Test circuit board and positioning jig thereof

Abstract

The utility model relates to a test circuit board and a positioning tool thereof, comprising a circuit board which is provided with a positioning frame, a bonding pad and a placing area. The orthographic projection of the placement area is overlapped with the orthographic projection of the to-be-tested chip, the positioning frame is located at the outer edge of the placement area, and the bonding pad is located in the placement area; the positioning frame comprises at least two positioning side lines and is used for determining the bonding position of the chip to be tested. According to the utility model, the positioning frame is arranged on the circuit board, the placing area for placing the chip to be tested is arranged in the positioning frame, and the bonding pad is located in the placing area, so that the chip to be tested can be positioned instead of an IC fixing device, an operator can intuitively place the chip to be tested in a positioning side line of the positioning frame, and the chip to be tested can be accurately positioned. The accuracy of the to-be-tested chip at the welding position is ensured, the production cost is reduced, the method can be widely applied to actual production, and meanwhile the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to memory technical field more specifically, relate to a test circuit board and its positioning jig. BACKGROUND

[0002] At present, when testing the chip, the test circuit board usually uses the test seat to fix the chip and keep the stability of the chip during the test.

[0003] The prior art discloses a layered test radio frequency chip high-frequency performance test fixture, which specifically discloses a supporting mechanism, a test seat mechanism, a cover mechanism and a test mechanism, and tests the chip through the test seat mechanism, the cover mechanism and the test mechanism. Although this kind of test seat can effectively fix the chip, it is less applied in actual production due to high cost, and the fixing device is also inconvenient to disassemble from the test circuit board. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model is that the prior art uses the IC fixing device to fix the chip when testing the IC, which has high cost and is difficult to be widely applied in actual production, and is inconvenient to disassemble from the circuit. In view of the above defects of the prior art, a test circuit board and a positioning jig thereof are provided.

[0005] The utility model solves the technical problems by adopting the following technical scheme:

[0006] A test circuit board is constructed, which comprises a circuit board, a positioning frame, a solder pad and a placement area are arranged on the circuit board, the orthographic projection of the placement area overlaps the orthographic projection of the chip to be tested, the positioning frame is located at the outer edge of the placement area, and the solder pad is located in the placement area; the positioning frame comprises at least two positioning lines and is used for determining the bonding position of the chip to be tested.

[0007] Further, the positioning frame is an ink layer.

[0008] Further, the positioning frame is a protruding part.

[0009] Further, an opening part is arranged between the protruding part and the circuit board.

[0010] A positioning jig of a test circuit board is constructed, which comprises a body and a plurality of fixing parts, a plurality of fixing parts are arranged on the first surface of the body, and the plurality of fixing parts are used for penetrating a plurality of through holes reserved in the circuit board; the side of the body facing the chip to be tested is used for positioning the limiting frame.

[0011] Further, the side of the body facing the chip to be tested is a drawing part.

[0012] Further, the body comprises a first body and a second body, the first body and the second body are detachably connected.

[0013] Further, the drawing part is in L shape.

[0014] Further, the first body is provided with at least one slot, the second body is provided with at least one insertion piece, and at least one slot and at least one insertion piece are correspondingly arranged.

[0015] Further, when the insertion piece is located in the slot respectively, the drawing part is in rectangular shape.

[0016] The utility model discloses a beneficial effect lies in: through setting the positioning frame on the circuit board, and being provided with the placement area for placing the chip to be measured in the positioning frame, and the pad is in the mode of being located in the placement area, can replace IC fixed device and position the chip to be measured, makes operator can visually place the chip to be measured in the positioning frame's positioning boundary line, ensures the accuracy of the chip to be measured in the welding position, reduces production cost, can be widely applied to practical production, improves production efficiency simultaneously.

[0017] The utility model discloses a positioning jig is set up on the circuit board, can draw the limit frame, the fixed part of positioning jig is installed with the through -hole reserved on the circuit board cooperation, can draw after the limit frame fades, compared with laser engraving and mechanical engraving, will not form the recess on the circuit board surface, avoid the problem of poor welding due to the accumulation of solder and impurities. ACCURATE DESCRIPTION

[0018] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the utility model will be further described below in conjunction with the drawings and embodiments, the drawings in the following description are only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings:

[0019] Figure 1 It is a kind of overall structure diagram of test circuit board in an embodiment of the utility model;

[0020] Figure 2 It is the three-dimensional schematic diagram of positioning frame for convex part in an embodiment of the utility model;

[0021] Figure 3 It is the three-dimensional schematic diagram of positioning frame provided with convex in an embodiment of the utility model;

[0022] Figure 4 It is the three-dimensional schematic diagram of the positioning jig of a kind of test circuit board in an embodiment of the utility model;

[0023] Figure 5 is a top view schematic diagram of the body located on the circuit board in an embodiment of the utility model;

[0024] Figure 6 is a three-dimensional schematic diagram of the protruding part in another embodiment of the utility model;

[0025] Figure 7 is a three-dimensional schematic diagram of the first body in an embodiment of the utility model;

[0026] Figure 8 is a three-dimensional schematic diagram of the second body in an embodiment of the utility model;

[0027] Figure 9 is an assembly schematic diagram of the first body and the second body in an embodiment of the utility model.

