Wafer bearing device

Abstract

The utility model discloses a wafer bearing device, which comprises an electrostatic chuck and a contact pin, and is characterized in that the electrostatic chuck is used for bearing and adsorbing a wafer; the contact pin is installed on the electrostatic chuck, the contact pin is provided with a grounding end and a discharging end, the contact pin is grounded through the grounding end, and the wafer is punctured and discharged through the discharging end. According to the wafer bearing device, accurate recognition of the wafer adsorption state can be achieved, and therefore the overall working efficiency is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a wafer carrying device. BACKGROUND

[0002] With the development of semiconductor technology, the demand for semiconductor wafers is also increasing. In the production process of wafers, the wafers need to be detected to ensure the production quality of the wafers. In the detection process of the wafers, the detection stability needs to be ensured, and the transmission path of the wafers needs to be ensured not to deviate, so as to ensure the line width accuracy in the wafer measurement. Therefore, the wafer carrying device needs to have high stability.

[0003] At present, an electrostatic chuck is usually used as the wafer carrying device, and the electrostatic chuck uses electrostatic adsorption to stably adsorb the wafer on the chuck surface. After the electrostatic chuck electrostatically adsorbs the wafer, the operator judges whether the adsorption is completed through the feedback of the wafer surface capacitance value, but in the third generation of semiconductors, most of the wafer surfaces do not have the feedback of the capacitance value, so that it is impossible to judge whether the electrostatic chuck completes the adsorption, which affects the subsequent operation and further affects the overall work efficiency. CONTENT OF THE INVENTION

[0004] The present application provides a wafer carrying device, which can accurately identify the adsorption state of the wafer, thereby ensuring the overall work efficiency.

[0005] The present application provides a wafer carrying device, which comprises: an electrostatic chuck for carrying and adsorbing a wafer; and a pin installed on the electrostatic chuck, the pin having a grounding end and a discharging end, the pin being grounded through the grounding end and piercing and discharging the wafer through the discharging end.

[0006] The wafer carrying device as above, wherein the electrostatic chuck has a carrying surface and a mounting portion, the carrying surface being used for carrying and adsorbing the wafer, the mounting portion being recessed in the carrying surface and extending in a direction perpendicular to the carrying surface, the pin being movably installed in the mounting portion in the extending direction of the mounting portion to allow the pin to move towards the wafer to contact and pierce the wafer.

[0007] The wafer carrying device as above, wherein the mounting portion is provided with an elastic member, the pin being installed in the mounting portion through the elastic member, the elastic member being used for applying an elastic force to the pin to make the pin extend out of the carrying surface under the action of the elastic force.

[0008] The wafer carrying device as claimed in any one of the preceding claims, wherein the bottom of the elastic member is fixedly connected to the mounting portion, and the top of the elastic member is fixedly connected to the pin; the wafer carrying device has an idle state and a carrying state; in the idle state, the elastic member is in a natural state, and the discharge end of the pin extends out of the carrying surface; in the carrying state, the wafer is carried on the carrying surface and abuts against the discharge end of the pin, so as to compress the elastic member and make it in a compressed state.

[0009] The wafer carrying device as claimed in any one of the preceding claims, wherein the mounting portion is provided with a driving motor, the driving motor is a linear motor, and the pin is connected to a driving end of the driving motor, the driving end being used to drive the pin to extend out of or retract into the carrying surface.

[0010] The wafer carrying device as claimed in any one of the preceding claims, wherein the electrostatic chuck has a plurality of mounting portions which are spaced apart along the circumferential direction of the electrostatic chuck, and each of the mounting portions is provided with a pin, and each of the pins is movably arranged in the corresponding mounting portion.

[0011] The wafer carrying device as claimed in any one of the preceding claims, wherein, in a direction perpendicular to the carrying surface, the grounding end is arranged at the bottom of the pin, and the discharge end is arranged at the top of the pin, and the discharge end of the pin is in a pointed end structure.

[0012] The wafer carrying device as claimed in any one of the preceding claims, further comprising an electrostatic detection assembly, the electrostatic detection assembly comprising a mounting bracket and an electrostatic detection member mounted on the mounting bracket, the mounting bracket being arranged in a spaced-apart manner with the carrying surface, and the electrostatic detection member being used to detect the charged quantity of the wafer in a non-contact state.

