Clamp for piezoelectric sensor bonding process

Abstract

The utility model belongs to the technical field of structural health monitoring, and particularly relates to a clamp for a piezoelectric sensor bonding process. The clamp is characterized in that a force application rod mounting part is arranged on a fixed bracket; one end of the telescopic support frame is connected with the fixed bracket, and the other end of the telescopic support frame is connected with a structural member of a piezoelectric sensor to be bonded through a fixed sucker; the force application rod is mounted on the force application rod mounting part, a force application handle is mounted at one end of the force application rod, and a force sensor is mounted at the other end of the force application rod; the piezoelectric sensor bonding head is mounted on the force sensor, and a piezoelectric sensor is bonded in the piezoelectric sensor bonding head; the sensor output display device is used for displaying and recording measurement data of the force sensor. According to the invention, standardization and uniformity of the installation technology can be realized, difference caused by manual bonding is eliminated, and the bonding performance of the sensor is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of structural health monitoring, and particularly relates to a clamp for piezoelectric sensor bonding process. BACKGROUND

[0002] Structural health monitoring is a real-time monitoring technology, which uses sensors to monitor the changes of a structure under load, analyzes data to realize damage assessment of the structure. With the continuous development of structure design towards large-scale, complex and intelligent, the health monitoring technology has important significance in improving reliability, reducing maintenance cost and early warning disasters. In recent years, piezoelectric sensors as the core equipment of health monitoring are more and more used in the fields of aerospace, civil engineering, machinery, transportation and other fields, and have been widely used in the fields of energy and chemical industry, medicine and other fields.

[0003] When piezoelectric sensors are used to realize structural health monitoring, the sensor arrangement is generally divided into three forms of external pasting, embedding and surface coating. Among them, the arrangement of external pasting sensors generally pastes piezoelectric ceramic sensors in matrix, circular and various forms on the surface of the structure, monitors the impedance, guided wave or other signals in a certain range, and judges the damage through signal processing. This arrangement form will be affected by the limitations of the structure shape and various factors, including the material, size, pasting and environment of the piezoelectric sheet, which will affect the monitoring results.

[0004] The installation of external piezoelectric sensors mainly adopts manual pasting, that is, adhesive is coated between the sensor and the structure test position, the sensor is pressed on the test position, and after the adhesive is cured, it serves as the signal propagation medium between the sensor signal and the structure. During installation, if the glue layer is too thick, it will cause too large signal attenuation, affecting signal quality, and if the glue layer is too thin, the sensor is easy to fall off, so the thickness control of the glue layer is also extremely critical during sensor installation. In addition, during the curing process of the glue layer, the size of the pressing force and the pressing method will also cause changes in the glue layer, but the current installation method causes inconsistencies in the bonding performance of the piezoelectric sensor due to the differences in manual installation experience, resulting in large differences in the obtained signals, which brings great difficulty to data processing and affects the results of structural health monitoring.

[0005] Therefore, it is desirable to have a technical solution to overcome or at least alleviate at least one of the aforementioned deficiencies of the prior art. CONTENT OF THE UTILITY MODEL

[0006] The purpose of the present application is to provide a clamp for piezoelectric sensor bonding process to solve at least one problem existing in the prior art.

[0007] The technical solution of the present application is:

[0008] A clamp for piezoelectric sensor bonding process, comprising:

[0009] A fixed support is provided with a force rod mounting portion;

[0010] A telescopic support is connected to one end of the fixed support and connected to a structure to be bonded with a piezoelectric sensor through a fixed suction cup at the other end;

[0011] A force rod is mounted on the force rod mounting portion, one end of the force rod is provided with a force handle, and the other end is provided with a force sensor;

[0012] A piezoelectric sensor bonding head is mounted on the force sensor, and a piezoelectric sensor is bonded inside the piezoelectric sensor bonding head;

[0013] A sensor output display device is used to display and record the measurement data of the force sensor.

[0014] In at least one embodiment of the present application, the fixed support is circular, the force rod mounting portion is located at the center of the fixed support, and the telescopic support is located at the outer edge of the fixed support.

