MEMS chip transfer clamp

Abstract

The MEMS chip transfer clamp comprises an upper clamping plate and a lower clamping plate, and a plurality of upper electromagnets are embedded in the upper clamping plate; a lower electromagnet is embedded in the position, corresponding to the electromagnet on the upper clamping plate, of the lower clamping plate, the polarities of the opposite faces of the upper electromagnet and the lower electromagnet are opposite, and an MEMS chip is placed between the upper electromagnet and the lower electromagnet. The electromagnets are installed on the upper clamping plate and the lower clamping plate, the MEMS chip is fixed through the magnetic attraction force of the upper electromagnet and the lower electromagnet, the vibrating diaphragm is prevented from being broken in the chip transferring process, meanwhile, automatic control can be achieved in the whole process, and the chip transferring automation degree is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to MEMS chip production tool technical field especially relates to a MEMS chip transfer fixture. BACKGROUND

[0002] MEMS (Micro-Electro-Mechanical System) chip is a kind of high-tech chip that combines microelectronic circuit technology and micro-mechanical system, and is mainly used for manufacturing various sensors.

[0003] MEMS chip ultrasonic sensor can measure distance by emitting ultrasonic pulse and then listening to reflected echo, and the distance between sensor and target object can be accurately calculated, and currently MEMS chip ultrasonic sensor is widely used in consumer electronics, robots, unmanned aerial vehicles, automobiles and other fields.

[0004] When existing ultrasonic sensing MEMS chip is processed, back cavity is formed on MEMS chip, resulting in that diaphragm of MEMS chip is relatively thin and is prone to breakage during transfer process.

[0005] The patent document with application number 202320987295.0 discloses a kind of chip automatic transfer device, and its scheme uses manipulator to drive clamping device to clamp material box, realizes the automatic transfer of chip processing, improves the production efficiency of chip.The clamping plate is fixed in different installation area, so that the clamping column on the clamping plate can transport different specifications of material box, improve the scope of application.But its scheme also has the problems of too complex structure and high equipment cost.

[0006] Therefore, a MEMS chip transfer device is needed in practical application to safely transfer MEMS chip at low cost and prevent diaphragm breakage and damage. UTILITY MODEL CONTENT

[0007] The utility model aims at providing a kind of MEMS chip transfer fixture, solve the problem that diaphragm is relatively thin after MEMS chip forms back cavity and is prone to breakage during transfer process.

[0008] The purpose of the utility model can be realized by the following technical scheme: a kind of MEMS chip transfer fixture, comprising:

[0009] Upper clamping plate, the upper clamping plate is embedded with a plurality of upper electromagnet;

[0010] Lower clamping plate, the lower clamping plate is embedded with lower electromagnet in the corresponding place of upper electromagnet of upper clamping plate;

[0011] Wherein, the polarity of opposite surface of upper electromagnet and lower electromagnet is opposite, and MEMS chip is placed between upper electromagnet and lower electromagnet.

[0012] As a further place of the utility model, the upper electromagnet and the lower electromagnet are opposite and installed with pressure sensors; and / or the lower electromagnet and the upper electromagnet are opposite and installed with pressure sensors.

[0013] As a further place of the utility model, the lower clamp plate is installed with infrared sensors at the middle part corresponding to the MEMS chip.

[0014] As a further place of the utility model, the material of the upper clamp plate and the lower clamp plate is organic glass.

[0015] As a further place of the utility model, the upper electromagnet and the lower electromagnet are cylindrical, or the upper electromagnet and the lower electromagnet are cuboids.

[0016] As a further place of the utility model, the upper electromagnet, the lower electromagnet, the pressure sensor and the infrared sensor are electrically connected with the controller.

[0017] The utility model discloses the beneficial effect:

[0018] The utility model discloses the electromagnet is installed in the upper and lower clamp plate, utilizes the magnetic attraction of upper and lower electromagnet, fixes the MEMS chip, avoids the diaphragm rupture in the process of chip transfer, can realize automatic control in whole process simultaneously, improves chip transfer automation degree, and the whole equipment investment cost is low, safe and reliable, has higher practical value. DRAWINGS

[0019] Figure 1 It is the appearance structure schematic drawing of the utility model transfer clamp;

[0020] Figure 2 It is one kind of exploded structure schematic drawing of the utility model transfer clamp;

[0021] Figure 3 It is another exploded structure schematic drawing of the utility model transfer clamp.

