High-brightness and high-strength LED support

Abstract

The utility model discloses a high-brightness high-strength LED support, which comprises a substrate, two bonding pads and two pins are formed on the substrate, a groove is arranged between the two bonding pads, a cup body is arranged on the substrate through injection molding, a separation strip is formed in the groove to separate the two bonding pads, the bonding pads are arranged at the groove bottom of the cup body, and the side wall of the cup body is an inclined plane. At least one supporting strip is arranged perpendicular to the separation strip, the two ends of the supporting strip are connected with the two side walls of the cup body respectively, an inner cavity of the cup body is divided into at least two chip binding parts, the two side walls of the supporting strip are inclined planes, the height of the supporting strip is 1 / 3-1 / 2 of the embedded height, and light rays emitted by adjacent lamp beads are converged in the inner cavity of the cup body. In addition, if the supporting strip is in a special shape, a dark area can be formed above the supporting strip, but due to the fact that the area is in the cup body, the dark area can be covered in the mode that the side wall of the cup body reflects light, the effect of eliminating the dark area is achieved, and on the premise that the structure of the cup body is reinforced, the overall display effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor package support, specifically a high brightness high strength LED support. BACKGROUND

[0002] The LED package support is mainly used for binding the main bearing component of the light emitting chip, and the LED package support plays a role in protecting the light emitting chip in addition to the conductivity and convenient installation, and then the strength of the LED package support is crucial.

[0003] With the continuous progress of technology, the existing LED package support usually binds two or more light emitting chips in a cup body, in order to increase the light extraction efficiency and strengthen the strength of the LED package support, usually increase the partition in the cup body, such as the disclosed technical document "CN209963084U, a double cup LED support", in the technical scheme, the inside of the cup cavity is provided with a partition 3, the partition 3 is integrally formed with the injection body 1 and divides the cup cavity into the first chamber and the second chamber located on both sides thereof, so that the LED support can realize three color temperature segments of 3000K, 4000K and 6500K color temperature through the double chamber structure, and can also meet the automatic switching of color temperature in different time, different environment and different occasions.

[0004] Based on the document in the background art and its Figure 2 As shown, the height of the partition 3 is flush with the surface of the cup body, so that the light angle emitted by the two lamp beads is affected by the partition 3, and the light beams will converge above the partition 3, at this time, a dark area will be formed between the partition 3 and the intersection point, although the overall brightness will be improved, but the position of the dark area will be particularly obvious, which will affect the display effect. INVENTION CONTENTS

[0005] The utility model aims at providing a kind of high brightness high strength LED support to solve the problems raised in the above background art.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] A kind of high brightness high strength LED support, including substrate, the substrate is formed with two pads and two pins, two pads are provided with groove between them, cup is injection molded on the substrate, and separation strip is formed in the groove to separate two pads, the pad is located in the groove bottom of cup, and the cup side wall is inclined surface;

[0008] At least one supporting strip is arranged perpendicularly to the partition strip, two ends of the supporting strip are connected with two side walls of the cup body respectively, and the cup body inner cavity is divided into at least two chip binding parts, two side walls of the supporting strip are inclined surfaces, the height of the supporting strip is 1 / 3 to 1 / 2 of the embedding height, and light emitted by adjacent lamp beads is converged in the cup body inner cavity.

[0009] Further technical solutions are that the cross section of the supporting strip is isosceles triangular or equilateral trapezoidal.

[0010] Further technical solutions are that the supporting strip has two supporting strips and is arranged in parallel.

[0011] Further technical solutions are that the inclined surface of the supporting strip is symmetrical with the inclined surface of the cup body side wall, and the angle formed between the two inclined surfaces is 60°-120°.

[0012] Further technical solutions are that the supporting strip is made of translucent material.

[0013] Further technical solutions are that the soldering pad is flush with the pin, steps are arranged on two sides of the soldering pad, the steps are matched with the cup body, and the supporting strip is attached to the surface of the soldering pad.

