Cooling device for electron beam evaporation source and vacuum processing system

Abstract

The utility model relates to the technical field of vacuum equipment, and discloses a cooling device of an electron beam evaporation source and a vacuum treatment system. The cooling device of the electron beam evaporation source comprises a cooling cavity, a liquid inlet pipe and a liquid outlet pipe. The cooling cavity is used for cooling liquid circulation, is arranged above one or more electron beam evaporation sources, is thermally coupled with the electron beam evaporation sources and is used for cooling the electron beam evaporation sources. The liquid inlet pipe communicates with the cooling cavity and is used for introducing cooling liquid into the cooling cavity. And the liquid outlet pipe is communicated with the cooling cavity and is used for discharging the cooling liquid from the cooling cavity.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of vacuum equipment, in particular to a cooling device of an electron beam evaporation source and a vacuum processing system. BACKGROUND

[0002] In the electron beam coating technology, materials are usually placed in a crucible, and through the bombardment and heating of an electron beam, the materials are evaporated and deposited on the surface of a substrate to form a thin film in a high vacuum environment. The cooling device of the electron beam evaporation source is one of the main components in the electron beam coating technology to provide effective cooling for the crucible during the electron beam evaporation process. The existing cooling device of the electron beam evaporation source is sleeved on the electron beam evaporation source, resulting in a large installation flange and a large space occupied by the cooling device. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides a cooling device of an electron beam evaporation source, comprising:

[0004] a cooling cavity for cooling liquid flow, and arranged above one or more electron beam evaporation sources and thermally coupled with the electron beam evaporation sources for cooling the electron beam evaporation sources;

[0005] a liquid inlet pipe in communication with the cooling cavity for introducing cooling liquid into the cooling cavity, and a liquid outlet pipe in communication with the cooling cavity for discharging cooling liquid from the cooling cavity.

[0006] In some embodiments of the present disclosure, the cooling cavity comprises:

[0007] an upper cold plate;

[0008] a lower cold plate arranged below the upper cold plate; and

[0009] one or more evaporation through holes for allowing evaporation materials of the one or more electron beam evaporation sources to pass through, respectively; and / or

[0010] one or more observation window through holes for providing an observation window; and / or

[0011] one or more infrared temperature measurement instrument through holes for providing a measurement channel of an infrared temperature measurement instrument.

[0012] In some embodiments of the present disclosure, the cooling device of the electron beam evaporation source further comprises a magnetic shielding assembly arranged on the upper cold plate.

[0013] In some embodiments of the present disclosure, the magnetic shielding assembly comprises:

[0014] an upper magnetic shielding layer;

[0015] a lower magnetic shielding layer arranged below the upper magnetic shielding layer; and

[0016] The non-magnetic gap layer is arranged between the upper magnetic shielding layer and the lower magnetic shielding layer.

[0017] In some embodiments of the present disclosure, the magnetic shielding assembly further comprises: a metal gasket arranged on the lower surface of the upper magnetic shielding layer, and / or the upper surface of the non-magnetic gap layer, and / or the lower surface of the non-magnetic gap layer, and / or the upper surface of the lower magnetic shielding layer, and / or the lower surface of the lower magnetic shielding layer, for supporting the upper magnetic shielding layer and / or the non-magnetic gap layer and / or the lower magnetic shielding layer.

[0018] In some embodiments of the present disclosure, the upper cold plate comprises at least one positioning pin;

[0019] The magnetic shielding assembly comprises at least one positioning hole matched with the at least one positioning pin of the upper cold plate respectively, for installation and positioning of the magnetic shielding assembly.

[0020] In some embodiments of the present disclosure, the upper end of the positioning pin comprises a through hole;

[0021] The cooling device of the electron beam evaporation source further comprises a tantalum wire for passing through the through hole of the upper end of the positioning pin, for fixing the upper cold plate and the magnetic shielding assembly.

[0022] In some embodiments of the present disclosure, the cooling device of the electron beam evaporation source further comprises at least one supporting rod connected with the lower cold plate, for supporting the cooling cavity.

[0023] The present disclosure provides a vacuum processing system, comprising:

[0024] a vacuum cavity;

[0025] at least one electron beam evaporation source arranged at least partially in the vacuum cavity and in sealed connection with the vacuum cavity; and

[0026] a cooling device of the electron beam evaporation source according to any one of the embodiments of the present disclosure, arranged in the vacuum cavity and above the at least one electron beam evaporation source, for cooling the at least one electron beam evaporation source.

