RFPC rigid-flex board, camera module and electronic equipment

Abstract

The utility model relates to an RFPC rigid-flex board, a camera module and an electronic device. The RFPC rigid-flex board comprises a first ink layer, a second via hole copper plating layer, a third copper foil layer, a fourth PP layer, a fifth covering film layer, a sixth base material layer, a seventh covering film layer, an eighth PP layer, a ninth copper foil layer, a tenth via hole copper plating layer and an eleventh ink layer. And the middle part of the RFPC rigid-flex board is provided with an open slot matched with the photosensitive chip, so that at least one part of the photosensitive chip is embedded into the open slot. According to the utility model, the ultrathin requirement can be met, and the strength requirement can also be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to camera module technical field, concretely relates to a kind of RFPC soft and hard combination board, camera module and electronic equipment. BACKGROUND

[0002] With the rapid development of technology, consumers' demand for smartphone camera modules is increasing, especially in terms of pixels and performance. In recent years, the front camera resolution of smartphones has made a significant leap, gradually increasing from low pixels in the early days to 32 million pixels today, and even some high-end flagship models have equipped camera modules with up to 50 million pixels. This increase in high-pixel resolution not only provides users with more delicate and clear selfie effects, but also brings more detailed and higher dynamic range in video shooting, greatly enhancing users' visual experience.

[0003] However, while high-pixel camera module technology is constantly advancing, it also faces some challenges in design. Currently, camera modules generally use a structure design in which the photosensitive chip overlaps the RFPC (Radio Frequency Printed Circuit Board) soft and hard combination board. While this design optimizes the integration and performance of the module to some extent, it also increases the overall height of the module. Since the optical height of the camera module needs to be calculated cumulatively, including the height of the photosensitive chip, lens group, RFPC board, and other necessary electronic components, the smartphone camera module part often protrudes to some extent. This not only affects the aesthetics of the phone's appearance, but also may cause inconvenience or damage in use.

[0004] In addition, the layout of electronic components such as resistors, capacitors, and Bracket supports (usually used to fix and protect internal components of the camera module) further increases the physical height of the module. In order to avoid interference and damage between these components, sufficient space needs to be reserved during design, which also results in a higher height of the module limiting step, making the smartphone camera module part relatively thick. This not only limits the trend of thinness in phone design, but also may affect users' grip and use experience.

[0005] Therefore, how to reduce the overall height of the camera module while ensuring its high performance and high pixels has become a technical problem to be solved. SUMMARY

[0006] The utility model aims at providing a kind of RFPC soft and hard combination board, camera module and electronic equipment, can satisfy strength requirement, and can reduce the overall height of camera module.

[0007] The utility model relates to a kind of RFPC soft and hard combination board, the RFPC soft and hard combination board includes first ink layer, second via copper plating layer, third copper foil layer, fourth PP layer, fifth cover film layer, sixth substrate layer, seventh cover film layer, eighth PP layer, ninth copper foil layer, tenth via copper plating layer and eleventh ink layer;

[0008] The middle part of the RFPC soft and hard combination board is provided with a slot matching the photosensitive chip, so that at least a part of the photosensitive chip is embedded in the slot.

[0009] Optionally, the RFPC soft and hard combination board is composed of a first ink layer, a second via copper plating layer, a third copper foil layer, a fourth PP layer, a fifth cover film layer, a sixth substrate layer, a seventh cover film layer, an eighth PP layer, a ninth copper foil layer, a tenth via copper plating layer and an eleventh ink layer.

[0010] The middle part of the RFPC soft and hard combination board is provided with a slot matching the photosensitive chip, so that at least a part of the photosensitive chip is embedded in the slot.

[0011] Optionally, the depth of the slot is less than or equal to the thickness of the photosensitive chip. The depth of the slot matches the thickness of the photosensitive chip, that is, the photosensitive chip can be completely embedded in the slot of the RFPC soft and hard combination board. The thickness of a conventional photosensitive chip is generally 150 um. This scheme can reduce the optical height of the camera module by 150 um, which is suitable for front-facing or folding mobile phones.

[0012] Optionally, the thickness of the RFPC soft and hard combination board is less than or equal to 400 um.

