Light-emitting device and LED packaging structure
By placing the IC chip in a recess in the substrate or embedding it within the substrate, the problem of the IC chip blocking light is solved, improving the light emission uniformity of the LED packaging structure and the lifespan of the IC chip, while also simplifying electrical connections and heat dissipation.
Patent Information
- Application Number
- CN202423203013.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-24
AI Technical Summary
The IC chip blocks the light from the light-emitting unit in the LED package structure, resulting in reduced light output and affecting the uniformity of light output.
The IC chip is placed in a groove on the first surface of the substrate or embedded in the substrate to avoid blocking the light from the light-emitting unit, and electrical connection is achieved through leads or lead holes.
It improves the light emission uniformity of the LED packaging structure, reduces the risk of heat transfer and local heat concentration, extends the service life of the IC chip, and facilitates the installation and electrical connection of the light-emitting unit.
Smart Images
Figure CN223639646U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of LED packaging, and in particular to a light emitting device and an LED packaging structure. BACKGROUND
[0002] At present, in order to adjust the brightness of the light emitting unit in the LED packaging structure, an IC chip (Integrated Circuit Chip) is embedded in the LED packaging structure, and the functions of communication and driving the light emitting unit to emit light are realized simultaneously through the IC program. However, the setting of the IC chip causes the light output of part of the LED packaging structure to be weakened, which affects the light output uniformity of the LED packaging structure. SUMMARY
[0003] The embodiments of the present application provide a light emitting device and an LED packaging structure.
[0004] In one aspect, the present application provides an LED packaging structure, which comprises:
[0005] a substrate having a first surface;
[0006] a bowl cup arranged on the first surface of the substrate;
[0007] a light emitting unit arranged on the first surface and located in the bowl cup; and
[0008] an IC chip;
[0009] wherein the first surface of the substrate is provided with a recess, and the IC chip is completely located in the recess; and a projection of the light emitting unit on the first surface does not overlap with the recess.
[0010] Alternatively, the IC chip is embedded in the substrate, and the first surface of the substrate is provided with a lead hole; the LED packaging structure further comprises a lead; the lead is at least partially arranged in the lead hole, and the terminal of the IC chip and the electrode of the light emitting unit are electrically connected through the lead.
[0011] In some embodiments, in a direction perpendicular to the substrate, the top surface of the IC chip is lower than the first surface.
[0012] In some embodiments, the distance between the IC chip and the side wall of the recess is greater than zero and less than or equal to 75 μm.
[0013] In some embodiments, the LED packaging structure further comprises an insulating sealing layer covering the IC chip.
[0014] In some embodiments, the insulating sealing layer is a white glue layer.
[0015] In some embodiments, the IC chip is fixedly bonded with the bottom wall of the recess.
[0016] In some embodiments, the IC chip is embedded in the substrate; the region of the first surface where the light emitting unit is arranged is a light emitting region; a projection of the IC chip on the first surface at least partially falls in the light emitting region.
[0017] In some embodiments, the lead hole extends along the thickness direction of the substrate.
[0018] In some embodiments, the LED packaging structure comprises a plurality of light emitting units, and the plurality of light emitting units comprises a red light emitting unit, a green light emitting unit and a blue light emitting unit.
[0019] In another aspect, the present application also provides a light emitting device comprising the LED packaging structure provided by the present application.
[0020] The plurality of embodiments provided by the present application avoid the shielding of the light emitted by the light emitting unit by placing the IC chip in the recess on the first surface of the substrate or embedding the IC chip in the substrate, thereby reducing the light emission weakening of the LED packaging structure and improving the light emission uniformity. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 The structural schematic diagram of the LED packaging structure provided by one embodiment of the present application.
[0022] Figure 2 The structural schematic diagram of the LED packaging structure provided by another embodiment of the present application.
[0023] REFERENCE SIGNS
[0024] 100 / 200, LED packaging structure; 110, substrate; 111, first surface; 112, recess; 113, lead hole; 120, bowl cup; 121, light emitting cavity; 122, reflecting surface; 130, light emitting unit; 140, IC chip; 150, insulating sealing layer; 160, lead. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.
[0026] In the present application, the drawings are not necessarily drawn to scale, and local features can be enlarged or reduced to more clearly show the details of the local features.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. As used in the description of the application and the appended claims, the singular forms "a", "an" and "the" are used herein to include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a" or "the" includes one or more such items, irrespective of whether additional items can be present or not.
[0028] In the description of the application, it should be understood that the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "multiple" is two or more, unless otherwise specifically limited. In the description of the application, the meaning of "several" is one or more, unless otherwise specifically limited.
[0029] In the description of the application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of the simplified description of the application, and does not indicate that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, that is, cannot be understood as limiting the application.