[0013] The wafer carrying device as claimed in any one of the preceding claims, wherein the mounting bracket has a plurality of fixing grooves, the electrostatic detection member is detachably mounted in one of the fixing grooves, and the depths of the plurality of fixing grooves in a direction perpendicular to the carrying surface are different.

[0014] The wafer carrying device as claimed in any one of the preceding claims, wherein the mounting bracket has a sliding groove, and the electrostatic detection member is slidably mounted in the sliding groove in a direction perpendicular to the carrying surface.

[0015] The wafer carrying device of the present application comprises an electrostatic chuck and a pin, when a wafer is carried and adsorbed on the electrostatic chuck, the discharge end of the pin mounted on the electrostatic chuck can contact the surface of the wafer to pierce the surface of the wafer, since the pin also has a grounding end and is grounded through the grounding end, the grounding of the pierced part of the wafer surface can be realized, and positive and negative ions are combined with the wafer through the pin, so that the wafer surface is in a charged state. When the surface of the wafer is detected, the charged wafer surface can exist a capacitance value feedback, so that the adsorption state of the electrostatic chuck to the wafer can be accurately identified through the capacitance value change, thereby ensuring the working efficiency of the wafer carrying device. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced. Those drawings can help the ordinary skilled in the art to obtain other drawings without creative effort.

[0017] Fig. 1 A sectional view of a wafer carrying device according to an embodiment of the present application;

[0018] Fig. 2 A side view of a wafer carrying device according to an embodiment of the present application;

[0019] Fig. 3 A top view of a wafer carrying device according to an embodiment of the present application.

[0020] Explanation of the drawings:

[0021] 10, electrostatic chuck; 11, carrying surface; 12, mounting portion; 13, elastic member;

[0022] 20, pin; 21, discharge end;

[0023] 30, electrostatic detection assembly; 31, mounting bracket; 311, fixing groove; 32, electrostatic detection member. DETAILED DESCRIPTION

[0024] The features and exemplary embodiments of various aspects of the present application will be described in detail below, in order to make the purposes, technical solutions and advantages of the present application more clear and apparent, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of these specific details by those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0025] With the development of semiconductor technology, the demand for semiconductor wafers has also increased. In the production process of wafers, the wafers need to be detected to ensure the production quality of the wafers. In the detection process of the wafers, the detection stability needs to be ensured, and the transmission path of the wafers needs to be ensured not to deviate, so as to ensure the line width accuracy in the wafer measurement. Therefore, the wafer carrying device needs to have high stability.

[0026] Currently, an electrostatic chuck is usually used as a wafer bearing device, and the electrostatic chuck will use electrostatic adsorption to stably adsorb the wafer on the chuck surface. The electrostatic chuck is a general term for an ultra-clean sheet bearing and grabbing and carrying equipment suitable for atmospheric or vacuum environment. The adsorption principle of the electrostatic chuck is as follows: when an electrostatic object approaches another non-electrostatic object, due to electrostatic induction, the side of the non-electrostatic object close to the electrostatic object will gather charges of opposite polarity to the charges carried by the electrostatic object (the other side will generate the same amount of same polarity charges), and due to the attraction between opposite charges, the electrostatic adsorption phenomenon will occur.

[0027] After the electrostatic chuck adsorbs the wafer, the capacitance value of the wafer surface can be detected in real time, and the capacitance value displayed by the controller is fed back. When it is judged according to the feedback result of the capacitance value that the electrostatic chuck has completed the adsorption of the wafer, the machine will perform a wafer transfer operation according to the feedback of the signal to complete the subsequent quality detection operation of the wafer.

[0028] With the development of semiconductor technology, the application of the third generation semiconductor is more and more widely used. Compared with the previous two generations of semiconductor materials, the third generation semiconductor material has a wider band gap, which makes them can be applied to high temperature, high frequency, strong radiation and other environments. However, in the current third generation semiconductor, such as GaAs (gallium arsenide), LT (lithium tantalate), LN (lithium niobate) and other materials made of semiconductor wafers, there is no capacitance value feedback on the wafer surface, which leads to the inability to determine whether the electrostatic chuck has completed the adsorption, affecting the subsequent wafer transfer and detection operations, and further affecting the overall work efficiency. In order to solve the above problems, the wafer bearing device provided by the embodiments of the present application.

