Inverted infrared receiving head assembly

Abstract

An inverted infrared receiving head assembly comprises a base and a functional foot support, the base is provided with a single spherical epoxy glue body structure, the functional foot support is embedded in the base, the base is provided with an infrared receiving head groove, the infrared receiving head groove is used for fixing an infrared receiving head body, and the functional foot support is fixedly provided with a built-in IC signal shielding module and a net-free receiving PD; distance secret communication and information forwarding between two points of the infrared technology with the back-off type infrared receiving head assembly are achieved, the device has the advantages that work of other electrical equipment is not interfered, the surrounding environment is not affected, IC signal interference shielding areas are increased, PD is received through an X network, the product anti-interference capacity is improved, and the signal receiving capacity is enhanced. The device has the characteristics of miniaturization design, low-voltage work and compatibility of TTL and COMS circuits, and is suitable for transmitting codes: NEC code and RC5 code. The appearance epoxy colloid of the product is designed in an inverted buckling mode, so that the product is not loosened and tightly combined after being loaded into a finished product.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared receiving head assembly technical field, especially a kind of with inverted head type infrared receiving head assembly. BACKGROUND

[0002] In order to avoid the light emitted by remote controller to cause human eye discomfort and reduce general artificial light interference, so select the wavelength of infrared (Infrared) that human eye cannot see, the wavelength of 940nm is selected by the emission head of remote controller in the industry at present. The application of infrared remote controller is also a kind of wireless signal transmission, like most wireless transmission technologies, in order to avoid the interference of same wavelength electromagnetic wave in environment, so carrier frequency will be added on its transmission signal, the carrier frequency range of remote control application is 30~60kHz, and 38kHz is the most common carrier frequency. Figure Two

[0003] Generally, the difference between data "0" and "1" of infrared signal after demodulation by receiving head usually reflects on the time length of high and low level or signal period, when decoding by single-chip microcomputer, the output pin of receiving head is usually connected to the external interrupt of single-chip microcomputer, and the time interval of external interrupt is judged by combining timer to obtain data. The key is to find the waveform difference between data "0" and "1", and the output end can be connected with CMOS and TTL circuit. This kind of receiving head is widely used in air conditioner, television, VCD and other electrical appliances. The principle diagram and pin arrangement of infrared receiving head. The early infrared integrated receiving head is generally completed by welding integrated circuit and receiving diode on a circuit board. This kind of receiving head has the disadvantage of large size. The current receiving head is integrated circuit and receiving diode packaged together, which cannot be disassembled and repaired, and the size is very small. SUMMARY

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a kind of with inverted head type infrared receiving head assembly for enhancing receiving angle.

[0005] The technical scheme adopted by the utility model to solve its technical problems is: a kind of with inverted head type infrared receiving head assembly, including base and function foot support, single-sphere epoxy glue body structure is equipped on the base, the function foot support is embedded in the base, the base is equipped with infrared receiving head slot, the infrared receiving head slot is used to fix infrared receiving head body, the function foot support is fixed with built-in IC signal shielding module and netless receiving PD.

[0006] As a further improvement of the utility model: the function foot support is built-in IC signal shielding support.

[0007] As a further improvement of the utility model: the function foot support is C-shaped. ​

[0008] As a further improvement of the present application: the functional foot support is provided with a chip fixing part, and the IC chip and the network-free receiving PD are fixed on the chip fixing part.

[0009] As a further improvement of the present application: the base is integrally formed by pouring, and the built-in shielding cover of the base is formed by automatic bending and pouring.

[0010] As a further improvement of the present application: the IC chip and the network-free receiving PD are connected through gold wires.

[0011] Compared with the prior art, the present application has the advantages that: the distance between the two infrared receiving head assemblies is kept secret, and information is forwarded, without interfering with the work of other electrical equipment and affecting the surrounding environment, the IC signal interference shielding area is increased, the X network receiving PD improves the anti-interference ability of the product while enhancing the signal receiving ability. It has the characteristics of miniaturization design, low voltage work, compatibility with TTL and COMS circuit, and is suitable for transmitting codes: NEC code, RC5 code. The product shape uses epoxy glue with a reverse design, so that the product is tightly combined without loosening after being assembled into a finished product. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described in the following are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor.

[0013] Figure One The present application is a structural schematic diagram.

[0014] Figure Two The present application is an exploded view.

[0015] Figure Three The present application is a structural schematic diagram of the functional foot support. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical scheme and advantages of the present application more clear, the following will combine the specific embodiments of the present application and the corresponding drawings to clearly and completely describe the technical scheme of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0017] It is to be understood that the terminology of the abstract and claims and the above mentioned drawings includes the terms "comprises", "comprising", "has", "having", "includes" or "including" and their variants thereof, that are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus that comprises a list of steps or units is not necessarily limited to those steps or units which are expressly listed, but can include other steps or units that are not expressly listed or inherent to such process, method, product, or apparatus.

[0018] The existing infrared receiving head assembly is widely used in the fields of household appliance remote control, wireless data transmission, etc., and plays a key role in the remote control device. The infrared receiving head assembly generally includes an infrared receiving diode, an amplification circuit, a filter circuit and a decoding circuit, which receives and processes the infrared signal through these modules. The typical receiving assembly is packaged by a plastic package structure, can resist electromagnetic interference, and has strong sensitivity at a specific wavelength (usually 940nm).