[0013] Secondly, the utility model relates to a camera module, comprising:

[0014] The RFPC soft and hard combination board as described in the utility model;

[0015] A photosensitive chip is embedded in the slot of the RFPC soft and hard combination board.

[0016] A plurality of electronic components, including capacitors and resistors, are arranged on the RFPC soft and hard combination board.

[0017] A bracket is provided with at least one through hole corresponding to each electronic component at a position corresponding to each electronic component.

[0018] An optical filter is arranged on the bracket and located above the photosensitive chip.

[0019] An optical lens is fixed at the lower end of the Bracket support.

[0020] A connector is arranged on the RFPC soft and hard combination board.

[0021] Optionally, the Bracket support has a first top surface, a second top surface, a first bottom surface and a second bottom surface from top to bottom.

[0022] The optical filter is arranged on the second top surface of the Bracket support.

[0023] The lower end of the optical lens is fixedly installed on the first top surface of the Bracket support.

[0024] The second bottom surface of the Bracket support is fixedly installed on the RFPC soft and hard combination board. This multi-layer structure design can provide more assembly and fixing options for the camera module. Different surfaces can be used to install different components, such as optical filters, optical lenses, etc., to achieve a more compact and efficient layout.

[0025] Optionally, the top surface of the electronic element is flush with the first top surface of the Bracket support. This design can ensure that the electronic element does not protrude from the surface of the Bracket support, thereby avoiding interference or damage to other components.

[0026] Optionally, the electronic elements are arranged symmetrically on both sides of the slot. This symmetrical arrangement can improve the structural balance and stability of the camera module.

[0027] In a third aspect, the utility model discloses an electronic device using the camera module as described in the utility model.

[0028] The utility model has the following advantages:

[0029] (1) The RFPC soft and hard combination board in the utility model comprises a first ink layer, a second via copper plating layer, a third copper foil layer, a fourth PP layer, a fifth cover film layer, a sixth base material layer, a seventh cover film layer, an eighth PP layer, a ninth copper foil layer, a tenth via copper plating layer and an eleventh ink layer. After slotting on the RFPC soft and hard combination board, the strength requirement can also be met, and the ultra-thin requirement is also met.

[0030] (2)The utility model discloses a light sensitive chip is directly embedded to RFPC soft and hard combination board, and the thickness of the conventional light sensitive chip is 150um, for the camera module of adopting the light sensitive chip of thickness 150um, the optical height of camera module is reduced to 150 microns. This improvement is particularly important for the electronic equipment (such as smart phone, tablet computer etc.) of pursuing the utmost light and thin design, it makes camera module can be more compactly integrated into electronic equipment without sacrificing performance.

[0031] (3)The utility model discloses that resistance, capacitor and other electronic components are directly embedded in the through hole of Bracket support, this design not only eliminates the gap of 80 microns between resistance, capacitor and Bracket support upper wall in conventional design, but also reduces the thickness of Bracket support plane 200 microns, makes the overall height of Bracket support reduce 280 microns cumulatively, and then make the step height of whole camera module also reduce 280 microns accordingly. This remarkable size reduction makes the camera module particularly suitable for the front camera or folding ultra-thin mobile phone and other electronic equipment of extremely harsh space requirement. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is the structure schematic drawing of RFPC soft and hard combination board in the embodiment of the application;

[0033] Figure 2 It is the sectional view of high-pixel ultra-thin camera module in the embodiment of the application;

[0034] Figure 3 It is the structure schematic drawing of Bracket support (including light sensitive chip and electronic component) in the embodiment of the application;

[0035] BRIEF DESCRIPTION OF DRAWINGS:1, optical lens, 2, optical filter, 3, Bracket support, 31, through hole, 32, first top surface, 33, second top surface, 34, first bottom surface, 35, second bottom surface, 4, RFPC soft and hard combination board, 401, slot, 402, first ink layer, 403, second via copper plating layer, 404, third copper foil layer, 405, fourth PP layer, 406, fifth cover film layer, 407, sixth base material layer, 408, seventh cover film layer, 409, eighth PP layer, 410, ninth copper foil layer, 411, tenth via copper plating layer, 412, eleventh ink layer, 5, light sensitive chip, 6, electronic component, 7, connector. DETAILED DESCRIPTION

[0036] The preferred embodiments of the present application will be described below with reference to the accompanying drawings and preferred embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present specification. The present application can also be implemented or applied by means of other different specific embodiments, and each detail in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be understood that the preferred embodiments are only for illustrating the present application, but not for limiting the protection scope of the present application.

