Machining module and machining equipment

Abstract

The utility model discloses a machining module and machining equipment. The machining module comprises a module body, a machining head and a machining head sensor. The machining head is installed on the module body and provided with an identification structure. The machining head is arranged on the module body, and the machining head sensor is matched with the recognition structure so as to recognize the type of the machining head by detecting the recognition structure. According to the technical scheme of the utility model, the processing equipment can identify the type of the processing head so as to ensure that the processing mode of the processing equipment is matched with the type of the installed processing head, so that a workpiece can be normally and accurately processed.

Description

TECHNICAL FIELD

[0001] The utility model relates to processing equipment technical field, especially processing module and application processing equipment of this processing module. BACKGROUND

[0002] At present, more and processing equipment is matched with different processing head, to realize processing equipment can carry out multiple types of processing to workpiece. At this time, in the type of processing head is more diversified, after installing processing head in processing equipment, it is easy to appear the processing mode of processing equipment and the type of installed processing head mismatching, leading to processing equipment can not carry out normal accurate processing to workpiece. UTILITY MODEL CONTENTS

[0003] The utility model discloses a processing module, to make processing equipment can identify the type of processing head and guarantee the processing mode of processing equipment and the type of installed processing head are adapted to, so that processing equipment can carry out normal accurate processing to workpiece.

[0004] To realize above-mentioned purpose, the processing module of the utility model is applied to processing equipment, and the processing module includes:

[0005] Module main part;

[0006] Processing head, processing head is installed in module main part, and processing head is equipped with identification structure;And

[0007] Processing head inductor, processing head inductor is equipped in module main part, and processing head inductor is cooperated with identification structure, to identify the type of processing head by detecting identification structure.

[0008] Optionally, module main part is equipped with first wall surface and second wall surface, and second wall surface and first wall surface are arranged at the included angle and are enclosed to form installation space;

[0009] Processing head is installed in installation space, and one end of processing head is installed in module main part and is arranged side by side with second wall surface;

[0010] Processing head inductor is arranged on the side of module main part away from second wall surface and is arranged opposite to processing head.

[0011] Optionally, processing head includes:

[0012] Main body rod, one end of main body rod is equipped with processing part, and the other end is installed in module main part;And

[0013] Sleeve, sleeve is sleeved on main body rod, and both ends of main body rod are stretched out by the opening of both ends of sleeve;

[0014] The inner side of sleeve and the side peripheral surface of main body rod are enclosed to form containing cavity, and identification structure is installed in containing cavity.

[0015] Optionally, the identification structure includes a magnet, and the processing head sensor is a Hall sensor, with magnets on different processing heads providing different magnetic field signals to the Hall sensor.

[0016] Optionally, the identification structures on each processing head are positioned differently in the circumferential direction of the processing head, but are equal in shape and size, so that the relative distance between the identification structure and the processing head sensor is different when different types of processing heads are installed on the module body.

[0017] Optionally, on the projection plane perpendicular to the axis of the processing head, the first line connecting the center point of the identification structure and the center point of the processing head forms an angle with the second line connecting the center point of the processing head sensor and the center point of the processing head. The angle is different when different processing heads are installed on the module body.

[0018] And / or, the identification structures on each processing head are located at the same height on the processing head.

[0019] Optionally, the module body is provided with a positioning part, and the processing head is provided with a mating part. The mating part and the positioning part cooperate to position the orientation of the processing head in the circumferential direction.

[0020] Optionally, one of the positioning part and the mating part is a positioning groove, and the other is a positioning head, with the positioning head inserted into the positioning groove.

[0021] Optionally, the module body includes:

[0022] The support carrier has the processing head sensor mounted on it.

[0023] The drive mechanism is located on the supporting carrier; and

[0024] The mounting carrier is connected to the drive mechanism, which is configured to drive the mounting carrier to rotate.

[0025] The processing head is mounted on a mounting carrier, which is equipped with a positioning part.

[0026] Optionally, the processing module also includes an origin sensor, which is located on the support carrier;

[0027] The origin sensor is electrically connected to the drive mechanism and is configured to detect whether the mounting carrier has rotated to the origin position.