[0014] The beneficial effects of the present application are as follows:

[0015] Although the light emitted by the lamp bead is limited by the inclined surface of the supporting strip, the light emitted by adjacent lamp beads is converged in the cup body inner cavity, and if the supporting strip adopts a special shape, a dark area is formed above the supporting strip, but since the area is in the cup body, the dark area is covered by the way of reflecting the light by the cup body side wall, so that the effect of eliminating the dark area is achieved, and under the premise of strengthening the cup body structure, the overall display effect is further improved.

[0016] Other features and advantages of the present application will be described in detail in the following specific embodiment part. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Prior art schematic view.

[0018] Figure 2 Front view structure of the present application.

[0019] Figure 3 Rear view structure of the present application.

[0020] Figure 4 Cross-sectional structure of the present application Figure 1 .

[0021] Figure 5 Cross-sectional structure of the present application Figure 2 .

[0022] Figure 6 : the schematic diagram of the plurality of support bar structures Figure 1 .

[0023] Figure 7 : the schematic diagram of the plurality of support bar structures Figure 2 .

[0024] Figure 8 : the light reflection effect simulation diagram of the utility model. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.

[0026] Please refer to Figures 2-8 ;

[0027] The packaging support of the utility model is used for binding white light source chips, aims at strengthening the overall structure and improving the brightness, and specifically comprises a substrate, the substrate is formed with two soldering pads 11 and two pins 12, a groove is arranged between the two soldering pads 11 and is used for being connected with the positive and negative poles respectively, preferably, a silver layer is arranged at the soldering pad 11, so that the conductivity is better, a cup body 21 is injection molded on the substrate, in the injection molding process, the molten slurry not only forms the cup body 21, but also enters the groove to form a separation strip 22 to separate the two soldering pads 11, the separation strip 22 is integrally injection molded with the cup body 21, the cup body 21 wraps the outer periphery of the soldering pad 11, and the relative position of the two soldering pads 11 can be fixed in combination with the arrangement of the separation strip 22, a groove is arranged in the cup body 21, the soldering pad 11 is located at the groove bottom of the cup body 21, and the sidewall of the cup body 21 is inclined.

[0028] In the prior art, the separation strip 22 is not enough to increase the strength of the LED packaging support, therefore, in the technical scheme, at least one support bar 3 is arranged perpendicularly to the separation strip 22, the two ends of the support bar 3 are connected with the two sidewalls of the cup body 21 respectively, the support bar 3 is located above the separation strip 22 and is arranged staggeredly, forming an upper and lower support structure, so that the overall strength of the cup body 21 is enhanced, and the soldering pad 11 is divided into at least two regions for binding the chips, each region contains the positive and negative poles, the number of the binding parts depends on the number of the support bars 3, and the two are in the relationship of n and n+1, the two sidewalls of the support bar 3 are inclined, and the height of the support bar 3 is 1 / 3 to 1 / 2 of the embedded height;

[0029] The light emitted by the lamp beads will be limited by the inclined surface of the support strip 3, the light emitted by adjacent lamp beads converges in the inner cavity of the cup body 21, and a dark area is formed above the support strip 3 when the support strip 3 adopts a special shape. However, since the area is in the cup body 21, the dark area can be covered by reflecting the light through the side wall of the cup body 21, thereby eliminating the dark area and further improving the overall display effect under the premise of strengthening the structure of the cup body 21.

[0030] Preferably, the cross section of the support strip 3 is isosceles triangular or isosceles trapezoidal, wherein when the isosceles trapezoidal shape is adopted, a gap is formed at the intersection of the light and the end surface of the support strip 3, and when the isosceles triangular shape is adopted, the intersection of the light is located at the top of the triangle, and at this time, the condition for forming a dark area does not exist, and the display effect is better.

