Cooling system of etching chamber

Abstract

The utility model provides an etching chamber cooling system and method. The etching chamber cooling system comprises a cooling plate, a chamber temperature measuring device, a proportional control regulating valve and a cooling water valve, the cooling plate is arranged on the outer side wall of the etching chamber, and a cooling water channel is arranged in the cooling plate. The chamber temperature measuring device is used for measuring the side wall temperature of the etching chamber, and the proportional control regulating valve is used for regulating the proportional control regulating valve to a target angle according to the side wall temperature of the etching chamber; the cooling water valve is used for opening or closing the cooling water channel, and cooling water enters the cooling water channel through the proportional control regulating valve at the target angle. The opening target angle of the proportional control regulating valve can be determined according to the side wall temperature, measured by the chamber temperature measuring device, of the etching chamber, the flow of cooling water entering the cooling water channel is controlled through the target angle, then the temperature adjusting effect of the cooling plate on the side wall of the etching chamber is controlled, the temperature of the etching chamber is uniform and stable, and the etching efficiency is improved. That is to say, the temperature of the etching chamber is kept stable by using the cooling plate provided with the cooling water.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor, especially a kind of etching chamber cooling system. BACKGROUND

[0002] In the current semiconductor manufacturing process, including etching process. Etching process needs to be carried out in etching equipment. To realize the manufacture of high-performance semiconductor devices, it is necessary to provide etching process parameters with high accuracy and stability, such as etching chamber temperature, that is, the etching chamber temperature needs to be maintained within a predetermined temperature range at present, so as to ensure the temperature stability in the etching process.

[0003] But with the advanced process demand etching process power is higher and higher, under the high-power etching process, the temperature of etching chamber is extremely unstable, especially the temperature of the sidewall of etching chamber is not uniform, which leads to the deposition of process by-products on the sidewall of the chamber, affecting the particle performance, and ultimately affecting the manufacture of semiconductor devices. SUMMARY

[0004] Therefore, the purpose of the present application is to provide an etching chamber cooling system, which can realize uniform and stable sidewall temperature of the etching chamber, and further realize temperature stability of the etching chamber.

[0005] The present application provides an etching chamber cooling system, which comprises a cooling plate, a chamber temperature measuring device, a proportional control valve and a cooling water valve.

[0006] The cooling plate is arranged on the outer sidewall of the etching chamber, and the cooling plate is provided with a cooling water channel.

[0007] The chamber temperature measuring device is used to measure the sidewall temperature of the etching chamber.

[0008] The proportional control valve is used to adjust the proportional control valve to a target angle according to the sidewall temperature of the etching chamber.

[0009] The cooling water valve is used to open or close the cooling water channel, and the cooling water enters the cooling water channel through the proportional control valve with a target angle.

[0010] Optionally, the angle of the proportional control valve is proportional to the sidewall temperature of the etching chamber.

[0011] Optionally, the shape and number of the cooling plate are determined according to the shape and number of the outer sidewall of the etching chamber.

[0012] Optionally, the number of the cooling water valve is the same as the number of the cooling plate.

[0013] Optionally, the outer sidewall of the etching chamber has a receiving groove recessed towards the chamber, and the cooling plate is embedded in the receiving groove.

[0014] Optionally, the etching chamber cooling system further comprises a heat-conducting silica gel pad.

[0015] The heat-conducting silica gel pad is arranged between the cooling plate and the outer sidewall of the etching chamber.

[0016] Optionally, the etching chamber cooling system comprises a controller.

[0017] The controller is configured to acquire the sidewall temperature of the etching chamber, determine whether the sidewall temperature of the etching chamber is greater than a set temperature, and if so, convert the sidewall temperature of the etching chamber into a current signal and send the current signal to the proportional control valve.

[0018] The proportional control valve is configured to adjust the proportional control valve to a target angle according to the current signal.

[0019] Optionally, if the sidewall temperature of the etching chamber is less than the set temperature, the controller is configured to control the proportional control valve to be closed.