[0030] In the description of the application, unless otherwise specifically limited, the terms "mounting", "connection", "connection", "fixing", "setting" and the like should be broadly understood. For example, "connection" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, or internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0031] In the description of the present application, unless otherwise explicitly defined, the first feature is "on", "over", "above" and "upper", "under", "below", "under" or "under" of the second feature can be direct contact of the first feature and the second feature, or indirect contact of the first feature and the second feature through intermediate medium. Moreover, the first feature is "over", "above" and "above" of the second feature can be directly above or obliquely above the first feature, or just indicate that the horizontal height of the first feature is higher than the horizontal height of the second feature. The first feature is "below", "below" and "below" of the second feature can be directly below or obliquely below the first feature, or just indicate that the horizontal height of the first feature is less than the horizontal height of the second feature.
[0032] The researchers found that in the traditional LED packaging structure, the IC chip is often placed in the bowl cup, that is, in the light-emitting cavity of the LED packaging structure. The IC chip will block the light emitted by the light-emitting unit, thereby causing the light emitted by the LED packaging structure to be weakened, affecting the light uniformity of the LED packaging structure.
[0033] Therefore, the researchers propose an LED packaging structure. The multiple embodiments provided in the present application place the IC chip in the groove on the first surface of the substrate or embed the IC chip in the substrate, thereby avoiding blocking the light emitted by the light-emitting unit, thereby reducing the light weakening of the LED packaging structure and improving the light uniformity.
[0034] Referring to Figure 1 The LED packaging structure 100 provided in an embodiment of the present application includes a substrate 110, a bowl cup 120, a light-emitting unit 130, and an IC chip 140. The substrate 110 has a first surface 111. The bowl cup 120 is arranged on the first surface 111 of the substrate 110. The light-emitting unit 130 is arranged on the first surface 111 and located in the bowl cup 120. The first surface 111 of the substrate 110 is provided with a groove 112, and the IC chip 140 is completely located in the groove 112. The projection of the light-emitting unit 130 on the first surface 111 does not overlap the groove 112.
[0035] It can be understood that the IC chip 140 is completely located in the groove 112, which means that the top end of the IC chip 140 is not higher than the first surface 111 of the substrate 110.
[0036] The above LED packaging structure 100 places the IC chip 140 in the groove 112 on the first surface 111 of the substrate 110, thereby avoiding blocking the light emitted by the light-emitting unit 130, thereby reducing the light weakening of the LED packaging structure 100 and improving the light uniformity.
[0037] In other words, the inner side surface of the bowl cup 120 and the first surface 111 of the substrate 110 form the light emitting cavity 121. The inner side surface of the bowl cup 120 constitutes the reflecting surface 122, and the portion of the first surface 111 exposed in the light emitting cavity 121 constitutes the bottom wall of the light emitting cavity 121. The light emitting unit 130 is disposed on the bottom wall of the light emitting cavity 121. The groove 112 is located on the bottom wall of the light emitting cavity 121.
[0038] It can be understood that the top end opening of the groove 112 facilitates the electrical connection between the light emitting unit 130 and the IC chip 140. Specifically, the lead wire electrically connected to the light emitting unit 130 can enter the groove 112 through the opening at the top end of the groove 112 and be electrically connected to the corresponding terminal of the IC chip 140, facilitating the wiring arrangement between the IC chip 140 and the light emitting unit 130.
[0039] The IC chip 140 is completely located in the groove 112, and the distance between the IC chip 140 and the light emitting unit 130 is increased, reducing the heat transfer between the IC chip 140 and the light emitting unit 130, facilitating the dispersion of heat of the IC chip 140 and the light emitting unit 130, and also reducing the risk of local heat concentration.
[0040] In the embodiment, the IC chip 140 is completely located in the groove 112, and the distance between the IC chip 140 and the light emitting unit 130 is not reduced in the direction parallel to the first surface 111, so the response speed between the IC chip 140 and the light emitting unit 130 is not reduced.
[0041] In the embodiment, the projection of the light emitting unit 130 on the first surface 111 does not overlap with the groove 112, so the projection of the light emitting unit 130 on the first surface 111 does not overlap with the projection of the IC chip 140 on the first surface 111. When fixing the light emitting unit 130, the influence of interference from the IC chip 140 is avoided, the installation space of the light emitting unit 130 is improved, and the operation is facilitated.
[0042] In the embodiment, the top surface of the IC chip 140 is coplanar with the first surface 111 in the direction perpendicular to the substrate 110. It can be understood that in some other embodiments, the top surface of the IC chip 140 is lower than the first surface 111 in the direction perpendicular to the substrate 110, which reduces the risk of the top surface of the IC chip 140 being higher than the first surface 111 due to process errors, reduces the risk of interference from the IC chip 140 during installation of the light emitting unit 130. In addition, it also reduces the requirement for process precision when forming the groove 112, reduces production cost, and improves production efficiency.