[0028] Label explanation: circuit board 1, positioning frame 101, solder pad 102, placement area 103, protrusion 104, positioning edge line 105, protruding part 106, opening part 107, body 201, fixed part 202, through hole 203, limiting frame 204, drawing part 206, first body 207, second body 208, slot 209, insertion piece 210, first surface 211. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below, obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0030] The terms "first", "second", "third", "fourth" and the like in the specification and claims of the application and the above-mentioned drawings (if any) are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0031] The application is described in detail in combination with the schematic diagram. In the detailed description of the embodiments of the application, the sectional view of the device structure is partially enlarged without the general proportion for the convenience of illustration, and the schematic diagram is only an example which should not limit the scope of protection of the application herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0032] The test socket of the prior art can effectively fix the chip, but is less applied in actual production due to high cost and is inconvenient to disassemble from the circuit board.

[0033] Please refer to Figure 1 In an embodiment of the application, a test circuit board is provided, comprising a circuit board 1, the circuit board 1 is provided with a positioning frame 101, a solder pad 102 and a placement area 103, the orthographic projection of the placement area 103 overlaps the orthographic projection of the chip to be tested, the positioning frame 101 is located at the outer edge of the placement area 103, and the solder pad 102 is located in the placement area 103; the positioning frame 101 comprises at least two positioning lines 105 and is used to determine the bonding position of the chip to be tested.

[0034] In order to make the above-mentioned purposes, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application are described in detail below in combination with the drawings.

[0035] As shown in Figure 1 In an embodiment, a test circuit board is provided, comprising a circuit board 1, the circuit board 1 is provided with a positioning frame 101, a solder pad 102 and a placement area 103, the orthographic projection of the placement area 103 overlaps the orthographic projection of the chip to be tested, the positioning frame 101 is located at the outer edge of the placement area 103, and the solder pad 102 is located in the placement area 103; the positioning frame 101 comprises at least two positioning lines 105 and is used to determine the bonding position of the chip to be tested.

[0036] Specifically, as shown in Figure 1 The positioning frame 101 is provided on the circuit board 1 and located at the periphery of the solder pad 102. The positioning frame 101 can be a rectangular frame marked by silk printing or mechanically carved, which can assist the operator to position the chip. The area of the positioning frame 101 is larger than the area of the chip to be tested, so that the operator can intuitively place the chip within the positioning lines 105 of the positioning frame 101, ensuring the accuracy of the chip welding. In addition, the positioning frame 101 is also provided with a placement area 103, which is correspondingly provided with the chip, and further, the area of the placement area 103 is equal to the area of the chip.

[0037] More specifically, the positioning frame 101 can be made by manual drawing, mechanical carving or laser carving, which can be rectangular or L-shaped to position the chip. In a specific embodiment, the positioning frame 101 is a wire frame located on the circuit board 1.

[0038] The pad 102 is located in the placement area 103, and after the chip is placed in the placement area 103, the chip can be bonded on the circuit board 1 by welding at the pad 102.

[0039] In actual testing, the positioning frame 101 is designed around the pad 102 on the circuit board 1 in advance, and a gap (which can be 0.5-1 mm) is provided between the positioning edge line 105 of the positioning frame 101 and the chip, so as to ensure that the chip can be placed in the positioning frame 101 and correspond to the placement area 103, and then the positioning frame 101 is printed on the surface of the circuit board 1 by a silk printing process or is formed as a permanent mark on the copper foil layer of the circuit board 1 by laser engraving. Before welding, the chip is aligned with the position of the positioning frame 101, so as to ensure that the chip is accurately placed in the positioning edge line 105 and corresponds to the placement area 103. Then the chip is fixed by welding, and chip testing is performed. It can be applied to the chip verification test stage, without the need to purchase expensive IC fixing devices, so as to meet the testing of a large number of chips and save costs.

