Light-emitting chip transfer substrate

Abstract

The utility model relates to the technical field of mass transfer, in particular to a light-emitting chip transfer substrate, which comprises a first surface and a second surface opposite to the first surface, a plurality of through holes are arranged to penetrate through the first surface and the second surface, the distance between the through holes corresponds to the distance between the light-emitting chips, and the through holes are filled with adhesive materials. The adhesive is used for adhering and transferring the light-emitting chip; the adhesive material can be ablated and gasified under the action of laser so as to release the light-emitting chip, and meanwhile, the through hole comprises one or a combination of a straight through hole, a conical hole or a spiral hole; according to the scheme, the plurality of through holes in different shapes are formed, and the adhesive materials which can be ablated and gasified by the laser are arranged in the through holes to adhere or release the light-emitting chips, so that the transfer effect of a single light-emitting chip can be more accurately controlled, and the arrangement effect of different light-emitting chips is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of mass transfer, in particular to a light emitting chip transfer substrate. BACKGROUND

[0002] In the development of display technology, Micro LED display technology has shown great market potential due to its many advantages. However, the key link of Micro LED mass production - mass transfer technology faces many challenges.

[0003] On the one hand, the process route of laser direct transfer directly transfers the chip from the sapphire epitaxial wafer to the backplane. It is difficult to accurately control the laser dissociation, resulting in low transfer yield and poor precision. On the other hand, the process of laser indirect transfer, i.e. temporary carrier assisted transfer, will generate airflow in different directions when the laser is used to debond or dissociate the adhesive material, causing the chip to deviate in direction when it falls onto the temporary carrier, resulting in displacement or rotation of the chip. There are problems such as slow and inaccurate release of adhesive material chips. At the same time, when the laser acts on a specific position, the deformation of the entire adhesive layer will affect the surrounding chips, resulting in a decrease in transfer precision. SUMMARY

[0004] The purpose of the utility model is to provide a light emitting chip transfer substrate to improve the transfer precision of light emitting chips.

[0005] The utility model is implemented as follows:

[0006] A light emitting chip transfer substrate, the transfer substrate comprises: a first surface and a second surface opposite to the first surface; a plurality of through holes are provided through the first surface to the second surface, the pitch of the through holes corresponds to the pitch of the light emitting chips, and the through holes are filled with adhesive material for adhering and transferring the light emitting chips; the adhesive material can be ablated and gasified under the action of laser to release the light emitting chips, and the through holes include one or a combination of straight cylinder through holes, tapered holes or spiral holes.

[0007] Further, the through hole is a straight cylinder through hole, and the diameter of the straight cylinder through hole remains consistent from the first surface to the second surface.

[0008] Further, when the adhesive material is ablated and gasified under the action of laser, the airflow generated under the constraint of the straight cylinder through hole flows vertically downward and acts on the light emitting chip.

[0009] Further, the through hole is a tapered hole, and the diameter of the tapered hole gradually expands or shrinks from the first surface to the second surface.

[0010] Further, when the adhesive material is ablated and gasified under the action of the laser, the gas flow generated is correspondingly offset along with the change in the diameter of the tapered hole, so that the light emitting chip is oriented and offset within a predetermined angle range.

[0011] Further, the through hole is a spiral hole, which spirally extends from the first surface to the second surface to form a spiral channel.

[0012] Further, when the adhesive material is ablated and gasified under the action of the laser, the gas flow generated flows along the spiral hole to form a spiral gas flow acting on the light emitting chip, so that the light emitting chip is initially deflected.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a kind of light emitting chip transfer substrate, including first surface and the second surface opposite to first surface, it is provided with multiple through holes passing through first surface and second surface, the pitch of this through hole corresponds with the pitch of light emitting chip, and adhesive material is filled in through hole, to be used for the adhesion transfer of light emitting chip;The adhesive material can be ablated and gasified under the action of laser to release the light emitting chip, and the through hole includes one or combination of straight through hole, tapered hole or spiral hole;The present scheme is by being provided with multiple different shapes of through hole, and adhesive material that can be ablated and gasified by laser is arranged in through hole, and the adhesion or release of light emitting chip is carried out, the transfer effect of single light emitting chip can be more accurately controlled, and different light emitting chip arrangement effect is realized.

[0014] In order to make the above-mentioned purpose, features and advantages of the utility model more apparent and easy to understand, the following preferred embodiments are specifically described, and the accompanying drawings are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to make the purpose, technical scheme and advantage of the utility model embodiment more clear, the technical scheme in the utility model embodiment will be described clearly and completely in the following with reference to the drawings in the utility model embodiment. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the utility model embodiments described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the utility model.

