Wafer sealing pressure balancing device

Abstract

The utility model discloses a wafer sealing pressure balancing device, which comprises a pressing plate pressed on the surface of a wafer, a pressure component provided with a plurality of pressure end parts, and a balancing module arranged between the pressing plate and the pressure component, wherein two ends of the balance module are respectively provided with a connecting part connected with the plurality of pressure end parts and an abutting part abutting against the center of the pressing plate, and along with the pressure applied by the plurality of pressure end parts, the balance module synchronously converges the pressure from the connecting part to the abutting part, transmits the pressure to the center of the pressing plate and uniformly diffuses the pressure to the surface of the wafer. According to the utility model, one end of the balance module is connected with the pressure end part, the other end abuts against the center of the pressing plate, and the pressure is uniformly applied to the surface of the wafer after being converged by the balance module, thereby effectively eliminating the pressure difference generated by each pressure end part, and guaranteeing the packaging sealing performance of the wafer; in addition, the structure is simple, and implementation cost is low.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor, concretely relates to a wafer sealing pressure balancing device. BACKGROUND

[0002] In the semiconductor packaging circuit manufacturing, when the wafer after photoetching enters the electroplating procedure, it needs to use the packaging mechanism to accurately and completely seal the edge and back surface of the wafer not etched by the circuit to ensure that the wafer after photoetching has a high-precision packaging environment, so as to be applicable to each wafer processing procedure after photoetching, for example, when the wafer is immersed in the electrolyte for electroplating, it can make the wafer have a reliable cathode conduction environment.

[0003] At present, when the wafer is sealed, a pressure device is needed to press the wafer and the sealing piece to ensure the sealing effect, and the existing pressure device generally includes multiple air cylinders, a pressing plate provided with push rods at the bottom of the multiple air cylinders, and under the driving of the multiple air cylinders, the pressing plate is driven to press the surface of the wafer.

[0004] However, in the actual production process, because the air inlet pipelines of the air cylinders have certain differences from the air inlet, the push rods of the multiple air cylinders cannot be guaranteed to move synchronously when air is inhaled, so that the push rods of the multiple air cylinders have a pressure difference, the pressing plate has a lateral pressure imbalance, and vibration occurs on the central shaft, which affects the normal work of the equipment. SUMMARY

[0005] The utility model wants to solve the technical problem of overcoming the prior art, and provides a new wafer sealing pressure balancing device.

[0006] To solve the above technical problems, the utility model adopts the following technical scheme:

[0007] A wafer sealing pressure balancing device includes a pressing plate arranged on the surface of the wafer and a pressure component, wherein the pressure component has multiple pressure end portions, the pressure balancing device further includes a balancing module arranged between the pressing plate and the pressure component, wherein the two ends of the balancing module respectively form a connecting portion connected with the multiple pressure end portions and a contact portion in contact with the center of the pressing plate, and as the multiple pressure end portions apply pressure, the balancing module synchronously converges and transmits the pressure from the connecting portion to the contact portion to the center of the pressing plate and uniformly spreads to the surface of the wafer.

[0008] Preferably, the balancing module is in the shape of a circular truncated cone, and the outer diameter of the balancing module gradually decreases from the connecting portion to the contact portion. Here, the balancing module adopts a circular truncated cone structure, which is simple in structure, convenient to process, and facilitates the convergence of the pressure formed by the multiple pressure end portions along the circular truncated cone to the contact portion. It needs to be particularly pointed out that, based on the circular truncated cone structure of the balancing module, when the connecting portion applies pressure, the pressure converged by the contact portion is the resultant force of the component forces of the pressure of the multiple pressure end portions along the direction of the circular truncated cone taper surface.

[0009] Preferably, the center lines of the balancing module, the pressing plate and the wafer are coincidently arranged, or the center lines of the balancing module, the abutting part, the pressing plate and the wafer are coincidently arranged. In this way, the uniform pressure can be ensured to be transmitted to the wafer surface.

[0010] Preferably, the connecting part is bent outward from the corresponding end of the balancing module, and the extending direction of the connecting part is intersected with the applying direction of each pressure. In this way, the processing and forming are facilitated.