[0027] In some embodiments of the present disclosure, the vacuum processing system further comprises:

[0028] a liquid inlet flange assembly comprising a liquid inlet flange and a liquid inlet connecting pipe, the liquid inlet flange being in sealed connection with the vacuum cavity, and the liquid inlet connecting pipe being connected with the liquid inlet pipe;

[0029] a liquid outlet flange assembly comprising a liquid outlet flange and a liquid outlet connecting pipe, the liquid outlet flange being in sealed connection with the vacuum cavity, and the liquid outlet connecting pipe being connected with the liquid outlet pipe.

[0030] In some embodiments of the present disclosure, the vacuum processing system further comprises:

[0031] The liquid inlet vacuum connection radial sealing joint connects the liquid inlet connecting pipe and the liquid inlet pipe.

[0032] The liquid outlet vacuum connection radial sealing joint connects the liquid outlet connecting pipe and the liquid outlet pipe.

[0033] The cooling device of the electron beam evaporation source and the vacuum processing system according to some embodiments of the present disclosure can bring beneficial technical effects. For example, the cooling device of the electron beam evaporation source and the vacuum processing system according to some embodiments of the present disclosure, the cooling device of the electron beam evaporation source is arranged above the electron beam evaporation source, without increasing the installation flange area of the electron beam evaporation source. The cooling device of the electron beam evaporation source can cool multiple electron beam evaporation sources at the same time, and has small space occupation, simple structure and convenient use. For another example, the cooling device of the electron beam evaporation source and the vacuum processing system according to some embodiments of the present disclosure, the magnetic shielding assembly is installed on the upper cold plate of the cooling cavity, which can reduce the influence of the magnetic field of the electron beam evaporation source on the instruments above the system. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only one embodiment of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0035] Figure 1 A structure schematic diagram of the cooling device of the electron beam evaporation source according to some embodiments of the present disclosure is shown;

[0036] Figure 2 A structure schematic diagram of the cooling cavity according to some embodiments of the present disclosure is shown;

[0037] Figure 3 A structure schematic diagram of the magnetic shielding assembly according to some embodiments of the present disclosure is shown;

[0038] Figure 4 A structure schematic diagram of the vacuum processing system according to some embodiments of the present disclosure is shown;

[0039] Figure 5 An installation structure schematic diagram of the cooling cavity in the vacuum processing system according to some embodiments of the present disclosure is shown;

[0040] In the above drawings, various reference signs represent:

[0041] 1000-vacuum processing system

[0042] 100-cooling device of the electron beam evaporation source

[0043] 110 - cooling cavity

[0044] 111 - upper cold plate

[0045] 1111 - positioning pin

[0046] 112 - lower cold plate

[0047] 113a, 113b - evaporation through hole

[0048] 114 - observation window through hole

[0049] 115 - infrared thermometer through hole

[0050] 120 - liquid inlet pipe

[0051] 130 - liquid outlet pipe

[0052] 140 - magnetic shielding assembly

[0053] 141 - upper magnetic conductive shielding layer

[0054] 142 - lower magnetic conductive shielding layer

[0055] 143 - non-magnetic conductive spacing layer

[0056] 144 - metal gasket

[0057] 145 - positioning hole

[0058] 150 - tantalum wire

[0059] 160 - support rod

[0060] 200 - vacuum cavity

[0061] 210 - flange base

[0062] 300a, 300b - electron beam evaporation source

[0063] 400 - liquid inlet flange assembly

[0064] 410 - liquid inlet flange

[0065] 420 - liquid inlet connecting pipe

[0066] 500 - liquid outlet flange assembly

[0067] 510 - liquid outlet flange

[0068] 520 - liquid outlet connecting pipe

[0069] 600 - liquid inlet vacuum connection radial seal (VCR) joint

[0070] 610 - liquid inlet VCR inner threaded joint

[0071] 620-liquid inlet VCR male threaded joint

[0072] 630-liquid inlet VCR metal sealing gasket

[0073] 700-liquid outlet VCR joint

[0074] 710-liquid outlet VCR female threaded joint

[0075] 720-liquid outlet VCR male threaded joint

[0076] 730-liquid outlet VCR metal sealing gasket DETAILED DESCRIPTION

[0077] Some embodiments of the present disclosure will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only exemplary embodiments of the present disclosure, not all embodiments.