[0040] More specifically, the positioning frame 101 includes at least two positioning edge lines 105, and the two positioning edge lines 105 are vertically arranged on the circuit board 1 and form a right angle, so that the chip can be limited in the positioning edge line 105.

[0041] In an embodiment, the positioning frame 101 is an ink layer. In a specific implementation, the positioning frame 101 is prepared by an ink layer and can be drawn on the circuit board 1 by mechanical printing or manual drawing.

[0042] In an embodiment, the positioning frame 101 is a protruding part 106.

[0043] Specifically, as shown in Figure 2 When the size of the chip is small, the positioning and limiting requirements of the chip are high, and the manual positioning method is easy to cause the chip to deviate or the welding to be poor, which affects the testing efficiency. The protruding part 106 is protrudingly arranged on the circuit board 1, and compared with the planar positioning frame 101, the positioning frame 101 is a protruding structure and is easier to position and limit the chip, which can provide a double effect. In the chip testing process, the chip can be limited only by being placed in the protruding part 106. The protruding part 106 can be L-shaped or rectangular. When the protruding part 106 is L-shaped, it only needs to be aligned with one right angle of the chip and can be positioned. When the protruding part 106 is rectangular, the chip is placed in the protruding part 106 as a whole. Compared with the planar line frame, the protruding part 106 can prevent the chip from deviating or falling off, can physically constrain the chip on the basis of visual positioning, and is convenient for limiting the chip.

[0044] In a specific embodiment, as shown in Figure 6As shown, the protruding part 106 is provided with four, each with four corners, which can also constitute the positioning frame 101 and limit the chip. The chip to be tested is placed in the four corners, which can position the chip to be tested in the protruding part 106.

[0045] In an embodiment, the protruding part 106 and the circuit board 1 are provided with an opening part 107.

[0046] Specifically, as shown, Figure 3 When the protruding part 106 is L-shaped, the protruding part 106 and the circuit board 1 have an opening part 107, which can leave more space than the traditional four-edge frame limiting method, facilitating the operator to clean the excess solder during the welding process, while increasing the lateral limiting effect and flexibility of the chip. When the protruding part 106 is rectangular, the four corners of the rectangle can also be provided with an opening part 107, which facilitates the cleaning of the solder left by welding, avoiding affecting the test results of the chip.

[0047] When the limiting frame is used to position the IC for welding test, the ink layer drawn by hand and silk-screen marked will become blurred under the long-term high temperature of the welding gun, which can easily lead to the operator unable to position the IC according to the limiting frame 204. The engraved and laser-engraved methods can form a groove on the circuit board 1, which can easily damage the conductive layer of the circuit board 1, and can easily accumulate solder foreign matter in the groove, resulting in poor welding.

[0048] Please refer to Figure 4 An embodiment of the present application proposes a positioning jig for testing a circuit board, which comprises a body 201 and a plurality of fixing parts 202. The first surface of the body 201 is provided with a plurality of fixing parts 202, and the plurality of fixing parts 202 are used to penetrate a plurality of through holes 203 reserved in the circuit board 1. The side of the body 201 facing the chip to be tested is used to position the limiting frame 204.

[0049] Specifically, as shown, Figure 4 The positioning jig comprises a body 201, a fixing part 202, and a drawing part 206 on the side of the body 201 facing the chip to be tested. The first surface 211 is the lower surface of the body. The fixing part 202 is located on the lower surface of the body 201 and protrudes from the lower surface of the body 201. The present application provides a positioning jig which can be placed at the limiting frame 204 and align the frame line of the limiting frame 204 with the drawing part 206, and then draw. The positioning jig can quickly draw the limiting frame 204 after the limiting frame 204 fades, which can avoid forming a groove on the surface of the circuit board 1, avoiding the accumulation of solder and impurities, and the phenomenon of poor welding.

[0050] As shown, Figure 1As shown, the circuit board 1 of the present application is provided with at least two through holes 203, which can be the reserved hole positions of the IC fixing device. The two through holes 203 can be horizontally arranged or diagonally arranged. The fixing portion 202 corresponds to the through hole 203, and can realize the positioning and limiting of the positioning jig. By providing the fixing portion 202 and the through hole 203, the positioning jig can be accurately placed at a specific position of the circuit board 1, which facilitates the drawing of the limiting frame 204 and prevents the positioning jig from shifting during the drawing process.

[0051] In a specific embodiment, the fixing portion 202 provided on the body 201 is aligned with the through hole 203 provided on the circuit board 1, and then the fixing portion 202 is respectively fitted into the through hole 203. At this time, the positioning jig is fixed on the circuit board 1, ensuring the stability of the drawing process.