[0011] Specifically, the applying direction of each pressure is the same as the extending direction of the center line of the balancing module, and the extending direction of the connecting part is perpendicularly arranged with the applying direction of each pressure. In this way, the resultant force of the pressure components transmitted to the abutting part can be calculated to accurately control the pressure on the wafer.

[0012] Further, the connecting part is annular and extends around the center line of the balancing module, and the plurality of pressure end parts are uniformly distributed around the center of the connecting part.

[0013] Preferably, the abutting part is formed with an abutting plane, and the abutting part is arranged to be coincident with the center of the pressing plate from the abutting plane. In this way, the pressure can be ensured to be converged and transmitted to the pressing plate, and the center pressure of the pressing plate can be reduced based on the surface contact to avoid the deformation of the pressing plate and prolong the service life.

[0014] Preferably, the thickness of the pressing plate is gradually reduced from the center to the edge, and / or the pressing plate is arranged on the surface of the wafer from the edge. In this way, the pressure on the center of the pressing plate can be uniformly dispersed to the edge to ensure that the pressing plate can uniformly diffuse the pressure to the wafer surface.

[0015] Preferably, the pressure component comprises a supporting platform and a plurality of air cylinders arranged on the supporting platform and respectively having pressure end parts, wherein the plurality of pressure end parts pass through the supporting platform and are fixedly connected with the connecting part.

[0016] Specifically, the center of the pressing plate is further fixedly provided with a connecting shaft extending along the center line thereof, and the supporting platform and the balancing module are sequentially arranged on the connecting shaft. In this way, the pressure component and the balancing module can be quickly disassembled from the pressing plate.

[0017] Compared with the prior art, the present application has the following advantages:

[0018] The existing pressure device has a certain difference in the distance between the intake pipeline of each cylinder and the intake port, and the bottom push rod cannot be ensured to move synchronously when multiple cylinders are in the process of intake, so that the push rod of multiple cylinders appears pressure difference, which causes the side pressure imbalance of the pressing plate and the vibration on the center shaft, affecting the normal work of the equipment; the structure of the wafer sealing pressure balancing device is designed as a whole, and the deficiencies and defects of the prior art are ingeniously solved, after the wafer sealing pressure balancing device is adopted, the pressing plate is placed on the surface of the wafer, the balance module is fixedly connected with the plurality of pressure end portions from the connecting portion of one end, and abuts against the center of the pressing plate from the abutting portion of the other end, pressure is applied by the plurality of pressure end portions, the pressure is gathered and transmitted to the center of the pressing plate from the connecting portion through the balance module, and finally the pressing plate uniformly diffuses the pressure to the surface of the wafer based on the center stress. Therefore, compared with the prior art, the balance module is connected with the pressure end portion at one end and abuts against the center of the pressing plate at the other end, the pressure is uniformly applied to the surface of the wafer after being gathered through the balance module, the pressure difference generated by each pressure end portion is effectively eliminated, and the packaging sealing property of the wafer is ensured; in addition, the structure is simple, and the implementation cost is low. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a front view schematic diagram of the wafer sealing pressure balancing device of the utility model;

[0020] Figure 2 It is a three-dimensional partial sectional view schematic diagram of the wafer sealing pressure balancing device of the utility model;

[0021] Among them: 1, pressing plate; 10, connecting shaft;

[0022] 2, pressure component; 20, support platform; 21, cylinder; d, pressure end portion;

[0023] 3, balance module; 30, connecting portion; 31, abutting portion;

[0024] Y, wafer; Q, support ring. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0028] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0030] It is to be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on the other element or intervening elements can also be present. In addition, the term "connected" as used herein means the element that can be directly connected to the other element or intervening elements can also be present. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right", and the like are merely used for the purpose of illustration and are not intended to be limiting.

[0031] As shown in Figure 1 and Figure 2 The wafer sealing pressure balancing device of the present embodiment comprises a pressing plate 1, a pressure component 2, and a balancing module 3.

[0032] Specifically, the wafer Y is horizontally placed on the support ring Q, the pressing plate 1 is a circular plate body, and the pressing plate 1 is arranged on the surface of the wafer Y from top to bottom and from the lower surface.