[0078] In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", "transverse", "longitudinal" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In the description of the present disclosure, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connected", "coupling" should be interpreted broadly, for example, it can be fixedly connected, or it can be detachably connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. In the description of the present disclosure, the distal end or the distal side refers to the end or side that goes deep into the vacuum environment (for example, the vacuum chamber), and the proximal end or the proximal side refers to the end or side opposite to the distal end or the distal side (for example, the end or side away from the vacuum chamber, or the end or side close to the wall of the vacuum chamber inside the vacuum chamber, etc.). Alternatively, the end or side close to the driving device is the proximal end or the proximal side, and the end or side away from the driving device is the distal end or the distal side. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0079] Figure 1 A structural schematic diagram of a cooling device 100 of an electron beam evaporation source according to some embodiments of the present disclosure is shown.

[0080] As Figure 1As shown, in some embodiments of this disclosure, the cooling device 100 of the electron beam evaporation source may include a cooling chamber 110, an inlet pipe 120, and an outlet pipe 130. The cooling chamber 110 is used for coolant flow and is disposed in one or more electron beam evaporation (e.g., Figure 4 Above the electron beam evaporation sources 300a and 300b shown, and above the electron beam evaporation source (e.g. Figure 4 The electron beam evaporation sources 300a and 300b shown are thermally coupled for cooling the electron beam evaporation sources (e.g., Figure 4 Electron beam evaporation sources 300a and 300b are shown. The inlet pipe 120 is connected to the cooling chamber 110 for introducing coolant into the cooling chamber 110. The outlet pipe 130 is connected to the cooling chamber 110 for discharging coolant from the cooling chamber 110.

[0081] In some embodiments of this disclosure, the cooling device 100 for the electron beam evaporation source is disposed above the electron beam evaporation source, without increasing the mounting flange area of ​​the electron beam evaporation source. The cooling device 100 for the electron beam evaporation source can cool multiple electron beam evaporation sources simultaneously, and occupies little space, has a simple structure, and is easy to use.

[0082] Figure 2 A schematic diagram of the structure of a cooling cavity 110 according to some embodiments of the present disclosure is shown.

[0083] like Figure 2 As shown, in some embodiments of this disclosure, the cooling cavity 110 may include an upper cooling plate 111, a lower cooling plate 112, and one or more evaporation through-holes (e.g., evaporation through-holes 113a and 113b). The lower cooling plate 112 is disposed below the upper cooling plate 111. The one or more evaporation through-holes (e.g., evaporation through-holes 113a and 113b) are used to allow one or more electron beam evaporation sources (e.g., electron beam evaporation sources) to evaporate. Figure 4 The evaporation material of the electron beam evaporation sources 300a and 300b shown passes through. A cavity space for coolant flow can be formed between the upper cooling plate 111 and the lower cooling plate 112. In some embodiments, the upper cooling plate 111 and / or the lower cooling plate 112 may include sidewalls and form a cavity space for coolant flow by mutual sealing connection.

[0084] Those skilled in the art will understand that, although Figure 2 Evaporation vias 113a and 113b are shown for allowing evaporation materials from two electron beam evaporation sources to pass through, but this is only exemplary. The cooling chamber 110 may also include other numbers of evaporation vias, for example, the number of evaporation vias may be adjusted according to the number of electron beam evaporation sources.

[0085] like Figure 2As shown, in some embodiments of this disclosure, the cooling cavity 110 may also be provided with other through holes as needed. For example, in some embodiments, the cooling cavity 110 may include one or more observation window through holes 114 for providing an observation window. In some embodiments, the cooling cavity 110 may also include one or more infrared thermometer through holes 115 for providing a measurement channel for an infrared thermometer.

[0086] like Figure 1 As shown, in some embodiments of this disclosure, the cooling device 100 for the electron beam evaporation source may further include a magnetic shielding assembly 140. The magnetic shielding assembly 140 may be disposed on the upper cold plate 111.

[0087] In some embodiments of this disclosure, a magnetic shielding assembly 140 is installed on the upper cooling plate 111 of the cooling cavity 110, which can reduce the influence of the magnetic field of the electron beam evaporation source on instruments above the system (e.g., instruments such as a reflection high-energy electron diffractometer (RHEED)).

[0088] Figure 3 A schematic diagram of the structure of a magnetic shielding assembly 140 according to some embodiments of the present disclosure is shown.