[0029] As shown in Figs. 1 to 3 The wafer bearing device provided by the embodiments of the present application includes an electrostatic chuck 10 for bearing and adsorbing a wafer, and a pin 20 installed on the electrostatic chuck 10. The pin 20 has a grounding end and a discharge end 21. The pin 20 is grounded through the grounding end and punctures and discharges the wafer through the discharge end 21.

[0030] In the embodiment, the wafer carrying device comprises an electrostatic chuck 10 and a pin 20. When the wafer is carried and adsorbed on the electrostatic chuck 10, the discharge end 21 of the pin 20 installed on the electrostatic chuck 10 can contact the wafer surface to pierce the wafer surface. Since the pin 20 also has a grounding end and is grounded through the grounding end, the wafer surface piercing part can be grounded. Positive and negative ions are combined with the wafer through the pin 20, so that the wafer surface is in a charged state. When the wafer surface is detected, the wafer surface in a charged state can provide a capacitance value feedback, so that the adsorption state of the electrostatic chuck 10 to the wafer can be accurately identified through the capacitance value change, thereby ensuring the working efficiency of the wafer carrying device.

[0031] Since the grounding end of the pin 20 can be grounded, the positive and negative ions on the ground can be introduced into the pin 20. When the discharge end 21 of the pin 20 contacts the wafer surface, the positive and negative ions in the pin 20 can flow into the uncharged wafer surface.

[0032] It should be noted that the pin 20 pierces the wafer surface with the discharge end 21 to pierce the insulating layer of the wafer surface to promote the complete combination of positive and negative ions with the wafer surface, thereby charging the wafer surface.

[0033] As shown in FIG. 1, Figs. 1 to 3 The wafer carrying device of the embodiment comprises an electrostatic chuck 10 and a pin 20. The electrostatic chuck 10 has a carrying surface 11 and a mounting portion 12. The carrying surface 11 is used to carry and adsorb the wafer. The mounting portion 12 is recessed in the carrying surface 11 and extends in a direction perpendicular to the carrying surface 11. The pin 20 is movably installed in the mounting portion 12 to allow it to move towards the wafer to contact and pierce the wafer.

[0034] In the embodiment, the mounting portion 12 of the electrostatic chuck 10 is recessed in the carrying surface 11 to provide a mounting space for the pin 20 on the electrostatic chuck 10, avoiding the case that the protrusion height of the pin 20 on the carrying surface 11 is too high to cause the wafer to be unable to be stably adsorbed on the carrying surface 11. When the wafer is carried, the wafer can be parallel to the carrying surface 11, and the bottom of the wafer can contact the pin 20 to realize piercing and conduction of the wafer.

[0035] When the pin 20 is installed in the mounting portion 12, the pin 20 can freely move along the extension direction of the mounting portion 12 to realize piercing and conduction or avoidance of the wafer by the pin 20.

[0036] Specifically, the mounting portion 12 is a hole structure that penetrates the electrostatic chuck 10. The pin 20 can contact the wafer through one end of the hole-shaped mounting portion 12 and be grounded through the other end of the hole-shaped mounting portion 12. Therefore, the hole-shaped mounting portion 12 facilitates grounding connection of the grounding end of the pin 20.

[0037] Optionally, the mounting portion 12 can also be a recessed structure recessed in the bearing surface 11, with the discharge end 21 of the pin 20 facing the open end of the recessed structure to facilitate the discharge end 21 piercing and discharging the wafer surface, while the grounding end faces the bottom of the recessed structure. The grounding end can be grounded to the external ground through a grounding wire passing through the electrostatic chuck 10. The grounding wire can conduct positive and negative ions from the ground to the pin 20, thereby enabling the discharge end 21 of the pin 20 to discharge the wafer. By making the mounting portion 12 a recessed structure, it is possible to prevent the pin 20 from exceeding the thickness range of the electrostatic chuck 10 when moving downwards, thus preventing the discharge end 21 of the pin 20 from being separated from the wafer and unable to contact it.

[0038] like Fig. 1 As shown in the embodiment of this application, the wafer carrier device includes an elastic member 13 in the mounting part 12. The pin 20 is mounted in the mounting part 12 through the elastic member 13. The elastic member 13 is used to apply an elastic force to the pin 20 so that the pin 20 extends out of the carrier surface 11 under the action of the elastic force.

