Ultrathin VC liquid cooling plate

Abstract

The utility model discloses an ultrathin VC liquid cooling plate which comprises a liquid cooling plate body, a circulation pipeline structure and a heat dissipation fin structure. The circulating pipeline structure is connected with a circulating pump; the liquid cooling plate body is provided with a reinforcing structure; the circulating pipeline structure is filled with cooling liquid; the circulating pipeline structure is provided with a water inlet pipe, a circulating pipeline and a water outlet pipe; the overlook plane structure of the circulation pipeline is in a wave shape. The plane structure of the pipeline is a wave structure. According to the utility model, the circulation pipeline structure and the circulation pump are arranged to realize the function of flowing heat dissipation, and the wavy circulation management structure formed by a plurality of pipelines is adopted to increase the heat conduction and heat dissipation area of the liquid cooling plate, so that the heat dissipation effect of the liquid cooling plate body is improved; and the pipelines adopting the wave-shaped structures are combined to increase the flowing heat dissipation area of the liquid cooling plate body and the heat dissipation fins, so that the heat conduction and heat dissipation efficiency and effect are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of electronic equipment heat dissipation, specifically relates to a kind of ultra-thin VC liquid cooling plate. BACKGROUND

[0002] Liquid cooling plate is widely used in optical module, battery heat dissipation, control circuit board and other fields of heat dissipation treatment due to its light and thin advantage, such as patent number 201520679974.7, it discloses a kind of electric vehicle battery liquid cooling plate, including liquid cooling bottom plate, liquid cooling pipeline, heat transfer plate, cooling liquid and circulating pump, the liquid cooling bottom plate is equipped with circulating liquid cooling pipeline, multiple heat transfer plates are fixed at the surface of liquid cooling bottom plate with equal interval, battery monomer is installed between adjacent heat transfer plates, cooling liquid is built-in in liquid cooling pipeline, circulating pump is connected on liquid cooling pipeline.The utility model reduces the temperature difference in the interior of battery monomer by liquid cooling bottom plate and heat transfer plate simultaneously to battery monomer dissipate;By increasing heat transfer plate, the area of contact with battery is increased, and the battery heat dissipation efficiency is improved.But the liquid cooling plate still has the following problems: the liquid cooling bottom plate is equipped with circulating liquid cooling pipeline, and the heat transfer plate is arranged on the liquid cooling plate, and the circulating liquid cooling management is arranged in the bottom of the liquid cooling bottom plate in the manner of flat laying, which can only effectively flow and dissipate heat on the top surface of the liquid cooling plate body, the flow contact area is small, the heat dissipation effect is poor, the heat dissipation efficiency is slow, and the demand of existing high heat dissipation cannot be met;And the existing liquid cooling plate body has poor deformation resistance, cannot be manufactured ultra-thin, and affects the use range. SUMMARY

[0003] The utility model provides a kind of ultra-thin VC liquid cooling plate for the technical deficiency of present, aims to solve the technical problems of poor heat dissipation effect and slow efficiency in prior art.

[0004] The technical scheme adopted by the utility model to achieve the above-mentioned purposes is as follows:

[0005] An ultra-thin VC liquid cooling plate includes a liquid cooling plate body, the liquid cooling plate body is provided with a circulating pipeline structure and a heat dissipation fin structure; the circulating pipeline structure is arranged in the liquid cooling plate body; the circulating pipeline structure is connected with a circulating pump; the liquid cooling plate body is further provided with a reinforcing structure; the circulating pipeline structure is filled with cooling liquid;

[0006] The circulating pipeline structure is provided with an inlet pipe, a circulating pipeline and an outlet pipe, the inlet pipe is connected with one end of the circulating pipeline, the outlet pipe is connected with the circulating pipeline, and the inlet pipe and the outlet pipe are connected with the circulating pump.

[0007] Further improvement, the heat dissipation fin structure is arranged on the surface of the liquid cooling plate body; the heat dissipation fin structure includes a plurality of fins, and a plurality of heat dissipation fins are arranged on the liquid cooling plate body in an array manner; the plan view structure of the circulating pipeline is wave-shaped.