[0020] Optionally, the cooling water channel is arranged in the shape of an S in the cooling plate.

[0021] Optionally, the number of chamber temperature measuring devices is determined according to the shape and number of the outer sidewall of the etching chamber.

[0022] The present application provides an etching chamber cooling method applied to the etching chamber cooling system described above, and the etching chamber cooling method comprises:

[0023] Measuring the sidewall temperature of the etching chamber by using a chamber temperature measuring device;

[0024] Controlling a proportional control valve to adjust the proportional control valve to a target angle according to the sidewall temperature of the etching chamber;

[0025] Controlling a cooling water valve to be opened, and the cooling water enters the cooling water channel through the proportional control valve at the target angle.

[0026] Optionally, the method further comprises:

[0027] Determining whether the sidewall temperature of the etching chamber is greater than a set temperature, and if so, converting the sidewall temperature of the etching chamber into a current signal and sending the current signal to the proportional control valve;

[0028] The proportional control valve adjusts the proportional control valve to a target angle according to the sidewall temperature of the etching chamber, which comprises:

[0029] The proportional control regulating valve adjusts to a target angle according to the current signal.

[0030] The application provides an etching chamber cooling system, which comprises a cooling plate, a chamber temperature measuring device, a proportional control regulating valve and a cooling water valve. The cooling plate is arranged on the outer sidewall of the etching chamber, and a cooling water channel is arranged in the cooling plate. The cooling water channel is filled with cooling water by introducing cooling water into the cooling water channel. The chamber temperature measuring device is used to measure the sidewall temperature of the etching chamber. The proportional control regulating valve is used to adjust to a target angle according to the sidewall temperature of the etching chamber. The cooling water valve is used to open or close the cooling water channel. The cooling water enters the cooling water channel through the proportional control regulating valve with the target angle. That is, the target angle of the proportional control regulating valve is determined according to the sidewall temperature of the etching chamber measured by the chamber temperature measuring device. The flow of the cooling water into the cooling water channel is controlled through the target angle, so as to control the temperature adjustment effect of the cooling plate on the sidewall of the etching chamber, realize the uniform and stable sidewall of the etching chamber, maintain the stable temperature of the sidewall of the etching chamber by the cooling plate with cooling water, control the temperature of the etching chamber, and finally improve the performance of the manufactured semiconductor device. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0032] Figure 1 A structural schematic diagram of an etching chamber cooling system provided by an embodiment of the application is shown;

[0033] Figure 2 A structural schematic diagram of a cooling plate provided by an embodiment of the application is shown;

[0034] Figure 3 A structural schematic diagram of another etching chamber cooling system provided by an embodiment of the application is shown;

[0035] Figure 4 A flowchart of an etching chamber cooling method provided by an embodiment of the application is shown. DETAILED DESCRIPTION

[0036] In the following, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort shall fall within the protection scope of the present application.

[0037] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other manners different from those described herein, and a person of ordinary skill in the art can make similar generalizations without departing from the content of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0038] The present application is described in detail in conjunction with the schematic diagram, and in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure is locally enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual manufacture.

[0039] In recent years, with the rapid development of intelligence, informationization and networking, the application field of semiconductor is continuously expanding, and the market demand for semiconductor devices is increasing, especially the demand for advanced process semiconductor devices is more prominent. The advanced process semiconductor device has more and more stringent requirements for various parameters of the manufacturing equipment.

[0040] Etching process is a very key link in semiconductor device manufacturing process, especially in advanced process nodes, so the control precision of various parameters of etching equipment is relatively high. In the etching equipment, the chamber control temperature is also a relatively important parameter. The current etching chamber uses an electric heating rod to heat and control the temperature in the four corners of the etching chamber to reach the required set temperature. The electric heating rod can adjust the output power according to the temperature value fed back by the temperature sensor arranged in the etching chamber to achieve the temperature control effect of the etching chamber. In the conventional process, the output power of the electric heating rod fluctuates in a fixed range, so that the temperature is controllable.