[0028] This utility model also proposes a processing equipment, including the processing module as described above.

[0029] The processing module of this utility model has a processing head sensor on the module body and an identification structure on the processing head. When the processing head is installed on the module body, the processing head sensor can detect the identification structure so that the processing equipment can identify the type of the installed processing head and select the appropriate processing mode. This ensures that the processing mode of the processing equipment and the type of the installed processing head are compatible, so that the processing equipment can perform normal and accurate processing on the workpiece. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of one embodiment of the processing module of this utility model;

[0032] Figure 2 for Figure 1 Another perspective illustration of the processing module;

[0033] Figure 3 for Figure 1 A partial structural diagram of the intermediate processing module;

[0034] Figure 4 for Figure 3 Another perspective illustration of the processing module;

[0035] Figure 5 for Figure 3 A partial structural diagram of the intermediate processing module;

[0036] Figure 6 for Figure 5 Another perspective illustration of the processing module;

[0037] Figure 7 for Figure 1 Schematic diagram of the intermediate machining head;

[0038] Figure 8 for Figure 7 A cross-sectional view of the intermediate machining head;

[0039] Figure 9 for Figure 7 Another cross-sectional view of the machining head;

[0040] Figure 10This is a cross-sectional schematic diagram of another embodiment of the processing head of the processing module of this utility model;

[0041] Figure 11 This is a cross-sectional schematic diagram of another embodiment of the processing head of the processing module of this utility model;

[0042] Figure 12 for Figure 5 Another perspective illustration of the mid-processing module;

[0043] Figure 13 for Figure 2 A schematic diagram of the structure of the mounting carrier;

[0044] Figure 14 for Figure 13 Another perspective diagram of the mounting carrier;

[0045] Figure 15 for Figure 14 Exploded structural diagram of the mounting carrier and the second magnetic suction component;

[0046] Figure 16 for Figure 1 A schematic diagram of the assembly structure of the mounting carrier and origin sensor of the intermediate processing module;

[0047] Figure 17 for Figure 16 A schematic diagram of the exploded structure in which the carrier and origin sensor are installed.

[0048] Explanation of icon numbers:

[0049]

[0050]

[0051] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0053] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0054] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0055] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0056] Currently, an increasing number of processing equipment are equipped with different processing heads to enable the equipment to perform various types of processing on workpieces. However, with such a diverse range of processing head types, a mismatch can easily occur between the processing mode of the equipment and the type of processing head installed, preventing the equipment from performing accurate and normal processing of the workpiece.

[0057] Therefore, based on the above considerations, this application proposes a novel processing module. This processing module innovatively has an identification structure on the processing head, and a processing head sensor is also provided on the module body. When the processing head is installed on the module body, the identification structure can be detected by the processing head sensor, thereby realizing the identification of the type of processing head.

[0058] Furthermore, it should be noted that the processing equipment used in the processing module proposed in this application can be a laser processing device. This allows the laser processing device to perform non-contact laser processing, and further, through the processing head in the processing module, contact processing, such as cutting or indentation. Additionally, the type of laser processing equipment can be a laser cutter, a laser drilling machine, or a laser engraving machine, as long as it is a device used to emit laser light for processing. Of course, in other embodiments, the processing equipment used in the processing module can also be a CNC machining device or a metal cutting processing device, etc. This application does not limit the type of processing equipment used in the processing module.

[0059] The structure of the processing module proposed in this application will be explained and illustrated below with examples:

[0060] Please refer to the reference. Figures 1 to 8 In one embodiment of this application, the processing module 500 proposed in this application includes a module body 510, a processing head 530, and a processing head sensor 560. The processing head 530 is installed on the module body 510 and is provided with an identification structure 531. The processing head sensor 560 is disposed on the module body 510 and cooperates with the identification structure 531 to identify the type of the processing head 530 by detecting the identification structure 531.

