Semiconductor high-speed testing machine

Abstract

The utility model relates to the technical field of semiconductor rotary joint detection, in particular to a semiconductor high-speed testing machine. Comprising a bottom plate, two vertical rods are symmetrically and fixedly connected to the edge of the upper surface of the bottom plate, a mounting plate is fixedly connected to the position, close to the top end, between the two vertical rods, a main shaft is rotationally arranged on one side of the mounting plate, and a driving mechanism used for driving the main shaft to rotate is arranged on the mounting plate. According to the shell clamping device, after the rotating shaft is fixed to the connecting flange, the shell is located between the two clamping rods, then the displacement mechanism drives the two clamping rods to be close to each other, and the two clamping rods can clamp and fix the shell through the two rubber pads; a gap exceeding a design value is prevented from being generated between the shell and the rotating shaft due to large-amplitude vibration of the shell, leakage exceeding the design value cannot be generated when fluid substances are introduced into and conducted by each fluid channel, and the accuracy of a sealing performance detection result of the high-rotating-speed semiconductor rotating joint is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor rotary joint detection technical field, concretely relates to a semiconductor high speed testing machine. BACKGROUND

[0002] Semiconductor rotary joint belongs to indispensable grinding equipment in chip production process and important functional components in chip exposure, developing and other process equipment, and the semiconductor rotary joint needs to detect whether its performance reaches the design use standard after production, especially the wafer ion implantation and planarization and other equipment needing low-speed stable transmission medium and vacuum, the medium transmission stability, low flow pressure fluctuation performance requirement is very high, so a kind of semiconductor rotary joint performance detection testing machine is needed, simulates the actual working condition of equipment, to detect whether product can reach use requirement.

[0003] In the production process of silicon-based chip, with the improvement of chip manufacturing process, the speed of various functional shafts of equipment also has greatly improved demand, and high-speed semiconductor joint and low-speed product are not the same in product structure and performance requirement, the internal structure of high-speed semiconductor rotary joint is different, shell fixed, shaft floating mode is adopted to design, so a new fixed mode high-speed test equipment is needed when testing performance.

[0004] A kind of high-speed semiconductor joint is composed of shell 41 and rotating shaft 42 rotatingly arranged in the inside of shell 41, the semiconductor testing machine in prior art is difficult to rigidly fix shell 41, when rotating shaft 42 rotates at high speed relative to shell 41, shell 41 will have uncontrollable large vibration, causing the gap between shell 41 and rotating shaft 42 to exceed the design value, at this time, fluid substance in the fluid passage in semiconductor rotary joint can leak through the gap, however, shell 41 is in the state of rigid fixation when semiconductor rotary joint is actually used, therefore, the sealing detection of high-speed semiconductor rotary joint also needs to be carried out when shell 41 is in the state of rigid fixation, the semiconductor testing machine in prior art is easy to cause fluid substance leakage due to the large vibration of shell 41 when carrying out the sealing detection of high-speed semiconductor rotary joint, and this leakage condition will not occur when high-speed semiconductor rotary joint is actually used, so as to affect the accuracy of high-speed semiconductor rotary joint sealing detection result. SUMMARY

[0005] The utility model discloses a semiconductor high speed testing machine to solve the problems in the above background.

[0006] To achieve the above object, the utility model provides a semiconductor high speed testing machine, including the bottom plate, the edge of bottom plate upper surface is fixedly connected with two vertical rods, two vertical rods between the position close to the top is fixedly connected with the mounting plate, the side of mounting plate is rotatably provided with the main shaft, and is provided with the drive mechanism for driving the main shaft rotation on the mounting plate, both ends of main shaft are fixedly connected with the connecting flange, the rotating shaft is fixedly installed on one of connecting flanes, the side of mounting plate away from main shaft is provided with two clamping rods, and the clamping rod is C type, two clamping rods are symmetrically set up two arc grooves on the side of mutual approach, the inner arc surface of arc groove is fixedly connected with rubber pad, and the displacement mechanism is set up on the mounting plate, the displacement mechanism is used for driving two clamping rods to move relatively, when the displacement mechanism drives two clamping rods to approach each other, two rubber pads respectively extrude and contact the side wall of shell.