[0041] However, as the power of etching process required by advanced process is higher and higher, under the high-power etching process, the temperature of the etching chamber is extremely unstable, especially the high-temperature temperature is extremely unstable, thereby causing the temperature of the etching chamber to be out of control, and even triggering the chamber temperature alarm. Moreover, the sidewall temperature of the etching chamber is uneven, causing the process by-products to deposit on the sidewall of the chamber, affecting the particle performance, and ultimately affecting the manufacturing of semiconductor devices. In addition, the chamber temperature is thermally radiated to the wafer surface in the etching chamber which is being processed, affecting the etching process performance.

[0042] Based on this, the application provides an etching chamber cooling system, which comprises a cooling plate, a chamber temperature measuring device, a proportional control regulating valve and a cooling water valve.

[0043] In order to better understand the technical solutions and technical effects of the application, specific embodiments will be described in detail below with reference to the accompanying drawings.

[0044] Referring to Figure 1 The figure is a structural schematic diagram of an etching chamber cooling system provided by an embodiment of the application.

[0045] The etching chamber cooling system provided by the embodiment comprises a cooling plate 110, a chamber temperature measuring device 120, a proportional control regulating valve 130 and a cooling water valve 140.

[0046] In the embodiment of the application, the cooling plate 110 is arranged on the outer sidewall of the etching chamber, and the cooling plate 110 can be closely attached to the outer sidewall of the etching chamber. The cooling plate 110 is provided with a cooling water channel 111, and cooling water can flow in the cooling water channel 111. When the cooling water flows in the cooling water channel 111, the heat of the sidewall of the etching chamber can be taken away, so as to reduce the temperature of the sidewall of the etching chamber, and further reduce the temperature of the etching chamber and improve the temperature stability of the etching chamber.

[0047] As a possible implementation manner, the cooling water channel 111 can be uniformly arranged in the cooling plate 110, so as to uniformly cool the sidewall of the etching chamber by using the cooling plate 110. The cooling water channel 111 can be arranged in the shape of the letter S in the cooling plate 110, as shown in Figure 2As shown, the cooling water channel 111 arranged in the shape of letter S not only realizes uniform arrangement of the cooling water channel 111 in the cooling plate 110, but also realizes arrangement of more cooling water channels 111 in the limited area of the cooling plate 110, thereby enhancing the cooling effect of the cooling plate 110 and further enhancing the control effect of the etching chamber temperature stability.

[0048] The cross section of the cooling water channel 111 can be a circular ring shape, and the diameter of the cooling water channel 111 is smaller than the thickness of the cooling plate 110. The thickness of the cooling plate 110 is about 2 cm. The cooling water channel 111 includes a water inlet and a water outlet, which are connected by a sleeve joint and an external water channel, respectively.

[0049] To realize arrangement of the cooling plate 110 on the outer side wall of the etching chamber, the cooling plate 110 can be tightly attached to the outer side wall of the etching chamber by a fixing device. The fixing device is, for example, a fixing screw, and the cooling plate 110 is provided with a fixing screw hole so that the fixing screw arranges the cooling plate 110 on the outer side wall of the etching chamber by the fixing screw hole. The fixing screw hole can be arranged at the edge of the cooling plate 200, and if the cooling plate 200 is rectangular, the fixing screw hole is arranged at the four corners of the cooling plate 200. The cooling plate 110 can be inlaid and attached to the outer side wall of the etching chamber, and fastened by the fixing screw. The cooling plate 110 based on the fixing device is convenient to disassemble and install, and is convenient for later maintenance.