[0061] The module body 510 can provide a mounting position for the machining head 530. Simultaneously, the module body 510 can also be used to connect to the housing of the machining equipment, thereby enabling the machining module 500 to be mounted entirely on the housing of the machining equipment. The module body 510 can include a drive mechanism 511 and a mounting carrier 519, as described below. Alternatively, the module body 510 can only include the drive mechanism 511 or only the mounting carrier 519. That is, this application does not limit the structural type of the module body 510, as long as it can be used to connect to the housing of the machining equipment and mount the machining head 530.

[0062] The processing head 530 is a tool used to process workpieces. The processing head 530 can be a cutting blade for cutting workpieces. Alternatively, it can be an indentation head for indenting workpieces. This application does not limit the type of processing head 530; it can be adapted to the required processing type. Furthermore, the processing head 530 is mounted on the module body 510, which can be a plug-in mounting as described below, a further combination of plug-in mounting and clamping mounting, a standalone clamping mounting, or a snap-fit ​​connection or screw connection, etc. This application does not limit the mounting method of the processing head 530 on the module body 510. Further, the identification structure 531 provided on the processing head 530 can be used for sensing and detection by the processing head sensor 560. The identification structure 531 can include a magnet as described below; it can also be an abutment protrusion, or text and / or pattern markings. This application does not limit the type of identification structure 531. In addition, the identification structure 531 can be disposed on the outside of the processing head 530 or on the inside of the processing head 530. This application does not limit the location of the identification structure 531.

[0063] The processing head sensor 560 can be used to sense and detect the identification structure 531 on the processing head 530. When the identification structure 531 includes a magnet as described above, the processing head sensor 560 can be a Hall sensor, as described below, to detect different magnetic field signals after different processing heads 530 are installed, allowing the processing equipment to identify the type of the processing head 530. When the identification structure 531 is an abutment protrusion as described above, the processing head sensor 560 can be a pressure sensor, to detect different pressure signals after different processing heads 530 are installed, allowing the processing equipment to identify the type of the processing head 530. When the identification structure is text and / or pattern markings as described above, the processing head sensor 560 can be a camera, to detect different marking signals after different processing heads 530 are installed, allowing the processing equipment to identify the type of the processing head 530. Therefore, this application does not limit the structural type of the processing head sensor 560. The processing head sensor 560 can be located on one side of the processing head 530 in the circumferential direction or above the processing head 530. This application does not limit the location of the processing head sensor 560.

[0064] The processing module 500 of this application has a processing head sensor 560 on the module body 510 and an identification structure 531 on the processing head 530. When the processing head 530 is installed on the module body 510, the processing head sensor 560 can detect the identification structure 531 so that the processing equipment can identify the type of the installed processing head 530 and select the appropriate processing mode. This ensures that the processing mode of the processing equipment and the type of the installed processing head 530 are compatible, so that the processing equipment can perform normal and accurate processing on the workpiece.

[0065] Please refer to the reference. Figures 1 to 6 In one embodiment of this application, the module body 510 is provided with a first wall surface 5271 and a second wall surface 5273. The second wall surface 5273 and the first wall surface 5271 are arranged at an angle to form an installation space 5275. The processing head 530 is disposed in the installation space 5275. One end of the processing head 530 is installed on the module body 510 and is arranged side by side with the second wall surface 5273. The processing head sensor 560 is disposed on the side of the module body 510 away from the second wall surface 5273 and is arranged opposite to the processing head 530.

[0066] The first wall surface 5271 and the second wall surface 5273 can be arranged in an L-shape to enclose and form an installation space 5275. For example, when the processing equipment is in normal use and installation condition, the first wall surface 5271 can be horizontally arranged, the second wall surface 5273 can be vertically arranged, the upper end of the processing head 530 can be installed on the first wall surface 5271, and arranged side by side with the second wall surface 5273 in a front-to-back direction, while the processing head sensor 560 can be located on the rear side of the module body 510. Moreover, in order to shorten the distance between the processing head sensor 560 and the identification structure 531 located on the processing head 530, so that the processing head sensor 560 can detect the identification structure 531 more accurately, a groove can be recessed on the side of the module body 510 away from the second wall surface 5273 for the installation of the processing head sensor 560.