[0037] As shown in Figure 1 , in an embodiment of the present application, an RFPC soft and hard combination board comprises a first ink layer 402, a second via copper plating layer 403, a third copper foil layer 404, a fourth PP layer 405, a fifth cover film layer 406, a sixth substrate layer 407, a seventh cover film layer 408, an eighth PP layer 409, a ninth copper foil layer 410, a tenth via copper plating layer 411 and an eleventh ink layer 412. A slot 401 matched with a photosensitive chip 5 is formed in the middle of the RFPC soft and hard combination board 4, so that at least a part of the photosensitive chip 5 is embedded into the slot 401.

[0038] As shown in Figure 1 , in a possible embodiment, the RFPC soft and hard combination board is composed of the first ink layer 402, the second via copper plating layer 403, the third copper foil layer 404, the fourth PP layer 405, the fifth cover film layer 406, the sixth substrate layer 407, the seventh cover film layer 408, the eighth PP layer 409, the ninth copper foil layer 410, the tenth via copper plating layer 411 and the eleventh ink layer 412. The middle part of the RFPC soft and hard combination board is removed from the first ink layer 402, the second via copper plating layer 403, the third copper foil layer 404, the fourth PP layer 405 and the fifth cover film layer 406 to form the slot 401 matched with the photosensitive chip 5.

[0039] As shown in Figure 2 , in a possible embodiment, the depth of the slot 401 is less than or equal to the thickness of the photosensitive chip 5.

[0040] In a possible embodiment, the thickness of the RFPC soft and hard combination board 4 is less than or equal to 400 um.

[0041] In an embodiment, the thickness of each layer of the RFPC soft and hard combination board 4 is as follows:

[0042]

[0043] The functions of each layer will be introduced in detail as follows:

[0044] 1. The first ink layer and the eleventh ink layer:

[0045] In the manufacturing of RFPC soft and hard combination board 4, ink is commonly used to form the solder mask layer to prevent solder paste from flowing to undesired places during the soldering process.

[0046] 2. Second via plated copper layer and tenth via plated copper layer:

[0047] A via is a conductive pathway that connects different layers of the RFPC soft and hard combination board 4. Plating copper is the process of making these pathways conductive by depositing copper on the inner walls of the via, thus establishing an electrical connection between the different layers.

[0048] 3. Third copper foil layer (L1 layer copper foil):

[0049] L1 layer refers to the first layer of the RFPC soft and hard combination board 4 (usually counted from the top layer). Copper foil is the primary conductive material of this layer, used to form the circuit pattern.

[0050] 4. Fourth PP layer (L1 layer PP sheet):

[0051] PP sheet (Polypropylene sheet) is commonly used as an insulating or dielectric layer in the RFPC soft and hard combination board 4, especially in multi-layer boards, it is located between different copper foil layers to prevent current from flowing directly through unintended paths.

[0052] 5. Fifth cover film layer (cover film L2):

[0053] Cover film (also known as solder mask or protective layer) is used to protect the second layer (L2) of the RFPC soft and hard combination board 4 from dust, moisture, and other contaminants, while also preventing faulty soldering during the soldering process.

[0054] 6. Sixth base layer (substrate L2 / L3):

[0055] Substrate is the main structural material of the RFPC soft and hard combination board 4, usually made of fiberglass and epoxy composite material. Here, it refers to the part located between L2 and L3 layers, providing support and insulation for these two layers.

[0056] 7. Seventh cover film layer (cover film L3):

[0057] Similar to the cover film of L2 layer, the cover film of L3 layer is also used to protect the RFPC soft and hard combination board 4 from contamination and faulty soldering.

[0058] 8. Eighth PP layer (L4 layer PP sheet):

[0059] Similar to the PP sheet of L1 layer, the PP sheet of L4 layer is also used as an insulating layer, located between the L4 layer copper foil and the next layer.