[0050] The shape and number of the cooling plate 110 can be determined according to the shape and number of the outer side wall of the etching chamber. When the etching chamber is a cylindrical chamber, the cross section of the outer side wall of the etching chamber is a circular ring, the cross section shape of the cooling plate 110 can also be a circular ring, the surface shape of the cooling plate 110 can be rectangular, and the number of the cooling plate 110 can be one. One cooling plate 110 is connected end to end and tightly attached to the outer side wall of the etching chamber. When the etching chamber is a hexahedral chamber, the cross section of the outer side wall of the etching chamber is a rectangle, the cross section shape and surface shape of the cooling plate 110 can both be rectangular, and the number of the cooling plate 110 can be four. One cooling plate 110 is arranged on each outer side wall of the etching chamber, thereby realizing temperature control of different outer side walls by different cooling plates 110, realizing uniformity of the chamber temperature, and further improving the control effect of the temperature stability.

[0051] In the embodiment of the present application, the chamber temperature measuring device 120 is used to measure the side wall temperature of the etching chamber, and can specifically measure the inner side wall temperature and the outer side wall temperature of the etching chamber. The chamber temperature measuring device 120 can be arranged on the inner side wall and the outer side wall of the etching chamber to measure the side wall temperature of the etching chamber. The chamber temperature measuring device 120 can be a temperature sensor.

[0052] The number of chamber temperature measuring devices 120 can also be determined according to the shape of the outer side wall of the etching chamber and the number of outer side walls. When the etching chamber is a hexahedral chamber, the outer side wall of the etching chamber is 4, and one chamber temperature measuring device 120 is arranged on each outer side wall of the etching chamber, so that different chamber temperature measuring devices 120 are used to measure the temperature of different outer side walls respectively, so that the temperature of each side wall is controlled according to the side wall temperature, the temperature of the chamber is uniform, and the control effect of temperature stability is further improved.

[0053] In the embodiment of the present application, the cooling water valve 140 is used to open or close the cooling water channel 111. When the cooling water valve 140 is opened, cooling water can flow into the cooling water channel 111. When the cooling water valve 140 is closed, no cooling water flows into the cooling water channel 111.

[0054] The number of cooling water valves 140 can be determined according to the number of cooling plates 110. For example, the number of cooling water valves 140 can be the same as the number of cooling plates 110. The number of cooling plates 110 can be 4, and the number of cooling water valves 140 can also be 4. One cooling plate 110 and one cooling water valve 140 are arranged on each outer side wall of the etching chamber, so that whether the cooling plate 110 corresponding to the outer side wall flows into the cooling water is controlled by the cooling water valve 140, the temperature of different outer side walls is controlled respectively, the temperature of the chamber is uniform, and the control effect of temperature stability is further improved.

[0055] In the embodiment of the present application, the proportional control adjusting valve 130 can be adjusted in angle, so as to control the flow of cooling water after passing through the proportional control adjusting valve 130. The proportional control adjusting valve 130 is used to adjust the proportional control adjusting valve 130 to a target angle according to the side wall temperature of the etching chamber, and the cooling water enters the cooling water channel 111 through the proportional control adjusting valve 130 at the target angle. That is, the side wall temperature of the etching chamber affects the angle of the proportional control adjusting valve 130, and the cooling water enters the cooling water channel 111 after passing through the proportional control adjusting valve 130, so the side wall temperature of the etching chamber affects the flow of cooling water after passing through the proportional control adjusting valve 130, and then the cooling effect of the cooling plate 110 is controlled.

[0056] As a possible implementation manner, the angle of the proportional control adjusting valve 130 is proportional to the side wall temperature of the etching chamber, that is, the higher the side wall temperature of the etching chamber, the larger the angle of the proportional control adjusting valve 130, the larger the flow of cooling water flowing into the cooling water channel 111, and the larger the cooling effect of the cooling plate 110. That is, the angle of the proportional control adjusting valve 130 can be controlled, so as to control the flow of cooling water after passing through the proportional control adjusting valve 130, so as to realize accurate control of the side wall temperature of the etching chamber.