[0007] As a further improvement of the technical solution, the displacement mechanism comprises a transmission shaft rotatably arranged on the side of the mounting plate away from the main shaft, a disc coaxially fixedly connected to the transmission shaft, two connecting rods hingedly connected to the circumferential side of the disc, the two connecting rods being symmetrically arranged with the disc axis as the center, the other ends of the two connecting rods being hingedly connected to the sides of the two clamping rods approaching each other, and the connecting rods being obliquely arranged.

[0008] As a further improvement of the technical solution, the displacement mechanism further comprises a worm gear coaxially fixedly connected to the transmission shaft, a worm rotatably arranged on the side of the mounting plate away from the main shaft, an adjusting rod rotatably arranged on the mounting plate, a bevel gear coaxially fixedly connected to one end of the adjusting rod and one end of the worm, and the two bevel gears being meshed with each other.

[0009] As a further improvement of the technical solution, the drive mechanism comprises a servo motor fixedly installed on the side of the mounting plate away from the main shaft, a transmission wheel coaxially fixedly connected to the output shaft of the servo motor and the main shaft, and the same transmission belt drivingly connected to the two transmission wheels.

[0010] As a further improvement of the technical solution, the side of the mounting plate away from the main shaft is symmetrically fixedly connected with two transversely arranged sliding rails, two T-shaped sliding blocks are symmetrically fixedly connected to the clamping rod, and one end of the two T-shaped sliding blocks is slidingly arranged in the two sliding rails, respectively.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] The high-speed semiconductor testing machine, after fixing the rotating shaft on the connecting flange, enables the two clamping rods to clamp and fix the shell through the two rubber pads by locating the shell between the two clamping rods, avoids the gap between the shell and the rotating shaft from exceeding the design value due to the large vibration of the shell, ensures that each fluid channel will not leak more than the design value when the fluid material is input and conducted, and improves the accuracy of the sealing detection result of the high-speed semiconductor rotary joint. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a whole structure schematic view of the utility model;

[0014] Figure 2 It is a structure schematic view of the mounting plate of the utility model;

[0015] Figure 3 It is a structure schematic view of the main shaft and the semiconductor rotary joint combination of the utility model;

[0016] Figure 4 It is a sectional view of the main shaft and the semiconductor rotary joint combination of the utility model;

[0017] Figure 5 It is a structure schematic view of the displacement mechanism of the utility model one;

[0018] Figure 6 It is a structure schematic view of the displacement mechanism of the utility model two;

[0019] Figure 7 It is a structure schematic view of the semiconductor rotary joint of the utility model;

[0020] Figure 8 It is an explosion view of the semiconductor rotary joint of the utility model.

[0021] The meaning of each mark in the figure is:

[0022] 1, bottom plate; 11, vertical rod;

[0023] 2, mounting plate; 21, slide rail;

[0024] 3, main shaft; 31, connecting flange;

[0025] 41, shell; 42, rotating shaft;

[0026] 5, driving mechanism; 51, servo motor; 52, transmission wheel; 53, transmission belt;

[0027] 6, clamping rod; 61, T-shaped sliding block; 62, rubber pad;

[0028] 7, displacement mechanism; 71, transmission shaft; 72, disc; 73, connecting rod; 74, worm gear; 75, worm; 76, bevel gear; 77, adjusting rod. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. EMBODIMENT

