Conductive structure of die-casting middle plate and middle frame

Abstract

The utility model provides a conductive structure for a middle frame of a die-casting middle plate. The conductive structure comprises a conductive column, a middle frame and a middle plate, the conductive column comprises a first conductive part and a second conductive part, and the first conductive part and the second conductive part are arranged on the same straight line; a through hole is formed in the middle plate, and the first conductive part penetrates through the through hole and is inserted into the through hole; the middle frame is provided with a groove, and the second conductive part is inserted into the groove. According to the utility model, the problem of poor net conductivity caused by welding cracking of the middle frame and the middle plate is solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic product accessories, concretely relates to a die casting middle plate middle frame conductive structure. BACKGROUND

[0002] In the intelligent mobile phone manufacturing process, the die casting middle plate mobile phone middle frame is the core structure support part, usually by aluminum alloy, magnesium alloy and other light metals through the die casting process manufacturing. In order to improve the functionality and reliability of the middle frame, especially the electromagnetic shielding performance. The middle frame and the middle plate are welded together before injection molding, and the middle frame and the middle plate are cracked at the welding position in the injection molding process. The welding quality directly affects the network division rate, that is, whether the functional area division of the middle frame meets the design standard. The mobile phone middle frame will detect the network division conductivity before delivery, and about 3% of the defective products will appear. CONTENT

[0003] The utility model discloses a technical solution to the problem: provide a kind of die casting middle plate middle frame conductive structure, solve the problem of network division conductivity caused by middle frame middle plate welding cracking.

[0004] The utility model discloses a technical solution: the utility model provides a kind of die casting middle plate middle frame conductive structure, comprising: conductive column and with the middle frame and middle plate of the conductive column insertion;

[0005] The conductive column includes a first conductive part and a second conductive part, and the first conductive part and the second conductive part are arranged on the same straight line.

[0006] The middle plate is provided with a through hole, and the first conductive part penetrates through the through hole and is inserted into the through hole.

[0007] The middle frame is provided with a groove, and the second conductive part is inserted into the groove.

[0008] Further, a first protrusion is arranged on the side wall of the first conductive part, and the first protrusion is arranged around the side wall of the first conductive part and perpendicular to the axis of the first conductive part.

[0009] Further, a second protrusion is arranged on the side wall of the second conductive part, and the second protrusion is arranged around the side wall of the second conductive part and perpendicular to the axis of the second conductive part.

[0010] Further, the conductive column further includes a column head, and the column head is fixedly connected to one end of the first conductive part away from the second conductive part.

[0011] Further, the diameter of the column head is greater than the diameter of the first conductive part, and the diameter of the first conductive part is greater than the diameter of the second conductive part.

[0012] Further, the groove side wall is provided with an opening, and the opening is arranged towards the side of the middle frame.

[0013] Further, the middle plate is provided with a first lug towards the side of the middle frame, the middle frame is provided with a second lug towards the side of the middle plate, the first lug and the second lug are in contact, the through hole is arranged on the first lug, and the groove is arranged on the second lug.

[0014] Further, the middle axis of the through hole and the middle axis of the groove coincide.

[0015] Further, the cross section of the groove is circular, and the diameter of the through hole is greater than the diameter of the groove.

[0016] Further, the die-casting middle plate middle frame conductive structure at least includes two groups of the conductive column, and the middle frame includes at least one group of the conductive column on the two symmetrical side edges.

[0017] The die-casting middle plate middle frame conductive structure has the advantages that: the first conductive part and the second conductive part of the conductive column are respectively inserted into the through hole of the middle plate and the groove on the middle frame, the contact area of the middle plate and the middle frame is increased, the cracking of the welding position of the middle frame and the middle plate caused by large glue flow pressure in the injection molding process is solved, and the qualified rate of the meshing rate is significantly improved. The design not only improves the conductive stability and electromagnetic compatibility, but also simplifies the manufacturing process, reduces the production cost, and enhances the overall structural strength and reliability of the middle frame of the mobile phone. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The die-casting middle plate middle frame conductive structure explosion schematic diagram provided by the embodiments of the present application;

[0020] Figure 2 The Figure 1 Structure schematic diagram of the middle conductive column;

[0021] Figure 3 The die-casting middle plate middle frame structure schematic diagram provided by the embodiments of the present application.