[0057] The number of proportional control valves 130 can be determined according to the number of cooling plates 110, for example, the number of proportional control valves 130 can be the same as the number of cooling plates 110. If the number of cooling plates 110 is 4, the number of proportional control valves 130 can also be 4, and one cooling plate 110 and one proportional control valve 130 are arranged on the outer side wall of each etching chamber, so as to adjust the angle of the corresponding proportional control valve 130 according to the side wall temperature of each side wall, and then control the flow of cooling water flowing into the corresponding cooling plate 110 of each outer side wall, so as to control the temperature of different side walls respectively, realize the uniformity of the chamber temperature, and further improve the control effect of temperature stability.

[0058] In the embodiment of the present application, the etching chamber cooling system further comprises a heat-conducting silica gel pad. The heat-conducting silica gel pad is arranged between the cooling plate 110 and the outer side wall of the etching chamber, further realizing the close fit between the cooling plate 110 and the outer side wall of the etching chamber. The heat-conducting silica gel pad can eliminate the air gap between the cooling plate 110 and the outer side wall of the etching chamber, realize the sufficient contact between the cooling plate 110 and the outer side wall of the etching chamber, improve the overall heat conversion capacity, and enhance the cooling effect. The thickness of the heat-conducting silica gel pad can be 0.5 millimeters.

[0059] In the embodiment of the present application, the etching chamber cooling system further comprises a controller 150, as shown in Figure 3 The controller 150 is electrically connected with the chamber temperature measuring device 120 and the proportional control valve 130. The controller 150 can obtain the side wall temperature of the etching chamber from the chamber temperature measuring device 120, judge whether the side wall temperature of the etching chamber is greater than the set temperature, if the side wall temperature of the etching chamber is greater than the set temperature, it represents that the temperature of the chamber needs to be controlled, the side wall temperature of the etching chamber is converted into a current signal and sent to the proportional control valve 130, so that the proportional control valve 130 adjusts the proportional control valve 130 to the target angle according to the current signal converted by the side wall temperature of the etching chamber. That is to say, when the side wall temperature of the etching chamber is measured to be high, the proportional control valve 130 can be controlled to adjust the angle, so as to control the flow of cooling water according to the angle, and then reduce the side wall temperature of the etching chamber.

[0060] In actual application, if the controller 150 judges that the side wall temperature of the etching chamber is less than the set temperature, the controller 150 can control the proportional control valve to be closed, that is, no cooling water is introduced into the cooling water channel 111.

[0061] In the embodiment of the present application, the outer sidewall of the etching chamber has a receiving groove recessed into the chamber, and the cooling plate 110 can be embedded in the receiving groove. Embedding the cooling plate 110 in the receiving groove can reasonably utilize the outer space of the chamber, does not affect the installation and use of other components of the chamber, is convenient for disassembly and equipment maintenance, and has more obvious cooling effect on the sidewall of the chamber.

[0062] Therefore, the etching chamber cooling system provided by the embodiment of the present application can determine the target angle of opening of the proportional control regulating valve according to the sidewall temperature of the etching chamber measured by the chamber temperature measuring device, control the flow of cooling water entering the cooling water channel through the target angle, control the temperature adjustment effect of the cooling plate on the outer sidewall of the etching chamber, realize the uniformity and stability of the outer sidewall of the etching chamber, that is, maintain the temperature stability of the outer sidewall of the etching chamber by using the cooling plate provided with cooling water, then control the temperature of the etching chamber, and finally improve the performance of the semiconductor device manufactured.

[0063] Based on the etching chamber cooling system provided in the above embodiment, the embodiment of the present application further provides an etching chamber cooling method, and the working principle thereof will be described in detail below with reference to the accompanying drawings. Referring to Figure 4 , which is a flowchart of an etching chamber cooling method provided by the embodiment of the present application. The etching chamber cooling method provided by the embodiment of the present application is applied to the etching chamber cooling system described in the above embodiment, and can be executed by the controller included in the etching chamber cooling system.