[0060] 9. Ninth copper foil layer (L4 layer copper foil):

[0061] The copper foil of the L4 layer is the main conductive material of this layer, used to form the circuit pattern, similar to the copper foil of the L1 layer, but located deeper in the RFPC soft and hard combination board 4.

[0062] In an embodiment of the present application, a camera module includes the RFPC soft and hard combination board 4, the photosensitive chip 5, the Bracket support 3, the optical filter 2, the optical lens 1, and a plurality of electronic components 6. The RFPC soft and hard combination board 4 is mainly used to carry the photosensitive chip 5, the Bracket support 3, the electronic components 6, the optical filter 2, the optical lens 1, and the connector 7, etc., and at the same time, the image data processed by the photosensitive chip 5 is transmitted to the connector 7 through a circuit, and the power supply is transmitted to the photosensitive chip 5. A slot 401 matching the photosensitive chip 5 is provided in the middle of the RFPC soft and hard combination board 4 for mounting the photosensitive chip 5. The photosensitive chip 5 is used to convert the visible light passing through the optical filter 2 into an electrical signal, and the photosensitive chip 5 is embedded in the slot 401. The plurality of electronic components 6 includes capacitors and resistors, and each capacitor and resistor is arranged on the RFPC soft and hard combination board 4. The main function of each electronic component 6 is to filter out the power supply ripple supplied by the mainboard of the electronic device to the photosensitive chip 5. The Bracket support 3 is provided with a through hole 31 capable of accommodating at least a part of each electronic component 6 at a position corresponding to each electronic component 6; the Bracket support 3 is mainly used to fix the optical filter 2, carry the weight of the optical lens 1, and avoid the electronic components 6. The optical filter 2 mainly filters out the light wave band that cannot be recognized by the human eye, only retains the visible light part, and absorbs the stray light emitted between the optical lenses, and the optical filter 2 is arranged on the Bracket support 3 and located above the photosensitive chip 5. The optical lens 1 mainly transmits the light signal to be photographed to the optical filter 2 through refraction, and the lower end of the optical lens 1 is fixed on the Bracket support 3. The connector 7 is arranged on the RFPC soft and hard combination board 4. The connector 7 mainly transmits the electrical signal of the RFPC soft and hard combination board 4 to the mainboard, and transmits the power supply provided by the mainboard to the RFPC soft and hard combination board 4.

[0063] In a possible embodiment, the Bracket support 3 has a first top surface 32, a second top surface 33, a first bottom surface 34, and a second bottom surface 35 from top to bottom. This multi-layer structure design can provide more assembly and fixing options for the camera module. Different surfaces can be used to mount different components, such as the optical filter 2, the optical lens 1, etc., thereby realizing a more compact and efficient layout. The optical filter 2 is arranged on the second top surface 33 of the Bracket support 3. The lower end of the optical lens 1 is fixedly installed on the first top surface 32 of the Bracket support 3. The second bottom surface 35 of the Bracket support 3 is fixedly installed on the RFPC soft and hard combination board 4.

[0064] As Figure 2As shown in a possible embodiment, the top surface of the electronic component 6 is flush with the first top surface 32 of the Bracket 3. This design can ensure that the electronic component 6 does not protrude from the surface of the Bracket 3, thereby avoiding interference or damage to other components.

[0065] As shown in a possible embodiment, the electronic component 6 is arranged symmetrically in pairs on both sides of the slot 401. This symmetrical arrangement can improve the structural balance and stability of the camera module. Figure 3

[0066] In the embodiments of the present application, the RFPC soft and hard combination board 4 is composed of eleven layers, but the overall thickness of the RFPC soft and hard combination board 4 is less than or equal to 400 um. It can not only meet the requirement of ultra-thin, but also meet the strength requirement.

[0067] In the embodiments of the present application, by directly embedding the photosensitive chip 5 into the RFPC soft and hard combination board 4, for the camera module using a photosensitive chip with a thickness of 150 um, the optical height of the camera module is reduced by 150 microns. This improvement is particularly important for electronic devices (such as smartphones, tablets, etc.) that pursue extreme thinness design, as it enables the camera module to be more compactly integrated into electronic devices without sacrificing performance.