[0067] In this embodiment, the processing head 530 is positioned within the installation space 5275 formed by the first wall surface 5271 and the second wall surface 5273 at the layer angle, which improves the compactness of the processing head 530 installation on the module body 510. Simultaneously, the side of the processing module 510 facing away from the second wall surface 5273 provides a convenient mounting position for the processing head sensor 560, allowing the processing head sensor 560 and the processing head 530 to be aligned and aligned in the arrangement of the processing head 530 and the second wall surface 5273. This ensures that the processing head sensor 560 can accurately detect the identification structures 531 at different positions on different processing heads 530.

[0068] Please refer to the reference.Figure 2 , Figure 7 as well as Figure 8 In one embodiment of this application, the processing head 530 includes a main body rod 530A and a sleeve 530B. One end of the main body rod 530A is provided with a processing part 530A1, and the other end is installed on the module body 510. The sleeve 530B is sleeved on the main body rod 530A, and both ends of the main body rod 530A extend out from the openings at both ends of the sleeve 530B. The inner side of the sleeve 530B and the side peripheral surface of the main body rod 530A form a receiving cavity 530C, and the identification structure 531 is installed in the receiving cavity 530C.

[0069] When the processing equipment is in normal operating condition, the main body rod 530A can extend vertically, with its upper end mounted on the module body 510 and its lower end equipped with a processing section 530A1. This processing section 530A1 can be used to process workpieces; for example, it can be a cutting tool or an indentation head. Additionally, the sleeve 530B can be open at both ends and fitted onto the outside of the main body rod 530A. The sleeve 530B can be fixed relative to the main body rod 530A without rotation. Alternatively, the sleeve 530B can rotate circumferentially relative to the main body rod 530A, allowing the processing head 530 to still rotate and process while it is clamped and mounted on the module body 510 by a clamping mechanism. Furthermore, the accommodating cavity 530C formed by the sleeve 530B and the main body rod 530A can be formed by a groove provided on the main body rod 530A, so that the accommodating cavity 530C is formed by the groove and the sleeve 530B. Alternatively, a groove can be provided on the sleeve 530B, so that the accommodating cavity 530C is formed by the groove and the main body rod 530A. Or, grooves can be provided on both the sleeve 530B and the main body rod 530A, so that the accommodating cavity 530C is formed by the two grooves.

[0070] In this embodiment, the identification structure 531 is installed within the accommodating cavity 530C, allowing it to be concealed and reducing the possibility of damage. This arrangement also eliminates the need for a connecting structure between the identification structure 531 and the processing head 530, simplifying installation while protecting the structure of the identification structure 531 itself. Furthermore, by configuring the processing head 530 to include a main body rod 530A and a sleeve 530B, the two can be processed separately and then assembled together to form the accommodating cavity 530C, thereby improving the ease of processing the accommodating cavity 530C.

[0071] In one embodiment of this application, the identification structure 531 includes a magnet, and the processing head sensor 560 is a Hall sensor. The magnets on different processing heads 530 provide different magnetic field signals to the Hall sensor 560.

[0072] In this embodiment, when different processing heads 530 are mounted on the module body 510, the magnets on the processing heads 530 can provide different magnetic field signals to the Hall sensor 560. When the processing head sensor 560 detects the corresponding magnetic field signal, it can transmit the signal to the controller in the processing equipment. The controller can determine the type of processing head 530 based on the preset magnetic field signal and the type of processing head 530. For example, when processing head A 530 is mounted on the module body 510, the magnet on processing head A 530 can provide a magnetic field signal A1. The controller in the processing equipment can determine that processing head 530 is processing head A based on the correspondence between A and A1. Similarly, when processing head B 530 is mounted on the module body 510, the magnet on processing head B 530 can provide a magnetic field signal B1. The controller in the processing equipment can determine that processing head 530 is processing head B based on the correspondence between B and B1. Furthermore, by configuring the identification structure 531 to include a magnet and the processing head sensor 560 to be a Hall effect sensor, the processing head sensor 560 can have high sensitivity, thereby improving the accuracy of identifying the type of processing head 530. Simultaneously, the Hall effect sensor's detection is non-contact, ensuring that the placement of the processing head sensor 560 will not affect the operation of the processing head 530. Additionally, it allows for a smaller size of the processing head sensor 560, thus improving the ease of its installation and placement.

