Air guide device and server with same
By designing a tapered section and airflow guiding components in the air guide device, combined with a temperature sensor, the problem of poor heat dissipation in existing air guide devices has been solved, achieving efficient, flexible, and energy-saving heat dissipation, and improving the overall performance and stability of the server.
Patent Information
- Application Number
- CN202522188102.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-16
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2035-10-16
AI Technical Summary
Existing airflow devices cannot efficiently concentrate cooling airflow onto high-temperature components inside the OCP card, such as chips or optical modules, resulting in poor heat dissipation and affecting equipment performance and lifespan.
Design an air guiding device comprising a housing and a detachable air guiding component. The housing forms an air guiding cavity, and the air guiding component forms a tapering section inside the housing. By using Bernoulli's principle, the airflow is accelerated and concentrated to the part to be cooled. The device is also dynamically monitored and controlled by a temperature sensor.
It significantly improves heat dissipation efficiency, ensures effective cooling of key components, enhances equipment stability and flexibility, reduces energy consumption, and adapts to diverse heat dissipation needs.
Smart Images

Figure CN223639587U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of servers, and in particular to an air guide device and a server having the same. BACKGROUND
[0002] At present, with the rapid development of information technology, electronic devices such as servers and high-performance computers continue to improve in processing speed, storage capacity and network communication functions to meet the increasingly complex data processing needs. A large number of high-power hardware are integrated inside these devices, among which the OCP (Open Compute Project) card as a key technology carries the core functions of high-speed data transmission and high-performance computing. The key components such as chips and optical modules inside the OCP card will generate a large amount of heat under high-intensity working conditions, which will have a serious impact on the stability and life of the device if not effectively dissipated in time. Therefore, the heat dissipation technology has become one of the key links in the design of servers. In the prior art, the air guide device as an important part of the internal heat dissipation system of the server is widely used in the heat management of the OCP card. The air guide device is usually composed of a shell, and a flow guide cavity is formed inside the shell. By setting an air inlet and an air outlet on the shell, external cooling air flow can be introduced and cover the key heat dissipation area of the OCP card, thereby taking away heat and reducing the overall temperature.
[0003] However, although the air guide device in the prior art takes into account the overall heat dissipation demand in the design, in actual application, the heat distribution of the components such as chips and optical modules inside the OCP card is not uniform. When processing a large amount of data transmission tasks, the heat load of the optical module increases significantly, while the heat load of the chip is relatively low. Conversely, when performing high-performance computing tasks, the heat generated by the chip becomes the main heat dissipation bottleneck. The existing air guide device cannot efficiently concentrate the cooling air flow on the parts with higher temperature to be dissipated, such as the overheated chip or optical module. This results in waste of heat dissipation resources, and at the same time, the parts with higher temperature to be dissipated cannot be sufficiently cooled, and the heat dissipation effect is poor. Local overheating not only reduces the performance of the OCP card, but also accelerates the aging of the hardware, shortens the service life, and even causes system failure in extreme cases, which seriously affects the reliability and stability of the server. CONTENT OF THE UTILITY MODEL
[0004] The present application provides an air guide device and a server having the same to at least solve the technical problem of poor heat dissipation effect of the air guide device in the related art.
[0005] The present application provides an air guide device, comprising a shell and a flow guide assembly, the shell enclosing a flow guide cavity having an air inlet and an air outlet, the flow guide cavity being used for accommodating at least part of a heat dissipation component, and the air inlet and the air outlet being respectively arranged at two ends of the shell.
[0006] The flow guide assembly is detachably arranged on the shell, and at least part of the flow guide assembly protrudes from the inner wall of the shell to form a tapered portion arranged corresponding to the portion of the to-be-cooled component to be cooled.
[0007] The flow channel cross-sectional area of the tapered portion is smaller than the flow channel cross-sectional area of the air inlet.
[0008] Further, the flow guide assembly comprises a mounting plate and a flow guide plate, and the shell is provided with an opening away from the to-be-cooled component; the mounting plate and the flow guide plate are arranged in sequence at the opening in the direction from the air inlet to the air outlet to form a flow guide cavity together with the shell.
[0009] Further, the opening is provided with a sliding rail extending in the direction from the air inlet to the air outlet, and the mounting plate and the flow guide plate are each provided with a sliding block in sliding cooperation with the sliding rail to detachably connect the mounting plate and the flow guide plate with the shell; and / or,
[0010] The opening is provided with a plurality of first clamping portions arranged in sequence in the direction from the air inlet to the air outlet, and the mounting plate and the flow guide plate are each provided with a second clamping portion corresponding to one of the plurality of first clamping portions to detachably connect the mounting plate and the flow guide plate with the shell.