[0068] In the embodiments of the present application, the electronic components such as resistors and capacitors are directly embedded into the through hole 31 of the Bracket 3. This design not only eliminates the gap of up to 80 microns between the resistors, capacitors and the upper wall of the Bracket 3 in conventional design, but also reduces the planar thickness of the Bracket 3 by 200 microns. The overall height of the Bracket 3 is reduced by 280 microns, and the step height of the entire camera module is also reduced by 280 microns. This significant size reduction makes the camera module particularly suitable for electronic devices such as front-facing cameras or folding ultra-thin mobile phones that have extremely stringent space requirements.

[0069] In the embodiments of the present application, an electronic device uses the camera module as in the embodiments of the present application.

[0070] The above embodiments are the preferred embodiments of the present application, but the embodiments of the present application are not limited by the above embodiments. Any changes, modifications, substitutions, combinations and simplifications made without departing from the spirit and principles of the present application shall be equivalent replacement methods and shall be within the scope of protection of the present application.​

Claims

1. An RFPC rigid-flex board, characterized by: The RFPC soft and hard combination board (4) comprises a first ink layer (402), a second via copper plating layer (403), a third copper foil layer (404), a fourth PP layer (405), a fifth cover film layer (406), a sixth substrate layer (407), a seventh cover film layer (408), an eighth PP layer (409), a ninth copper foil layer (410), a tenth via copper plating layer (411), and an eleventh ink layer (412).

2. The RFPC rigid-flex board of claim 1, wherein: The RFPC soft and hard combination board (4) is composed of a first ink layer (402), a second via copper plating layer (403), a third copper foil layer (404), a fourth PP layer (405), a fifth cover film layer (406), a sixth substrate layer (407), a seventh cover film layer (408), an eighth PP layer (409), a ninth copper foil layer (410), a tenth via copper plating layer (411), and an eleventh ink layer (412).

3. The RFPC rigid-flex board of claim 1 or 2, wherein: The middle part of the RFPC soft and hard combination board (4) is removed of the first ink layer (402), the second via copper plating layer (403), the third copper foil layer (404), the fourth PP layer (405), and the fifth cover film layer (406) to form a slot (401) adapted to the photosensitive chip (5).

4. The RFPC rigid-flex board of claim 3, wherein: The depth of the slot (401) is less than or equal to the thickness of the photosensitive chip (5).

5. The RFPC rigid-flex board of claim 2, wherein: The thickness of the RFPC soft and hard combination board (4) is less than or equal to 400 um.

6. An image capture module, comprising: Comprise: The RFPC soft and hard combination board (4) according to any one of claims 1 to 5; The photosensitive chip (5) is embedded in the slot (401) of the RFPC soft and hard combination board (4); A plurality of electronic elements (6) including capacitors and resistors are respectively arranged on the RFPC soft and hard combination board (4); The Bracket support (3) is provided with a through hole (31) capable of accommodating a part of the electronic element (6) at a position corresponding to each electronic element (6); The optical filter (2) is arranged on the Bracket support (3) and located above the photosensitive chip (5); The optical lens (1) is fixed at the lower end of the Bracket support (3); The connector (7) is arranged on the RFPC soft and hard combination board (4).

7. The camera module of claim 6, wherein: The Bracket support (3) has a first top surface (32), a second top surface (33), a first bottom surface (34), and a second bottom surface (35) from top to bottom; The optical filter (2) is arranged on the second top surface (33) of the Bracket support (3); The lower end of the optical lens (1) is fixedly installed on the first top surface (32) of the Bracket support (3); The second bottom surface (35) of the Bracket support (3) is fixedly installed on the RFPC soft and hard combination board (4).

8. The camera module of claim 7, wherein: The top surface of the electronic element (6) is flush with the first top surface (32) of the Bracket support (3).

9. The camera module of claim 6, wherein: The electronic components (6) are arranged symmetrically in twos on both sides of the slot (401).

10. An electronic device, comprising: The camera module as claimed in any one of claims 6 to 9 is adopted.

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