Lateral transparent computer case
By setting raised mounting points and airflow guide shields on the front of the motherboard bracket, combined with the fan bracket to form an airflow channel, the problem of insufficient heat dissipation on the back of the motherboard is solved, and the stability of hardware operation is improved.
Patent Information
- Application Number
- CN202520216555.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2035-02-11
AI Technical Summary
In existing side-panel case designs, insufficient heat dissipation at the back of the motherboard affects hardware stability.
By setting raised motherboard mounting points on the front of the motherboard bracket, and combining them with a flow guide shield and fan bracket, an effective airflow channel is formed, improving the heat dissipation effect on the back of the motherboard.
It effectively improves the heat dissipation of the back of the motherboard, avoids heat buildup, and enhances the stability of hardware operation.
Smart Images

Figure CN223637953U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to computer equipment technical field, concretely relates to a side -through computer case. BACKGROUND
[0002] The side -through computer case is also called side -through case, and the side thereof is equipped with transparent glass or plastic plate, so that the user can clearly see the operation and light effect of internal hardware, and the aesthetic sense is perfect.
[0003] The internal part of the existing side -through case is usually divided into visible space and hidden space based on the mainboard support, and the hardware such as mainboard, independent display and fan is installed in the visible space, and the hardware such as hard disk and power supply is installed in the hidden space, which not only can improve the aesthetic sense in the visible space, but also realizes the partition heat dissipation of core hardware.
[0004] However, it is worth noting that in the existing side -through case design, the user and the designer generally focus on the heat dissipation management of the front of the mainboard, but ignore the heat dissipation demand of the back of the mainboard, so that heat accumulation is prone to occur at the back of the mainboard, and the working stability of the hardware is affected. INVENTION CONTENTS
[0005] The utility model discloses a kind of side -through computer cases, by setting up the mainboard installation point of protruding and setting flow guide screen board, can effectively improve the heat dissipation effect of the back of mainboard, avoid heat accumulation at the back of mainboard, it is favorable to improve the working stability of hardware.
[0006] The utility model discloses a kind of side -through computer cases, including case shell, the case shell has visible space and hidden space in, the visible space and the hidden space are separated based on mainboard support, one side of the mainboard support is connected with the backplate of the case shell, the other side of the mainboard support is connected with the front plate of the case shell based on flow guide screen board;
[0007] First heat dissipation mesh hole is set on the right side plate of the case shell;First fan support is provided in the hidden space, the back of the first fan support is against the first heat dissipation mesh hole, the front of the first fan support is against the flow guide screen board;
[0008] The side, which is connected with the mainboard support of the flow guide screen board, forms first air vent, and the airflow blown from the first air vent sweeps the front of the mainboard support;The front of the mainboard support is protrusively provided with a plurality of mainboard installation points.
[0009] Specifically, the side of the mainboard support connected with the flow guide and wire shielding plate is bent towards the right side plate of the case shell to form a wire passing partition plate, the wire passing partition plate is parallel to the front plate of the case shell, and a first interval exists between the wire passing partition plate and the right side plate of the case shell.
[0010] A plurality of wire passing holes are formed in the wire passing partition plate, and a wire protection sleeve is arranged in any wire passing hole.
[0011] Specifically, a second interval exists between the upper end of the flow guide and wire shielding plate and the top plate of the case shell; and / or
[0012] A plurality of second air vents are arranged on the side of the flow guide and wire shielding plate connected with the front plate of the case shell.
[0013] Specifically, a second heat dissipation mesh hole is formed in the front plate of the case shell corresponding to the visible space, a second fan support is arranged on the inner side of the front plate of the case shell corresponding to the visible space, the back of the second fan support faces the second heat dissipation mesh hole, and the front of the second fan support faces the back plate of the case shell.
[0014] A top heat dissipation mesh hole, a main heat dissipation mesh hole, a mainboard external interface position and an expansion position are formed in the back plate of the case shell corresponding to the visible space.
[0015] A bottom heat dissipation mesh hole is formed in the bottom plate of the case shell corresponding to the visible space, and a fan mounting position is arranged on the inner side of the bottom plate of the case shell corresponding to the visible space.
