Single tube assembly and heat dissipation device

Abstract

The utility model discloses a single tube assembly, and belongs to the field of heat dissipation devices. The single-tube assembly comprises a PCB, a plurality of single tubes are fixedly connected to the surface of the PCB, a plurality of substrate units are attached to the surfaces of the single tubes, insulating films are arranged between the substrate units and the single tubes, and the insulating films are located in gaps between every two adjacent substrate units. The projection area of the insulating film on the PCB at least covers part of the pins of each single tube, and the insulating film ensures safe electrical gaps between the pins of the single tubes and conductors. According to the single tube assembly, the safety distance between the single tube and the radiator can be guaranteed, and the stability of the device in the operation process is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of heat dissipation device, especially single tube subassembly and heat dissipation device. BACKGROUND

[0002] At present, the group string formula single tube high current photovoltaic inverter realizes the heat conduction to the single tube by pressing the ceramic substrate on the radiator, and the single tube high current photovoltaic inverter on the market basically adopts the scheme that eight or more single tubes are pressed on a piece of ceramic substrate for heat conduction.

[0003] The scheme is widely applied because of high heat conduction efficiency and relatively simple process, but because the single tubes pressed on a piece of ceramic substrate are more, the ceramic substrate needs to be larger, and the risk of fragmentation of the ceramic substrate increases with the area of the ceramic substrate being too large, once the ceramic substrate is fragmented, the safety distance between the single tube and the radiator cannot be guaranteed, the device is prone to failure and unstable operation. UTILITY MODEL CONTENT

[0004] The utility model provides a single tube subassembly and heat dissipation device, can guarantee the safety distance between single tube and radiator, improve the stability of device in the operation process.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme:

[0006] The utility model discloses a single tube subassembly, including the PCB board, the surface fixed connection of PCB board has multiple single tubes, the surface of multiple single tubes is attached with multiple substrate units, the insulating film is arranged between substrate unit and single tube, the insulating film is located on the gap between adjacent two substrate units, and the projection area of insulating film on the PCB board covers at least part pin of each single tube, and the insulating film ensures the safe electrical clearance between the pin of single tube and conductor.

[0007] Preferably, the width of the insulating film is 0.1-0.5mm.

[0008] Preferably, the substrate unit has a piece of substrate.

[0009] Preferably, it further includes single tube pressing strip, the single tube is welded to the PCB board, the single tube pressing strip is located on the PCB board, the single tube pressing strip has accommodating space, and the single tube is located in the accommodating space.

[0010] Preferably, the corresponding relationship between the single tube and the substrate unit is that one substrate unit is pressed on at least two single tubes.

[0011] Preferably, the side of the single tube close to the substrate unit is provided with a first heat conduction layer.

[0012] Preferably, the substrate unit is provided with a second heat-conducting layer on the side away from the single tube.

[0013] Preferably, the second heat-conducting layer comprises a heat-conducting silicone grease layer.

[0014] The utility model discloses still a kind of heat sink, and the heat dissipation end of the heat sink is contacted with the substrate unit of the single tube subassembly as described above.

[0015] Preferably, the third heat-conducting layer is provided between the substrate unit and the heat sink, and the third heat-conducting layer comprises a heat-conducting silicone grease layer.

[0016] The utility model has the beneficial effects compared with prior art:

[0017] By providing an insulating film capable of isolating the electrical gap between the single tube pin and the conductor on the gap between the substrate units and the position of the single tube pin, the safe electrical gap is maintained in the case that the substrate unit is broken and the safety distance between the single tube and the conductor is insufficient, and the cost of the device is reduced and the stability of the device operation is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings described in the following are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 It is a structural schematic diagram of eight single tubes being crimped on a ceramic substrate in the prior art;

[0020] Figure 2 It is a structural schematic diagram of four single tubes being crimped on a substrate unit provided by the embodiments of the utility model;

[0021] Figure 3 It is Figure 2 It is a side view of the single tube subassembly in the middle;

[0022] Figure 4 It is a structural schematic diagram of two single tubes being crimped on a substrate unit provided by the embodiments of the utility model.

[0023] Figure 5 It is a structural schematic diagram of two single tubes being crimped on a substrate unit provided by the embodiments of the utility model.

[0024] The reference signs in the drawings are as follows:

[0025] 1, substrate unit; 2, insulating film; 3, single tube crimping strip; 4, single tube; 41, pin; 5, PCB board. DETAILED DESCRIPTION

[0026] The following description provides specific applications and requirements of the present specification, which is to enable a person skilled in the art to manufacture and use the contents of the present specification. Various local modifications of the disclosed embodiments are obvious to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the present specification. Therefore, the present specification is not limited to the embodiments shown, but is consistent with the widest scope of the claims.

[0027] The terms used herein are only for the purpose of describing specific example embodiments, and are not limiting. For example, unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" can also include the plural forms. When used in the present specification, the terms "include", "contain" and / or "have" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the presence of one or more other features, integers, steps, operations, elements, components and / or groups or additional features, integers, steps, operations, elements, components and / or groups can be added to the system / method.