[0064] The etching chamber cooling method provided by the embodiment of the present application includes the following steps:

[0065] S101, measuring the sidewall temperature of the etching chamber by using a chamber temperature measuring device.

[0066] In the embodiment of the present application, in order to realize temperature control of the etching chamber, the sidewall temperature of the etching chamber can be measured by using a chamber temperature measuring device.

[0067] Specifically, the number of chamber temperature measuring devices can also be determined according to the shape of the outer sidewall of the etching chamber. When the etching chamber is a hexahedral chamber, the outer sidewall of the etching chamber is 4, and one chamber temperature measuring device is arranged on each outer sidewall of the etching chamber, so that the chamber temperature measuring device corresponding to each outer sidewall measures the temperature of the outer sidewall, so as to subsequently control the temperature of each outer sidewall according to the sidewall temperature, realize the uniformity of the chamber temperature, and further improve the control effect of temperature stability.

[0068] S102, controlling the proportional control regulating valve to adjust the proportional control regulating valve to a target angle according to the sidewall temperature of the etching chamber.

[0069] In the embodiments of the present application, after the sidewall temperature of the etching chamber is obtained, the proportional control regulating valve is controlled to adjust the proportional control regulating valve to a target angle according to the sidewall temperature of the etching chamber. The cooling water enters the cooling water channel through the proportional control regulating valve at the target angle, that is, the sidewall temperature of the etching chamber affects the angle of the proportional control regulating valve, and based on the cooling water entering the cooling water channel after passing through the proportional control regulating valve, the sidewall temperature of the etching chamber affects the flow rate of the cooling water after passing through the proportional control regulating valve, thereby controlling the cooling effect of the cooling plate.

[0070] Specifically, the number of proportional control regulating valves can be determined according to the number of cooling plates, for example, the number of proportional control regulating valves can be the same as the number of cooling plates. If the number of cooling plates is 4, the number of proportional control regulating valves can also be 4. One cooling plate and one proportional control regulating valve are arranged on the outer sidewall of each etching chamber, the chamber temperature measuring device corresponding to each outer sidewall measures the temperature of the outer sidewall, the proportional control regulating valve corresponding to each outer sidewall adjusts the angle according to the sidewall temperature, thereby controlling the flow rate of the cooling water flowing into the cooling plate corresponding to each outer sidewall, and the temperature of different outer sidewalls is controlled respectively, so that the temperature of the chamber is uniform and consistent, and the control effect of temperature stability is further improved.

[0071] S103, control the cooling water valve to open, and the cooling water enters the cooling water channel through the proportional control regulating valve at the target angle.

[0072] In the embodiments of the present application, after the proportional control regulating valve is adjusted to the target angle according to the sidewall temperature, the cooling water valve is controlled to open, so that the cooling water enters the cooling water channel through the proportional control regulating valve at the target angle, thereby achieving the cooling of the outer sidewall of the etching chamber.

[0073] Specifically, the number of cooling water valves can be determined according to the number of cooling plates, for example, the number of cooling water valves can be the same as the number of cooling plates. If the number of cooling plates is 4, the number of cooling water valves can also be 4. One cooling plate 110 and one cooling water valve are arranged on the outer sidewall of each etching chamber, and the cooling water valve corresponding to each outer sidewall is opened to pass the cooling water into the cooling water channel of the cooling plate corresponding to the outer sidewall, thereby controlling the temperature of the outer sidewall and achieving the uniformity and consistency of the temperature of the chamber, and the control effect of temperature stability is further improved.

[0074] In the embodiment of the present application, before controlling the proportional control adjusting valve, the controller can also determine whether the sidewall temperature of the etching chamber is greater than the set temperature, and if so, convert the sidewall temperature of the etching chamber into a current signal and send it to the proportional control adjusting valve; then the controller controls the proportional control adjusting valve to adjust the proportional control adjusting valve to the target angle according to the current signal, that is, the controller can control the proportional control adjusting valve to adjust to the angle calculated according to the current signal. That is, when the sidewall temperature of the etching chamber is measured to be high, the controller can control the proportional control adjusting valve to adjust the angle, so as to control the flow of cooling water according to the angle, and then reduce the sidewall temperature of the etching chamber.