[0033] At the same time, the lower surface of the pressing plate 1 is arched inward from the middle, and the pressing plate 1 contacts the edge of the wafer Y from the edge, and the thickness of the pressing plate 1 gradually thins from the center to the edge. At this point, it is convenient for the pressure at the center of the pressing plate to be evenly dispersed to the edge, so as to ensure that the pressing plate can evenly spread the pressure to the surface of the wafer.

[0034] In order to facilitate implementation, the center of the pressing plate 1 is further fixedly provided with a connecting shaft 10 extending along the center line direction of the pressing plate 1, in other words, the center of the pressing plate 1 is vertically provided with the connecting shaft 10.

[0035] In this example, the pressure component 2 comprises a support platform 20 arranged horizontally above the pressing plate 1, and a plurality of air cylinders 21 arranged on the support platform 20 and each having a pressure end d, wherein the pressure end d of each air cylinder 21 penetrates the support platform 20 downward. In the present embodiment, the number of air cylinders 21 is 3 and is evenly distributed in a ring shape.

[0036] In this example, the balancing module 3 is arranged between the support platform 20 and the pressing plate 1, wherein the two ends of the balancing module 3 respectively form a connecting part 30 connected with the plurality of pressure ends d and a abutting part 31 abutting with the center of the pressing plate 1, and as the plurality of pressure ends d apply pressure, the balancing module 3 synchronously converges and transmits the pressure from the connecting part to the abutting part to the center of the pressing plate 1 and evenly spreads to the surface of the wafer Y.

[0037] In some specific embodiments, the support platform 20 and the balancing module 3 are sequentially sleeved on the connecting shaft 10. At this point, it is convenient for the pressure component and the balancing module to be quickly disassembled and assembled with the pressing plate.

[0038] Meanwhile, the balancing module 3 is in the shape of a circular truncated cone, and the outer diameter of the balancing module 3 gradually decreases from the connecting portion 30 to the abutting portion 31; the center lines of the balancing module 3, the pressing plate 1 and the wafer Y are coincident, or the center lines of the balancing module 3, the abutting portion 31, the pressing plate 1 and the wafer Y are coincident; the connecting portion 30 is bent outward from the corresponding end of the balancing module 3, and the extension direction of the connecting portion 30 intersects with the direction of each pressure. Here, the balancing module is in the shape of a circular truncated cone, which is simple in structure, convenient to process, and facilitates the pressure formed by each pressure end to converge at the abutting portion along the circular truncated cone. It should be particularly noted that, based on the balancing module in the shape of a circular truncated cone, when the pressure is applied from the connecting portion, the pressure converged at the abutting portion is the resultant force of the component forces of the pressure of each pressure end in the direction of the circular truncated cone, which is the conventional force analysis.

[0039] In order to further facilitate implementation, the plurality of pressure ends d pass through the support platform 20 and are fixedly connected with the connecting portion 30; the direction of each pressure is the same as the extension direction of the center line of the balancing module 3; and the extension direction of the connecting portion 30 is perpendicular to the direction of each pressure. Here, it is convenient to calculate the resultant force of the pressure component transmitted to the abutting portion, so as to accurately control the pressure on the wafer.

[0040] The connecting portion 30 is in the shape of a ring extending around the center line direction of the balancing module 3, and the plurality of pressure ends d are uniformly and spacedly distributed around the center of the connecting portion 30; the abutting portion 31 is formed with an abutting plane, and the abutting portion is arranged to be coincident with the center of the pressing plate 1 from the abutting plane. While ensuring that the pressure converges and is transmitted to the pressing plate, the center pressure of the pressing plate is reduced based on the surface contact, the deformation of the pressing plate is avoided, and the service life is prolonged.