[0039] In practice, the pin 20 is mounted in the mounting portion 12 via the elastic member 13. When the elastic member 13 undergoes elastic deformation, it can drive the pin 20 to move together, so that the pin 20 extends out of the bearing surface 11 under the elastic force of the elastic member 13 and pierces the wafer surface. The driving structure of the elastic member 13 is relatively simple, which can reduce the overall cost of the wafer bearing device and facilitate its installation in the mounting portion 12. It can drive the pin 20 and control its movement direction without the need for an external electric drive device.

[0040] Specifically, the elastic element 13 is a cylindrical spring with the same extension direction as the mounting part 12, and the elastic element 13 is a compression spring that can generate elastic force under compression.

[0041] like Fig. 1 As shown in the embodiment of this application, the wafer carrier device has an elastic member 13 whose bottom is fixedly connected to the mounting part 12 and whose top is fixedly connected to the pin 20. The wafer carrier device has an unloaded state and a loaded state. In the unloaded state, the elastic member 13 is in a natural state and the discharge end 21 of the pin 20 extends out of the bearing surface 11. In the loaded state, the wafer is supported on the bearing surface 11 and abuts against the discharge end 21 of the pin 20 to compress the elastic member 13 and put it in a compressed state.

[0042] In the empty state of the wafer carrying device, the wafer is not arranged on the carrying surface 11, the pins 20 and the elastic member 13 are not pressed by the wafer, and the elastic member 13 is in a natural state as a whole. The overall length of the elastic member 13 is relatively long, so that the discharge end 21 of the pin 20 connected thereto can extend out of the carrying surface 11, in preparation for contact with the wafer. In the carrying state of the wafer carrying device, the wafer is arranged on the carrying surface 11 and in contact with the discharge end 21 of the pin 20. Under the action of the gravity of the wafer, the wafer and the discharge end 21 have a mutual force of interaction, the discharge end 21 can pierce the surface of the wafer, thereby completing the discharge operation, and the wafer can also exert a downward pressure on the pin 20 and the elastic member 13, so that the elastic member 13 is in a compressed state. At this time, the discharge end 21 of the pin 20 is in the same plane as the carrying surface 11.

[0043] The wafer carrying device of the embodiment of the present application adopts the design that the top of the elastic member 13 is connected to the pin 20, so that the pin 20 can automatically extend out of and retract into the carrying surface 11 along with the wafer, without the need for an external electric driving device to drive the pin 20. Moreover, the maximum force of interaction between the discharge end 21 of the pin 20 and the wafer is the resultant force of the gravity of the wafer and the elastic force of the elastic member 13, so that the insertion depth of the discharge end 21 into the wafer surface can be prevented from being too deep, thereby preventing damage to the structure of the wafer after piercing the insulating layer, and the piercing depth can be controlled by selecting an elastic member 13 with a suitable elastic force.

[0044] The wafer carrying device of another embodiment of the present application, wherein the mounting portion 12 is provided with a driving motor, the driving motor is a linear motor, and the pin 20 is connected to the driving end of the driving motor, and the driving end is used to drive the pin 20 to extend out of or retract into the carrying surface 11.

[0045] In specific implementation, the driving motor is arranged in the mounting portion 12, and the driving end of the driving motor is connected to the pin 20. Since the driving motor is a linear motor, the driving end can move the pin 20 movably arranged along the extension direction of the mounting portion 12. When the wafer is carried on the carrying surface 11, the driving motor can drive the discharge end 21 of the pin 20 to contact the surface of the wafer, thereby achieving piercing and discharging on the surface of the wafer. The arrangement of the driving motor in the mounting portion 12 can achieve free control of the movement of the pin 20, and facilitate the extension and retraction operation of the pin 20.

[0046] The wafer carrying device of the embodiment of the present application, wherein the electrostatic chuck 10 has a plurality of mounting portions 12 spaced apart along the circumferential direction thereof, and each mounting portion 12 has a pin 20 movably arranged therein.

[0047] In specific implementation, a plurality of mounting portions 12 are arranged at intervals in the circumferential direction of the electrostatic chuck 10, and a pin 20 is arranged in each mounting portion 12, so that different parts of the wafer carried on the carrying surface 11 can be punctured and discharged, and each part of the wafer can be charged, and the capacitance of the wafer is easier to detect in subsequent detection.