[0022] 100, upper clamp plate;110, upper electromagnet;

[0023] 200, lower clamp plate;210, lower electromagnet;

[0024] 300, MEMS chip;310, diaphragm part;320, back cavity part;

[0025] 410, infrared sensor;420, pressure sensor. Specific implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar symbols denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0027] Example 1:

[0028] like Figure 1 As shown, this utility model discloses a MEMS chip transfer fixture, comprising:

[0029] Upper clamping plate 100, wherein a plurality of upper electromagnets 110 are mounted on the upper clamping plate 100;

[0030] The lower clamping plate 200 has a lower electromagnet 210 installed at the corresponding position of the upper electromagnet 110 on the upper clamping plate 100.

[0031] Among them, the upper electromagnet 110 and the lower electromagnet 210 have opposite polarities on their opposite sides, and the space between the upper electromagnet 110 and the lower electromagnet 210 is used to place the MEMS chip 300.

[0032] like Figure 1 As shown, after the MEMS chip 300 is formed, the back cavity portion 320 is about 725μm, and the diaphragm portion 310 is relatively thin, about 10-30nm, which makes it easy to break during transportation.

[0033] Current transport methods are not convenient for transporting MEMS chips after fixing them vertically and horizontally, and the transport process has a low degree of automation, making it inconvenient for assembly line operations.

[0034] To address the aforementioned issues, this invention employs an upper electromagnet 110 and a lower electromagnet 210 respectively embedded in the upper clamping plate 100 and the lower clamping plate 200. The upper electromagnet 110 and the lower electromagnet 210 are positioned vertically to correspond to each other and also correspond to the edge of the back cavity when the MEMS chip 300 is placed.

[0035] The upper electromagnet 110 and the lower electromagnet 210 have opposite polarities on their opposite sides. By using the magnetic attraction between the upper electromagnet 110 and the lower electromagnet 210, the MEMS chip 300 is fixed between the upper clamping plate 100 and the lower clamping plate 200. This forms a protective layer for the MEMS chip 300 during the transfer process, making the diaphragm of the MEMS chip 300 less susceptible to external forces and greatly reducing the possibility of breakage during the transfer process.

[0036] Specifically, such as Figure 2As shown, the shapes of the upper electromagnet 110 and the lower electromagnet 210 can be cylinders, and the upper electromagnet 110 and the lower electromagnet 210 are respectively located at the corners around the MEMS chip 300. The upper and lower magnetic attraction of the four upper electromagnets 110 and the four lower electromagnets 210 makes the overall force on the MEMS chip 300 uniform, thereby keeping the MEMS chip 300 stable during the transfer process.

[0037] Further, as shown, Figure 3 As shown, the shapes of the upper electromagnet 110 and the lower electromagnet 210 can be cuboids, and the opposite faces of the upper and lower cuboids are located at the edges of the back cavity of the MEMS chip 300. The upper electromagnet 110 and the lower electromagnet 210 form a planar magnetic attraction, which makes the overall force on the MEMS chip 300 uniform, thereby keeping the MEMS chip 300 stable during the transfer process.

[0038] Further, the opposite faces of the upper electromagnet 110 and / or the lower electromagnet 210 are provided with a pressure sensor 420. The pressure sensor 420 can be attached to the upper electromagnet 110 or the lower electromagnet 210. The upper electromagnet 110, the lower electromagnet 210, and the pressure sensor 420 are all electrically connected to a controller. The controller can detect the magnetic attraction force generated by the upper electromagnet 110 and the lower electromagnet 210 through the pressure sensor 420. According to the monitoring data of the pressure sensor 420, the controller can timely adjust the magnetic attraction force between the upper electromagnet 110 and the lower electromagnet 210 to prevent the magnetic attraction force from being too large or too small. In this way, the clamp can be flexibly applied to MEMS chips 300 of different thickness specifications.

