second tank body and arranged in the second inner space to form an overflow space with the second tank body.

[0030] Further, the overflow dam comprises a first plate connected to the second tank body;

[0031] and a second plate connected to the second tank body and connected to the first plate at one end to form an "L" shape with the first plate, and the other end of the second plate is lower than the top of the second tank body.

[0032] Further, the other end of the second plate has a sawtooth structure.

[0033] Further, the waste liquid collection tank comprises a tank body having a third inner space in the tank body;

[0034] and at least two third reinforcing members connected to the outer wall of the tank body.

[0035] Further, the pipeline assembly comprises a liquid inlet pipeline connected to the defatting tank assembly, the first soaking tank assembly and the second soaking tank assembly, for introducing the cleaning liquid into the defatting tank assembly, and introducing the soaking liquid into the first soaking tank assembly and the second soaking tank assembly;

[0036] an air inlet pipeline connected to the defatting tank assembly, the first soaking tank assembly and the second soaking tank assembly, for introducing gas into the defatting tank assembly, the first soaking tank assembly and the second soaking tank assembly for pneumatic agitation;

[0037] a waste liquid discharge pipeline connected to the defatting tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collection tray, for introducing the waste liquid in the defatting tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collection tray into the waste liquid collection tank;

[0038] and an overflow pipeline connected to the first soaking tank assembly and the second soaking tank assembly, for introducing the overflow at the overflow space into the waste liquid collection tank.

[0039] Further, the waste liquid discharge pipeline comprises a discharge pipe for communicating the defatting tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collection tray with the waste liquid collection tank;

[0040] and a pneumatic diaphragm pump connected to the discharge pipe for introducing the waste liquid in the defatting tank assembly, the first soaking tank assembly, the second soaking tank assembly and the liquid collection tray into the waste liquid collection tank.

[0041] Further, the electric appliance control system comprises: a timing alarm arranged on the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly, and used for timing alarm;

[0042] An ultrasonic generator is arranged in the degreasing tank assembly, and used for ultrasonic cleaning of the semiconductor parts;

[0043] An electric heater is arranged in the degreasing tank assembly, and used for electric heating of the cleaning liquid in the degreasing tank assembly;

[0044] And an intelligent digital display temperature controller is used for electrically controlling the timing alarm, the ultrasonic generator and the electric heater.

[0045] The above technical scheme has the following beneficial effects: a semiconductor part degreasing and cleaning device is provided with a liquid collecting tray, a support frame, a degreasing tank assembly, a first soaking tank assembly, a second soaking tank assembly, a waste liquid collecting box, a pipeline assembly and an electric appliance control system compared with related technologies;

[0046] The liquid collecting tray can prevent the cleaning liquid and the soaking liquid from spilling on the ground, and protect the working environment and be relatively sanitary;

[0047] The support frame forms a reliable support structure, and is conducive to connecting and arranging the degreasing tank assembly, the first soaking tank assembly and the second soaking tank assembly;

[0048] During cleaning, the electric appliance control system electrically heats the cleaning liquid in the degreasing tank assembly to a temperature of 50 degrees, and ultrasonically cleans the semiconductor parts in the degreasing tank assembly, opens the pipeline assembly, introduces gas into the degreasing tank assembly, and performs pneumatic stirring, and the cleaning time is 1-5 minutes;

[0049] The semiconductor parts in the degreasing tank assembly are moved to the first soaking tank assembly, the semiconductor parts are soaked and cleaned by the soaking liquid, the pipeline assembly is opened, gas is introduced into the first soaking tank assembly, pneumatic stirring is performed, and the soaking time is 1-15 minutes;

[0050] The semiconductor parts in the first soaking tank assembly are moved to the second soaking tank assembly, the semiconductor parts are soaked and cleaned by the soaking liquid, and the soaking time is 1-5 minutes;

[0051] The waste liquid generated during the cleaning and soaking process is introduced into the waste liquid collecting box by the pipeline assembly;

[0052] Since the semiconductor parts are cleaned and soaked in multiple tanks, the cleaning is relatively clean, and the cleanliness is relatively good;

[0053] Thus, the technical problem of relatively poor cleanliness is solved, and the technical effect of relatively good cleanliness is achieved, and the device is practical. BRIEF DESCRIPTION OF DRAWINGS