[0019] The market demand for small, integrated and high-performance infrared receiving devices is increasing, especially in the fields of household appliances, automotive electronics and intelligent devices, etc. which have high requirements on volume and anti-interference ability. In order to meet these demands, the design scheme of the inverted-docking type infrared receiving head assembly gradually becomes a development trend. The inverted-docking structure has significant advantages in overall size control, component protection and signal processing efficiency. Through reasonable structure design and high integration circuit configuration, the inverted-docking type infrared receiving head assembly can complete the efficient reception and pre-signal processing of infrared signals in a smaller packaging volume, and improve the working stability of the product in a strong interference environment.

[0020] The utility model is further illustrated by the drawings and examples as follows: as shown in a kind of inverted-docking type infrared receiving head assembly shown in the figure, Figures One to Three Including base 1 and functional foot support 2, the single spherical surface epoxy glue body structure 11 is equipped on the base 1, the functional foot support 2 is embedded in the base 1, the infrared receiving head slot 12 is equipped on the base 1, the infrared receiving head slot 12 is used to fix infrared receiving head body, the functional foot support 2 is fixed with built-in IC signal shielding module 3 and netless receiving PD 4.

[0021] Realize infrared transceiver function, can complete to the preamplification of remote control signal, limiting amplitude amplification, band pass filter, peak detection, waveform shaping. Make it have high temperature patch function, strengthen receiving angle and receiving distance simultaneously, improve product anti-interference ability.

[0022] As an embodiment of the utility model, the functional foot support 2 is built-in IC signal shielding support.

[0023] As an embodiment of the utility model, the functional foot support 2 is C-shaped.

[0024] As an embodiment of the utility model, the functional foot support 2 is provided with a chip fixing portion 21, and the IC chip 3 and the networkless receiving PD 4 are fixed on the chip fixing portion.

[0025] As an embodiment of the utility model, the base is integrally formed by pouring, and the built-in shielding cover of the base is formed by automatic bending and pouring.

[0026] As an embodiment of the utility model, the built-in shielding cover is formed by automatic bending and pouring, and the production capacity of the pouring-formed product reaches 30 kpcs per hour.

[0027] As an embodiment of the utility model, the IC chip 3 and the networkless receiving PD 4 are connected by gold wires, the gold wires have excellent conductivity and low resistance, and the signal is stably transmitted between the receiving diode and the integrated circuit.

[0028] As an embodiment of the utility model, the IC chip is an integrated IC, the IC integrates circuit modules such as pre-amplification, limiting-amplitude amplification, band-pass filtering, peak detection and waveform shaping, and greatly improves the integration degree and signal processing capability of the component.

[0029] As an embodiment of the utility model, the infrared receiving tube is packaged with an epoxy resin buckle position, the combination of the product and the finished product assembly is improved, and the product is prevented from shaking.

[0030] As an embodiment of the utility model, the base 1 is provided with a single-spherical-surface epoxy glue body structure 11, the functional foot support 2 is embedded on the base 1, the base 1 is provided with an infrared receiving head groove 12, the infrared receiving head groove 12 is used for fixing an infrared receiving head body, and the functional foot support 2 is fixed with a built-in IC signal shielding module 3 and a networkless receiving PD 4; the distance between two points of the product is realized by the infrared technology, the distance is kept secret, information is forwarded, other electrical equipment is not disturbed, and the surrounding environment is not affected.

[0031] The main function of the utility model is a reverse-docking-type infrared receiving head component, which adopts an IC shielding area increase, a networkless PD receiving, a support hollow combination and a single-spherical-mirror receiving structure, realizes strong product structure combination, prevents loosening, shields useless light source signals and electromagnetic signals and has other advantages; automatic production procedures are realized, production efficiency is improved, labor cost is reduced, the finished product assembly has strong combination, the product is prevented from shaking, production is stable and other advantages, is easy to implement and promote, and the competitiveness of the product is improved.

[0032] As described above, after reading the utility model document, according to the technical scheme and technical concept of the utility model, other various corresponding transformation schemes can be made by ordinary skilled in the art without creative mental labor, and all belong to the range protected by the utility model.

Claims

1. An infrared receiver assembly with a reverse-bayonet type, characterized by: Including base and function foot support, the base is provided with single spherical surface epoxy glue body structure, the function foot support is embedded on the base, the base is provided with infrared receiving head slot, the infrared receiving head slot is used for fixing the infrared receiving head body, the function foot support is fixed with built-in IC signal shielding module and networkless receiving PD.

2. The infrared receiver assembly with inverted head according to claim 1, characterized in that: The function foot support is built-in IC signal shielding support.

3. The infrared receiver assembly with inverted-docking according to claim 2, wherein: The function foot support is C-shaped.

4. The infrared receiver assembly with inverted underfill according to claim 2, wherein: The function foot support is provided with chip fixing part, and the IC chip and the networkless receiving PD are fixed on the chip fixing part.

5. The infrared receiver assembly of claim 1, wherein: The base is integrally formed by pouring, and the built-in shielding cover of the base is formed by automatic bending and pouring.

6. The infrared receiver assembly with inverted underfill according to claim 4, wherein: The IC chip and the networkless receiving PD are connected through gold wires.

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