[0011] Further, the flow guide cavity further comprises a gradually expanding portion, and the flow guide assembly is provided with a flow guide surface on the side close to the air inlet; the flow guide surface on the side close to the air inlet forms the tapered portion, and the flow guide surface on the side away from the air inlet forms the gradually expanding portion, so that the flow channel cross-sectional area of the flow guide cavity gradually decreases and then gradually increases.
[0012] Further, the flow guide plate is provided with a flow guide surface, and the flow guide plate extends in a direction perpendicular to the direction from the air inlet to the air outlet; at least part of the flow guide surface is arranged in an inclined manner in the direction from the air inlet to the air outlet to form the tapered portion.
[0013] Further, the flow guide plate is a planar plate, and in the direction from the air inlet to the air outlet, the planar plate in the tapered portion gradually approaches the to-be-cooled component; and / or,
[0014] The flow guide plate is an arc-shaped plate, and the outer arc surface of the arc-shaped plate faces the air inlet; in the direction from the air inlet to the air outlet, the arc-shaped plate in the tapered portion gradually approaches the to-be-cooled component.
[0015] Further, the flow guide assembly comprises a flow guide plate, the shell is provided with a sliding rail extending in the direction from the air inlet to the air outlet, the flow guide plate is provided with a sliding block in sliding cooperation with the sliding rail, the shell is provided with an opening extending in the direction from the air inlet to the air outlet, and at least part of the flow guide plate protrudes from the opening to form a first positioning member; the periphery of the opening is provided with a plurality of second positioning members arranged in sequence in the direction from the air inlet to the air outlet, and the first positioning member and the second positioning members are arranged correspondingly to position the flow guide plate.
[0016] Further, the air guide device further comprises a temperature sensor, the temperature sensor is arranged on the side of the flow guide assembly close to the heat dissipation component corresponding to the heat dissipation component.
[0017] Further, the shell is provided with a plurality of mounting positions arranged in sequence from the air inlet to the air outlet, and the flow guide assembly is selectively arranged on one of the plurality of mounting positions; and / or,
[0018] The air guide device comprises a plurality of flow guide assemblies, at least two of the plurality of flow guide assemblies are arranged on any two of the plurality of mounting positions.
[0019] The application also provides a server comprising the air guide device, the server comprises a mainboard and a fan assembly,
[0020] The mainboard is provided with a heat dissipation component, the air guide device is detachably arranged on the mainboard, and the air guide device and the mainboard enclose a flow guide cavity;
[0021] The fan assembly is arranged on the mainboard corresponding to the air inlet, so that the airflow flows into the flow guide cavity from the air inlet and flows out from the air outlet.
[0022] According to the application, due to the design of the shell, a flow guide cavity is enclosed, which contains an air inlet and an air outlet, the flow guide assembly is detachably arranged on the shell, forming a tapered portion, which gradually reduces the cross-sectional area of the flow channel through the flow guide cavity, thereby forcing the airflow to accelerate, according to Bernoulli's principle, the increase of flow velocity will cause the decrease of pressure, which helps the airflow to penetrate the heat dissipation area of the heat dissipation component more effectively, and carry away more heat, thereby significantly improving the heat dissipation efficiency. Therefore, the technical problem of poor heat dissipation effect of the air guide device can be solved, and the technical effect of improving the heat dissipation effect of the air guide device is achieved. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to more clearly illustrate the embodiments of the application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0024] Figure 1 A perspective view of an embodiment of an air guide device provided by the application;
[0025] Figure 2 A bottom view of an embodiment of an air guide device provided by the application;
[0026] Figure 3 A partial perspective view of an embodiment of an air guide device provided by the application;
[0027] Figure 4 A perspective view of a wind guide device according to an embodiment of the present application Figure 1 An enlarged view of A in FIG. 2;
[0028] Figure 5 A perspective view of another embodiment of a wind guide device according to an embodiment of the present application
[0029] Figure 6 A side perspective view of another embodiment of a wind guide device according to an embodiment of the present application
[0030] Wherein, the above-mentioned drawings include the following reference signs:
[0031] 100, housing; 110, air inlet; 120, air outlet; 130, sliding rail; 140, fixing buckle; 101, flow guide cavity;
[0032] 200, flow guide assembly; 210, flow guide plate; 220, mounting plate;
[0033] 300, heat dissipation component. DETAILED DESCRIPTION
[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
[0035] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.
[0036] In order for those skilled in the art to better understand the scheme of the present application, the present application is further described in detail below in combination with the drawings and specific embodiments.