[0054] Figure 1 It is a schematic view of the overall assembly structure;

[0055] Figure 2 It is a schematic view of the overall assembly structure;

[0056] Figure 3 It is Figure 1 Or Figure 2 It is a top view of the support frame removed;

[0057] Figure 4 It is a schematic view of the first or second soaking tank assembly;

[0058] Figure 5 It is a partial sectional view of the first or second soaking tank assembly;

[0059] In the drawings: 10. liquid collection tray, 20. support frame, 21. main frame body, 21-1. first support surface, 21-2. second support surface, 22. rectangular grid empty plate, 23. guardrail, 24. walkway stairs, 30. degreasing tank assembly, 31. first tank body, 31-1. first inner space, 32. first reinforcing member, 33. first water baffle, 34. filter, 40. first soaking tank assembly, 50. second soaking tank assembly, 41. second tank body, 41-1. second inner space, 42. second reinforcing member, 43. second water baffle, 44. overflow blocking piece, 44-1. first plate, 44-2. second plate, 44-21. sawtooth structure, 45. overflow space, 60. waste liquid collection box, 61. box body, 61-1. third inner space, 62. third reinforcing member, 70. pipeline assembly, 71. liquid inlet pipeline, 72. gas inlet pipeline, 73. waste liquid discharge pipeline, 73-1. discharge pipe, 73-2. pneumatic diaphragm pump, 74. overflow pipeline, 80. electrical control system, 81. timing alarm, 82. ultrasonic generator, 83. electric heater. DETAILED DESCRIPTION

[0060] In order to make the content easier to be clearly understood, the following is further described in detail according to specific embodiments and in combination with the drawings;

[0061] A semiconductor part degreasing and cleaning device solves the technical problem of relatively poor cleanliness in the related art, can be manufactured and used, achieves the positive effect of relatively good cleanliness, and the overall idea is as follows:

[0062] EMBODIMENT

[0063] As Figure 1 ,Figure 2 A semiconductor component degreasing and cleaning apparatus, comprising:

[0064] a liquid collecting tray 10;

[0065] a support frame 20 connected in the liquid collecting tray 10;

[0066] at least one degreasing tank assembly 30 connected in the support frame 20;

[0067] at least one first soaking tank assembly 40 connected in the support frame 20 and arranged at one side of the degreasing tank assembly 30;

[0068] at least one second soaking tank assembly 50 connected in the support frame 20 and arranged at one side of the first soaking tank assembly 40;

[0069] a waste liquid collecting tank 60 arranged at one side of the liquid collecting tray 10 and spaced apart from the support frame 20;

[0070] a pipeline assembly 70 for introducing cleaning liquid, soaking liquid and gas into the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, and for leading waste liquid in the degreasing tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collecting tray 10 into the waste liquid collecting tank 60;

[0071] and an electric control system 80 for timing and alarming, and for electrically heating the cleaning liquid in the degreasing tank assembly 30 and ultrasonically cleaning semiconductor components in the degreasing tank assembly 30;

[0072] Specifically, during cleaning, the electric control system 80 electrically heats the cleaning liquid in the degreasing tank assembly 30 to a temperature of 50 degrees, ultrasonically cleans semiconductor components in the degreasing tank assembly 30, opens the pipeline assembly 70, introduces gas (such as clean air) into the degreasing tank assembly 30, and performs pneumatic stirring, with a cleaning time of 1-5 minutes;

[0073] The semiconductor components in the degreasing tank assembly 30 are moved to the first soaking tank assembly 40, the semiconductor components are soaked and cleaned by the soaking liquid, the pipeline assembly 70 is opened, gas (such as clean air) is introduced into the first soaking tank assembly 40, pneumatic stirring is performed, and the soaking time is 1-15 minutes;

[0074] The semiconductor components in the first soaking tank assembly 40 are moved to the second soaking tank assembly 50, the semiconductor components are soaked and cleaned by the soaking liquid, and the soaking time is 1-5 minutes;

[0075] The waste liquid generated in the cleaning and soaking process is introduced into the waste liquid collecting tank 60 through the pipeline assembly 70;

[0076] Since the semiconductor parts are cleaned and soaked in multiple grooves, the cleaning is relatively clean and the cleanliness is relatively good;

[0077] Another embodiment:

[0078] As Figure 1 , Figure 2 , Figure 3 shown; in implementation, the liquid collecting tray 10 is spliced from 8mm thick PP plates, has a rectangular structure, a rectangular inner cavity, is conducive to containing cleaning liquid and soaking liquid, prevents the cleaning liquid and soaking liquid from spilling on the ground, protects the working environment, and is relatively sanitary;

[0079] Another embodiment:

[0080] As Figure 1 , Figure 2 shown; in implementation, the support frame 20 includes: a main frame body 21 arranged in the liquid collecting tray 10, the main frame body 21 having a first support surface 21-1 and a second support surface 21-2, the second support surface 21-2 being higher than the first support surface 21-1, the first support surface 21-1 being provided with the degreasing groove assembly 30, the first soaking groove assembly 40 and the second soaking groove assembly 50; a glass steel plate arranged on the first support surface 21-1 and placed at the bottom of the degreasing groove assembly 30, the first soaking groove assembly 40 and the second soaking groove assembly 50; a rectangular grid empty plate 22 placed on the second support surface 21-2; a guardrail 23 connected to the edge of the second support surface 21-2 and arranged spaced apart from the degreasing groove assembly 30, the first soaking groove assembly 40 and the second soaking groove assembly 50; and two walkway stairs 24 symmetrically arranged and connected between the liquid collecting tray 10 and the second support surface 21-2;

[0081] The main frame body 21 is combined from stainless steel square tubes, forms a stepped structure, has a first support surface 21-1 and a second support surface 21-2, and the second support surface 21-2 is higher than the first support surface 21-1, which is conducive to arranging the degreasing groove assembly 30, the first soaking groove assembly 40 and the second soaking groove assembly 50 on the first support surface 21-1, and the operator can stand at the second support surface 21-2 for convenient operation;

[0082] The glass steel plate is a common structure in the prior art, forms a reliable support structure, and is conducive to arranging the degreasing groove assembly 30, the first soaking groove assembly 40 and the second soaking groove assembly 50 along a straight line;

[0083] The rectangular grid empty board 22 is a common structure in the prior art, which forms a reliable support structure and is beneficial for operators to stand;

[0084] The guardrail 23 is formed by pipe assembly welding and is welded with the main frame body 21 to form a barrier, which is relatively safe;

[0085] The walkway stairs 24 are welded with the main frame body 21, which is beneficial for operators to climb and walk;

[0086] Another embodiment:

[0087] As shown in Figure 1 , Figure 2 , Figure 3 ; in implementation, the degreasing tank assembly 30 includes: a first tank body 31, the first tank body 31 has a first inner space 31-1; at least two first reinforcing members 32 connected to the outer wall of the first tank body 31; a first water baffle 33 connected to the top of the first tank body 31; a filter 34 arranged in the liquid collecting tray 10 and arranged on one side of the first tank body 31, used for circulating and filtering the cleaning liquid in the first inner space 31-1; and a cover plate used for covering the first inner space 31-1;

[0088] The number of the degreasing tank assembly 30 is one;

[0089] The first tank body 31 is a square tank body spliced by 15mm thick PP flame-retardant plates, has a square first inner space 31-1, and is beneficial for containing cleaning liquid in the first inner space 31-1;

[0090] The bottom of the first tank body 31 is provided with a sewage collecting box type drainage, and the sewage collecting box is a common structure in the prior art, which is beneficial for complete drainage without residue. After seeing the disclosed content, those skilled in the art can directly and without doubt know how to set the sewage collecting box without creative labor and excessive experiments;

[0091] The first reinforcing member 32 is formed by pipe assembly welding and surrounds the outer wall of the first tank body 31, and the first reinforcing member 32 is wrapped with a 4mm thick PP plate, which improves the structural strength of the first tank body 31;

[0092] The first water baffle 33 is a square frame structure arranged on the top of the first tank body 31, increases the area of the top of the first tank body 31, forms a barrier, and has the effect of preventing cleaning liquid from overflowing and dripping;

[0093] The filter 34 is a common structure in the prior art, which is used for circulating and filtering the cleaning liquid and ensures the cleaning effect;

[0094] The cover plate is a square plate structure, used to cover the first inner space 31-1, preventing the cleaning liquid from splashing and overflowing;