[0089] like Figure 3 As shown, in some embodiments of this disclosure, the magnetic shielding assembly 140 may include an upper magnetically conductive shielding layer 141, a lower magnetically conductive shielding layer 142, and a non-magnetically conductive spacer layer 143. The lower magnetically conductive shielding layer 142 is disposed below the upper magnetically conductive shielding layer 141. The non-magnetically conductive spacer layer 143 is disposed between the upper magnetically conductive shielding layer 141 and the lower magnetically conductive shielding layer 142.

[0090] In some embodiments of this disclosure, the magnetic shielding effect of the magnetic shielding assembly 140 can be optimized by introducing a non-magnetic spacer layer 143 between the upper magnetic shielding layer 141 and the lower magnetic shielding layer 142.

[0091] In some embodiments of this disclosure, the magnetic shielding assembly 140 may further include a metal pad 144. The metal pad 144 is disposed on the lower surface of the upper magnetic shielding layer 141, and / or the upper surface of the non-magnetic spacer layer 143, and / or the lower surface of the non-magnetic spacer layer 143, and / or the upper surface of the lower magnetic shielding layer 142, and / or the lower surface of the lower magnetic shielding layer 142, for supporting the upper magnetic shielding layer 141 and / or the non-magnetic spacer layer 143 and / or the lower magnetic shielding layer 142.

[0092] like Figure 3 As shown, in some embodiments of this disclosure, metal pads 144 are disposed on the lower surface of the upper magnetic shielding layer 141, the lower surface of the non-magnetic spacer layer 143, and the lower surface of the lower magnetic shielding layer 142, for supporting the upper magnetic shielding layer 141, the non-magnetic spacer layer 143, and the lower magnetic shielding layer 142.

[0093] In some embodiments of the present disclosure, the setting of the metal gasket 144 can enhance the stability and durability of the overall structure of the magnetic shielding assembly 140.

[0094] As shown in Figure 1 and Figure 2 In some embodiments of the present disclosure, the upper cold plate 111 can include at least one positioning pin 1111. Figure 1 As shown in

[0095] Those skilled in the art can understand that Figure 2 The upper cold plate 111 shown in the figure includes four positioning pins 1111, and the magnetic shielding assembly 140 includes four positioning holes 145, which are only exemplary. The upper cold plate 111 can also include other numbers of positioning pins 1111, for example, two, five positioning pins, etc. The magnetic shielding assembly 140 can also include positioning holes 145 matched with the number of positioning pins 1111, for example, two, five positioning holes 145, etc., which are respectively matched with the positioning pins 1111 of the upper cold plate 111 for installation and positioning of the magnetic shielding assembly 140.

[0096] As shown in Figure 1 In some embodiments of the present disclosure, the upper end of the positioning pin 1111 can include a through hole (not shown in the figure). The cooling device 100 of the electron beam evaporation source can also include a tantalum wire 150. The tantalum wire 150 is used to pass through the through hole at the upper end of the positioning pin 1111 for fixing the upper cold plate 111 and the magnetic shielding assembly 140. The tantalum wire 150 is fixed in a simple way, which is convenient for installation and disassembly during maintenance.

[0097] As shown in Figure 1 and Figure 2 In some embodiments of the present disclosure, the cooling device 100 of the electron beam evaporation source can also include at least one support rod 160. The at least one support rod 160 is connected with the lower cold plate 112 for supporting the cooling cavity 110.

[0098] As shown in Figure 1 and Figure 2 In some embodiments of the present disclosure, the liquid inlet pipe 120 and the liquid outlet pipe 130 also have the function of supporting the cooling cavity 110, and one support rod 160 is used to form stable support for the cooling cavity 110 by cooperating with the liquid inlet pipe 120 and the liquid outlet pipe 130.

[0099] Those skilled in the art can understand that Figure 1The cooling device 100 for the electron beam evaporation source shown includes a support rod 160, which is merely exemplary. The cooling device 100 for the electron beam evaporation source may also be provided with other suitable numbers of support rods, such as two or three support rods, as needed.

[0100] Figure 4 A schematic diagram of the structure of a vacuum processing system 1000 according to some embodiments of the present disclosure is shown.