[0048] Specifically, the plurality of mounting portions 12 are uniformly arranged at intervals in the circumferential direction of the electrostatic chuck 10, so that each part of the wafer in the circumferential direction can be uniformly charged after puncturing and discharging the wafer, thereby further improving the accuracy of capacitance detection.

[0049] In the wafer carrying device, the grounding end is arranged at the bottom of the pin 20, the discharging end 21 is arranged at the top of the pin 20, and the discharging end 21 of the pin 20 is in a pointed end structure.

[0050] In specific implementation, the grounding end is arranged at the bottom of the pin 20, which facilitates grounding of the pin 20, and the discharging end 21 is arranged at the top of the pin 20, which facilitates the pin 20 to extend out of the carrying surface 11 and contact the wafer surface to puncture and discharge the wafer surface. In addition, the discharging end 21 is in a pointed end structure, which can more effectively puncture the insulating layer of the wafer surface, avoid the insulating layer not being punctured to cause the pin 20 to fail to transfer positive and negative ions to the wafer, and thus affect the detection of the capacitance of the wafer surface.

[0051] In the wafer carrying device, the electrostatic detection assembly 30 further includes a mounting bracket 31 and an electrostatic detection piece 32 mounted on the mounting bracket 31, the mounting bracket 31 is arranged at intervals from the carrying surface 11, and the electrostatic detection piece 32 is used to detect the charged quantity of the wafer in a non-contact state with the wafer. It should be noted that the electrostatic detection piece 32 can accurately detect the static voltage value of the wafer surface and the electrostatic discharge phenomenon of the wafer when detecting the charged quantity of the wafer.

[0052] In specific implementation, the electrostatic detection assembly 30 includes the mounting bracket 31 and the electrostatic detection piece 32, the mounting bracket 31 is arranged at intervals from the carrying surface 11, so that the electrostatic detection piece 32 mounted on the mounting bracket 31 can be spaced apart from the carrying surface 11 by a certain distance, and the electrostatic detection piece 32 can detect the charged quantity of the wafer in a non-contact state. Non-contact detection can avoid direct contact between the electrostatic detection piece 32 and the wafer on the carrying surface 11 during detection, thereby affecting the charged quantity of the wafer surface, causing the capacitance of the wafer to change, and thus the specific adsorption state of the wafer cannot be determined.

[0053] Specifically, the wafer carrying device has a mounting base, the electrostatic detection assembly 30 is mounted on the mounting base and spaced apart from the electrostatic chuck 10 as a whole, and the two are spaced apart in the thickness direction of the electrostatic chuck 10 (i.e. the direction perpendicular to the carrying surface 11), so as to facilitate the electrostatic detection of the wafer on the carrying surface 11 of the electrostatic chuck 10 by the electrostatic detection assembly 30.

[0054] As shown in Fig. 3 the wafer carrying device of the embodiment of the present application, wherein the mounting bracket 31 has a plurality of fixing grooves 311, the electrostatic detection piece 32 is detachably mounted in one of the fixing grooves 311, and the depths of the plurality of fixing grooves 311 in the direction perpendicular to the carrying surface 11 are different.

[0055] In specific implementation, the depths of the plurality of fixing grooves 311 of the mounting bracket 31 are different, and when the electrostatic detection piece 32 is mounted, the electrostatic detection piece 32 can be mounted in a suitable fixing groove 311 according to the actual detection height requirement, so as to complete the height adjustment of the electrostatic detection piece 32. The detachable mounting of the electrostatic detection piece 32 and the fixing groove 311 improves the efficiency of the height adjustment of the electrostatic detection piece 32, thereby improving the overall working efficiency of the wafer carrying device.

[0056] Specifically, the bottom of the fixing groove 311 is in an arc structure, and when the electrostatic detection piece 32 enters the groove from the opening of the fixing groove 311, the arc structure of the bottom facilitates the opening of the fixing groove 311 to be enlarged, so as to facilitate the clamping of the electrostatic detection piece 32, and after the clamping of the electrostatic detection piece 32 is completed, the opening of the fixing groove 311 can also be contracted, thereby improving the clamping stability of the electrostatic detection piece 32.