[0030] Please refer to Figures 1-6The purpose of the embodiment is to provide a semiconductor high-speed tester. The tester comprises a base plate 1, two vertical rods 11 symmetrically fixed on the edge of the upper surface of the base plate 1, an installation plate 2 fixed on the vertical rods 11 near the top end, a main shaft 3 rotatably arranged on one side of the installation plate 2, a limiting buckle arranged on the main shaft 3 to limit the position of the main shaft 3 on the installation plate 2, so that the main shaft 3 cannot move up and down on one side of the installation plate 2, thereby improving the stability of the rotation of the main shaft 3, a driving mechanism 5 arranged on the installation plate 2 to drive the rotation of the main shaft 3, two connecting flanges 31 fixed on the two ends of the main shaft 3, a rotating shaft 42 fixed on one of the connecting flanges 31 by screws, a plurality of fluid channels arranged in the rotating shaft 42 and the shell 41, the fluid channels of the rotating shaft 42 and the shell 41 corresponding to each other, two clamping rods 6 arranged on the side of the installation plate 2 away from the main shaft 3, the clamping rods 6 being C-shaped, the two ends of the clamping rods 6 extending to the other side of the installation plate 2, two transversely arranged slide rails 21 symmetrically fixed on the side of the installation plate 2 away from the main shaft 3, two T-shaped sliding blocks 61 symmetrically fixed on the clamping rods 6, one end of the two T-shaped sliding blocks 61 slidingly arranged in the two slide rails 21, the T-shaped sliding blocks 61 and the slide rails 21 cooperating with each other to limit the clamping rods 6 to move only along the axis of the slide rails 21 in the transverse direction, thereby limiting the movement track of the two clamping rods 6, and two arc-shaped grooves symmetrically arranged on the side of each clamping rod 6 away from the other clamping rod 6, the arc-shaped grooves corresponding to the outer side wall of the shell 41 in size, rubber pads 62 fixed on the inner arc surface of the arc-shaped grooves, a displacement mechanism 7 arranged on the installation plate 2 to drive the relative movement of the two clamping rods 6, when the displacement mechanism 7 drives the two clamping rods 6 to move close to each other, the two rubber pads 62 respectively extrude and contact the side wall of the shell 41, the two clamping rods 6 clamp and fix the shell 41 through the two rubber pads 62, at this time, the shell 41 is limited from rotating by the friction force with the rubber pads 62, so that the position of the shell 41 is fixed, at this time, the driving mechanism 5 is controlled to drive the main shaft 3 to rotate at high speed, the main shaft 3 drives the rotating shaft 42 to rotate synchronously through the connecting flanges 31, the rotating shaft 42 rotates at high speed relative to the shell 41 due to the limitation of the shell 41 from rotating by the two clamping rods 6, thereby simulating the working state of the shell 41 and the rotating shaft 42, after the outer side wall of the shell 41 is connected with the fluid channel, a plurality of hoses are used to respectively transport fluid substances such as water, oil and air into the plurality of fluid channels, the fluid substances are discharged through the fluid channels in the rotating shaft 42, thereby detecting the reliability of the semiconductor rotary joint when various liquids, vacuum and dry air and other fluids required in chip production pass through at the same time, detecting the fluid leakage, rotation stability, noise and rotation torque and other comprehensive tests of various fluids at a set rotating speed, and detecting the performance of the shell 41 required by the chip production equipment.

[0031] When testing the semiconductor rotary joint, depending on whether the rotating shaft 42 is installed downwards or upwards, the semiconductor rotary joint is selectively installed above or below the main shaft 3. This more realistically simulates the working state of the semiconductor rotary joint, allowing for targeted testing of semiconductor rotary joints with different installation methods, thus improving the accuracy of the test results. Simultaneously, the main shaft 3 is hollow, and only one semiconductor rotary joint is installed on the main shaft 3 during the testing process. When the semiconductor rotary joint is installed above the main shaft 3, the fluid flowing from the rotating shaft 42 flows downwards along the inner wall of the main shaft 3. When the semiconductor rotary joint is installed below the main shaft 3, the fluid flowing from the rotating shaft 42 fills the internal space of the main shaft 3 before flowing out from the upper end of the main shaft 3. This ensures smooth flow of the fluid and guarantees the normal operation of the semiconductor rotary joint testing.