[0073] Please refer to the reference. Figures 8 to 11 In one embodiment of this application, the identification structure 531 on each processing head 530 is positioned differently in the circumferential direction of the processing head 530, but has the same shape and size, so that when different types of processing heads 530 are installed on the module body 510, the relative distance between the identification structure 531 and the processing head sensor 560 is different.

[0074] In this embodiment, the identification structures 531 on each processing head 530 are positioned differently in the circumferential direction of the processing head 530. This results in different relative distances between the processing head sensor 560 and the identification structures 531 on each processing head 530 when different processing heads 530 are mounted on the module body 510. This facilitates the identification structures 531 on each processing head 530 to provide differentiated magnetic field signals for accurate identification by the processing head sensor 560. Simultaneously, the size and shape of the identification structures 531 on each processing head 530 can also be set to be consistent to allow for batch installation of the identification structures 531. Of course, in other embodiments, the identification structures 531 on each processing head 530 can also be positioned identically in the circumferential direction of the processing head 530. In this case, the shape and / or size of the identification structures 531 on each processing head 530 can be set differently to provide different magnetic field signals.

[0075] Please refer to the reference. Figures 9 to 11 In one embodiment of this application, on a projection plane perpendicular to the axis of the processing head 530, a first line connecting the center point of the identification structure 531 and the center point of the processing head 530 forms an angle with a second line connecting the center point of the processing head sensor 560 and the center point of the processing head 530. The angle is different when different processing heads 530 are installed on the module body 510.

[0076] When the processing equipment is in normal use and installation condition, the projection plane perpendicular to the axis of the processing head 530 can be a horizontal plane, and when the processing head 530 and the processing head sensor 560 are arranged side by side in the front-back direction as described above, the second connection line can be parallel to the front-back direction.

[0077] In this embodiment, after different processing heads 530 are installed in place, the included angle formed by the first connecting line and the second connecting line is set to be different. This can increase the difference in the magnetic field signal given by the identification structure 531 on each processing head 530, thereby improving the accuracy of the processing head sensor 560 in detecting the identification structure 531 on each processing head 530.

[0078] Please refer to Figure 8 In one embodiment of this application, the identification structure 531 on each processing head 530 is located at the same height position on the processing head 530.

[0079] In this embodiment, the identification structure 531 on each processing head 530 is set at the same height on the processing head 530, which facilitates the rotation of different processing heads 530 to align the identification structure 531 with the processing head sensor 560. Furthermore, this arrangement ensures that the processing head sensor 560 is at the same height as the identification structure 531 in each processing head 530, without requiring a relatively large height value. This helps to ensure that the processing head sensor 560 can be relatively small in size while still being able to detect the identification structure 531 in each processing head 530. In addition, this arrangement facilitates the installation of the same structure on different processing heads 530 for the identification structure 531, thereby improving the manufacturing convenience of each processing head 530. Of course, it should be noted that in other embodiments, the identification structure 531 on each processing head 530 may have a height difference. In this case, the height of the processing head sensor 560 can be set relatively high to detect identification structures 531 with height differences in different processing heads 530.

[0080] Please refer to the reference. Figure 2 , Figure 4 as well as Figure 7 In one embodiment of this application, the module body 510 is provided with a positioning part 520, and the processing head 530 is provided with a mating part 532. The mating part 532 and the positioning part 520 cooperate to position the orientation of the processing head 530 in the circumferential direction.

[0081] The positioning part 520 is a structure that can be used to mate with the mating part 532 on the processing head 530 to position the processing head 530 during installation. The positioning part 520 and the mating part 532 can be a combination of a positioning groove 521 and a mating positioning head 533 (described below), a reference block and a mating reference surface, or a positioning mark and a corresponding indicator mark. Therefore, this application does not limit the structural type of the positioning part 520 and the mating part 532, as long as they can position the installation orientation of the processing head 530 on the module body 510, ensuring a unique installation orientation for quick installation. Furthermore, when the processing head 530 includes a main body rod 530A and a sleeve 530B as described above, the mating part 532 can be provided on the main body rod 530A.