[0037] The embodiments of the present application provide a wind guide device. The device is described in detail in combination with the structure and working principle of the wind guide device.
[0038] An aspect of the present application provides a wind guide device, such as Figures 1 to 3As shown, it includes a housing 100, which encloses a flow guide cavity 101 with an air inlet 110 and an air outlet 120, the flow guide cavity 101 is used to accommodate at least part of the heat dissipation component 300, the air inlet 110 and the air outlet 120 are respectively arranged at both ends of the housing 100; a flow guide assembly 200 is detachably arranged on the housing 100, at least part of the flow guide assembly 200 protrudes from the inner wall of the housing 100 to form a tapered portion corresponding to the heat dissipation portion of the heat dissipation component 300; wherein the flow passage cross-sectional area of the tapered portion is smaller than the flow passage cross-sectional area of the air inlet 110.
[0039] The air flow guide device in the above-mentioned embodiments of the present application is adopted, by arranging the flow guide assembly 200 protruding from the inner wall of the housing 100, the flow passage is narrowed when the air flow passes through the tapered portion, which promotes the acceleration of the air flow and the concentration of the air flow to the heat dissipation portion, thereby improving the heat transfer rate and solving the technical problem of poor heat dissipation effect of the air flow guide device.
[0040] In the above-mentioned embodiments, the housing 100 is designed to enclose a flow guide cavity 101, which contains an air inlet 110 and an air outlet 120. Such a design ensures that air can enter and exit in a controlled manner, thereby providing a stable air flow environment for the heat dissipation component 300. The positions of the air inlet 110 and the air outlet 120 are set at both ends of the housing 100, which ensures that air can flow along the length direction of the device, increasing the effectiveness of the heat dissipation path. The flow guide assembly 200 is detachably arranged on the housing 100, the key of this design is that part of the flow guide assembly 200 protrudes from the inner wall of the housing 100 to form a tapered portion, which is specially designed for the heat dissipation portion of the heat dissipation component 300. The tapered portion gradually reduces the flow passage cross-sectional area of the flow guide cavity 101, thereby forcing the air flow to accelerate. According to Bernoulli's principle, an increase in flow rate will result in a decrease in pressure, which helps the air flow to penetrate the heat dissipation area of the heat dissipation component 300 more effectively, carrying away more heat, thereby significantly improving the heat dissipation efficiency. The flow passage cross-sectional area of the tapered portion is smaller than that of the air inlet 110, and this change in flow passage size is the key to improving the heat dissipation effect. Smaller cross-sectional area not only accelerates the air flow, reduces turbulence and resistance, but also can more concentratedly guide the air flow to the key parts of the heat dissipation component 300, achieving the goal of precise heat dissipation.
[0041] Specifically, as Figure 3As shown, the flow guide assembly 200 includes a mounting plate 220 and a flow guide plate 210, and the housing 100 is provided with an opening on the side away from the heat dissipation member 300. The mounting plate 220 and the flow guide plate 210 are sequentially arranged at the opening in the direction from the air inlet 110 to the air outlet 120 to form a flow guide cavity 101 with the housing 100. By arranging the opening on one side of the housing 100, the mounting plate 220 and the flow guide plate 210 can be sequentially arranged at the opening in the direction of air flow. This modular connection method simplifies the combination process of the flow guide assembly 200 and the housing 100, making the air guide device more flexible and convenient in design, manufacture and maintenance, and facilitating quick adjustment or replacement of the flow guide assembly according to different heat dissipation requirements. The mounting plate 220 and the flow guide plate 210 are positioned and installed through the opening on the housing 100, ensuring the accurate position of the protruding part of the flow guide plate in the flow guide cavity 101. This direct connection relationship not only helps the flow guide assembly 200 closely fit the inner wall of the housing 100, but also enables the flow guide plate 210 to stably perform its function of gradually reducing the flow, without displacement due to vibration or air flow impact. In addition, the detachability of the flow guide assembly 200 allows users to select appropriate designs and specifications of the flow guide plate 210 and the mounting plate 220 for combination and installation according to different heat dissipation requirements of the heat dissipation member 300. This connection mechanism not only improves the versatility of the air guide device, but also allows adjustment of the flow guide assembly 200 to meet various heat dissipation requirements without changing the structure of the housing 100, enhancing the adaptability of the device to varying environments.
[0042] In actual application, the heat distribution of the OCP card, i.e. the chips and optical modules inside the heat dissipation member, is not uniform. When handling a large amount of data transmission tasks, the heat load of the optical module increases significantly, while the heat load of the chip is relatively low. Conversely, when performing high-performance computing tasks, the chip generates more heat. When the heat load of the optical module is high, the flow guide plate 210 is arranged at the corresponding position close to the optical module, and when the heat load of the chip is high, the flow guide plate 210 is arranged at the corresponding position close to the chip, so that the air guide device can target the heat dissipation of the heat dissipation member with high heat.