[0016] A third heat dissipation mesh hole is formed in the top plate of the case shell corresponding to the visible space, a third fan support is arranged on the inner side of the top plate of the case shell corresponding to the visible space, the back of the third fan support faces the third heat dissipation mesh hole, and the front of the third fan support faces the bottom plate of the case shell.
[0017] Specifically, a first filter screen is arranged between the first fan support and the first heat dissipation mesh hole, a second filter screen is arranged between the second fan support and the second heat dissipation mesh hole, a third filter screen is arranged between the third fan support and the third heat dissipation mesh hole, and a fourth filter screen is arranged on the outer side of the bottom heat dissipation mesh hole.
[0018] Specifically, a solid state disk mounting position is arranged on the inner side of the front plate of the case shell corresponding to the hidden space, a mechanical hard disk mounting rack and a computer power supply mounting position are arranged on the inner side of the back plate of the case shell corresponding to the hidden space, and the mechanical hard disk mounting rack is located above the computer power supply mounting position.
[0019] Specific, the upper side of the mainboard support is provided with a first opening, the lower side of the mainboard support is provided with a second opening, the region of the mainboard support corresponding to the CPU is provided with a third opening.
[0020] Specific, the right side plate of the case shell is a light-shielding quick-release side plate, the light-shielding quick-release side plate shields the hidden space;
[0021] The left side plate of the case shell is a light-transmitting quick-release side plate, the light-transmitting quick-release side plate shields the visible space.
[0022] Specific, the top plate of the case shell corresponding to the visible space is a quick-release top plate, the front plate of the case shell corresponding to the visible space is a quick-release front plate;
[0023] The top plate of the case shell corresponding to the hidden space is a fixed top plate, the front plate of the case shell corresponding to the hidden space is a fixed front plate.
[0024] Specific, the bottom of the case shell is provided with support feet and a support reinforcing plate, the support reinforcing plate extends from front to back, and the support reinforcing plate covers the support feet.
[0025] Compared with the prior art, the utility model has the advantages that:
[0026] In the side-transmission computer case, the front of the mainboard support is provided with a plurality of mainboard mounting points, the mainboard is mounted on the protruding mainboard mounting points, sufficient gaps are left between the back of the mainboard and the mainboard support, air circulation and heat dissipation are facilitated, the first fan support can be provided with a heat dissipation fan, the heat dissipation fan can draw fresh air from outside and blow it to the flow guide shading plate, the flow guide shading plate can change the direction of the airflow and guide the airflow to blow out from the first air vent, the airflow blown out from the first air vent sweeps the front of the mainboard support, that is, the airflow flows in the gaps between the back of the mainboard and the mainboard support, thereby achieving heat dissipation of the back of the mainboard, the heat dissipation effect of the back of the mainboard can be effectively improved, heat accumulation on the back of the mainboard is avoided, and the working stability of the hardware is improved. BRIEF DESCRIPTION OF DRAWINGS
[0027] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.
[0028] Figure 1 It is the front side, right side and top side structure schematic view of the case shell in the embodiment of the utility model;
[0029] Figure 2 is the front side, left side and top side structure schematic view of the case shell in the embodiment of the utility model;
[0030] Figure 3 is the internal structure schematic view of the front side view angle of the case shell in the embodiment of the utility model;
[0031] Figure 4 is the internal structure schematic view of the rear side view angle of the case shell in the embodiment of the utility model;
[0032] Figure 5 is the three-dimensional structure schematic view of the mainboard support and the threading partition plate in the embodiment of the utility model;
[0033] Figure 6 is the plan view structure schematic view of the mainboard support and the flow guide wire shielding plate in the embodiment of the utility model;
[0034] Figure 7 is the internal structure schematic view of the bottom view angle of the case shell in the embodiment of the utility model;
[0035] Figure 8 is the internal structure schematic view of the hidden space of the case shell in the embodiment of the utility model.