[0022] Explanation of the drawings:

[0023] 1-conductive column, 2-middle frame, 3-middle plate;

[0024] 11 - first conductive part, 12 - second conductive part, 13 - stud, 21 - first lug, 22 - groove, 23 - opening, 31 - second lug, 32 - through hole;

[0025] 111 - first protrusion, 112 - second protrusion. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0027] In the present application, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality of" is two or more.

[0028] The implementation of the present application will be described in detail below in combination with specific drawings:

[0029] Figure 1 The explosion schematic diagram of the conductive structure of the die-casting middle plate middle frame is provided for the embodiments of the present application; as shown in the figure, the conductive column 1 is inserted with the middle frame 2 and the middle plate 3, Figure 1 Figure 2 The explosion schematic diagram of the conductive structure of the die-casting middle plate middle frame is provided for the embodiments of the present application; as shown in the figure, the conductive column 1 is inserted with the middle frame 2 and the middle plate 3, Figure 1 ​The structure diagram of the middle conductive column is shown in the figure. The conductive column includes a column head 13, a first conductive part 11 and a second conductive part 12 connected in sequence from top to bottom. The diameter of the column head 13 is larger than that of the first conductive part 11, and the diameter of the first conductive part 11 is larger than that of the second conductive part 12. The first conductive part 11 is provided with a first protrusion 111, and the second conductive part 12 is provided with a second protrusion 121. The first protrusion 111 is circumferentially arranged around the first conductive part 11 and perpendicular to the axis of the first conductive part 11. The conductive column 1 is made of brass. The first protrusion 111 increases the friction between the first conductive part 11 and the through hole 32, and the second protrusion 121 increases the friction between the second conductive part 12 and the groove 22. In order to solve the problem of cracking of the welding position caused by large injection pressure during the welding connection of the middle frame and the middle plate before injection molding, a conductive column process is added, and the conductive connection is realized through the conductive column. The conductive column provides an additional mechanical fixing point, effectively disperses the stress generated during the injection molding process, thereby significantly reducing the pressure borne by the welding area and preventing cracking. The mechanical connection of the conductive column has strong tensile and shear resistance, making the overall structure of the middle frame and the middle plate more stable and improving the durability. The conductive column not only plays a mechanical fixing role, but also has a conductive function, forming an additional conductive path. Even if the conductive performance of the welding position is damaged due to a small crack, the conductive column can still maintain stable current conduction. The conductive redundancy design improves the conductive reliability between the middle frame and the middle plate, and reduces the risk of functional failure caused by poor conduction. The conductive column fixing structure can withstand the large glue flow pressure during the injection molding process, preventing the middle frame and the middle plate from separating or shifting due to the impact force of material flow.

[0030] The first ear 21 is provided on the side of the middle frame 2 facing the middle plate 3, and the second ear 31 is provided on the side of the middle plate 3 facing the middle frame 2. The first ear 21 and the second ear 31 are in contact. The first ear 21 is provided with a groove 22, and the side wall of the groove 22 is provided with an opening 23. The opening 23 is provided on the side of the middle plate 2, and the opening 23 is a rectangular opening parallel to the axis of the groove 22. The second ear 31 is provided with a through hole 32. The first conductive part 11 of the conductive column 1 is inserted into the through hole 32, and the second conductive part 12 is inserted into the groove 22. The groove 22 and the through hole 32 are arranged on the same straight line, the height of the groove 22 is greater than the length of the second conductive part 12, and the conductive column is divided into a first conductive part and a second conductive part, which are connected with the middle plate and the middle frame respectively, ensuring a stable conductive path from the middle plate to the middle frame. The insertion structure of the conductive column forms a continuous conductive path in the through hole and the groove, ensuring the electromagnetic shielding effect of each functional area, effectively isolating signal interference, preventing cross talk between the network division areas, and forming a bidirectional fixing structure by the conductive column passing through the through hole and being inserted into the groove, thereby increasing the connection strength between the middle plate and the middle frame and effectively preventing loosening or breaking caused by mechanical stress.