[0043] In this embodiment, the heat dissipation member 300 is an OCP card, and the heat dissipation member has two heat dissipation parts, i.e. an optical module and a chip. The chip is arranged at the position of the heat dissipation member 300 close to the air inlet 110, and the optical module is arranged at the side of the chip close to the air outlet 120. Figures 1 to 3 As shown, when the heat dissipation requirement of the chip of the OCP card is high, the flow guide plate 210 is installed first, and then the mounting plate 220 is installed, so that the air flow is lowered in advance and gathered at the chip of the OCP card, facilitating heat dissipation of the chip. Figure 4 Figure 5 As shown, when the heat dissipation requirement of the optical module of the OCP card is high, first install a mounting plate 220, then install a flow guide plate 210, delay and press down the airflow, and concentrate it at the optical module of the OCP card, which can solve the problem of overheating of the optical module.
[0044] Specifically, regarding the connection mode of the mounting plate 220 and the flow guide plate 210 arranged at the opening, the present application provides two embodiments. In embodiment one, a sliding rail 130 is arranged at the opening, the sliding rail 130 is arranged extending in the direction from the air inlet 110 to the air outlet 120, and a sliding block is arranged on the mounting plate 220 and the flow guide plate 210, the sliding block is in sliding cooperation with the sliding rail 130 to enable the mounting plate 220 and the flow guide plate 210 to be detachably connected with the shell 100.
[0045] As shown in Figure 3 , Figure 4 , the combination design of the sliding rail 130 and the sliding block enables the mounting plate 220 and the flow guide plate 210 to be quickly slid into or out of the shell 100 along the airflow direction, the sliding rail 130 provides a guiding effect when the flow guide plate 210 and the mounting plate 220 are installed, ensuring that they slide into the opening along the correct trajectory and achieve stable connection with the shell 100. The precise cooperation of the sliding block and the sliding rail 130 also helps to accurately align the flow guide assembly 200 and ensure its correct position in the flow guide cavity 101, thereby exerting the optimal fluid guiding performance. The design of the sliding rail 130 allows the flow guide plate 210 and the mounting plate 220 to adjust their positions relative to the shell 100 within a certain range, and this flexibility enables the flow guide assembly 200 to adapt to different sizes or shapes of the heat dissipation object 300, or to adjust its arrangement according to different heat dissipation requirements, thereby enhancing the versatility and adaptability of the air guiding device. In addition, the detachable connection characteristics of the sliding rail 130 and the sliding block mean that users can easily pull out the flow guide assembly 200 when maintaining or cleaning the flow guide cavity 101, without the need for complex tools or professional knowledge, and the maintenance process becomes more convenient and efficient.
[0046] In the above embodiments, as shown in Figure 4 , a fixed buckle 140 is arranged on one end of the rail near the air outlet 120, and when the flow guide assembly 200 is installed, the fixed buckle 140 is rotated to avoid the installation rail, so that the flow guide assembly 200 is smoothly installed. After the flow guide assembly 200 is installed, the fixed buckle 140 is turned back to the original position and fixed at the end of the installation rail, which can prevent the flow guide plate from moving due to the influence of airflow or external factors.
[0047] Specifically, in the second embodiment of the connecting manner of the installation plate 220 and the guide plate 210 being arranged at the opening, a plurality of first clamping portions are arranged at the opening in sequence from the air inlet 110 to the air outlet 120, and the installation plate 220 and the guide plate 210 are each provided with a second clamping portion, which is correspondingly arranged with one of the plurality of first clamping portions to enable the installation plate 220 and the guide plate 210 to be detachably connected with the shell 100. Since the plurality of first clamping portions are arranged in sequence from the air inlet 110 to the air outlet 120, it means that the installation plate 220 and the guide plate 210 can be installed at different positions. This design enables the guide assembly 200 to be flexibly adjusted in position, thereby achieving heat dissipation for different positions of the heat dissipation object 300. The clamping connection is a connection manner that can be achieved without fasteners such as screws, nails, etc. Compared with the traditional fixing method, it greatly simplifies the installation process. The user only needs to align the second clamping portion with the corresponding first clamping portion and push it gently to complete the installation, without the need for complex tools or skills, improving the efficiency and convenience of installation. Moreover, the clamping mechanism ensures stable connection between the installation plate 220 and the guide plate 210 and the shell 100, so that the guide assembly 200 will not easily loosen or fall off even in the case of high-speed airflow impact or equipment vibration, maintaining the stability and reliability of the guide performance. Compared with the sliding rail 130 sliding block connection, the clamping connection is more rapid when disassembled, and the guide assembly 200 can be easily removed by simply releasing the clamping, which provides convenience for daily maintenance and cleaning work, and also facilitates the replacement or upgrading of the guide assembly 200 to cope with changes in device performance or updates in heat dissipation requirements.