[0052] In an embodiment, the side of the body 201 facing the chip to be measured is the drawing portion 206.

[0053] Specifically, as shown, Figure 4 The side of the body 201 facing the chip to be measured is the drawing portion 206. After the body 201 is fixed on the circuit board 1, the limiting frame 204 is drawn at the drawing portion 206 of the body 201. When the body 201 is L-shaped, the drawing portion 206 is also L-shaped. After drawing on the drawing portion 206 by using a marker pen, paint or other high-temperature resistant coating materials, an L-shaped limiting frame 204 can be obtained. By changing the placement direction of the body 201, other frame lines of the limiting frame 204 can be drawn.

[0054] In an embodiment, the body 201 includes a first body 207 and a second body 208, and the first body 207 and the second body 208 are detachably connected.

[0055] Specifically, as shown, Figure 7 and Figure 8 Specifically, the body 201 can be divided into two parts, i.e. the first body 207 and the second body 208. When only the first body 207 is provided, an L-shaped positioning frame 101 can be drawn. When the first body 207 and the second body 208 are provided, a rectangular limiting frame 204 can be drawn, and the drawing requirement can be selected according to the drawing requirement. The limiting frame 204 has only one frame line (i.e. two positioning edges 105), which is prone to error during positioning. Therefore, only the first body 207 and the second body 208 are used for drawing, and four positioning edges 105 are drawn to improve the positioning accuracy. In another embodiment, the first body 207 and the second body 208 are arranged in different directions, and the positioning edges 105 can be flexibly drawn according to the requirement.

[0056] In an embodiment, the drawing portion 206 is L-shaped.

[0057] like Figure 5 As shown, specifically, the drawing section 206 provided in the first body 207 and the second body 208 is L-shaped and can draw the two positioning edges 105 of the limiting frame 204.

[0058] In one embodiment, the first body 207 is provided with at least one slot 209, the second body 208 is provided with at least one mating member 210, and the at least one slot 209 is correspondingly provided with the at least one mating member 210.

[0059] like Figure 7 As shown, specifically, the first body 207 is L-shaped and has slots 209 on the left and lower sides, or at least on one side. The slots 209 can be square or circular. Figure 8 As shown, the second body 208 is also L-shaped, and has a fitting 210 on the right and lower sides or at least one side, and the fitting 210 corresponds to the slot 209. The shape of the fitting 210 corresponds to the shape of the slot 209, and the fitting 210 can be inserted into the slot 209.

[0060] In one embodiment, when the fitting 210 is located in the slot 209, the drawing portion 206 is rectangular.

[0061] like Figure 9 As shown, specifically, when it is necessary to draw a rectangular limit frame 204, the first body 207 and the second body 208 are assembled, that is, the insertion part 210 provided on the second body 208 is inserted into the slot 209 provided on the first body 207. At this time, a rectangular drawing part 206 is formed between the first body 207 and the second body 208, and finally the limit frame 204 can be drawn using a marker pen.

[0062] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the structural embodiments, so they are described more simply; relevant parts can be referred to the descriptions of the structural embodiments.

[0063] The above describes the specific implementation of this application. It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A test circuit board, characterized by, The circuit board is provided with a positioning frame, a solder pad and a placement area, the projection of the placement area overlaps the projection of the chip to be tested, the positioning frame is located at the outer edge of the placement area, and the solder pad is located in the placement area. The positioning frame includes at least two positioning lines and is used for determining the bonding position of the chip to be tested.

2. The test circuit board of claim 1, wherein, The positioning frame is an ink layer.

3. The test circuit board of claim 1, wherein, The positioning frame is a protruding part.

4. The test circuit board of claim 3, wherein, An opening part is arranged between the protruding part and the circuit board.

5. A positioning jig for testing a circuit board, characterized by comprising: The body includes a plurality of fixing parts, the first surface of the body is respectively provided with a plurality of fixing parts, and the plurality of fixing parts are used for penetrating a plurality of through holes reserved in the circuit board. The side of the body facing the chip to be tested is used for positioning the limiting frame.

6. The test board positioning jig according to claim 5, wherein The side of the body facing the chip to be tested is a drawing part.

7. The test board positioning jig according to claim 6, wherein The body includes a first body and a second body, and the first body and the second body are detachably connected.

8. The test board positioning jig according to claim 6, wherein The drawing part is L-shaped.

9. The test board positioning jig according to claim 7, wherein The first body is provided with at least one slot, the second body is provided with at least one insertion part, and at least one slot and at least one insertion part are correspondingly arranged.

10. The test board positioning jig according to claim 9, wherein When the insertion part is located in the slot, the drawing part is rectangular.

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