[0041] In summary, after adopting the wafer sealing pressure balancing device, the pressing plate is placed on the wafer surface, the balancing module is fixedly connected with the plurality of pressure end portions from the connecting portion of one end and abuts against the center of the pressing plate from the abutting portion of the other end, pressure is applied by the plurality of pressure end portions, the pressure is converged to the abutting portion from the connecting portion through the balancing module and is transmitted to the center of the pressing plate, and finally the pressing plate uniformly spreads the pressure to the surface of the wafer under the stress of the center. Therefore, compared with the prior art, the wafer sealing pressure balancing device has the following advantages: the one end of the balancing module is connected with the pressure end portion, the other end abuts against the center of the pressing plate, the pressure is uniformly applied to the wafer surface after being converged through the balancing module, the pressure difference generated by the plurality of pressure end portions is effectively eliminated, and the sealing property of the wafer is ensured; in addition, the structure is simple, and the implementation cost is low; secondly, the balancing module adopts a circular truncated cone structure, the structure is simple, the processing is convenient, and the pressure formed by the plurality of pressure end portions is conveniently converged to the abutting portion along the circular truncated cone; thirdly, the resultant force of the pressure components transmitted to the abutting portion is conveniently calculated, so that the pressure borne by the wafer is accurately controlled; fourthly, while ensuring that the pressure is converged and transmitted to the pressing plate, the pressure intensity at the center of the pressing plate is reduced based on the surface contact, the deformation of the pressing plate is avoided, and the service life is prolonged; and fifthly, the pressure components, the balancing module and the pressing plate are conveniently and quickly disassembled and assembled.

[0042] The utility model has been described in detail above, the purpose is to enable the person who is familiar with this field technology to understand the content of the utility model and implement, and cannot limit the protection scope of the utility model with this, all equivalent changes or modifications according to the spirit of the utility model should be covered in the protection scope of the utility model.

Claims

1. A wafer sealing pressure equalizing device comprising a pressure plate arranged to press against a wafer surface, a pressure member, wherein the pressure member has a plurality of pressure end portions, characterized in that, The pressure balancing device further comprises a balancing module arranged between the pressing plate and the pressure component, wherein two ends of the balancing module are respectively formed with a connecting portion connected with the plurality of pressure end portions and an abutting portion abutting with the center of the pressing plate, and the balancing module synchronously converges the pressure from the connecting portion to the abutting portion and transmits the pressure to the center of the pressing plate and uniformly spreads the pressure to the surface of the wafer as the plurality of pressure end portions apply pressure.

2. The wafer seal pressure equalization apparatus of claim 1, wherein, The balancing module is in the shape of a circular truncated cone, and the outer diameter of the balancing module gradually decreases from the connecting portion to the abutting portion.

3. The wafer seal pressure equalization apparatus of claim 2, wherein, The center lines of the balancing module, the pressing plate and the wafer are arranged in coincidence, or the center lines of the balancing module, the abutting portion, the pressing plate and the wafer are arranged in coincidence.

4. The wafer seal pressure equalization apparatus of claim 2, wherein, The connecting portion is bent outward from the corresponding end of the balancing module, and the extension direction of the connecting portion is arranged to intersect with the application direction of each pressure.

5. The wafer seal pressure equalization apparatus of claim 4, wherein, The application direction of each pressure is the same as the extension direction of the center line of the balancing module, and the extension direction of the connecting portion is arranged to be perpendicular to the application direction of each pressure.

6. The wafer seal pressure equalization apparatus of claim 5, wherein, The connecting portion is in the shape of a ring extending around the center line direction of the balancing module, and the plurality of pressure end portions are uniformly and spacedly distributed around the center of the connecting portion.

7. The wafer seal pressure equalization apparatus of claim 1, wherein, The abutting portion is formed with an abutting plane, and the abutting portion is arranged to abut with the center of the pressing plate from the abutting plane.

8. The wafer seal pressure equalization apparatus of claim 1, wherein, The thickness of the pressing plate gradually decreases from the center to the edge, and / or the pressing plate is arranged to press the surface of the wafer from the edge.

9. The wafer seal pressure equalization apparatus of claim 1, wherein, The pressure component comprises a support platform and a plurality of air cylinders arranged on the support platform and respectively having the pressure end portions, wherein the plurality of pressure end portions pass through the support platform and are fixedly connected with the connecting portion.

10. The wafer seal pressure equalization apparatus of claim 9, wherein, The center of the pressing plate is further fixedly provided with a connecting shaft extending along the center line direction thereof, and the support platform and the balancing module are sequentially arranged on the connecting shaft.

Images