[0048] Specifically, as Figure 3 、 Figure 6As shown, the flow guide cavity 101 also includes a diverging portion, and the flow guide assembly 200 is provided with a flow guide surface on the side close to the air inlet 110. The flow guide surface forms a converging portion on the side close to the air inlet 110 and a diverging portion on the side away from the air inlet 110, so that the flow passage cross-sectional area of the flow guide cavity 101 first gradually decreases and then gradually increases. The flow passage design of the converging portion and the diverging portion follows the principle of fluid dynamics, and the air flow speed and pressure are adjusted by controlling the change of the flow passage cross-sectional area. The converging portion narrows the flow passage when the air flow passes through, resulting in an increase in flow speed and a decrease in pressure, thereby enhancing the penetration of the air flow and more effectively guiding the air flow to the heat dissipation part of the heat dissipation component 300. After the air flow passes through the converging portion, the diverging portion expands the flow passage cross-sectional area, gradually slows down the flow speed, and gradually restores the pressure, which helps the air flow to cover the heat dissipation component 300 more evenly, while reducing turbulence and air flow resistance. The converging portion and the diverging portion formed by the flow guide surface on the flow guide assembly 200 and the shell 100 jointly act on the air flow, achieving precise control of the air flow. In the converging portion, the air flow is accelerated and concentrated, ensuring sufficient air flow speed and flow rate to quickly carry away the heat generated by the heat dissipation component 300; in the diverging portion, the air flow is diffused to cover a wider heat dissipation area, improving the heat dissipation efficiency, while avoiding the problem of local overheating caused by excessive concentration of air flow.
[0049] Specifically, the flow guide plate 210 is provided with a flow guide surface, and the flow guide plate 210 extends in a direction perpendicular to the air inlet 110 to the air outlet 120. At least part of the flow guide surface is inclined in the direction from the air inlet 110 to the air outlet 120 to form a converging portion. By forming a converging portion by at least part of the flow guide surface being inclined, the air flow entering from the air inlet 110 encounters a flow passage cross-sectional area that gradually decreases on the flow guide plate 210 extending in the vertical direction, which promotes the acceleration of the air flow, thereby improving the cooling efficiency. The increase in air flow speed means that more heat can be carried away per unit time, ensuring that the heat dissipation component 300 can be effectively cooled. The inclined design of the flow guide surface follows the Bernoulli equation, and the air flow accelerates in a narrow space while the pressure decreases, which is beneficial to the smooth passage of the air flow through the flow guide cavity 101, reducing the vortex and stagnation phenomenon of the air flow at the corner or sudden change, and improving the fluid dynamics efficiency. This optimized air flow dynamics design ensures uniform distribution and efficient transmission of the air flow. The extension of the flow guide plate 210 in the vertical direction and the formation of the converging portion by the inclination of the flow guide surface together constitute a channel with stable structure and controllable air flow. This design ensures that the air flow does not spread unnecessarily before the converging portion, thereby maintaining the concentration of the air flow, enabling it to be directly and accurately guided to the key heat dissipation part of the heat dissipation component 300.
[0050] Specifically, regarding the arrangement of the flow guide plate 210, the present application provides two embodiments. In embodiment one, as shown in Figure 3 、 Figure 6As shown, the deflector 210 is a flat plate, and along the direction from the air inlet 110 to the air outlet 120, the flat plate in the tapered portion gradually approaches the heat dissipation object 300; the design that the flat surface of the deflector 210 gradually approaches the heat dissipation object 300 in the tapered portion makes the flow path of the airflow gradually narrow when passing through, and the cross-sectional area of the flow passage gradually decreases. According to the principle of fluid mechanics, the airflow will accelerate when encountering a narrow passage, thereby forming a more intense airflow impact on the surface of the heat dissipation object 300, which helps to improve the heat dissipation efficiency. As the distance between the flat plate and the heat dissipation object 300 decreases, the airflow is in closer contact with the surface of the heat dissipation object 300, which enhances the heat exchange between the airflow and the heat dissipation object 300. The acceleration of the airflow and the close heat exchange work together to ensure that the heat dissipation object 300 can dissipate heat faster, prevent overheating, and ensure stable operation of the equipment.
