Special-shaped multi-step LTCC coupler

By designing an irregularly shaped multi-step LTCC coupler and using isostatic pressing technology, the problem of the lead-out end not being flush with the welding port was solved, improving welding reliability and reducing manufacturing risk.

CN223638590UActive Publication Date: 2025-12-05GUIYANG SUNLORD SCHINDLER ELECTRONICS CO LTD
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Patent Information

Application Number
CN202423313385.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-05
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

The five leads of the existing LTCC coupler are not on the same plane as the soldering port of the product to be installed, resulting in a high reliability risk.

Method used

The design of the irregular multi-step LTCC coupler involves setting five leads with steps of different heights to be flush with the plane of the port to be welded, and using isostatic pressing to press six identical bar blocks to form a bar block unit, thereby reducing product step collapse caused by multiple stacking.

Benefits of technology

It improves welding reliability, reduces manufacturing risks in the gold wire bonding process, and ensures high port consistency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a special-shaped multi-step LTCC coupler which comprises an LTCC porcelain body, the LTCC porcelain body is provided with five leading-out ends, the five leading-out ends are arranged to be steps with different heights, and the heights of the five leading-out ends are kept flush with the plane of a port to be welded. According to the utility model, LTCC couplers with different steps are adopted, and the heights of matched welding ports can be kept consistent, so that the reliability risk after manufacturing is reduced in the gold wire bonding process.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a special-shaped multi-step LTCC coupler and belongs to the technical field of LTCC coupler preparation. BACKGROUND

[0002] The LTCC coupler is shown in the circuit as Figure 5 When the gold wire bonding process is matched with the product to be installed, the five lead-out ends are not on the same plane with the soldering port of the product to be installed, the height span is too large, and there is a reliability risk. SUMMARY

[0003] The technical problem to be solved by the utility model is to provide a special-shaped multi-step LTCC coupler that can match the port height of the product to be installed and improve the reliability.

[0004] The technical scheme adopted by the utility model is:

[0005] A special-shaped multi-step LTCC coupler comprises an LTCC porcelain body, the LTCC porcelain body is provided with five lead-out ends, the five lead-out ends are arranged as steps with different heights, and the heights are kept flush with the plane of the port to be soldered.

[0006] Further, the LTCC porcelain body is formed by pressing six bar blocks in an isostatic pressing manner, and the green porcelain tapes of the bar blocks have the same laminated shape.

[0007] The utility model has the advantages that, compared with the prior art, the utility model adopts the LTCC coupler with different steps, can match the soldering port height to keep consistent, and further ensures that the reliability risk after production is reduced in the gold wire bonding process; the bar block units with the same shape are formed by lamination and then pressing, and the product step collapse problem caused by multiple lamination is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a three-dimensional structure schematic view of the special-shaped multi-step LTCC coupler;

[0009] Figure 2 is another perspective three-dimensional structure schematic view of the special-shaped multi-step LTCC coupler;

[0010] Figure 3 is an installation structure schematic view of the special-shaped multi-step LTCC coupler;

[0011] Figure 4 is a circuit principle diagram of the special-shaped multi-step LTCC coupler;

[0012] Figure 5 is a circuit diagram of the LTCC coupler. DETAILED DESCRIPTION

[0013] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0014] Example 1: As Figures 1-5 As shown, an irregularly shaped multi-step LTCC coupler includes an LTCC ceramic body 1, which has five leads 2. The five leads 2 are set as steps of different heights, and their heights are flush with the plane of the port 3 to be welded. This can accommodate welding of different heights of each lead. The height of each lead of the prepared LTCC coupler is designed to be on the same plane as the port to be welded, thereby achieving the welding requirements of different planes.

[0015] The LTCC ceramic body 1 is constructed with six identical green ceramic strips stacked together, featuring five leads. It consists of six bar blocks pressed together using isostatic pressing. Each bar block has the same green ceramic strip shape, and different steps are used to individually stack bar block units. This process reduces the risk of product step collapse due to multiple stacking steps. Figure 4 The bar shown is divided into 6 sections.

[0016] Example 2: Figures 1-5 As shown, a method for fabricating an irregularly shaped multi-step LTCC coupler includes the following steps:

[0017] S1. Ingredients: Select a material with a dielectric constant of 7.2, and ball-mill the powder to a set particle size of 0.2-1μm;

[0018] S2, Casting: The ball-milled ingredients are prepared into a slurry, and casting technology is used to obtain high-precision green ceramic tapes of different thicknesses (the key film thickness is 134±3um);

[0019] S3. Cutting: Cut the green ceramic strip into strips of a set size (usually (152.4±0.5) mm * (152.4±0.5) mm);

[0020] S4. Opening: Opening holes in the green ceramic strip where holes are required;

[0021] S5. Printing: The printing method is screen printing. The design graphic is prepared on film, exposed and transferred to 400-mesh and 300-mesh steel wire mesh covered with photosensitive emulsion to form a printing fixture. By controlling the photosensitive emulsion coating thickness: 37±2μm~; printing GAP value: 0.5mm~3mm; printing squeegee pressure: 0.05MPa~0.20MPa; squeegee stepping speed: 0.01m / s~0.10m / s; each layer of the design model is printed on a green ceramic tape of corresponding thickness, and the printed inductance linewidth is 476±7μm.

[0022] S6, laminating: using special equipment (such as full-automatic alignment laminator) to laminate the green ceramic tapes with the same shape to form a bar block, and then laminating different bar blocks to form the green body of the final product;

[0023] S7, isostatic pressing: using isostatic pressing to perform final pressing on the laminated film; the highest temperature of isostatic pressing: 70±5℃; holding time: 600s~900s; holding pressure: 5100psi~8300psi, forming a bar block;

[0024] S8, cutting: cutting the bar block to form independent product units, and the unit size is 11.9±0.10*9.52±0.10;

[0025] S9, glue removal: performing 36-hour glue removal operation on the cut product according to the glue removal curve;

[0026] S10, sintering: using a tunnel furnace to sinter the product after glue removal; sintering temperature zone: 8~10, sintering temperature: 850℃~900℃, holding time: 80min~100min;

[0027] S11, chamfering: chamfering the sintered product;

[0028] S12, silver dipping: using a full-automatic end electrode silver dipping machine to coat the external end electrode of the chamfered product;

[0029] S13, silver firing: performing silver firing process on the silver-dipped product; using a tunnel furnace to perform silver firing; sintering temperature zone: 6, sintering temperature: 600℃~715℃, holding time: 25min~35min;

[0030] S14, electroplating: electroplating the silver-fired product into the final product, electroplating nickel-gold: nickel layer thickness: 4~8um, gold layer thickness: 3um~5um.

[0031] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application, therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A profiled multi-step LTCC coupler, characterized in that, The application relates to a LTCC ceramic body (1) provided with five lead-out ends (2) arranged as steps of different heights, which are flush with the plane of the to-be-welded port (3).

2. The profiled multi-step LTCC coupler according to claim 1, characterized in that, The LTCC ceramic body (1) is formed by isostatic pressing of six bar blocks, and the green ceramic tape laminates of each bar block are identical in shape.