[0028] In the present utility model, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "transverse", "longitudinal" and the like is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present utility model and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0029] In addition, in addition to being used to indicate orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For a person of ordinary skill in the art, the specific meaning of these terms in the present utility model can be understood according to the specific circumstances.

[0030] In addition, the terms "mount", "set", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For a person of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present utility model can be understood according to the specific circumstances.

[0031] These and other features, and characteristics of the present specification, as well as the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings. All these form a part of this specification. It is to be expressly understood that the drawings are for the purpose of illustration and description and are not intended as a definition of the limits of the present specification. It should be further understood that the drawings are not drawn to scale.

[0032] At present, the string type single tube high current photovoltaic inverter realizes heat conduction of single tube by pressing ceramic substrate on heat sink, as shown in Figure 1 As shown in the figure, the single tube high current photovoltaic inverter on the market basically adopts the scheme of pressing eight or more single tubes on a ceramic substrate for heat conduction.

[0033] The utility model discloses a single tube assembly, as shown in Figure 2 And Figure 3 As shown, it comprises a PCB board 5, a plurality of single tubes 4 are fixedly connected on the surface of the PCB board 5, a plurality of substrate units 1 are attached to the surface of the plurality of single tubes 4, an insulating film 2 is arranged between the substrate unit 1 and the single tube 4, the insulating film 2 is located on the gap between the adjacent two substrate units 1, and the projection area of the insulating film 2 on the PCB board 5 covers at least part of the pin 41 of each single tube 4, the insulating film 2 ensures the safe electrical gap between the pin 41 of the single tube 4 and the conductor, the insulating film 2 is fixed at the gap of the pressed substrate unit 1 for insulation isolation, so as to avoid the safety problem between the pin 41 of the single tube 4 and the conductor, and improve the stability of the device. In the embodiment, the substrate unit 1 selects a ceramic substrate, the conductor includes a heat pipe, a vapor chamber, a metal cooling fin and a heat sink, and the single tube 4 includes a power tube (IGBT, MOSFET, etc.) and a diode.

[0034] As preferred, the width of the insulating film 2 is 0.1-0.5mm, since the gap between the substrate units 1 is small, the insulating film 2 covering the gap between the substrate units 1 can be arranged, preferably, the width of the insulating film 2 is 0.3mm. It can be understood that in another embodiment, the insulating film 2 can be arranged to cover the gap between the plurality of substrate units 1, at this time, the width of the insulating film 2 is mainly related to the substrate unit 1, and can be selected according to the width of the substrate unit 1.

[0035] As preferred, the substrate unit 1 has a substrate, and the substrate is pressed to the single tube 4 as a substrate unit 1, so as to facilitate integrated control of the whole device. It can be understood that in another embodiment, one substrate unit 1 can include a plurality of substrates, for example, one substrate unit 1 includes two substrates, one substrate unit 1 includes three substrates, one substrate unit 1 includes four substrates, etc., so as to reduce the area of the substrate, reduce the probability of the substrate being crushed, improve the safety of the device, and reduce the process difficulty and cost of the conductor pressed to the substrate.

[0036] It should be noted that in the embodiment of a substrate unit 1 including multiple substrates, since it is necessary to ensure the safe electrical gap between the pin 41 of the single tube 4 and the conductor, if the space between the gaps of the substrates does not have the pin 41, it is not necessary to set the insulating film 2 at the gap.

[0037] As preferred, it further includes a single tube pressing strip 3, the single tube 4 is welded to the PCB board 5, the single tube pressing strip 3 is arranged on the PCB board 5, the single tube pressing strip 3 has a containing space, the single tube 4 is located in the containing space, and the single tube pressing strip 3 further fixes the single tube 4 on the PCB board 5 to prevent the single tube 4 from shaking on the PCB board 5.

[0038] As preferred, the corresponding relationship between the single tube 4 and the substrate unit 1 is that one substrate unit 1 is pressed to at least two single tubes 4, and the pressing of the substrate unit 1 to multiple single tubes 4 can improve the cooling efficiency of the single tube 4, reduce the energy consumption of the heat dissipation device, and improve the energy efficiency. As shown in FIG. 4, it is a structural schematic diagram of one substrate unit 1 pressing four single tubes 4, and as shown in FIG. 5, it is a structural schematic diagram of one substrate unit 1 pressing two single tubes 4. The substrate unit 1 and the single tube 4 can be flexibly matched to adapt to different single tube layout power panels. One substrate unit 1 can be adapted to multiple single panels with different layouts, thereby enhancing the universality of the substrate unit 1 and reducing the material cost. Figure 4 Figure 5 It should be noted that in the embodiment of a substrate unit 1 including multiple substrates, since it is necessary to ensure the safe electrical gap between the pin 41 of the single tube 4 and the conductor, if the space between the gaps of the substrates does not have the pin 41, it is not necessary to set the insulating film 2 at the gap.