[0051] The design of the deflector 210 as a flat plate simplifies its manufacturing process, reduces costs, and also makes the installation and maintenance process more convenient. The connection mode of the flat plate in the tapered portion gradually approaching the heat dissipation object 300 does not require complex mechanical parts or additional fixing structures, and only the pressure difference naturally formed by airflow dynamics can achieve its function, reducing the introduction of additional mechanical stress and prolonging the service life of the deflector 210 and the entire air guide device.
[0052] Specifically, in Example Two, the deflector 210 is an arc-shaped plate, and the outer arc surface of the arc-shaped plate is arranged to face the air inlet 110, and along the direction from the air inlet 110 to the air outlet 120, the arc-shaped plate in the tapered portion gradually approaches the heat dissipation object 300. The outer arc surface of the arc-shaped plate can smoothly guide the airflow into the tapered portion, and compared to the flat plate design, it reduces the resistance and turbulence encountered by the airflow when entering the deflector cavity 101, ensuring that the airflow flows smoothly and continuously to the heat dissipation object 300. The design that the arc-shaped plate in the tapered portion gradually approaches the heat dissipation object 300 causes the airflow to gradually narrow in the space through the region, thereby causing the airflow to converge and accelerate. The accelerated airflow can more effectively impact the surface of the heat dissipation object 300, enhancing the heat exchange effect and improving the heat dissipation efficiency. The curved surface design of the arc-shaped plate helps to reduce local airflow separation, especially when the airflow is diverted or encounters obstacles. The smooth transition of the airflow on the arc surface reduces energy loss, maintains the continuity and strength of the airflow, and is beneficial to the effective dissipation of heat.
[0053] Specifically, the flow guide assembly 200 includes a flow guide plate, the shell 100 is provided with a sliding rail 130 extending from the air inlet 110 to the air outlet 120, the flow guide plate is provided with a sliding block slidingly matched with the sliding rail 130, the shell 100 is provided with an opening extending from the air inlet 110 to the air outlet 120, at least part of the flow guide plate extends out of the opening to form a first positioning member, and the periphery of the opening is provided with a plurality of second positioning members arranged in sequence from the air inlet 110 to the air outlet 120, and the first positioning member and the second positioning member are correspondingly arranged to position the flow guide plate. The sliding block arranged on the flow guide plate is in sliding cooperation with the sliding rail 130 of the shell 100, allowing the flow guide plate to freely slide along the direction from the air inlet to the air outlet. The plurality of second positioning members on the periphery of the opening can match the part of the flow guide plate extending out, i.e., the first positioning member, to achieve accurate positioning of the flow guide plate at different positions. This connection mode ensures that the flow guide plate can be adjusted in position according to actual needs to optimize the heat dissipation effect of the heat dissipation member 300. The arrangement of the second positioning member further simplifies the positioning process, and the user can easily adjust the flow guide plate to the desired position and then fix its position through the positioning member without the need for complex tools or professional skills.
[0054] In the above embodiment, the top end of the flow guide plate is provided with a connecting portion extending out of the opening, the connecting portion is provided with a first positioning member rotationally connected thereto, and the first positioning member is in clamping cooperation with a second positioning member. When the flow guide plate is slid to a suitable position, the first positioning member is buckled with the second positioning member to fix the flow guide plate on the shell 100.
[0055] Specifically, the air guide device further includes a temperature sensor, which is arranged on the side of the flow guide assembly 200 close to the heat dissipation member 300 corresponding to the heat dissipation part. Since the temperature sensor is next to the flow guide assembly 200 and directly faces the heat dissipation part of the heat dissipation member 300, it can accurately reflect the heat dissipation efficiency of this part. Based on the readings of the temperature sensor, the system can intelligently adjust the working state of the flow guide assembly 200, such as adjusting the position or angle of the flow guide plate, to achieve the best heat dissipation effect and avoid local overheating damage.
[0056] In some embodiments, the arrangement of the temperature sensor not only helps to adjust the heat dissipation in daily operation, but also can send a warning signal in abnormal situations. For example, if the temperature of the heat dissipation part abnormally rises, the temperature sensor can immediately feed back to the control system or the user to trigger the alarm mechanism, so as to take prompt measures to prevent potential equipment damage or system failure.