[0031] In one embodiment, the support strip 3 and the cup body 21 are integrally injection molded, and the color is white. In addition to having a supporting effect, it also has a good light reflection effect. In another embodiment, the support strip 3 is formed by secondary injection molding and is made of a translucent material, specifically frosted transparent or white transparent. Generally, the emitting angle of the light-emitting chip is 160°, and the inclination angle of the side wall of the cup body 21 is generally 120°. That is, part of the light needs to be reflected multiple times before it can be emitted outside the cup body 21. Moreover, during the reflection process, the energy of this part of the light is lost and converted into heat on the cup body 21. The energy of this part of the light is weaker than that of the light directly irradiated to the outside, and the superposition cannot enhance the brightness, or the superposition has a very limited effect on enhancing the brightness. Therefore, this part of the light is wasted.

[0032] In the embodiment, the translucent support strip 3 can not only reflect light but also absorb part of the light to emit light. The light of two adjacent light-emitting chips irradiates the support strip 3, forming a secondary light source. For the dark area formed by the special shape, such as the isosceles trapezoidal shape, the light emitted by the secondary light source can cover the dark area.

[0033] Preferably, a large number of light condensing points can be formed on the side wall of the support strip 3. The setting of these light condensing points is similar to the effect of making the brightness distribution uniform and absorbing light to increase the brightness in the catheter plate assembly. The light absorption effect of the support strip 3 is increased, the utilization rate of light is improved, the brightness emitted by the support strip 3 is higher, a certain light superposition effect can be achieved, and the overall brightness is improved.

[0034] In the embodiment of the utility model, the support strip 3 has two parallel settings, in other words, three binding areas are formed, which greatly increases the utilization rate of the packaging support. It should be noted that one chip can be set in one binding area, or two chips can be set, which is determined by the use mode.

[0035] Further, the slope of the support strip 3 is symmetrical with the slope of the cup body 21 side wall, the angle between the two slopes is 60°-120°.

[0036] The pad 11 is flush with the pin 12, and steps 13 are arranged on both sides of the pad 11. In the process of injection molding of the cup body 21, the slurry enters the steps 13 to form a shape suitable for the steps 13 and the cup body 21. In addition, the surface of the support strip 3 adheres to the pad 11, which not only has a supporting effect, but also can press the pad 11 tightly to prevent it from being raised.

[0037] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0038] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A high brightness high intensity LED holder characterized by: The application relates to a substrate with two pads (11) and two pins (12), a groove between the two pads (11), a cup (21) formed by injection molding on the substrate, and a partition (22) in the groove to separate the two pads (11), the pads (11) being located at the bottom of the cup (21), and the side wall of the cup (21) being inclined. At least one supporting strip (3) is arranged perpendicularly to the partition (22), the two ends of the supporting strip (3) being connected with the two side walls of the cup (21) respectively, the inner cavity of the cup (21) being divided into at least two chip binding parts, the two side walls of the supporting strip (3) being inclined, the height of the supporting strip (3) being 1 / 3 to 1 / 2 of the embedding height, and the light emitted by adjacent lamp beads being converged in the inner cavity of the cup (21).

2. The high-brightness high-strength LED support of claim 1, wherein: The cross section of the supporting strip (3) is isosceles triangular or equilateral trapezoidal.

3. The high-brightness high-strength LED support of claim 1, wherein: The supporting strip (3) has two parallel supporting strips.

4. The high-brightness high-strength LED support of claim 1, wherein: The inclined surface of the supporting strip (3) is symmetrical to the inclined surface of the side wall of the cup (21), and the angle between the two inclined surfaces is 60-120 degrees.

5. The high-brightness high-strength LED support of claim 1, wherein: The supporting strip (3) is made of translucent material.

6. The high-brightness high-strength LED support of claim 1, wherein: The pads (11) are flush with the pins (12), steps (13) are arranged on the two sides of the pads (11), the steps (13) are matched with the cup (21), and the supporting strip (3) is attached to the surface of the pad (11).

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