[0031] Figure 3 The die casting middle plate and middle frame structure provided by the embodiment of the present application is shown in the figure. Figure 3As shown, in this embodiment, three groups of conductive structures are provided between the die-cast middle plate and the middle frame, and the middle frame 2 includes at least one group of conductive structures on each of its two symmetrical sides. By arranging conductive structures on both sides of the middle frame, a more complete electromagnetic shielding layer can be formed, effectively preventing external electromagnetic interference (EMI) from entering the phone interior while suppressing internal signals from radiating outward. The symmetrical distribution of conductive structures ensures uniform distribution of shielding effects, effectively isolating electromagnetic interference between different functional modules and improving the overall electromagnetic compatibility (EMC) of the phone. The three groups of conductive structures provide multiple mechanical fixation points, enhancing the connection strength between the middle plate and the middle frame and effectively preventing the middle frame from deforming or loosening, especially showing stronger anti-shock performance when subjected to external force impact. The symmetrical arrangement further balances the mechanical stress distribution on both sides, reducing the risk of cracking caused by stress concentration and helping to improve the overall durability of the phone. Multiple groups of conductive structures increase the flexibility of connection during assembly, allowing for certain assembly errors. Even if one group of conductive structures is slightly offset, the overall conductive performance will not be significantly affected. This design helps to improve production yield and reduce rework and scrap rates.

[0032] Obviously, the above only describes preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

[0033] Note that in the description of the present application, the description referring to the terms "some embodiments", "other embodiments", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A die-cast mid-plate mid-frame conductive structure, characterized in that, The application relates to a conductive column and a middle frame and a middle plate matched with the conductive column. The conductive column comprises a first conductive part and a second conductive part, and the first conductive part and the second conductive part are arranged on the same straight line. A through hole is arranged on the middle plate, the first conductive part passes through the through hole and is matched in the through hole. A recess is arranged on the middle frame, and the second conductive part is matched in the recess. A first protrusion is arranged on the side wall of the first conductive part, the first protrusion is arranged around the side wall of the first conductive part and is perpendicular to the axis of the first conductive part.

2. An injection-molded mid-panel mid-frame conductive structure as defined in claim 1, wherein, A second protrusion is arranged on the side wall of the second conductive part, the second protrusion is arranged around the side wall of the second conductive part and is perpendicular to the axis of the second conductive part.

3. An injection-molded mid-panel mid-frame conductive structure as defined in claim 2, wherein, The conductive column further comprises a column head, and the column head is fixedly connected with one end of the first conductive part which is away from the second conductive part.

4. A die cast mid-panel mid-frame conductive structure as defined in claim 3, wherein, The diameter of the column head is larger than the diameter of the first conductive part, and the diameter of the first conductive part is larger than the diameter of the second conductive part.

5. An injection-molded mid-panel mid-frame conductive structure as defined in claim 4, wherein, An opening is arranged on the side wall of the recess, and the opening is arranged on the side of the middle frame.

6. An injection-molded mid-panel mid-frame conductive structure as defined in claim 1, wherein, A first lug is arranged on the side of the middle plate which is away from the middle frame, a second lug is arranged on the side of the middle frame which is away from the middle plate, the first lug and the second lug are in contact, the through hole is arranged on the first lug, and the recess is arranged on the second lug.

7. An injection-molded mid-panel mid-frame conductive structure as defined in claim 6, wherein, The central axis of the through hole is coincident with the central axis of the recess.

8. An injection-molded mid-panel mid-frame conductive structure as defined in claim 7, wherein, The cross section of the recess is circular, and the diameter of the through hole is larger than the diameter of the recess.

9. An injection-molded mid-panel mid-frame conductive structure as defined in claim 8, wherein, The die-casting middle plate and middle frame conductive structure at least comprises two groups of the conductive column, and at least one group of the conductive column is arranged on the two symmetrical side edges of the middle frame.

10. A die cast mid-panel mid-frame conductive structure as defined in claim 9, wherein, ​

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