[0008] Further, the circulation pipeline comprises a plurality of pipelines, the pipelines are arranged at equal intervals, and the pipelines are connected to each other.

[0009] Further, the pipeline has a wave structure.

[0010] Further, the pipeline comprises a plurality of annular pipeline portions and a plurality of connecting pipeline portions, the annular pipeline portions are arranged in the heat dissipation fins respectively, the connecting pipeline portions are arranged in the liquid cooling plate body between two fins respectively, and the connecting pipeline portions are connected to the two annular pipeline portions arranged at intervals respectively.

[0011] Further, the two connecting pipeline portions arranged at the ends of the liquid cooling plate body are connected to the water inlet pipe and the water outlet pipe respectively.

[0012] Further, the reinforcing structure is arranged at the bottom of the liquid cooling plate body, and the reinforcing structure is one of a mesh structure and a honeycomb mesh structure formed by a plurality of reinforcing ribs.

[0013] Further, the thickness of the liquid cooling plate body is 4-12 mm.

[0014] Compared with the prior art, the one or more technical solutions of the ultra-thin VC liquid cooling plate provided in the embodiment of the present application at least have one of the following technical effects:

[0015] The circulation pipeline structure and the circulation pump are arranged to realize the flow heat dissipation, the wave-shaped circulation pipeline structure formed by a plurality of pipelines is adopted to improve the heat dissipation area of the liquid cooling plate, improve the heat dissipation effect of the liquid cooling plate body, and the pipeline with a wave shape is combined to improve the flow heat dissipation area of the liquid cooling plate body and the heat dissipation fin, and improve the efficiency and effect of the heat dissipation; the reinforcing structure is arranged to improve the supporting force, thereby improving the anti-deformation performance of the ultra-thin VC liquid cooling plate, making the liquid cooling plate body more light and thin, improving the applicability, and ensuring the cooling effect of the circulation pipeline structure. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] Fig. 1A schematic view of the overall structure of the ultra-thin VC liquid cooling plate of the present embodiment is shown in FIG. 1.

[0018] Fig. 2 A schematic view of the bottom of the ultra-thin VC liquid cooling plate of the present embodiment is shown in FIG. 4.

[0019] Fig. 3 A schematic view of the top of the circulation pipeline structure of the present embodiment is shown in FIG. 5.

[0020] Fig. 4 A schematic view of the front of the circulation pipeline structure of the present embodiment is shown in FIG. 6. DETAILED DESCRIPTION

[0021] The preferred embodiments described below are merely intended to illustrate the present application, and do not limit the protection scope of the present application.

[0022] Embodiment, refer to the accompanying drawings Figs. 1-4 An ultra-thin VC liquid cooling plate 1 includes a liquid cooling plate body 2, which is provided with a circulation pipeline structure 3 and a heat dissipation fin structure 4; the circulation pipeline structure 3 is arranged in the liquid cooling plate body 2; the circulation pipeline structure 3 is connected with a circulation pump; the liquid cooling plate body 2 is further provided with a reinforcing structure 5; the circulation pipeline structure 3 is filled with cooling liquid;

[0023] The circulation pipeline structure 3 is provided with an inlet pipe 30, a circulation pipeline 31 and an outlet pipe 32, the inlet pipe 30 is connected with one end of the circulation pipeline 31, the outlet pipe 32 is connected with the circulation pipeline 31, the inlet pipe 30 and the outlet pipe 32 are both connected with the circulation pump, and the circulation pump is used for the flow and heat dissipation of the internal cooling liquid.

[0024] The heat dissipation fin structure 4 is arranged on the surface of the liquid cooling plate body 2; the heat dissipation fin structure 4 includes a plurality of fins, and the plurality of fins are arranged on the liquid cooling plate body 2 in an array manner; the top plane structure of the circulation pipeline 31 is in a wave shape; the circulation pipeline 31 includes a plurality of pipelines 310, equal intervals are provided between the pipelines 310, and the pipelines 310 are connected and communicated with each other, and the circulation pipeline 31 is used for improving the flow and heat dissipation performance, thereby greatly improving the heat dissipation effect and efficiency.