[0016] Figure 1 A structure schematic view of a light emitting chip transfer substrate provided by the utility model is shown.

[0017] Figure 2 The structure schematic diagram of the light emitting chip transfer substrate provided by the utility model is shown.

[0018] Figure 3 The laser transfer schematic diagram provided by the utility model is shown.

[0019] Figure 4 The schematic diagram of the laser transfer release chip provided by the utility model is shown.

[0020] Figure 5 The schematic diagram of the light emitting chip transfer substrate provided by the utility model is shown.

[0021] Figure 6 The schematic diagram of the light emitting chip transfer substrate provided by the utility model is shown.

[0022] Figure 7 The schematic diagram of the light emitting chip transfer substrate provided by the utility model is shown.

[0023] Fig.:

[0024] 100-transfer substrate; 110-first surface; 120-second surface; 130-adhesive material; 140-straight through hole; 150-tapered hole; 160-spiral hole; 200-light emitting chip. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the utility model.

[0026] As Figure 1 shown, it is the structure schematic diagram of the light emitting chip transfer substrate provided by the utility model, the transfer substrate 100 includes the first surface 110 and the second surface 120, and a plurality of through holes are arranged through the first surface 110 and the second surface 120, the interval of the through hole corresponds with the interval of the light emitting chip 200. As Figure 2As shown, the through hole is filled with adhesive material 130 for adhering and transferring the light emitting chip 200. As shown Figure 3 and Figure 4 As shown, the adhesive material 130 can be ablated and vaporized under the action of laser to release the light emitting chip 200 to be bonded on the driving backboard (for example, the driving backboard is used for description, and other transfer carriers such as intermediate substrate can also be used). The light emitting chip 200 can be but not limited to Micro LED or Mini LED. In addition, the through hole includes one or a combination of straight through hole 140, tapered hole 150 or spiral hole 160, that is, the straight through hole 140, tapered hole 150 or spiral hole 160 can be selectively arranged on the transfer substrate 100, or two or three of them can be arranged on the transfer substrate 100. Due to the inconsistent shape of each through hole, the light emitting chip 200 will have different arrangement effects on the driving backboard. In this scheme, by arranging through holes of different shapes and filling adhesive material 130 which can be ablated and vaporized by laser in the through hole, the airflow generated by the ablation and vaporization of the adhesive material 130 is limited by the through hole and only acts on the current corresponding light emitting chip 200, improving the transfer precision. At the same time, different through hole shapes also make the light emitting chip 200 have different arrangement effects on the driving backboard, achieving the effect of arranging light emitting chips 200 according to different needs.

[0027] The following describes the case where only one of the straight through hole 140, tapered hole 150 or spiral hole 160 is arranged on the transfer substrate 100. If two or more through holes are arranged on the transfer substrate 100, it is only the cumulative effect of arranging one kind of through hole.

[0028] As shown Figure 5 The straight through hole 140 is arranged on the transfer substrate 100, and the diameter of the straight through hole 140 is consistent from the first surface 110 to the second surface 120. At this time, when the adhesive material 130 filled in the straight through hole 140 is ablated and vaporized under the action of laser, the airflow generated is vertically downward under the constraint of the straight through hole 140 and acts on the light emitting chip 200. This kind of vertical airflow provides a stable and directional force for the light emitting chip 200, so that the light emitting chip can fall down according to the intended direction and be uniformly arranged on the driving backboard.

[0029] As shown Figure 6 The tapered hole 150 is arranged on the transfer substrate 100, and the diameter of the tapered hole 150 gradually expands or shrinks from the first surface 110 to the second surface 120. As shown Figure 6As shown, the taper hole 150 is shown to gradually reduce in diameter from the first surface 110 to the second surface 120, which can also be tapered on both sides towards the middle, or one side remains unchanged and the other side gradually approaches the side. The special structure of the taper hole 150 allows the adhesive material 130 filled in the taper hole 150 to change the gas flow distribution and flow direction when ablated and vaporized by laser, specifically, the gas flow can be guided and converged to a certain extent according to the angle and direction of the taper, such as the gas flow corresponding to the change in the diameter of the taper hole 150. Offset, thereby providing different directions and intensities of force for the light emitting chip 200, ultimately allowing the light emitting chip 200 to be oriented and offset within a predetermined angle, achieving different chip arrangement effects.