[0015] In at least one embodiment of the present application, a level is mounted on the fixed support, and the level is used to adjust the position of the telescopic support.

[0016] In at least one embodiment of the present application, three telescopic supports are installed along the outer edge of the fixed support at equal intervals.

[0017] In at least one embodiment of the present application,

[0018] A guide rail is mounted on the force rod mounting portion, a guide groove is provided on the force rod, and the force rod is mounted in the guide rail of the force rod mounting portion through the guide groove;

[0019] A positioning portion is provided on the fixed support near the force rod mounting portion, the positioning portion is provided with a positioning hole communicating with the guide groove, and the force rod can be positioned by connecting the positioning hole with the force rod through a bolt.

[0020] In at least one embodiment of the present application, a threaded hole is formed in the force rod mounting portion, a threaded section is provided on the force rod, and the force rod is mounted in the threaded hole of the force rod mounting portion through the threaded section.

[0021] In at least one embodiment of the present application, the force sensor is connected to the sensor output display device through a transmission cable.

[0022] In at least one embodiment of the present application, the force sensor is connected to the sensor output display device through wireless communication.

[0023] The utility model has at least the following beneficial technical effects:

[0024] The piezoelectric sensor bonding process clamp provided by the present application firstly solves the problem of performance difference of sensors caused by manual installation of sensors, and lays a foundation for standardization of piezoelectric sensor bonding process. Secondly, the size of the clamp can be changed through personalized design to meet the pasting of piezoelectric sensors in different installation environments, and the utility is strong. Moreover, the use of a plurality of clamps can avoid manual redundancy, improve the utilization rate of human resources, and improve work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic diagram of a piezoelectric sensor bonding process clamp according to an embodiment of the present application.

[0026] Wherein:

[0027] 1 - force applying handle; 2 - fixed support; 3 - telescopic support frame; 4 - fixed suction cup; 5 - force sensor; 6 - piezoelectric sensor bonding head; 7 - transmission cable; 8 - sensor output display device; 9 - force applying rod. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the embodiments of the present application will be described in more detail below in combination with the drawings of the embodiments of the present application. In the drawings, the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The described embodiments are part of the embodiments of the present application, not all embodiments. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. The embodiments of the present application will be described in detail below in combination with the drawings.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application.

[0030] The embodiments of the present application will be described in detail below in combination with the drawings.Figure 1 This application will be described in further detail.

[0031] This application provides a fixture for bonding piezoelectric sensors, such as... Figure 1 As shown, it includes: a force-applying handle 1, a fixed bracket 2, a telescopic support frame 3, a fixed suction cup 4, a force sensor 5, a piezoelectric sensor adhesive connector 6, a transmission cable 7, a sensor output display device 8, and a force-applying rod 9.

[0032] like Figure 1 As shown, a force-applying rod mounting part is provided on the fixed bracket 2; one end of the telescopic support frame 3 is connected to the fixed bracket 2, and the other end is connected to the structural component of the piezoelectric sensor to be bonded through the fixed suction cup 4; the force-applying rod 9 is installed on the force-applying rod mounting part, one end of the force-applying rod 9 is equipped with a force-applying handle 1, and the other end is equipped with a force sensor 5; the piezoelectric sensor adhesive joint 6 is installed on the force sensor 5, and the piezoelectric sensor is bonded inside the piezoelectric sensor adhesive joint 6; the sensor output display device 8 is used to display and record the measurement data of the force sensor 5.

[0033] In a preferred embodiment of this application, the fixed bracket 2 is circular, the force-applying rod mounting part is located at the center of the fixed bracket 2, and the telescopic support frame 3 is located at the outer edge of the fixed bracket 2. Advantageously, in this embodiment, a level is installed on the fixed bracket 2, which is used to adjust the position of the telescopic support frame 3. Preferably, three telescopic support frames 3 are installed at equal intervals along the outer circumference of the fixed bracket 2 to form a triangular support structure.