[0039] Further, the materials of the upper clamp plate 100 and the lower clamp plate 200 are organic glass, which facilitates the observation of the placement position of the MEMS chip 300 and the timely handling of unexpected situations during the transfer process.

[0040] Further, the lower clamp plate 200 is provided with an infrared sensor 410 at the middle part corresponding to the MEMS chip 300. The infrared sensor 410 is electrically connected to a controller. The infrared sensor 410 can sense the placement of the MEMS chip 300.

[0041] The utility model discloses a principle: when MEMS chip 300 needs to be transferred, place on upper clamping plate 100, MEMS chip 300 back cavity edge is right to lower electromagnet 210, infrared sensor 410 sends response signal and informs controller, and controller passes through power device, and moves upper clamping plate 100 from above and approaches MEMS chip 300, and upper electromagnet 110 is right to MEMS chip 300 back cavity edge, and controller controls upper electromagnet 110 and lower electromagnet 210 and produces magnetic attraction, and MEMS chip 300 is fixed between upper clamping plate 100 and lower clamping plate 200, and simultaneously through pressure sensor 420 monitoring magnetic attraction size and timely adjustment, make MEMS chip 300 whole stress even, and be protected up and down, keep the stability in the process of transferring, reduce the diaphragm easy break condition in the process of transferring, after transferring, through degaussing and separating upper clamping plate 100 and lower clamping plate 200, take out MEMS chip 300.

[0042] The above merely describes a preferred embodiment of the present application, and the scope of protection of the present application is not limited thereto. Any person skilled in the art, within the technical scope disclosed by the present application, can make equivalent replacements or changes to the technical scheme of the present application and its concept, and all of these should be covered within the scope of protection of the present application.

[0043] It should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0044] In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0045] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do the broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated; can be mechanical connection, also can be electric connection or each other can communicate; can be direct connection, also can indirectly connect through the intermediate medium, can be two element inside the communication or two element's mutual action relation, unless another definite limitation. For the ordinary skill in the art, can understand the concrete meaning of the above terms in the utility model according to specific circumstances.

[0046] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can be that first and second features directly contact, or first and second features indirectly contact through intermediate medium. Moreover, first feature "on", "above" and "on" second feature can be that first feature is directly above or obliquely above second feature, or just indicates that the horizontal height of first feature is higher than that of second feature. First feature "under", "below" and "under" second feature can be that first feature is directly below or obliquely below second feature, or just indicates that the horizontal height of first feature is less than that of second feature.

Claims

1. A MEMS chip transfer fixture, comprising: Comprise: Upper clamping plate (100), the upper clamping plate (100) is embedded with a plurality of upper electromagnet (110); Lower clamping plate (200), the lower clamping plate (200) is embedded with lower electromagnet (210) with upper clamping plate (100) upper electromagnet (110) corresponding place; Wherein, the upper electromagnet (110) and the lower electromagnet (210) opposite face polarity is opposite, the upper electromagnet (110) and the lower electromagnet (210) between for placing MEMS chip (300).

2. The MEMS chip transfer clamp of claim 1, wherein, The upper electromagnet (110) and the lower electromagnet (210) opposite face is equipped with pressure sensor (420), and / or the lower electromagnet (210) and the upper electromagnet (110) opposite face is equipped with pressure sensor (420).

3. The MEMS chip transfer clamp of claim 1, wherein, The lower clamping plate (200) middle part corresponding MEMS chip (300) place, is equipped with infrared sensor (410).

4. The MEMS chip transfer clamp of claim 1, wherein, The material of the upper clamping plate (100) and the lower clamping plate (200) is organic glass.

5. The MEMS chip transfer clamp of claim 1, wherein, The shape of the upper electromagnet (110) and the lower electromagnet (210) is cylinder, or the shape of the upper electromagnet (110) and the lower electromagnet (210) is cuboid.

6. The MEMS chip transfer clamp of claim 1, wherein, The upper electromagnet (110), the lower electromagnet (210), the pressure sensor (420) and the infrared sensor (410) are electrically connected to the controller.

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