[0057] Specifically, the shell 100 is provided with a plurality of mounting positions arranged in sequence from the air inlet 110 to the air outlet 120, and the flow guide assembly 200 is selectively arranged on one of the plurality of mounting positions; the air guide device includes a plurality of flow guide assemblies 200, and at least two of the plurality of flow guide assemblies 200 are arranged on any two of the plurality of mounting positions. The existence of the plurality of mounting positions allows the flow guide assembly 200 to be selectively installed at any one or more positions as needed. This design enables the system to flexibly adjust the layout of the flow guide assembly 200 according to the specific heat dissipation requirements of the heat dissipation component 300, to achieve precise control and optimization of the airflow, and to achieve the best heat dissipation effect. The selective arrangement of the flow guide assembly 200 between the plurality of mounting positions means that the airflow path can be more finely managed. By arranging the flow guide assembly 200 at different positions, the airflow can be more accurately guided to the key parts of the heat dissipation component 300, effectively avoiding waste of airflow and reducing heat dissipation efficiency.
[0058] The embodiment of the present application also provides a server comprising the above-mentioned air guide device, the server comprising a mainboard and a fan assembly, the mainboard being provided with a heat dissipation component 300, the air guide device being detachably arranged on the mainboard, and the air guide device and the mainboard enclosing a flow guide cavity 101; the fan assembly is arranged on the mainboard corresponding to the air inlet 110, so that the airflow flows into the flow guide cavity 101 from the air inlet 110 and flows out from the air outlet 120.
[0059] The mainboard is provided with an OCP socket, and the OCP card, i.e., the gold finger of the heat dissipation component, is inserted into the OCP socket and connected with the mainboard. An opening is arranged on the side wall of the air guide device away from the flow guide assembly, and during installation, the opening faces the mainboard of the server, so that the air guide device is snap-fitted above the OCP card of the mainboard, thereby forming the flow guide cavity 101 together with the mainboard, the heat dissipation component is arranged inside the flow guide cavity 101, and the fan assembly is arranged on the mainboard corresponding to the air inlet 110, so that the airflow generated by the fan can directly and effectively enter the flow guide cavity 101 and flow out of the flow guide cavity 101 after heat exchange with the heat dissipation component.
[0060] From the above description, it can be seen that the above-mentioned embodiments of the present application achieve the following technical effects:
[0061] Precise airflow management: by arranging the tapered portion of the flow guide assembly 200 inside the shell 100, the cross-sectional area of the airflow is reduced, and in combination with the design of the tapered portion, the flow rate and flow direction of the airflow when flowing through the heat dissipation component 300 can be accurately controlled, ensuring that the airflow can be effectively concentrated on the key heat dissipation part of the heat dissipation component 300, thereby improving the heat dissipation efficiency.
[0062] Flexibility and adjustability: The air guide assembly 200 adopts a detachable design, which can be flexibly adjusted in the direction from the air inlet 110 to the air outlet 120 through the cooperation of the sliding rail 130 and the sliding block, or the first clamping part and the second clamping part, or even replaced by different air guide assemblies 200. This design allows quick adjustment according to the changing heat dissipation needs of the heat dissipation component 300, improving the adaptability and flexibility of the system.
[0063] Dynamic monitoring and control: The temperature sensor integrated in the air guide device can monitor the temperature of the heat dissipation component in real time, providing immediate feedback, so that the server can dynamically adjust the operating state of the fan assembly, as well as the layout and angle of the air guide assembly 200, to achieve intelligent heat dissipation control and ensure stable operation of the equipment.
[0064] Modularity and maintainability: The detachable connection of the air guide device and the mainboard, as well as the modular design of the air guide assembly 200 and the shell 100, greatly improve the maintainability and upgradability of the server heat dissipation system. Maintenance or replacement of the air guide assembly 200 does not require disassembly of other parts of the server, reducing maintenance costs and time.
[0065] High-efficiency heat dissipation and energy saving: Through the above-mentioned precise airflow control, dynamic monitoring and adjustable design, the air guide device can significantly improve the heat dissipation efficiency and reduce unnecessary airflow dissipation, thereby reducing energy consumption while ensuring the heat dissipation effect of the equipment, achieving the dual goals of energy saving and high-efficiency heat dissipation.
[0066] Adapt to diverse heat dissipation needs: The air guide device can adapt to the diverse and changing heat dissipation needs inside the server by setting multiple installation sites and optionally setting multiple air guide assemblies 200. Whether it is handling high-load tasks or running in low-load state, the air guide device can provide the best heat dissipation strategy to ensure that the server maintains good heat dissipation state under various working conditions.
[0067] Optimized system integration: The integrated design of the air guide device with the server mainboard and fan assembly not only optimizes the airflow path, but also simplifies the system structure, making the space utilization inside the server more efficient. This optimized integration scheme reduces the airflow resistance inside the system, improving the flowability and heat dissipation efficiency of the airflow.