[0034] In one embodiment of this application, a guide rail is mounted on the force-applying rod mounting part, and a guide groove is provided on the force-applying rod 9. The force-applying rod 9 is mounted in the guide rail of the force-applying rod mounting part through the guide groove. The movement direction of the force-applying rod 9 can be limited by the cooperation between the guide groove and the guide rail. A positioning part is provided on the fixed bracket 2 near the force-applying rod mounting part. The positioning part is provided with a positioning hole communicating with the guide groove. After the bolt passes through the positioning hole, it is connected to the force-applying rod 9, which can realize the positioning of the force-applying rod 9. The force-applying handle 1 uses a direct pressing method to bond the piezoelectric sensor through the force-applying rod 9. When the applied pressing force reaches the expected value, the bolt passes through the positioning hole to tighten the force-applying rod 9, thereby positioning the force-applying rod 9 and keeping the pressing force constant during the adhesive curing process.

[0035] In another embodiment of the present application, a threaded hole is formed in the force applying rod mounting portion, a threaded segment is provided on the force applying rod 9, the force applying rod 9 is mounted in the threaded hole of the force applying rod mounting portion through the threaded segment, and the movement direction of the force applying rod 9 can be limited through the threaded cooperation. The force applying handle 1 is used to bond the piezoelectric sensor through the force applying rod 9 in a rotating manner, and when the applied pressing force reaches the expectation, the force applying rod 9 is positioned through the threaded cooperation, so that the pressing force is kept unchanged during the curing of the adhesive.

[0036] In the preferred embodiment of the present application, the force sensor 5 can be connected with the sensor output display device 8 through the transmission cable 7 or wireless communication.

[0037] The piezoelectric sensor bonding process jig of the present application can press the piezoelectric sensor bonding head 6 on the structural member in a direct pressing or rotating manner through the force applying handle 1; the force applying rod 9 and the telescopic support frame 3 are connected together through a mechanical structure by the fixed support 2, so that the force applying rod 9 can move up and down, the position of the telescopic support frame 3 can be adjusted by placing or installing a level on the surface of the fixed support 2, and the length of the telescopic support frame 3 can be designed and adjusted according to the size of the structural member; the front end of the force applying rod 9 is connected with the force sensor 5 for testing the size of the force applied on the piezoelectric sensor, so as to adjust the pressing degree; the output of the force sensor 5 can be observed and recorded on the sensor output display device 8 through the transmission cable 7, the form of the sensor output display device 8 can be designed according to the application scene, and the transmission cable 7 can be omitted in the case of wireless communication of the sensor; the piezoelectric sensor bonding head 6 needs to bond the piezoelectric sensor in the inside of the piezoelectric sensor bonding head 6 in advance when installing the piezoelectric sensor, and the piezoelectric sensor bonding head 6 can remain on the surface of the structure for the protection of the piezoelectric sensor after the installation is completed, and can also be recycled; the fixed suction cup 4 is mainly used to fix the telescopic support frame 3 on the structural member, and the fixed suction cup 4 and the telescopic support frame 3 should be stable and not move during the piezoelectric sensor bonding process.

[0038] The piezoelectric sensor bonding process jig of the present application fixes the force applying handle 1 and the force applying rod 9 through the combination of the three telescopic support frames 3 and the fixed suction cup 4, so as to improve the stability of the structure; the size of the pressing force during the piezoelectric sensor bonding process can be accurately controlled through the installation of the force sensor 5 output display; the reusable piezoelectric sensor bonding head 6 is adopted to realize the interaction between the piezoelectric sensor and the force applying jig, and to ensure the transmission of the pressing force.