[0095] The cleaning liquid is a common structure in the prior art, such as pure water, industrial degreasing cleaning agent, etc. Those skilled in the art can directly and without doubt know how to choose and use after seeing the disclosed content, without creative labor and excessive experiments;

[0096] Another embodiment:

[0097] As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 indicated; in implementation, the first soaking tank assembly 40 and the second soaking tank assembly 50 have the same structure, both including: a second tank body 41 having a second inner space 41-1 inside; at least two second reinforcing members 42 connected to the outer wall of the second tank body 41; a second water baffle 43 connected to the top of the second tank body 41; and an overflow blocking member 44 connected to the second tank body 41 and arranged in the second inner space 41-1, forming an overflow space 45 between the second tank body 41 and the overflow blocking member 44;

[0098] The number of the first soaking tank assembly 40 is one;

[0099] The number of the second soaking tank assembly 50 is one;

[0100] The second tank body 41 is a square tank body spliced by 15mm thick PP flame-retardant plates, having a square second inner space 41-1, which is conducive to containing soaking liquid in the second inner space 41-1;

[0101] The bottom of the second tank body 41 is provided with a sewage collecting box type drainage, and the sewage collecting box is a common structure in the prior art, which is conducive to complete drainage without residue. Those skilled in the art can directly and without doubt know how to set the sewage collecting box after seeing the disclosed content, without creative labor and excessive experiments;

[0102] The second reinforcing member 42 is composed of square tubes and is welded around the outer wall of the second tank body 41, and the second reinforcing member 42 is wrapped with a 4mm thick PP plate, improving the structural strength of the second tank body 41;

[0103] The second water baffle 43 is a square frame structure arranged on the top of the second tank body 41, increasing the area of the top of the second tank body 41 and forming a barrier to prevent the soaking liquid from overflowing and dripping;

[0104] The overflow dam 44 comprises a first plate 44-1 connected to the second groove body 41, and a second plate 44-2 connected to the second groove body 41 and connected to the first plate 44-1 at one end to form an "L" shaped structure with the first plate 44-1, and the other end of the second plate 44-2 is lower than the top of the second groove body 41; the overflow dam 44 is arranged between the second groove body 41 to form an overflow space 45, which is beneficial for floating substances (impurities and oil stains) generated after soaking to enter the overflow space 45 from the second inner space 41-1 and enter the waste liquid collection box 60 along the overflow pipeline 74;

[0105] The other end of the second plate 44-2 has a sawtooth structure 44-21, which is beneficial for floating substances generated after soaking to enter the overflow space 45 from the second inner space 41-1;

[0106] The soaking liquid is a common structure in the prior art, such as pure water; the semiconductor parts are soaked by 2MΩ·cm pure water, and the pure water is always kept in sufficient amount, and the excess pure water containing impurities and oil stains is discharged through the overflow space 45, so that the cleanliness of the soaking liquid is ensured, and the semiconductor parts after cleaning and soaking meet the requirements of semiconductor cleanliness and have relatively good cleanliness;

[0107] Another embodiment:

[0108] As shown in Figure 1 、 Figure 2 、 Figure 3 ; in implementation, the waste liquid collection box 60 comprises a box body 61 having a third inner space 61-1 in the box body 61, and at least two third reinforcing members 62 connected to the outer wall of the box body 61;

[0109] The box body 61 is a square groove body spliced by 12mm thick PP plates, has a square third inner space 61-1, and is beneficial for accommodating waste liquid in the third inner space 61-1;

[0110] The third reinforcing member 62 is composed of square tubes and is welded around the outer wall of the box body 61, and the third reinforcing member 62 is wrapped with 4mm thick PP plates, which improves the structural strength of the box body 61;

[0111] Another embodiment:

[0112] As shown in Figure 1 、 Figure 2 、 Figure 3As shown; in implementation, the pipeline assembly 70 includes: a liquid inlet pipeline 71 connected to the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, for introducing the cleaning liquid into the degreasing tank assembly 30, and introducing the soaking liquid into the first soaking tank assembly 40 and the second soaking tank assembly 50; an air inlet pipeline 72 connected to the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, for introducing gas into the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, for pneumatic stirring; a waste liquid discharge pipeline 73 connected to the degreasing tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collection tray 10, for introducing the waste liquid in the degreasing tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collection tray 10 into the waste liquid collection tank 60; and an overflow pipeline 74 connected to the first soaking tank assembly 40 and the second soaking tank assembly 50, for introducing the overflow at the overflow space 45 into the waste liquid collection tank 60;