[0039] It should be noted that in the embodiment of a substrate unit 1 including multiple substrates, since it is necessary to ensure the safe electrical gap between the pin 41 of the single tube 4 and the conductor, if the space between the gaps of the substrates does not have the pin 41, it is not necessary to set the insulating film 2 at the gap. Figure 5 It should be noted that in the embodiment of a substrate unit 1 including multiple substrates, since it is necessary to ensure the safe electrical gap between the pin 41 of the single tube 4 and the conductor, if the space between the gaps of the substrates does not have the pin 41, it is not necessary to set the insulating film 2 at the gap.

[0040] As preferred, the side of the single tube 4 close to the substrate unit 1 is provided with a first heat conduction layer, and the first heat conduction layer can improve the heat dissipation efficiency of the single tube 4 and prolong the service life of the single tube 4. In the embodiment, the second heat conduction layer includes a heat conduction silicone grease layer.

[0041] As preferred, the side of the substrate unit 1 away from the single tube 4 is provided with a second heat conduction layer, and the second heat conduction layer can improve the heat conduction efficiency of the substrate unit 1 and accelerate the heat dissipation efficiency of the single tube 4.

[0042] Further, the second heat conduction layer includes a heat conduction silicone grease layer, and by applying the second heat conduction layer on the substrate unit 1, the requirement for the flatness of the surface of the conductor can be reduced when the substrate unit 1 is pressed to the conductor, and the fracture of the substrate unit 1 caused by the uneven stress due to the uneven surface of the conductor during pressing can be avoided, the processing standard of the conductor can be reduced, and the safety of the single tube assembly can be improved.

[0043] ​The utility model further provides a kind of heat sink, the radiating end of radiator is contacted with the substrate unit 1 of above-mentioned single tube component, and the quick cooling to single tube 4 is realized by radiator,

[0044] Further, third heat-conducting layer is equipped between substrate unit 1 and radiator, third heat-conducting layer includes heat-conducting silicone grease layer, substrate unit 1 is evenly brushed third heat-conducting layer, and is pressed on the specified position of radiator by positioning tool, at this time, because the area of substrate unit 1 can be reduced, therefore increase the convenience in the operation of brushing heat-conducting silicone grease, reduce the surface flatness requirement of radiator simultaneously, avoid the stress inhomogeneity that substrate unit 1 suffers and occurs fragmentation when pressing due to the unevenness of radiator surface, reduce radiator processing process difficulty and processing cost, improve the security of single tube component.

[0045] The utility model further provides the assembly method of the heat sink, including the third heat-conducting layer on substrate unit 1 is brushed, and is pressed on the specified position of radiator by positioning tool, single tube 4 is welded on PCB board 5 and is further fixed by single tube pressing strip 3, the heat dissipation surface of single tube 4 is evenly brushed heat-conducting silicone grease, then PCB board 5 is pressed on substrate unit 1 that has been fixed on radiator, and is fixed and is pressed tightly by screw and completes assembly.

[0046] The above-mentioned, only for the specific implementation of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art in the technical range disclosed in the utility model, can easily think of various equivalent modifications or replacements, these modifications or replacements should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be the protection scope of claim.

Claims

1. A single tube assembly characterized by: The PCB board is fixedly connected with a plurality of single tubes on the surface, a plurality of substrate units are attached to the surface of the single tubes, an insulating film is arranged between the substrate units and the single tubes, the insulating film is located on the gap between adjacent two substrate units, and the projection area of the insulating film on the PCB board covers at least part of the pins of each single tube.

2. The single tube assembly of claim 1, wherein: The width of the insulating film is 0.1-0.5 mm.

3. The single tube assembly of claim 1, wherein: The substrate unit has a substrate.

4. The single tube assembly of claim 1, wherein: The single tube is welded to the PCB board, a single tube pressing strip is arranged on the PCB board, the single tube pressing strip has an accommodating space, and the single tube is located in the accommodating space.

5. The single tube assembly of claim 1, wherein: The corresponding relationship between the single tube and the substrate unit is that one substrate unit is pressed to at least two single tubes.

6. The single tube assembly of claim 1, wherein: A first heat-conducting layer is arranged on the side of the single tube close to the substrate unit.

7. The single tube assembly according to any one of claims 1 to 6, characterized in that: A second heat-conducting layer is arranged on the side of the substrate unit away from the single tube.

8. The single tube assembly of claim 7, wherein: The second heat-conducting layer comprises a heat-conducting silicone grease layer.

9. A heat dissipating device characterized by: A heat sink is arranged, and the heat sink is in contact with the substrate unit of the single tube assembly as claimed in any one of claims 1-8.

10. The heat dissipating device of claim 9, wherein: A third heat-conducting layer is arranged between the substrate unit and the heat sink, and the third heat-conducting layer comprises a heat-conducting silicone grease layer.

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