[0036] In the drawing, 1, case shell;11, first heat dissipation mesh hole;12, second heat dissipation mesh hole;13, bottom heat dissipation mesh hole;14, third heat dissipation mesh hole;100, visible space;110, second fan support;121, top heat dissipation mesh hole;122, main heat dissipation mesh hole;123, mainboard external interface position;124, extension position;130, third fan support;200, hidden space;210, first fan support;220, solid state disk installation position;230, mechanical hard disk mounting frame;240, computer power supply installation position;300, mainboard support;310, mainboard installation point;320, threading partition plate;321, threading hole;330, first interval;341, first opening;342, second opening;343, third opening;400, flow guide wire shielding plate;410, first ventilation opening;420, second interval;430, second ventilation opening;510, support foot;520, support reinforcing plate. DETAILED DESCRIPTION
[0037] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.
[0038] The utility model provides a kind of side transparent computer case, including case shell 1, Figure 1 The front side, right side and top side structure schematic diagram of the case shell in the utility model embodiment is shown, Figure 2 The front side, left side and top side structure schematic diagram of the case shell in the utility model embodiment is shown.
[0039] Figure 3 The internal structure schematic diagram of the front side view angle of the case shell in the utility model embodiment is shown, Figure 4 The internal structure schematic diagram of the rear side view angle of the case shell in the utility model embodiment is shown, the case shell 1 has visible space 100 and hidden space 200, the visible space 100 and the hidden space 200 are separated based on mainboard support 300, one side of the mainboard support 300 is connected with the back plate of the case shell 1, the other side of the mainboard support 300 is connected with the front plate of the case shell 1 based on flow guide screen board 400;Please refer to Figure 1 , first heat dissipation mesh hole 11 is formed on the right side plate of the case shell 1;Please refer to Figure 3 And Figure 4 First fan support 210 is arranged in the hidden space 200, the back of the first fan support 210 is opposite to the first heat dissipation mesh hole 11, the front of the first fan support 210 is opposite to the flow guide screen board 400;The side of the flow guide screen board 400 and the mainboard support 300 is formed with first air vent 410, the airflow blown from the first air vent 410 sweeps the front of the mainboard support 300;The front of the mainboard support 300 is provided with a plurality of mainboard mounting points 310.
[0040] In the side transparent computer case of the utility model, the front of the mainboard support 300 is provided with a plurality of mainboard mounting points 310, the mainboard is installed on the protruding mainboard mounting point 310, so that enough gap is left between the back of the mainboard and the mainboard support 300, and air circulation and heat dissipation are facilitated;Moreover, the first fan support 210 can install a cooling fan, the cooling fan can extract fresh air from outside through the first heat dissipation mesh hole 11 and blow to the flow guide screen board 400, the flow guide screen board 400 can change the direction of airflow, and guide the airflow to blow out from the first air vent 410;The airflow blown from the first air vent 410 sweeps the front of the mainboard support 300, that is, the airflow flows in the gap between the back of the mainboard and the mainboard support 300, so that the back of the mainboard is cooled, the heat dissipation effect of the back of the mainboard is effectively improved, the heat accumulation on the back of the mainboard is avoided, and the working stability of hardware is improved.
[0041] In some specific embodiments, the mainboard mounting point 310 is a hexagonal pillar, which plays a supporting and connecting role.
[0042] Figure 5 The utility model discloses a mainboard support and the stereogram structure schematic diagram of threading partition plate in the embodiment of the utility model is shown, the side of mainboard support 300 with the flow guide screen board 400 meets is bent to form threading partition plate 320 to the right side plate of case shell 1, threading partition plate 320 is parallel to the front plate of case shell 1, and there is first interval 330 between threading partition plate 320 and the right side plate of case shell 1, a plurality of threading holes 321 are seted up on threading partition plate 320, and the wire protection sleeve is provided in any threading hole 321. Threading hole 321 on threading partition plate 320 is used to thread cable, and it helps to comb cable and keeps cable neat, and the wire protection sleeve can protect cable and avoid cable from being scratched, and the existence of first interval 330 is favorable to air circulation and facilitates hardware heat dissipation in concealed space 200.