[0068] In summary, the present application realizes efficient, intelligent and energy-saving server heat dissipation system through precise airflow management, flexible adjustability, dynamic monitoring and control, and optimized system integration, while improving the maintainability of the system and the ability to adapt to diverse heat dissipation needs, greatly improving the heat management of the server and enhancing its overall performance and stability.
[0069] The above describes in detail the air guiding device and the server having the same provided by the present application. The principles and implementation manners of the present application are described by using specific examples, and the above description of the embodiments is only used to help understand the method of the present application and the core idea thereof. It should be noted that, for those skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. A wind guide device, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a shell (100) and a flow guide assembly (200). The shell (100) is provided with an air inlet (110) and an air outlet (120) and encloses a flow guide cavity (101) for accommodating at least part of a heat dissipation object (300). The flow guide assembly (200) is detachably arranged on the shell (100) and at least part of the flow guide assembly (200) protrudes from the inner wall of the shell (100) to form a tapered part corresponding to the part of the heat dissipation object (300) to be cooled.
2. The air guiding device of claim 1, wherein The cross-sectional area of the flow channel of the tapered part is smaller than that of the air inlet (110).
3. The air guiding device of claim 2, wherein The flow guide assembly (200) comprises a mounting plate (220) and a flow guide plate (210). The mounting plate (220) and the flow guide plate (210) are arranged in sequence at the opening of the shell (100) from the air inlet (110) to the air outlet (120) to form the flow guide cavity (101) together with the shell (100).
4. The air guiding device of claim 2, wherein The opening is provided with a sliding rail (130) extending from the air inlet (110) to the air outlet (120).
5. The air guiding device of claim 4, wherein The mounting plate (220) and the flow guide plate (210) are provided with sliding blocks which are in sliding connection with the sliding rail (130) to detachably connect the mounting plate (220) and the flow guide plate (210) with the shell (100). The opening is provided with a plurality of first clamping parts arranged in sequence from the air inlet (110) to the air outlet (120). The mounting plate (220) and the flow guide plate (210) are provided with second clamping parts corresponding to one of the plurality of first clamping parts to detachably connect the mounting plate (220) and the flow guide plate (210) with the shell (100). The flow guide cavity (101) further comprises a diverging part. The flow guide plate (210) is provided with the flow guide surface and extends in a direction perpendicular to the air inlet (110) and the air outlet (120). At least part of the flow guide surface is arranged in an inclined manner from the air inlet (110) to the air outlet (120) to form the tapered part.
6. The air guiding device of claim 5, wherein The guide plate (210) is a flat plate, and the flat plate in the tapered portion gradually approaches the heat-dissipating component (300) in the direction from the air inlet (110) to the air outlet (120); and / or, The guide plate (210) is an arc-shaped plate, and an outer arc surface of the arc-shaped plate faces the air inlet (110), and the arc-shaped plate in the tapered portion gradually approaches the heat-dissipating component (300) in the direction from the air inlet (110) to the air outlet (120).
7. The air guiding device of claim 1, wherein The guide assembly (200) comprises a guide plate, the shell (100) is provided with a sliding rail (130) extending in the direction from the air inlet (110) to the air outlet (120), the guide plate is provided with a sliding block in sliding cooperation with the sliding rail (130), the shell (100) is provided with an opening extending in the direction from the air inlet (110) to the air outlet (120), at least part of the guide plate extends out of the opening to form a first positioning component, and the periphery of the opening is provided with a plurality of second positioning components arranged in sequence in the direction from the air inlet (110) to the air outlet (120), and the first positioning component and the second positioning component are arranged correspondingly to position the guide plate.
8. The wind guide of claim 1, wherein, The air guiding device further comprises a temperature sensor arranged on a side of the guide assembly (200) close to the heat-dissipating component (300).
9. The wind guide of claim 1, wherein, The shell (100) is provided with a plurality of mounting positions arranged in sequence in the direction from the air inlet (110) to the air outlet (120), and the guide assembly (200) is selectively arranged on one of the mounting positions. And / or, The air guiding device comprises a plurality of guide assemblies (200), and at least two of the guide assemblies (200) are arranged on any two of the mounting positions.
10. A server comprising the air guiding device of any one of claims 1 to 9, characterized in that The server comprises: A mainboard provided with a heat-dissipating component (300), the air guiding device is detachably arranged on the mainboard, and the air guiding device and the mainboard enclose the guide cavity (101); A fan assembly arranged on the mainboard correspondingly to the air inlet (110), so that the air flow flows into the guide cavity (101) from the air inlet (110) and then flows out from the air outlet (120).