[0032] To drive the main shaft 3 to rotate, the structure of the drive mechanism 5 is detailed below, referring to... Figure 2 The drive mechanism 5 includes a servo motor 51 fixedly mounted on the mounting plate 2 away from the main shaft 3. Both the output shaft of the servo motor 51 and the main shaft 3 are coaxially fixedly connected to a transmission wheel 52. The two transmission wheels 52 are connected to the same transmission belt 53. The servo motor 51 is electrically connected to an external electrical control box. The start, stop, speed, and forward / reverse adjustment of the output shaft of the servo motor 51 are all controlled by the electrical control box. After the servo motor 51 starts, its output shaft drives one of the transmission wheels 52 to rotate. This transmission wheel 52 drives the other transmission wheel 52 and the main shaft 3 to rotate through the transmission belt 53. The main shaft 3 drives the rotating shaft 42 to rotate relative to the housing 41, thereby simulating the working state of the semiconductor rotary joint and testing the performance of the semiconductor rotary joint under working state.

[0033] To ensure that the two clamping rods 6 clamp and fix the housing 41 when the main shaft 3 drives the rotating shaft 42 to rotate, thereby restricting the rotation of the housing 41, the structure of the displacement mechanism 7 is detailed below, referring to... Figure 5 and Figure 6The displacement mechanism 7 comprises a transmission shaft 71 rotatably arranged on the side of the mounting plate 2 away from the main shaft 3, a disc 72 coaxially fixedly connected on the transmission shaft 71, two connecting rods 73 hingedly connected on the circumferential side of the disc 72, the two connecting rods 73 being symmetrically arranged with the axis of the disc 72 as the center, the other ends of the two connecting rods 73 being respectively hingedly connected to the sides of the two clamping rods 6 close to each other, and the connecting rods 73 being obliquely arranged, the displacement mechanism 7 further comprises a worm gear 74 coaxially fixedly connected on the transmission shaft 71, a worm shaft 75 meshingly connected on the lower side of the worm gear 74, the worm shaft 75 being rotatably arranged on the side of the mounting plate 2 away from the main shaft 3, an adjusting rod 77 rotatably arranged on the mounting plate 2, a bevel gear 76 coaxially fixedly connected on one end of the adjusting rod 77 and one end of the worm shaft 75, the two bevel gears 76 being meshed with each other, a knob fixedly connected on the end of the adjusting rod 77 away from the bevel gear 76, when a worker holds the knob and twists the adjusting rod 77 and one of the bevel gears 76, the other bevel gear 76 drives the worm shaft 75 to rotate through the meshing transmission of the two bevel gears 76, the worm gear 74 drives the transmission shaft 71 and the disc 72 to rotate through the meshing transmission of the worm shaft 75 and the worm gear 74, the disc 72 drives one end of the two connecting rods 73 to rotate, at this time, the two connecting rods 73 pull the two clamping rods 6, so that the two clamping rods 6 are close to each other along the axis direction of the slide rail 21, and the two clamping rods 6 close to each other drive the two rubber pads 62 to clamp and fix the shell 41, so as to simulate the working state of the semiconductor rotary joint of the shell 41.

[0034] When the two clamping rods 6 clamp and fix the shell 41 through the two rubber pads 62, the two clamping rods 6 limit the horizontal and vertical movement of the shell 41, when the rotating shaft 42 rotates at high speed and generates vibration, the two clamping rods 6 clamping the shell 41 buffer the vibration on the shell 41, reduce the vibration amplitude of the shell 41, so as to avoid that the gap between the shell 41 and the rotating shaft 42 exceeds the design value due to the large amplitude vibration of the shell 41, ensure that each fluid channel does not leak more than the design value when the fluid material is input and conducted, and improve the accuracy of the test result.