[0043] Figure 6 The utility model discloses a mainboard support and the planar structure schematic diagram of flow guide screen board in the embodiment of the utility model is shown, and there is second interval 420 between the upper end of flow guide screen board 400 and the top plate of case shell 1, and the existence of second interval 420 is favorable to the removal of hot air in concealed space 200.
[0044] In some specific embodiments, please refer to Figure 6 The side of flow guide screen board 400 with the front plate of case shell 1 meets is provided with a plurality of second air vents 430, the existence of second air vent 430 facilitates air circulation, can form branch air duct, and is favorable to hardware heat dissipation installed on the front plate of case shell 1.
[0045] In some specific embodiments, please refer to Figure 3 And Figure 4 The front plate of case shell 1 corresponding to visible space 100 is provided with second heat dissipation mesh 12, and the inside of the front plate of case shell 1 corresponding to visible space 100 is provided with second fan support 110, the back of second fan support 110 is opposite to second heat dissipation mesh 12, and the front of second fan support 110 is opposite to the back plate of case shell 1;The back plate of case shell 1 corresponding to visible space 100 is provided with top heat dissipation mesh 121, main heat dissipation mesh 122, mainboard external interface position 123 and extension position 124;Second heat dissipation mesh 12 cooperates with top heat dissipation mesh 121 and main heat dissipation mesh 122, and can form "front-in back-out" air duct, and the heat dissipation effect of hardware in visible space 100 is good.
[0046] Please refer to Figure 3 The bottom plate of case shell 1 corresponding to visible space 100 is provided with bottom heat dissipation mesh 13, and the inside of the bottom plate of case shell 1 corresponding to visible space 100 is provided with fan mounting position;Please refer to Figure 1The third heat dissipation mesh hole 14 is arranged on the top plate of the cabinet shell 1 corresponding to the visual space 100. Figure 7 The third fan bracket 130 is installed on the inside of the top plate of the cabinet shell 1 corresponding to the visual space 100, the back of the third fan bracket 130 faces the third heat dissipation mesh hole 14, and the front of the third fan bracket 130 faces the bottom plate of the cabinet shell 1.
[0047] Specifically, the first filter screen is arranged between the first fan bracket 210 and the first heat dissipation mesh hole 11, the second filter screen is arranged between the second fan bracket 110 and the second heat dissipation mesh hole 12, the third filter screen is arranged between the third fan bracket 130 and the third heat dissipation mesh hole 14, and the fourth filter screen is arranged on the outside of the bottom heat dissipation mesh hole 13.
[0048] Figure 8 The solid state disk mounting position 220 is arranged on the inside of the front plate of the cabinet shell 1 corresponding to the hidden space 200, the airflow generated by the heat dissipation fan installed on the first fan bracket 210 can blow through the solid state disk mounting position 220, and the heat dissipation effect of the solid state disk is improved.
[0049] In some specific embodiments, referring to Figure 6 The first opening 341 is arranged on the upper side of the mainboard bracket 300, the second opening 342 is arranged on the lower side of the mainboard bracket 300, and the third opening 343 is arranged on the region of the mainboard bracket 300 corresponding to the CPU.
[0050] In some embodiments, the right side plate of the case shell 1 is a light-shielding quick-release side plate that shields the hidden space 200; the left side plate of the case shell 1 is a light-transmitting quick-release side plate that shields the visible space 100. The quick-release design of the side plates facilitates disassembly and installation, and is conducive to improving the convenience of use of the side-transmission computer case.
[0051] Further, the top plate of the case shell 1 corresponding to the visible space 100 is a quick-release top plate, and the front plate of the case shell 1 corresponding to the visible space 100 is a quick-release front plate. The quick-release top plate and the quick-release front plate of the visible space 100 enable the user to quickly open the inside of the case without a complex disassembly process, which is conducive to cleaning and replacing the heat dissipation system. The top plate of the case shell 1 corresponding to the hidden space 200 is a fixed top plate, and the front plate of the case shell 1 corresponding to the hidden space 200 is a fixed front plate. The fixed top plate and the fixed front plate of the hidden space 200 are conducive to protecting the cables, power supply, and hard disk inside the case.