[0082] In this embodiment, since the module body 510 is provided with a positioning part 520, and the processing head 530 is provided with a mating part 532 that cooperates with the positioning part 520, when the processing head 530 is installed on the module body 510, the corresponding cooperation of the mating part 520 and the positioning part 532 can quickly position and install the processing head 530 in the circumferential direction. This ensures that the installation orientation of the processing head 530 is unique during installation, thus avoiding the need for repeated disassembly and adjustment due to incorrect installation orientation, thereby improving the convenience of installing the processing head 530. Especially when the type of the processing head 530 is detected and identified through the cooperation of the processing head sensor 560 and the identification structure 531 on the processing head 530, as described above, the positioning part 520 and the mating part further improve the consistency of the initial position of each processing head 530 when installed on the module body 510, thereby improving the accuracy of identifying different processing heads.

[0083] Please refer to the reference. Figure 1 , Figure 2 , Figure 4 , Figure 7 , Figure 8 , Figure 13 as well as Figure 14 In one embodiment of this application, the module body 510 includes a support carrier 527, a drive mechanism 511, and a mounting carrier 519. The processing head sensor 560 is disposed on the support carrier 527. The drive mechanism 511 is disposed on the support carrier 527. The mounting carrier 519 is connected to the drive mechanism 511 and can be driven to rotate by the drive mechanism 511. The mounting carrier 519 is provided with a positioning part 520. The processing head 530 is mounted on the mounting carrier 519, and the mounting carrier 519 is provided with a positioning part 520.

[0084] The support carrier 527 can provide a mounting position for the drive mechanism 511 and can also be used to connect to the housing of the processing equipment. The support carrier 527 can be a single plate structure, a column structure, a frame structure formed by combining multiple plate structures or column structures, or a base structure, etc. This application does not limit the structural type of the support carrier 527. The mounting carrier 519 is the carrier that provides a mounting position for the processing head 530. The mounting carrier 519 can be a round shaft structure as described below, or a square column or other shaped column structure, or a plate, block, or base structure, etc. This application does not limit the structure and shape of the mounting carrier 519. The drive mechanism 511, as the name suggests, is the mechanism that provides power to drive the processing head 530 to rotate. The drive mechanism 511 can be a combination including a drive component 512 and a transmission component 513 as described below, or it can consist only of the drive component 512. This application does not limit the structural type of the drive mechanism 511, as long as it can provide power to drive the processing head 530 to rotate. Alternatively, the drive mechanism 511 can be an XY-axis drive device (which can be a combination of a motor and pulley, or a linear module, etc.) installed in the laser processing equipment, to drive the processing module 500 to slide along the X-axis and / or Y-axis directions for processing. The X-axis and Y-axis directions can be two intersecting horizontal directions, and the rotation axis of the processing head 530 can be parallel to the vertical direction. Of course, this application is not limited to this; the rotation axis of the processing head 530 can also be parallel to other directions.