[0113] Wherein, the liquid inlet pipeline 71 is composed of a Φ40 PVC main pipeline and a Φ25 PVC branch pipeline, the PVC branch pipeline is in one-to-one communication with the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50 respectively, and the PVC main pipeline connects the PVC branch pipeline, the cleaning liquid or soaking liquid is introduced from the PVC main pipeline, and the PVC branch pipeline is also provided with a PVC flow meter, a PVC valve and the like, which is beneficial to control the on-off of the cleaning liquid or soaking liquid, and the operation is relatively convenient;

[0114] Wherein, the air inlet pipeline 72 is used to introduce gas into the degreasing tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, to form an aeration effect, improve the cleaning effect, and the air inlet pipeline 72 is provided with a pressure reducing valve, a pressure gauge and a filter, which is beneficial to control the pressure and on-off of the gas, and the operation is relatively convenient;

[0115] Wherein, the waste liquid discharge pipeline 73 includes: a discharge pipe 73-1 for communicating the degreasing tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collection tray 10 with the waste liquid collection tank 60; and a pneumatic diaphragm pump 73-2 connected to the discharge pipe 73-1, for introducing the waste liquid in the degreasing tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collection tray 10 into the waste liquid collection tank 60;

[0116] The exhaust pipe 73-1 comprises: a first main pipe and a first branch pipe; the first branch pipe is communicated with the defatting tank assembly 30, the first soaking tank assembly 40, the second soaking tank assembly 50 and the liquid collecting tray 10 one by one respectively, the first main pipe is connected with the first branch pipe, the waste liquid enters into the first main pipe along the first branch pipe, and the first branch pipe is provided with a PPH ball valve and the like, which is beneficial to control the on-off of the waste liquid and is convenient to operate;

[0117] The pneumatic diaphragm pump 73-2 is a common structure in the prior art, which is beneficial to pump the waste liquid into the waste liquid collecting tank 60;

[0118] The overflow pipe 74 comprises: a second main pipe and a second branch pipe; the second branch pipe is communicated with the first soaking tank assembly 40 and the second soaking tank assembly 50 one by one respectively; the second main pipe is connected with the second branch pipe; the overflow at the overflow space 45 enters the second branch pipe, and then enters the second main pipe, and finally enters the waste liquid collecting tank 60 along the second main pipe;

[0119] The person skilled in the art can directly and without doubt know how to set the pipe assembly 70 after seeing the disclosure, without creative labor and excessive experiments;

[0120] Another embodiment:

[0121] As shown in Figure 1 、 Figure 2 、 Figure 3 ; in implementation, the electric appliance control system 80 comprises: a timing alarm 81 arranged on the defatting tank assembly 30, the first soaking tank assembly 40 and the second soaking tank assembly 50, which is used for timing alarm; an ultrasonic generator 82 arranged in the defatting tank assembly 30, which is used for ultrasonic cleaning of the semiconductor parts; an electric heater 83 arranged in the defatting tank assembly 30, which is used for electric heating of the cleaning liquid in the defatting tank assembly 30; and an intelligent digital display temperature controller, which is used for electrically controlling the timing alarm 81, the ultrasonic generator 82 and the electric heater 83;

[0122] The timing alarm 81 is a common structure in the prior art, which is used for timing alarm, and the timing range is 1 second-99 minutes, which is convenient to set the cleaning and soaking time and control the buzzer alarm;

[0123] The ultrasonic generator 82 is a common structure in the prior art, which is used for vibrating the cleaning liquid in the defatting tank assembly 30 to clean the semiconductor parts, thereby ensuring the cleaning effect;

[0124] The electric heater 83 is a common structure in the prior art, which is used for heating the cleaning liquid from 20 degrees to 50 degrees within two hours;

[0125] The intelligent digital display temperature controller is a common structure in the prior art, such as a temperature control intelligent digital display PID, which is convenient for controlling the timing alarm 81, the ultrasonic wave generator 82 and the electric heater 83.