[0101] like Figure 1 As shown, in some embodiments of this disclosure, the vacuum processing system 1000 may include a vacuum chamber 200, at least one electron beam evaporation source (e.g., electron beam evaporation sources 300a and 300b), and a cooling device 100 for the electron beam evaporation source according to any embodiment of this disclosure (e.g., Figure 1 The cooling device 100 shown. At least one electron beam evaporation source (e.g., electron beam evaporation sources 300a and 300b) is at least partially disposed within and sealed to the vacuum chamber 200. The cooling device 100 for the electron beam evaporation source is disposed within the vacuum chamber 200 and located above at least one electron beam evaporation source (e.g., electron beam evaporation sources 300a and 300b) for cooling at least one electron beam evaporation source (e.g., electron beam evaporation sources 300a and 300b).

[0102] The cooling device 100 for the electron beam evaporation source in any embodiment of this disclosure does not increase the mounting flange area of ​​the electron beam evaporation source. Therefore, compared with existing electron beam evaporation source cooling devices, it can accommodate a larger number of electron beam evaporation sources in the vacuum processing system 1000. Therefore, although Figure 4 Only two electron beam evaporation sources are shown, but this is merely exemplary, and the vacuum processing system 1000 may also include three or more suitable electron beam evaporation sources. However, those skilled in the art will understand that the vacuum processing system 1000 may also include one electron beam evaporation source.

[0103] Figure 5 A schematic diagram of the installation structure of the cooling chamber 100 in a vacuum processing system 1000 according to some embodiments of the present disclosure is shown.

[0104] like Figure 5As shown, in some embodiments of this disclosure, the vacuum processing system 1000 may further include an inlet flange assembly 400 and an outlet flange assembly 500. The inlet flange assembly 400 may include an inlet flange 410 and an inlet connector 420. The inlet flange 410 is sealed to the vacuum chamber 200. The inlet connector 420 is connected to the inlet pipe 120. The outlet flange assembly 500 may include an outlet flange 510 and an outlet connector 520. The outlet flange 420 is sealed to the vacuum chamber 200. The outlet connector 520 is connected to the outlet pipe 130.

[0105] like Figure 5 As shown, in some embodiments of this disclosure, the vacuum chamber 200 may include a flange base 210. The flange base 210 is connected to the lower end of the support rod 160. In some embodiments, screws may be used to secure the support rod 160 to the flange base 150.

[0106] Those skilled in the art will understand, for clarity, Figure 5 Only a portion of the vacuum processing system 1000 is shown, and most of the components are in a disassembled state.

[0107] like Figure 5 As shown, in some embodiments of this disclosure, the inlet flange 410 and the inlet pipe 420 are sealed together, for example, by welding, bonding, etc. Similarly, the outlet flange 510 and the outlet pipe 520 are sealed together, for example, by welding, bonding, etc.

[0108] like Figure 5 As shown, in some embodiments of this disclosure, the vacuum processing system 1000 may further include an inlet vacuum connection radial seal (VCR) joint 600 and an outlet vacuum connection radial seal joint 700. The inlet pipe 420 and the inlet pipe 120 are connected via the inlet vacuum connection radial seal joint 600. The outlet pipe 520 and the outlet pipe 130 are connected via the outlet vacuum connection radial seal joint 700.

[0109] In some embodiments of this disclosure, the inlet VCR connector 600 and the outlet VCR connector 700 have good sealing performance and are easy to install and disassemble, facilitating system maintenance and cleaning.

[0110] like Figure 5As shown, in some embodiments of the present disclosure, the liquid inlet VCR joint 600 can include a liquid inlet VCR inner threaded joint 610, a liquid inlet VCR outer threaded joint 620 and a liquid inlet VCR metal sealing gasket 630. The liquid inlet VCR inner threaded joint 610 is arranged at the lower end of the liquid inlet pipe 120, and the liquid inlet VCR outer threaded joint 620 is arranged at the upper end of the liquid inlet connecting pipe 420. The liquid inlet VCR metal sealing gasket 630 is arranged between the liquid inlet VCR inner threaded joint 610 and the liquid inlet VCR outer threaded joint 620 for sealing when the liquid inlet VCR inner threaded joint 610 and the liquid inlet VCR outer threaded joint 620 are connected. The liquid outlet VCR joint 700 can include a liquid outlet VCR inner threaded joint 710, a liquid outlet VCR outer threaded joint 720 and a liquid outlet VCR metal sealing gasket 730. The liquid outlet VCR inner threaded joint 710 is arranged at the lower end of the liquid outlet pipe 130, and the liquid outlet VCR outer threaded joint 720 is arranged at the upper end of the liquid outlet connecting pipe 520. The liquid outlet VCR metal sealing gasket 730 is arranged between the liquid outlet VCR inner threaded joint 710 and the liquid outlet VCR outer threaded joint 720 for sealing when the liquid outlet VCR inner threaded joint 710 and the liquid outlet VCR outer threaded joint 720 are connected.