[0085] In this embodiment, the support carrier 510 and mounting carrier 519 facilitate the assembly of the various mechanisms within the processing module 500 and the mounting of the processing module 500 onto the equipment housing. The drive mechanism 511 drives the processing head 530 to rotate, enabling rotatable processing of the processing module 500 and enriching the processing methods available to the workpiece. Furthermore, when the processing head sensor 560 and the identification structure 531 are a Hall sensor and a magnet, respectively, as described above, in addition to the ability to identify the type of processing head 530 by directly sensing the different magnetic field signals from the magnets on each processing head 530 via the Hall sensor, as described above, this also allows for identification of the processing head 530's type. Alternatively, the processing head 530 can be defined to have an initial position after being installed on the module body 510. Then, the drive mechanism 511 can drive the processing head 530 to rotate until it corresponds to the identification structure 531 and the processing head sensor 560. The type of processing head 530 can be identified by detecting the angle between the initial position and the position rotated to the corresponding processing head sensor 560. Specifically, when the processing head 530 is in the initial position, the Hall sensor may detect a weak magnetic field signal from the magnet, or it may not detect a magnetic field signal at all. After the drive mechanism 511 drives the processing head 530 to rotate a corresponding angle from the initial position, the magnet can align with the Hall sensor. At this point, the relative distance between the magnet and the Hall sensor is minimal, and the Hall sensor can detect a strong magnetic field signal from the magnet, thus identifying this as the rotated position of the processing head 530. The controller in the processing equipment can then calculate the rotation angle of the drive mechanism 511 between the initial position and the rotated position, and determine the type of processing head 530 based on this rotation angle. For example, when a processing head 530 is driven to rotate 30° by the drive mechanism 511, the magnet on the processing head 530 can correspond to the Hall sensor, and the controller in the laser processing equipment can determine that the processing head 530 is processing head A based on this 30° rotation. Similarly, when another processing head 530 rotates 60°, the magnet on the processing head 530 can correspond to the Hall sensor, and the controller in the laser processing equipment can determine that the processing head 530 is processing head B based on this 60° rotation. Thus, the controller in the laser processing equipment can further identify the type of processing head 530 by the rotation angle of the processing head 530 driven by the drive mechanism 511, based on the detection of the Hall sensor and the magnet. It should be noted that the controller in the laser processing equipment calculates the rotation angle of the processing head 530 driven by the drive mechanism 511 using existing technology. Specifically, it can calculate the rotation angle of the processing head 530 by recording the rotation time and number of revolutions of the drive mechanism 511.

[0086] Please refer to the reference. Figure 7 , Figure 8 , Figure 13as well as Figure 14 In one embodiment of this application, one of the positioning part 520 and the mating part 532 is a positioning groove 521, and the other is a positioning head 533, which is inserted into the positioning groove 521.

[0087] The positioning groove 521 is a recessed structure formed by the recess on the surface of the mounting carrier 519 or the processing head 530. The positioning head 533 is either an end structure of the mounting carrier 519 or the processing head 530, or a protruding structure on the mounting carrier 519 or the processing head 530. The positioning part 520 can be the positioning groove 521, and the mating part 532 can be the positioning head 533; alternatively, the positioning part 520 can be the positioning head 533, and the mating part 532 can be the positioning groove 521. Furthermore, the positioning groove 521 can be, as described below, a D-shaped groove consisting of a flat surface, a positioning groove wall 522, and an arc-shaped enclosing groove wall 523. Alternatively, the positioning groove 521 can be an equilateral triangle or an irregular shape. This application does not limit the shape of the positioning groove 521, as long as the insertion direction of the positioning head 533 is unique, and the shape of the positioning head 533 is adapted to the shape of the positioning groove 521.

[0088] In this embodiment, the positioning part 520 and the mating part 532 are configured as a combination of a positioning groove 521 and a positioning head 533. This serves two purposes: firstly, it positions the machining head 530 in the correct installation direction; secondly, it increases the contact area between the machining head 530 and the mounting carrier 519, thereby improving the stability of the machining head 530's installation. Furthermore, this configuration simplifies the structure of the positioning part 520 and the mating part 532, thus improving the ease of machining and forming them. In another embodiment, to ensure the overall strength of the machining head 530, the positioning groove 521 can be located on the mounting carrier 519, and the positioning head 533 can be located on the machining head 530. Moreover, the positioning head 533 can be directly formed from the end of the machining head 530 furthest from the end used for machining, further improving the ease of machining and forming them.

[0089] Please refer to the reference. Figure 7 , Figure 8 , Figure 13 as well as Figure 14 In one embodiment of this application, the sidewall of the positioning groove 521 includes a positioning groove wall 522 and an enclosing groove wall 523 connected to each other. The positioning groove wall 522 is planar and the enclosing groove wall 523 is arc-shaped. The side circumferential surface of the positioning head 533 includes a positioning sidewall 534 and an enclosing sidewall 535 connected to each other. The positioning sidewall 534 is planar and is adapted to abut against the positioning groove wall 522. The enclosing sidewall 535 is arc-shaped and is adapted to abut against the enclosing groove wall 523.