[0126] The electric appliance control system 80 is a common structure in the prior art, which is convenient for electric control of the operator and operation of the opposite party, and is not the inventive point of the utility model, but is only for better description of the utility model and convenient understanding of the technical scheme of the utility model. After seeing the disclosed content, the ordinary skilled in the art can directly and without doubt know how to set the electric appliance control system 80 without creative labor and excessive test.

[0127] The working principle is as follows: during cleaning, the electric appliance control system 80 electrically heats the cleaning liquid in the degreasing tank assembly 30 to 50 degrees, and performs ultrasonic cleaning on the semiconductor parts in the degreasing tank assembly 30. The pipeline assembly 70 is opened, and gas is introduced into the degreasing tank assembly 30 for pneumatic stirring. The cleaning time is 1-5 minutes.

[0128] The semiconductor parts in the degreasing tank assembly 30 are moved to the first soaking tank assembly 40, and the semiconductor parts are soaked and cleaned by the soaking liquid. The pipeline assembly 70 is opened, and gas is introduced into the first soaking tank assembly 40 for pneumatic stirring. The soaking time is 1-15 minutes.

[0129] The semiconductor parts in the first soaking tank assembly 40 are moved to the second soaking tank assembly 50, and the semiconductor parts are soaked and cleaned by the soaking liquid. The soaking time is 1-5 minutes.

[0130] After cleaning and soaking are completed, the semiconductor parts are taken out from the second soaking tank assembly 50, and filtered compressed air is used to blow the surface, deep hole and recess cavity of the semiconductor parts until there is no water mark.

[0131] Appearance detection is performed, and the semiconductor parts are tested by rubbing with a Scotch-Brite cloth dipped in alcohol to ensure that the Scotch-Brite cloth does not change color.

[0132] Finally, the semiconductor parts are packaged and stored.

[0133] In the description, it should be understood that the terms "upper", "lower", "left", "right", "front", "back" and the like indicate the positional relationship or location relationship based on the position relationship described in the drawings, and are only for the convenience of description or simplification of description, and do not indicate a specific direction that must be had; the operation process described in the embodiments is not an absolute use step, and in actual use, corresponding adjustment can be made.

[0134] Unless otherwise defined, technical terms or scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terms "first", "second", and similar terms do not imply any order, quantity, or importance, but are used to distinguish different components, and the terms "one", "another", and similar terms do not determine the quantity, but mean at least one, according to the content of the embodiments;

[0135] The above description is only the preferred embodiment of the application, but the protection scope is not limited to this, any person skilled in the art can make equivalent replacements or changes within the disclosed technical scope according to the technical solutions and the inventive concept, which should be covered in the protection scope of the application.

Claims

1. A semiconductor component degreasing and cleaning device, characterized in that, The utility model relates to a semiconductor cleaning device, which comprises: a collecting tray (10); a support frame (20) connected in the collecting tray (10); at least one defatting tank assembly (30) connected to the support frame (20); at least one first soaking tank assembly (40) connected to the support frame (20) and arranged on one side of the defatting tank assembly (30); at least one second soaking tank assembly (50) connected to the support frame (20) and arranged on one side of the first soaking tank assembly (40); a waste liquid collecting tank (60) arranged on one side of the collecting tray (10) and spaced apart from the support frame (20); a pipeline assembly (70) for introducing cleaning liquid, soaking liquid and gas into the defatting tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50), and for guiding waste liquid in the defatting tank assembly (30), the first soaking tank assembly (40), the second soaking tank assembly (50) and the collecting tray (10) into the waste liquid collecting tank (60); and an electrical control system (80) for timing alarm and for electrically heating the cleaning liquid in the defatting tank assembly (30) and for ultrasonic cleaning of semiconductor parts in the defatting tank assembly (30).

2. A semiconductor component degreasing cleaning apparatus according to claim 1, characterized by: The support frame (20) comprises a main frame body (21) arranged in the collecting tray (10), the main frame body (21) having a first support surface (21-1) and a second support surface (21-2), the second support surface (21-2) being higher than the first support surface (21-1), the defatting tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50) being arranged on the first support surface (21-1); a glass fiber reinforced plastic plate arranged on the first support surface (21-1) and placed at the bottom of the defatting tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50); a rectangular lattice empty plate (22) placed on the second support surface (21-2); a guardrail (23) connected to the edge of the second support surface (21-2) and spaced apart from the defatting tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50); and two walkway stairs (24) symmetrically arranged and connected between the collecting tray (10) and the second support surface (21-2).