[0030] As shown in FIG. 1, the transfer substrate 100 is provided with a straight hole 140, a taper hole 150, and a spiral hole 160, and the light emitting chip 200 is filled with an adhesive material 130. Figure 7 As shown, only the spiral hole 160 is provided on the transfer substrate 100, which spirally extends from the first surface 110 to the second surface 120 to form a spiral channel. By adjusting the parameters related to the spiral hole 160 and the distance between the transfer substrate 100 and the driving backboard, the falling position and angle of the light emitting chip 200 can be accurately controlled. In the operation process, when the adhesive material 130 filled in the spiral hole 160 is ablated and vaporized by laser, the gas flow generated along the spiral hole forms a spiral gas flow acting on the light emitting chip 200, so that the light emitting chip 200 obtains a certain initial angle deflection, to realize the accurate control of the falling angle and position of the light emitting chip 200, and provides a new solution to solve the complex chip arrangement problem.

[0031] Therefore, the present scheme provides a light emitting chip transfer substrate, which can be provided with one or more of a straight hole 140, a taper hole 150 or a spiral hole 160 according to the chip arrangement requirements, and filled with an adhesive material 130 to adhere to the light emitting chip 200, so that the gas flow generated by the ablation of the adhesive material 130 is limited by the through hole, and the light emitting chip 200 is accurately transferred and arranged on the driving backboard according to the predetermined design.

[0032] In conclusion, the utility model provides a kind of light emitting chip transfer substrate, including first surface and second surface opposite with first surface, a plurality of through holes are arranged through first surface and second surface, the pitch of the through hole corresponds with the pitch of light emitting chip, adhesive material is filled in the through hole, to be used for the adhesion transfer of light emitting chip;The adhesive material can be ablated gasification under the action of laser to release the light emitting chip, and the through hole includes one or combination of straight cylinder through hole, taper hole or spiral hole;The present scheme is by being provided with multiple different shapes of through hole, and adhesive material that can be ablated gasification by laser is arranged in the through hole to adhere or release light emitting chip, the transfer effect of single light emitting chip can be more accurately controlled, and different light emitting chip arrangement effect is realized.

[0033] In the description of the utility model, it also needs to be explained that, unless there is explicit provision and limitation, the terms "arrangement", "installation", "connection", "connection" should be broadly understood, for example, it can be fixed connection, it can also be detachable connection, or integrally connected;It can be mechanical connection, or electrical connection;It can be directly connected, or indirectly connected through intermediate medium, it can be the communication inside two elements.For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0034] It should be noted that: similar signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0035] In the description of the utility model, it needs to be explained that, the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawing, or the orientation or positional relationship usually placed when the utility model product is used, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model.The above-mentioned is only the preferred embodiment of the utility model, and is not used to limit the utility model, for those skilled in the art, the utility model can have various changes and changes.Any modification, equivalent replacement, improvement, etc., within the spirit and principle of the utility model, should be included in the protection scope of the utility model.

Claims

1. A light emitting chip transfer substrate, characterized by, The transfer substrate comprises: a first surface and a second surface opposite to the first surface; a plurality of through holes are arranged through the first surface to the second surface, the pitch of the through holes corresponds to the pitch of the light emitting chips, and the through holes are filled with adhesive materials for adhering and transferring the light emitting chips; the adhesive materials can be ablated and gasified under the action of laser to release the light emitting chips, and the through holes include one or a combination of straight through holes, tapered holes or spiral holes.

2. The light emitting die transfer substrate of claim 1, wherein, The through holes are straight through holes, and the diameters of the straight through holes remain consistent from the first surface to the second surface.

3. The light emitting die transfer substrate of claim 2, wherein, When the adhesive materials are ablated and gasified under the action of laser, the generated gas flow flows vertically downward under the constraint of the straight through holes and acts on the light emitting chips.

4. The light emitting die transfer substrate of claim 1, wherein, The through holes are tapered holes, and the diameters of the tapered holes gradually increase or decrease from the first surface to the second surface.

5. The light emitting die transfer substrate of claim 4, wherein, When the adhesive materials are ablated and gasified under the action of laser, the generated gas flow is correspondingly offset with the change of the diameter of the tapered hole, so that the light emitting chip is oriented and offset within a predetermined angle range.

6. The light emitting die transfer substrate of claim 1, wherein, The through holes are spiral holes, and the spiral holes extend spirally from the first surface to the second surface to form spiral channels.

7. The light emitting die transfer substrate of claim 6, wherein, When the adhesive materials are ablated and gasified under the action of laser, the generated gas flow flows along the spiral holes to form a spiral gas flow acting on the light emitting chips, so that the light emitting chips are initially deflected.

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