[0057] The wafer carrying device of another embodiment of the present application, wherein the mounting bracket 31 has a sliding groove, and the electrostatic detection piece 32 is slidably mounted in the sliding groove in the direction perpendicular to the carrying surface 11.

[0058] In specific implementation, the electrostatic detection piece 32 can freely slide in the sliding groove in the direction perpendicular to the carrying surface 11, so as to realize the free adjustment of the setting height of the electrostatic detection piece 32, and when different wafers need to be electrostatically detected, the electrostatic detection piece 32 can be adjusted according to the actual requirement, so that the spacing between the electrostatic detection piece 32 and the wafer surface meets the requirement.

[0059] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0060] The above description is merely illustrative of the application, and not restrictive. Various modifications can be made by those skilled in the art without departing from the scope of the application. Thus, it is intended that the scope of the application should be determined by the appended claims and their equivalents.

Claims

1. A wafer carrier apparatus, comprising: The utility model relates to a wafer carrying device, including: An electrostatic chuck (10) for carrying and adsorbing a wafer; A pin (20) mounted on the electrostatic chuck (10), the pin (20) having a grounding end and a discharge end (21), the pin (20) being grounded through the grounding end and puncturing and discharging the wafer through the discharge end (21).

2. The wafer carrier apparatus of claim 1, wherein, The electrostatic chuck (10) has a carrying surface (11) for carrying and adsorbing the wafer and a mounting portion (12) recessed in the carrying surface (11) and extending in a direction perpendicular to the carrying surface (11), the pin (20) being movably mounted in the mounting portion (12) in the extending direction of the mounting portion (12) to allow it to move towards the wafer to contact and puncture the wafer.

3. The wafer carrier apparatus of claim 2, wherein, The mounting portion (12) is provided with an elastic member (13), the pin (20) being mounted in the mounting portion (12) through the elastic member (13), the elastic member (13) being used to apply an elastic force to the pin (20) to make the pin (20) extend out of the carrying surface (11) under the action of the elastic force.

4. The wafer carrier apparatus of claim 3, wherein, The bottom of the elastic member (13) is fixedly connected to the mounting portion (12) and the top is fixedly connected to the pin (20); The wafer carrying device has an unloaded state and a carrying state, in the unloaded state, the elastic member (13) is in a natural state, and the discharge end (21) of the pin (20) extends out of the carrying surface (11); in the carrying state, the wafer is carried on the carrying surface (11) and abuts against the discharge end (21) of the pin (20) to compress the elastic member (13) to make it in a compressed state.

5. The wafer carrier apparatus of claim 2, wherein, The mounting portion (12) is provided with a driving motor, the driving motor being a linear motor, the pin (20) being connected to a driving end of the driving motor, the driving end being used to drive the pin (20) to extend out of or retract into the carrying surface (11).

6. The wafer carrier apparatus of claim 2, wherein, The electrostatic chuck (10) has a plurality of mounting portions (12) spaced apart along the circumference thereof, each of the mounting portions (12) having the pin (20) movably arranged therein.

7. The wafer carrier apparatus of claim 2, wherein, In a direction perpendicular to the carrying surface (11), the grounding end is arranged at the bottom of the pin (20) and the discharge end (21) is arranged at the top of the pin (20), and the discharge end (21) of the pin (20) is in a pointed end structure.

8. The wafer carrier apparatus of claim 2, wherein, Further including: An electrostatic detection assembly (30) including a mounting bracket (31) and an electrostatic detection member (32) mounted on the mounting bracket (31), the mounting bracket (31) being arranged in spaced apart relation to the carrying surface (11), the electrostatic detection member (32) being used to detect the charged quantity of the wafer in a non-contact state with the wafer.

9. The wafer carrier apparatus of claim 8, wherein, The mounting bracket (31) has a plurality of fixing grooves (311), and the electrostatic detection member (32) is detachably mounted in one of the fixing grooves (311), and the depths of the fixing grooves (311) in the direction perpendicular to the bearing surface (11) are different.

10. The wafer carrier apparatus of claim 8, wherein, The mounting bracket (31) has a sliding groove, and the electrostatic detection member (32) is slidably mounted in the sliding groove in the direction perpendicular to the bearing surface (11).

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