[0035] The device is used for detecting the semiconductor rotary joint, the rotating shaft 42 is fixedly installed on the upper or lower connecting flange 31 according to the installation mode of the rotating shaft 42, then the worker holds the knob to twist the adjusting rod 77 and one of the bevel gears 76, the two clamping rods 6 are clamped and fixed to the shell 41 through the two rubber pads 62, the rotation of the shell 41 is limited through the friction force between the rubber pad 62 and the shell 41, then the hose is connected to the position of the side wall of the shell 41 communicated with the fluid channel, the fluid materials such as water, oil and air are respectively delivered to the inside of the plurality of fluid channels through the plurality of hoses, the fluid materials flow along the inner wall of the main shaft 3 and are discharged from the end of the main shaft 3 away from the rotating shaft 42, then the servo motor 51 is started, the main shaft 3 drives the rotating shaft 42 to rotate relative to the shell 41, so as to simulate the working state of the semiconductor rotary joint, and the performance of the semiconductor rotary joint in the working state is detected.

[0036] The basic principle, main features and advantages of the utility model are shown and described above. It should be understood by the person skilled in the art that the utility model is not limited by the above-mentioned embodiments, the above-mentioned embodiments and the description in the specification are only preferred examples of the utility model, and are not used to limit the utility model, various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A high speed semiconductor tester comprising a backplane (1) characterised in that: The bottom plate (1) upper surface edge is fixedly connected with two vertical rods (11) symmetrically, two vertical rods (11) are fixedly connected with mounting plate (2) near the top end, one side of mounting plate (2) is rotatably provided with main shaft (3), and the drive mechanism (5) for driving main shaft (3) to rotate is arranged on mounting plate (2), both ends of main shaft (3) are fixedly connected with connecting flange (31), rotating shaft (42) is fixedly installed on one of connecting flange (31) through screws, one side of mounting plate (2) away from main shaft (3) is provided with two clamping rods (6), the clamping rod (6) is C-shaped, two clamping rods (6) are symmetrically provided with two arc grooves on the side close to each other, the inner arc surface of the arc groove is fixedly connected with rubber pad (62), the displacement mechanism (7) is arranged on the mounting plate (2), the displacement mechanism (7) is used for driving two clamping rods (6) to move relatively, when the displacement mechanism (7) drives two clamping rods (6) to move close to each other, two rubber pads (62) respectively extrude and contact the side wall of the shell (41).

2. The semiconductor high-speed tester of claim 1, wherein: The displacement mechanism (7) comprises a transmission shaft (71) rotatably arranged on the side of the mounting plate (2) away from the main shaft (3), a disc (72) is fixedly connected with the transmission shaft (71) coaxially, two connecting rods (73) are hingedly connected to the circumferential side of the disc (72), the two connecting rods (73) are symmetrically arranged with the axis of the disc (72) as the center, the other ends of the two connecting rods (73) are hingedly connected to the sides close to each other of the two clamping rods (6), and the connecting rods (73) are inclined.

3. The semiconductor high-speed tester of claim 2, wherein: The displacement mechanism (7) further comprises a worm wheel (74) fixedly connected with the transmission shaft (71) coaxially, a worm (75) is engagedly connected to the lower side of the worm wheel (74), the worm (75) is rotatably arranged on the side of the mounting plate (2) away from the main shaft (3), an adjusting rod (77) is rotatably arranged on the mounting plate (2), a bevel gear (76) is fixedly connected with one end of the worm (75) and one end of the adjusting rod (77) coaxially, and the two bevel gears (76) are engaged with each other.

4. The semiconductor high-speed tester of claim 1, wherein: The drive mechanism (5) comprises a servo motor (51) fixedly installed on the side of the mounting plate (2) away from the main shaft (3), a transmission wheel (52) is fixedly connected with the output shaft of the servo motor (51) and the main shaft (3) coaxially, and the same transmission belt (53) is drivingly connected with the two transmission wheels (52).

5. The semiconductor high-speed tester of claim 1, wherein: Two transversely arranged slide rails (21) are fixedly connected to the side of the mounting plate (2) away from the main shaft (3) symmetrically, two T-shaped sliding blocks (61) are fixedly connected to the clamping rod (6) symmetrically, and one end of the two T-shaped sliding blocks (61) is slidingly arranged in the two slide rails (21) respectively.

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