[0043] In the embodiment, the distance between the IC chip 140 and the sidewall of the groove 112 is greater than zero and less than or equal to 75 μm. On the one hand, the IC chip 140 is facilitated to be placed in the groove 112. On the other hand, the groove 112 is avoided from occupying too much space of the bottom wall of the light emitting cavity 121, so as to leave more operation space for the light emitting unit 130. On the other hand, when the IC chip 140 is installed, the friction between the sidewall of the IC chip 140 and the sidewall of the groove 112 is reduced, so as to reduce the damage risk of the IC chip 140 and improve the service life of the IC chip 140.
[0044] Specifically, the distance between the IC chip 140 and the sidewall of the groove 112 can be any value in the range of greater than zero and less than or equal to 75 μm, such as 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm or 75 μm.
[0045] In the embodiment, the LED packaging structure 100 further comprises an insulating sealing layer 150 covering the IC chip 140, so as to seal the IC chip 140 in the groove 112 and prevent the IC chip 140 from being eroded by dust, water vapor and the like in the environment, thereby improving the service life of the IC chip 140. In addition, the setting of the insulating sealing layer 150 can also strengthen the strength of the fixed connection between the IC chip 140 and the substrate 110.
[0046] Further, in the embodiment, the insulating sealing layer 150 extends to cover the edge area beyond the groove 112, so as to avoid impurities from falling between the IC chip 140 and the sidewall of the groove 112 in the production process, thereby avoiding the influence on the strength of the fixed connection between the IC chip 140 and the substrate 110.
[0047] Optionally, the insulating sealing layer 150 is a white glue layer. The white glue has good insulation, sealing and adhesion, so as to better realize the insulation and sealing of the IC chip.
[0048] Optionally, the IC chip 140 is fixedly bonded with the bottom wall of the groove 112, without the need to set a fixing hole or other fixing structure on the IC chip 140, so that the structure of the IC chip 140 is simpler and the service life of the IC chip 140 is improved. In addition, the size of the IC chip 140 is small, and the IC chip 140 is fixed by bonding, that is, the bonding glue is applied on the bottom wall of the groove 112 and / or the bottom wall of the IC chip 140, and then the IC chip 140 is placed in the groove 112. The operation is simple, the operation difficulty is reduced, and the work efficiency is improved.
[0049] Optionally, the IC chip 140 is fixedly connected with the bottom wall of the groove 112 by die bonding glue.
[0050] In the embodiment, the LED packaging structure 100 comprises a plurality of light emitting units 130, which comprise red light emitting units, green light emitting units and blue light emitting units. Therefore, by adjusting the light emitting brightness of different light emitting units 130, the color of the light emitted by the LED packaging structure 100 can be adjusted in addition to the overall light emitting brightness of the LED packaging structure 100.
[0051] It can be understood that the number of red light emitting units, green light emitting units and blue light emitting units in the plurality of light emitting units 130 can be set as required and is not specifically limited here.
[0052] In addition, the arrangement mode of the plurality of light emitting units 130 can be set as required and is not specifically limited here.
[0053] It can be understood that in some other embodiments, the plurality of light emitting units 130 are not limited to comprising red light emitting units, green light emitting units and blue light emitting units, but can also comprise at least one of red light emitting units, green light emitting units and blue light emitting units, and / or other color light emitting units 130.
[0054] Specifically, in the embodiment, the red light emitting units are red light chips, the green light emitting units are green light chips, and the blue light emitting units are blue light chips. It can be understood that in some other embodiments, the red light emitting units can also be other color light emitting chips and fluorescent layers covering the surfaces thereof, etc., to emit red light; and / or the green light emitting units can also be other color light emitting chips and fluorescent layers covering the surfaces thereof, etc., to emit green light; and / or the blue light emitting units can also be other color light emitting chips and fluorescent layers covering the surfaces thereof, etc., to emit blue light.
[0055] Referring to Figure 2 Another embodiment of the present application provides an LED packaging structure 200, which is different from the LED packaging structure 100 in that the IC chip 140 is embedded in the substrate 110, and the first surface 111 of the substrate 110 is provided with a lead hole 113; the LED packaging structure 200 further comprises a lead 160; the lead 160 is at least partially arranged in the lead hole 113, and the terminal of the IC chip 140 and the electrode of the light emitting unit 130 are electrically connected through the lead 160.
[0056] Similarly, the IC chip 140 is embedded in the substrate 110, which can also avoid the shielding of the light emitted by the light emitting unit 130 by the IC chip 140, thereby reducing the light emission weakening of the LED packaging structure 200 and improving the light emission uniformity.