[0025] The pipeline 310 is in a wave structure; the pipeline 310 comprises a plurality of annular pipeline portions 310a and a plurality of connecting pipeline portions 310b; the annular pipeline portions 310a are arranged in the heat dissipation fins respectively; the connecting pipeline portions 310b are arranged in the liquid cooling plate body 2 between two fins respectively, and the connecting pipeline portions 310b are connected and communicated with two annular pipeline portions 310a arranged at intervals respectively; two connecting pipeline portions 310b arranged at the ends of the liquid cooling plate body 2 are connected and communicated with the water inlet pipe 30 and the water outlet pipe 32 respectively; the wave structure pipeline 310 is used for increasing the contact area, thereby improving the heat dissipation effect and efficiency.

[0026] The reinforcing structure 5 is arranged at the bottom of the liquid cooling plate body 2; the reinforcing structure 5 is one of a mesh structure or a honeycomb mesh structure formed by a plurality of reinforcing ribs; the reinforcing structure 5 is used for improving the supporting force, thereby improving the deformation resistance of the ultra-thin VC liquid cooling plate 1, and ensuring the cooling effect of the circulating pipeline structure 3.

[0027] The thickness of the liquid cooling plate body 2 is 4-12 mm; the liquid cooling plate body 2 is made of metal material or ceramic material.

[0028] The utility model discloses a circulating pipeline structure and circulating pump are set up for realizing the role of flowing heat dissipation, and the wave-shaped circulating management structure formed by a plurality of pipelines is used for improving the heat dissipation area of the liquid cooling plate, improving the heat dissipation effect of the liquid cooling plate body, and the pipeline in the wave shape is used for improving the flowing heat dissipation area of the liquid cooling plate body and the heat dissipation fin, improving the efficiency and effect of heat dissipation.

[0029] The utility model discloses not limited to the above-mentioned embodiment, adopts the same or similar structure or device with the above-mentioned embodiment of the utility model, and obtains other for ultra-thin VC liquid cooling plate, all are within the protection scope of the utility model.

Claims

1. An ultra-thin VC liquid cooling plate, characterized in that: The ultra-thin VC liquid cooling plate comprises a liquid cooling plate body provided with a circulating pipeline structure and a heat dissipation fin structure; the circulating pipeline structure is arranged in the liquid cooling plate body; the circulating pipeline structure is connected with a circulating pump; the liquid cooling plate body is further provided with a reinforcing structure; the circulating pipeline structure is filled with cooling liquid; The circulating pipeline structure is provided with an inlet pipe, a circulating pipeline and an outlet pipe; the inlet pipe is connected with one end of the circulating pipeline; the outlet pipe is connected with the circulating pipeline; the inlet pipe and the outlet pipe are connected with the circulating pump; The heat dissipation fin structure is arranged on the surface of the liquid cooling plate body; the heat dissipation fin structure comprises a plurality of fins; the fins are arranged on the liquid cooling plate body in an array manner; the top view structure of the circulating pipeline is in a wave shape; The circulating pipeline comprises a plurality of pipelines; the pipelines are provided with equal intervals; the pipelines are connected with each other in communication; The pipeline has a wave structure in plan view; The pipeline comprises a plurality of annular pipeline portions and a plurality of connecting pipeline portions; the annular pipeline portions are arranged in the heat dissipation fins respectively; the connecting pipeline portions are arranged in the liquid cooling plate body between two fins respectively; the connecting pipeline portions are connected with two annular pipeline portions arranged at intervals in communication.

2. The ultra-thin VC liquid cooling plate of claim 1, wherein: The two connecting pipeline portions arranged at the end of the liquid cooling plate body are connected with the inlet pipe and the outlet pipe in communication respectively.

3. The ultra-thin VC liquid cooling plate of claim 1, wherein: The reinforcing structure is arranged at the bottom of the liquid cooling plate body; the reinforcing structure is one of a mesh structure and a honeycomb mesh structure formed by a plurality of reinforcing ribs.

4. The ultra-thin VC liquid cooling plate of claim 1, wherein: The thickness of the liquid cooling plate body is 4-12 mm.

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