[0039] The piezoelectric sensor bonding process jig of the present application mainly adopts a mechanical connection mode to accurately control the size of the pressing force during the piezoelectric sensor bonding process, and the working principle is as follows:

[0040] (1) Before the piezoelectric sensor is bonded, the front surface of the piezoelectric sensor is first installed in the piezoelectric sensor bonding head 6, and the back surface of the piezoelectric sensor is coated with an adhesive, so that the inner surface of the reusable piezoelectric sensor bonding head 6 is not bonded with the adhesive of the sensor;

[0041] (2) The fixed suction disc 4 is fixed on the surface of the structural member, and the height of the telescopic support frame 3 is adjusted by observing the display of the level;

[0042] (3) The piezoelectric sensor is bonded by the force applying handle 1, and when the output value of the force sensor 5 reaches the expected pressing force, the force applying handle 1 is fixed, the size of the force is kept unchanged, and after the adhesive is cured (the curing time varies according to different adhesives), the clamp is removed.

[0043] The piezoelectric sensor bonding process jig of the present application can accurately control the size of the force pressed on the piezoelectric sensor through the force sensor 5, eliminate the differences caused by different manual pressing forces in the manual bonding process, and realize the standardization of the piezoelectric sensor bonding process through the design of the jig. The jig is flexible and can be designed according to different test scenarios, such as the size of the jig, the shape of the force applying handle, the force applying method and the sensor signal transmission method. The stability of the triangular support is more firm, which can improve the sensor bonding performance. When a large number of sensors need to be arranged, the number of jigs can be increased to avoid manual redundancy, improve the utilization rate of human resources and improve work efficiency.

[0044] The piezoelectric sensor bonding process jig of the present application can realize the standardization and uniformity of the installation process, eliminate the differences introduced by manual bonding, improve the sensor bonding performance, and lay a foundation for obtaining high-quality signals.

[0045] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed in the present application can be easily thought of by those skilled in the art, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A jig for a piezoelectric sensor bonding process, characterized by, The utility model relates to a kind of piezoelectric sensor bonding process clamp, including: Fixed support (2), force rod mounting portion is provided on the fixed support (2); Telescopic support frame (3), one end of the telescopic support frame (3) is connected with the fixed support (2), and the other end is connected with the structure to be bonded piezoelectric sensor through fixed suction disc (4); Force rod (9), the force rod (9) is installed on the force rod mounting portion, one end of the force rod (9) is installed with force handle (1), and the other end is installed with force sensor (5); Piezoelectric sensor bonding head (6), the piezoelectric sensor bonding head (6) is installed on the force sensor (5), and piezoelectric sensor is bonded in the piezoelectric sensor bonding head (6) inside; Sensor output display device (8), the sensor output display device (8) is used to display and record the measured data of the force sensor (5).

2. The piezoelectric sensor bonding process jig according to claim 1, characterized by The fixed support (2) is circular, the force rod mounting portion is located at the center position of the fixed support (2), and the telescopic support frame (3) is located at the outer edge of the fixed support (2).

3. The piezoelectric sensor bonding process fixture of claim 2, wherein A level is installed on the fixed support (2), and the level is used to adjust the position of the telescopic support frame (3).

4. The piezoelectric sensor bonding process fixture of claim 3, wherein Three telescopic support frames (3) are installed along the outer edge of the fixed support (2) at equal intervals.

5. The piezoelectric sensor bonding process clamp according to claim 4, wherein: A guide rail is installed on the force rod mounting portion, a guide groove is provided on the force rod (9), and the force rod (9) is installed in the guide rail of the force rod mounting portion through the guide groove. A positioning portion is provided on the fixed support (2) near the force rod mounting portion, a positioning hole is provided on the positioning portion and communicates with the guide groove, and the force rod (9) is connected through a bolt passing through the positioning hole, so that the positioning of the force rod (9) can be realized.

6. The piezoelectric sensor bonding process fixture of claim 4, wherein A threaded hole is formed in the force rod mounting portion, and a threaded section is provided on the force rod (9), so that the force rod (9) is installed in the threaded hole of the force rod mounting portion through the threaded section.

7. The piezoelectric sensor bonding process fixture of claim 1, wherein The force sensor (5) is connected with the sensor output display device (8) through a transmission cable (7).

8. The piezoelectric sensor bonding process fixture of claim 1, wherein, The force sensor (5) is connected with the sensor output display device (8) through wireless communication.

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