[0111] Those skilled in the art can understand that, Figure 5 The liquid inlet VCR inner threaded joint 610 can also be arranged at the upper end of the liquid inlet connecting pipe 420, and correspondingly, the liquid inlet VCR outer threaded joint 620 can be arranged at the lower end of the liquid inlet pipe 120, which is merely exemplary and is not used to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

[0112] It should be noted that the above is only an exemplary embodiment of the present disclosure, and is not used to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. Cooling device for an electron beam evaporation source, characterized in that The cooling device of the electron beam evaporation source comprises: a cooling cavity for cooling liquid flow, and arranged above one or more electron beam evaporation sources and in thermal coupling with the electron beam evaporation sources for cooling the electron beam evaporation sources; a liquid inlet pipe in communication with the cooling cavity for introducing cooling liquid into the cooling cavity; and a liquid outlet pipe in communication with the cooling cavity for discharging cooling liquid from the cooling cavity. The cooling cavity comprises:

2. Cooling device of an electron beam evaporation source according to claim 1, characterized in that an upper cold plate; a lower cold plate arranged below the upper cold plate; and one or more evaporation through holes for allowing evaporation materials of the one or more electron beam evaporation sources to pass through, respectively; and / or one or more observation window through holes for providing observation windows; and / or one or more infrared thermometers through holes for providing measurement channels of infrared thermometers. Further comprising:

3. Cooling device of an electron beam evaporation source according to claim 2, characterized in that a magnetic shielding assembly arranged on the upper cold plate. The magnetic shielding assembly comprises:

4. Cooling device of an electron beam evaporation source according to claim 3, characterized in that an upper magnetic shielding layer; a lower magnetic shielding layer arranged below the upper magnetic shielding layer; and a non-magnetic separation layer arranged between the upper magnetic shielding layer and the lower magnetic shielding layer. The magnetic shielding assembly further comprises: a metal gasket arranged on a lower surface of the upper magnetic shielding layer, and / or an upper surface of the non-magnetic separation layer, and / or a lower surface of the non-magnetic separation layer, and / or an upper surface of the lower magnetic shielding layer, and / or a lower surface of the lower magnetic shielding layer, for supporting the upper magnetic shielding layer and / or the non-magnetic separation layer and / or the lower magnetic shielding layer.

5. Cooling device of an electron beam evaporation source according to claim 4, characterized in that The upper cold plate comprises at least one positioning pin; 6. Cooling device of an electron beam evaporation source according to claim 3, characterized in that The magnetic shielding assembly comprises at least one positioning hole matched with the at least one positioning pin of the upper cold plate for installation and positioning of the magnetic shielding assembly. The upper end of the positioning pin comprises a through hole; 7. Cooling device of an electron beam evaporation source according to claim 6, characterized in that The cooling device of the electron beam evaporation source further comprises a tantalum wire for passing through the through hole of the upper end of the positioning pin for fixing the upper cold plate and the magnetic shielding assembly. Further comprising at least one supporting rod connected with the lower cold plate for supporting the cooling cavity.

8. Cooling device of an electron beam evaporation source according to claim 2, characterized in that The cooling device of the electron beam evaporation source comprises:

9. A vacuum processing system, characterized by a vacuum cavity; at least one electron beam evaporation source arranged at least partially in the vacuum cavity and in sealed connection with the vacuum cavity; and the cooling device of the electron beam evaporation source according to any one of claims 1-8 arranged in the vacuum cavity and above the at least one electron beam evaporation source for cooling the at least one electron beam evaporation source. Further comprising: a liquid inlet flange assembly comprising a liquid inlet flange in sealed connection with the vacuum cavity and a liquid inlet connecting pipe connected with the liquid inlet pipe; and 10. The vacuum processing system of claim 9, wherein, a liquid outlet flange assembly comprising a liquid outlet flange in sealed connection with the vacuum cavity and a liquid outlet connecting pipe connected with the liquid outlet pipe. Further comprising: a liquid inlet vacuum connection radial sealing joint through which the liquid inlet connecting pipe and the liquid inlet pipe are connected; and a liquid outlet vacuum connection radial sealing joint through which the liquid outlet connecting pipe and the liquid outlet pipe are connected.

11. The vacuum processing system of claim 10, wherein, ​ ​ ​ ​

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