[0052] In some embodiments, referring to Figure 7 , the bottom of the case shell 1 is provided with support feet 510 and a support reinforcing plate 520. The support reinforcing plate 520 extends from front to back, and covers the support feet 510. The support feet 510 can elevate the ground clearance of the case shell 1, so that the bottom plate of the case shell 1 is away from the ground or the desktop, leaving enough space for the heat dissipation mesh holes on the bottom plate to dissipate heat. The support reinforcing plate 520 can improve the strength of the bottom plate of the case shell 1, which is conducive to improving the support stability of the case shell 1.
[0053] In some embodiments, the area of the first heat dissipation mesh hole 11, the area of the second heat dissipation mesh hole 12, and the area of the third heat dissipation mesh hole 14 are all 9-16 cm 2 , which is small and beautiful, and is conducive to reducing dust entering the case shell 1.
[0054] In the side-through computer case, the front of the mainboard support 300 is provided with a plurality of mainboard mounting points 310, the mainboard is mounted on the protruding mainboard mounting points 310, sufficient gaps can be left between the back of the mainboard and the mainboard support 300, air circulation and heat dissipation are facilitated, the first fan support 210 can be provided with a heat dissipation fan, the heat dissipation fan can draw fresh air from outside and blow to the flow guide and wire shielding plate 400, the flow guide and wire shielding plate 400 can change the direction of the airflow and guide the airflow to blow out from the first air vent 410, the airflow blown out from the first air vent 410 can sweep the front of the mainboard support 300, that is, the airflow can flow in the gaps between the back of the mainboard and the mainboard support 300, thereby achieving heat dissipation of the back of the mainboard, the heat dissipation effect of the back of the mainboard can be effectively improved, heat accumulation on the back of the mainboard is avoided, and the working stability of the hardware is improved.
[0055] Moreover, the existence of the first interval 330 is conducive to air circulation and facilitates heat dissipation of the hardware in the hidden space 200, the existence of the second air vent 430 facilitates air circulation, a branch air duct can be formed, heat dissipation of the hardware mounted on the front plate of the case shell 1 is facilitated, the second heat dissipation mesh hole 12 cooperates with the top heat dissipation mesh hole 121 and the main heat dissipation mesh hole 122, and the like, a "front-in and rear-out" air duct can be formed, the heat dissipation effect of the hardware in the visible space 100 is good, the bottom heat dissipation mesh hole 13 cooperates with the third heat dissipation mesh hole 14, a "bottom-in and top-out" air duct can be formed, the heat dissipation effect of the hardware in the visible space 100 is good, each filter screen can intercept dust, insects and other foreign matters, and the hardware in the case shell 1 is protected, the first opening 341, the second opening 342 and the third opening 343 on the mainboard support 300 can communicate the visible space 100 and the hidden space 200, air circulation is facilitated, and the heat dissipation effect in the case shell 1 is improved.
[0056] In addition, the side plate with the quick-release design is convenient for people to disassemble and install, and the use convenience of the side-through computer case is improved, the quick-release top plate and the quick-release front plate of the visible space 100 enable the user to quickly open the inside of the case without a complicated disassembly process, and cleaning and replacement of the heat dissipation system are facilitated, and the fixed top plate and the fixed front plate of the hidden space 200 are conducive to protection of cables, power supplies and hard disks and the like in the inside of the case.
[0057] The side-through computer case provided by the embodiment of the utility model is described in detail, the principle and implementation mode of the utility model are described by using specific examples in the paper, the description of the above embodiment is only used for helping understanding of the method and core idea of the utility model, meanwhile, according to the idea of the utility model, the specific implementation mode and application range can be changed by the person skilled in the art, and according to the above, the content of the specification should not be understood as the limitation of the utility model.