3. The semiconductor component degreasing cleaning apparatus according to claim 1, characterized by: The defatting tank assembly (30) comprises a first tank body (31) having a first inner space (31-1) therein; at least two first reinforcing members (32) connected to the outer wall of the first tank body (31); a first water baffle (33) connected to the top of the first tank body (31); a filter (34) arranged in the collecting tray (10) and arranged on one side of the first tank body (31) for circulating filtration of the cleaning liquid in the first inner space (31-1); and a cover plate for covering the first inner space (31-1).

4. The semiconductor component degreasing cleaning apparatus according to claim 1, characterized by: The first soaking tank assembly (40) and the second soaking tank assembly (50) have the same structure, and each comprises: a second tank body (41) having a second inner space (41-1) therein; at least two second reinforcing members (42) connected to an outer wall of the second tank body (41); a second water baffle (43) connected to a top of the second tank body (41); and an overflow blocking member (44) connected to the second tank body (41) and arranged in the second inner space (41-1) to form an overflow space (45) between the second tank body (41).

5. A semiconductor component degreasing cleaning apparatus according to claim 4, characterized by: The overflow blocking member (44) comprises: a first plate (44-1) connected to the second tank body (41); 6. A semiconductor component degreasing cleaning apparatus according to claim 5, wherein: and a second plate (44-2) connected to the second tank body (41) and connected to the first plate (44-1) at one end to form an "L" shape structure with the first plate (44-1), and the other end of the second plate (44-2) is lower than the top of the second tank body (41).

7. The semiconductor component degreasing cleaning apparatus according to claim 1, characterized by: The other end of the second plate (44-2) has a sawtooth structure (44-21). The waste liquid collecting tank (60) comprises:

8. A semiconductor component degreasing cleaning apparatus according to claim 4, characterized by: a tank body (61) having a third inner space (61-1) therein; and at least two third reinforcing members (62) connected to an outer wall of the tank body (61). The pipeline assembly (70) comprises: a liquid inlet pipeline (71) connected to the degreasing tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50) for introducing the cleaning liquid into the degreasing tank assembly (30) and the soaking liquid into the first soaking tank assembly (40) and the second soaking tank assembly (50); 9. A semiconductor component degreasing cleaning apparatus according to claim 8, characterized by: an air inlet pipeline (72) connected to the degreasing tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50) for introducing gas into the degreasing tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50) for pneumatic stirring; a waste liquid outlet pipeline (73) connected to the degreasing tank assembly (30), the first soaking tank assembly (40), the second soaking tank assembly (50) and the liquid collecting tray (10) for introducing the waste liquid in the degreasing tank assembly (30), the first soaking tank assembly (40), the second soaking tank assembly (50) and the liquid collecting tray (10) into the waste liquid collecting tank (60); and an overflow pipeline (74) connected to the first soaking tank assembly (40) and the second soaking tank assembly (50) for introducing the overflow at the overflow space (45) into the waste liquid collecting tank (60). The waste liquid outlet pipeline (73) comprises: an outlet pipe (73-1) for communicating the degreasing tank assembly (30), the first soaking tank assembly (40), the second soaking tank assembly (50) and the liquid collecting tray (10) with the waste liquid collecting tank (60). and a pneumatic diaphragm pump (73-2) connected to the discharge pipe (73-1) for guiding waste liquid in the degreasing tank assembly (30), the first soaking tank assembly (40), the second soaking tank assembly (50) and the liquid collecting tray (10) into the waste liquid collecting box (60).

10. The semiconductor component degreasing cleaning apparatus according to claim 1 or 3 or 6 or 9, characterized by: The electric appliance control system (80) comprises: a timing alarm (81) arranged on the degreasing tank assembly (30), the first soaking tank assembly (40) and the second soaking tank assembly (50) for timing alarm; an ultrasonic generator (82) arranged in the degreasing tank assembly (30) for ultrasonic cleaning of the semiconductor parts; an electric heater (83) arranged in the degreasing tank assembly (30) for electric heating of the cleaning liquid in the degreasing tank assembly (30); and an intelligent digital display temperature controller for electrically controlling the timing alarm (81), the ultrasonic generator (82) and the electric heater (83).

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