[0057] In addition, it can be understood that the lead wire 160 can be at least partially placed in the lead wire hole 113, so as to realize the electrical connection between the IC chip 140 and the light emitting unit 130.
[0058] In addition, the IC chip 140 is embedded in the substrate 110, so as not to occupy the space of the bottom wall of the light emitting cavity 121, to reserve more space for the arrangement of the light emitting unit 130, and to facilitate the arrangement of the light emitting unit 130.
[0059] In addition, the IC chip 140 is embedded in the substrate 110, so as to avoid the influence of water vapor or impurities in the environment on the IC chip 140, and to improve the service life of the IC chip 140.
[0060] In addition, the IC chip 140 is embedded in the substrate 110, so as to avoid the damage of the IC chip 140 when the light emitting unit 130 is fixed, and to further avoid the damage of the IC chip 140; meanwhile, the difficulty of fixing the light emitting unit 130 can be reduced, and the preparation efficiency can be improved.
[0061] In addition, the IC chip 140 and the light emitting unit 130 are electrically connected through the lead wire 160 which is at least partially placed in the lead wire hole 113, so that the length of the lead wire 160 between the IC chip 140 and the light emitting unit 130 is short, and the response speed between the IC chip 140 and the light emitting unit 130 is improved.
[0062] In addition, the lead wire 160 is at least partially placed in the lead wire hole 113, so that the lead wire 160 does not occupy the space outside the outer wall of the substrate 110, and the miniaturization of the LED packaging structure 200 is facilitated.
[0063] In the embodiment, the region of the first surface 111 where the light emitting unit 130 is arranged is a light emitting region; the projection of the IC chip 140 on the first surface 111 at least partially falls in the light emitting region. In other words, the IC chip 140 is at least partially located on the bottom side of the light emitting unit 130, so as to reduce the size of the light emitting cavity 121, and to facilitate the miniaturization of the LED packaging structure 200.
[0064] Further, the lead wire hole 113 extends along the thickness direction of the substrate 110, so as to shorten the length of the lead wire 160, and to further improve the response speed between the IC chip 140 and the light emitting unit 130.
[0065] An embodiment of the present application also provides a light emitting device comprising the LED packaging structure provided by any one of the embodiments of the present application.
[0066] The light emitting device avoids the shielding of the light emitted by the light emitting unit by placing the IC chip in the groove on the first surface of the substrate or embedding the IC chip in the substrate, thereby reducing the light weakening of the LED package structure part and improving the light uniformity.
[0067] The light emitting device can be, but is not limited to, an atmosphere lamp, and can be used on a traffic device or other required device or scene.
[0068] It can be understood that in various embodiments in the present application, the size of the sequence number of each process does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
[0069] It can be understood that the various embodiments described in the present application can be implemented alone or in combination, and the embodiments of the present application do not limit this.
[0070] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.
[0071] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. An LED packaging structure, characterized in that, The LED packaging structure includes: The substrate has a first surface; A bowl / cup is disposed on the first surface of the substrate; A light-emitting unit is disposed on the first surface and located inside the bowl / cup; and IC chips; The first surface of the substrate is provided with a groove, and the IC chip is completely located within the groove; the projection of the light-emitting unit on the first surface does not overlap with the groove. Alternatively, the IC chip is embedded in the substrate, and the first surface of the substrate is provided with lead holes; the LED packaging structure further includes leads; the leads are at least partially passed through the lead holes, and the terminals of the IC chip and the electrodes of the light-emitting unit are electrically connected through the leads.
2. The LED packaging structure according to claim 1, characterized in that, Along a direction perpendicular to the substrate, the top surface of the IC chip is lower than the first surface.
3. The LED packaging structure according to claim 1, characterized in that, The distance between the IC chip and the sidewall of the groove is greater than zero and less than or equal to 75 μm.
4. The LED packaging structure according to claim 1, characterized in that, The LED packaging structure also includes an insulating sealing layer covering the IC chip.
5. The LED packaging structure according to claim 4, characterized in that, The insulating sealing layer is a white adhesive layer.
6. The LED packaging structure according to claim 1, characterized in that, The IC chip is bonded and fixed to the bottom wall of the groove.
7. The LED packaging structure according to claim 1, characterized in that, The IC chip is embedded in the substrate; the area on the first surface where the light-emitting unit is disposed is the light-emitting area; the projection of the IC chip on the first surface at least partially falls on the light-emitting area.
8. The LED packaging structure according to claim 7, characterized in that, The lead hole extends along the thickness direction of the substrate.
9. The LED packaging structure according to any one of claims 1 to 8, characterized in that, The LED packaging structure includes multiple light-emitting units, which include red light-emitting units, green light-emitting units, and blue light-emitting units.
10. A light-emitting device, characterized in that, Includes the LED packaging structure according to any one of claims 1 to 9.