Claims
1. A side-through computer case comprising a case housing having a visible space and a hidden space in the case housing, characterized in that, The visual space and the hidden space are separated based on a mainboard support, one side of the mainboard support is connected with a back plate of the case shell, and the other side of the mainboard support is connected with a front plate of the case shell based on a flow guide screen board; A first heat dissipation mesh hole is arranged on the right side plate of the case shell; a first fan support is arranged in the hidden space, the back surface of the first fan support faces the first heat dissipation mesh hole, and the front surface of the first fan support faces the flow guide screen board; A first air vent is formed on the side, where the flow guide screen board and the mainboard support are connected, of the flow guide screen board, and the airflow blown out of the first air vent sweeps the front surface of the mainboard support; a plurality of mainboard mounting positions are arranged on the front surface of the mainboard support.
2. The side-flow computer case of claim 1, wherein, The side, where the mainboard support and the flow guide screen board are connected, of the mainboard support is bent towards the right side plate of the case shell to form a wire passing partition plate, the wire passing partition plate is parallel to the front plate of the case shell, and a first interval is formed between the wire passing partition plate and the right side plate of the case shell; A plurality of wire passing holes are arranged on the wire passing partition plate, and a wire sleeve is arranged in each wire passing hole.
3. The side-flow computer chassis of claim 1, wherein, A second interval is formed between the upper end of the flow guide screen board and the top plate of the case shell; and / or A plurality of second air vents are arranged on the side, where the flow guide screen board and the front plate of the case shell are connected.
4. The side-flow computer chassis of claim 1, wherein, A second heat dissipation mesh hole is arranged on the front plate of the case shell corresponding to the visual space, a second fan support is arranged on the inner side of the front plate of the case shell corresponding to the visual space, the back surface of the second fan support faces the second heat dissipation mesh hole, and the front surface of the second fan support faces the back plate of the case shell; A top heat dissipation mesh hole, a main heat dissipation mesh hole, a mainboard external interface position and an expansion position are arranged on the back plate of the case shell corresponding to the visual space. A bottom heat dissipation mesh hole is arranged on the bottom plate of the case shell corresponding to the visual space, and a fan mounting position is arranged on the inner side of the bottom plate of the case shell corresponding to the visual space. A third heat dissipation mesh hole is arranged on the top plate of the case shell corresponding to the visual space, a third fan support is arranged on the inner side of the top plate of the case shell corresponding to the visual space, the back surface of the third fan support faces the third heat dissipation mesh hole, and the front surface of the third fan support faces the bottom plate of the case shell.
5. The side-flow computer chassis of claim 4, wherein, A first filter screen is arranged between the first fan support and the first heat dissipation mesh hole, a second filter screen is arranged between the second fan support and the second heat dissipation mesh hole, a third filter screen is arranged between the third fan support and the third heat dissipation mesh hole, and a fourth filter screen is arranged on the outer side of the bottom heat dissipation mesh hole.
6. The side-flow computer chassis of claim 1, wherein, A solid state disk mounting position is arranged on the inner side of the front plate of the case shell corresponding to the hidden space, a mechanical hard disk mounting rack and a computer power supply mounting position are arranged on the inner side of the back plate of the case shell corresponding to the hidden space, and the mechanical hard disk mounting rack is located above the computer power supply mounting position.
7. The side-flow computer chassis of claim 1, wherein, A first opening is arranged on the upper side of the mainboard support, a second opening is arranged on the lower side of the mainboard support, and a third opening is arranged on the region corresponding to the CPU of the mainboard support.
8. The side-flow computer chassis of claim 1, wherein, The right side plate of the case shell is a light shielding quick detach side plate, and the light shielding quick detach side plate shields the hidden space. The left side plate of the case shell is a light-transmitting quick-release side plate, which shields the visual space.
9. The side-flow computer chassis of claim 1, wherein, The top plate of the case shell corresponding to the visual space is a quick-release top plate, and the front plate of the case shell corresponding to the visual space is a quick-release front plate. The top plate of the case shell corresponding to the hidden space is a fixed top plate, and the front plate of the case shell corresponding to the hidden space is a fixed front plate.
10. The side-flow computer chassis of claim 1, wherein, The bottom of the case shell is provided with supporting feet and a supporting reinforcement plate, the supporting reinforcement plate extends from front to back, and the supporting reinforcement plate covers the supporting feet.