[0075] In actual application, if the controller determines that the sidewall temperature of the etching chamber is less than the set temperature, the controller can control the proportional control adjusting valve to be closed, that is, no cooling water is introduced into the cooling water channel.

[0076] As can be seen, the etching chamber cooling method provided by the embodiment of the present application can determine the target angle of opening of the proportional control adjusting valve according to the sidewall temperature of the etching chamber measured by the chamber temperature measuring device, control the flow of cooling water entering the cooling water channel through the target angle, and then control the temperature adjustment effect of the cooling plate on the sidewall of the etching chamber, so as to realize the uniform and stable sidewall of the etching chamber, that is, to maintain the temperature stability of the sidewall of the etching chamber by using the cooling plate provided with cooling water, and then control the temperature of the etching chamber, and finally improve the performance of the semiconductor device manufactured.

[0077] The above is only the preferred embodiment of the present application, although the present application has been disclosed as above with the preferred embodiment, however, it is not intended to limit the present application. Any person skilled in the art, without departing from the scope of the technical solution of the present application, can make many possible changes and modifications to the technical solution of the present application by using the above disclosed methods and technical contents, or modify it as equivalent changes and equivalent embodiments. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the content of the technical solution of the present application, all still belong to the scope of protection of the technical solution of the present application.

Claims

1. An etch chamber cooling system, comprising: The etching chamber cooling system comprises a cooling plate, a chamber temperature measuring device, a proportional control regulating valve and a cooling water valve. The cooling plate is arranged on the outer sidewall of the etching chamber, and the cooling plate is provided with a cooling water channel. The chamber temperature measuring device is used to measure the sidewall temperature of the etching chamber. The proportional control regulating valve is used to adjust the proportional control regulating valve to a target angle according to the sidewall temperature of the etching chamber. The cooling water valve is used to open or close the cooling water channel, and the cooling water enters the cooling water channel through the proportional control regulating valve at the target angle.

2. The etch chamber cooling system of claim 1, wherein, The angle of the proportional control regulating valve is in a proportional relationship with the sidewall temperature of the etching chamber.

3. The etch chamber cooling system of claim 1, wherein, The shape and number of the cooling plate are determined according to the shape and number of the outer sidewall of the etching chamber.

4. The etch chamber cooling system of claim 3, wherein, The number of the cooling water valves is the same as the number of the cooling plates.

5. The etch chamber cooling system of claim 1, wherein, The outer sidewall of the etching chamber has a containing groove recessed into the chamber, and the cooling plate is embedded in the containing groove.

6. The etch chamber cooling system of claim 1, wherein, The etching chamber cooling system further comprises a heat-conducting silica gel pad. The heat-conducting silica gel pad is arranged between the cooling plate and the outer sidewall of the etching chamber.

7. The etch chamber cooling system of claim 1, wherein, The etching chamber cooling system comprises a controller. The controller is used to acquire the sidewall temperature of the etching chamber, determine whether the sidewall temperature of the etching chamber is greater than a set temperature, and if so, convert the sidewall temperature of the etching chamber into an electric current signal and send the electric current signal to the proportional control regulating valve. The proportional control regulating valve is used to adjust the proportional control regulating valve to a target angle according to the electric current signal.

8. The etch chamber cooling system of claim 7, wherein, If the sidewall temperature of the etching chamber is less than the set temperature, the controller is used to control the proportional control regulating valve to be closed.

9. The etch chamber cooling system of any one of claims 1-8, wherein, The cooling water channel is arranged in the shape of a letter S in the cooling plate.

10. The etch chamber cooling system of any one of claims 1-8, wherein, The number of the chamber temperature measuring devices is determined according to the shape and number of the outer sidewall of the etching chamber.

Images