[0090] In this embodiment, the sidewalls of the positioning groove 521 are configured as a flat positioning groove wall 522 and an arc-shaped enclosing groove wall 523, and the side circumferential surface of the positioning head 533 is configured as a flat positioning sidewall 534 and an arc-shaped enclosing sidewall 535, making the positioning groove 521 and the positioning head 533 D-shaped. This simplifies the shapes of the positioning groove 521 and the positioning head 533 as much as possible while still providing positioning for the installation direction of the processing head 530, thereby improving the ease of processing and forming. Of course, it should be noted that this application is not limited to this; in other embodiments, the positioning groove wall 522 and the positioning sidewall 534 may also be arc-shaped or V-shaped with an included angle.

[0091] Please refer to the reference. Figure 7 , Figure 8 , Figure 13 as well as Figure 14 In one embodiment of this application, the positioning head 533 is provided with a first magnetic suction member 536, and the positioning groove 521 is provided with a second magnetic suction member 525. The second magnetic suction member 525 and the first magnetic suction member 536 are magnetically connected so that the positioning head 533 can be detachably installed in the positioning groove 521.

[0092] In this embodiment, a first magnetic chuck 536 and a second magnetic chuck 525 are respectively provided in the positioning head 533 and the positioning groove 521, so that the processing head 530 and the mounting carrier 519 can be magnetically connected through the first magnetic chuck 536 and the second magnetic chuck 525. At this time, the materials of the processing head 530 and the mounting carrier 519 are not affected by the magnetic connection, and the material selection can be more widely set as needed. Of course, in other embodiments, the materials of the positioning head 533 and the mounting carrier 519 can also be directly set to a magnetically pleasing metal.

[0093] Please refer to the reference. Figure 7 and Figure 8 In one embodiment of this application, the positioning head 533 is provided with a first mounting groove 537, and the first magnetic member 536 is embedded in the first mounting groove 537.

[0094] In this embodiment, the first mounting groove 537 accommodates the first magnetic member 536, allowing it to be more compactly arranged on the positioning head 533. Similarly, to improve the compactness of the second magnetic member 525, in one embodiment, please refer to the reference... Figure 14 and Figure 15 The bottom wall of the positioning groove 521 is provided with a second mounting groove 526, and the second magnetic member 525 is embedded in the second mounting groove 526.

[0095] In one embodiment of this application, one of the first magnetic member 536 and the second magnetic member 525 is a magnet, and the other is a metal that can be magnetically attracted.

[0096] In this embodiment, one of the first magnetic attractor 536 and the second magnetic attractor 525 is a magnet, and the other is a magnetically attractable metal. This ensures that the two can be magnetically connected, and also reduces the use of magnets, thus lowering manufacturing costs. Specifically, the first magnetic attractor 536 can be a magnet, and the second magnetic attractor 525 can be a magnetically attractable metal. Alternatively, the second magnetic attractor 525 can be a magnet, and the first magnetic attractor 536 can be a magnetically attractable metal. Furthermore, in other embodiments, both the first magnetic attractor 536 and the second magnetic attractor 525 can be magnets.

[0097] Please refer to the reference. Figure 1 , Figure 3 , Figure 16 as well as Figure 17 In one embodiment of this application, the processing module 500 further includes an origin sensor 540, which is disposed on the support carrier 527. The origin sensor 540 is electrically connected to the drive mechanism 511 and is configured to detect whether the mounting carrier 519 has rotated to the origin position.

[0098] In this embodiment, the origin sensor 540 can detect whether the mounting carrier 519 and the processing head 530 have returned to the origin position, thereby facilitating the next processing cycle of the processing head 530 module. The origin sensor 540 may include a light emitter 541, a light receiver 542, and a light-blocking component 543, as described below. Of course, the origin sensor 540 can also be a contact switch; this application does not limit the position of the origin sensor 540. Furthermore, the processing module 500 can control the drive mechanism 511 to drive the processing head 530 to rotate and return to the origin position each time the laser processing equipment is turned on or off, thus ensuring that the processing head 530 has the same initial position for subsequent type detection after installation.

[0099] Please refer to the reference. Figure 16 and Figure 17 In one embodiment of this application, the origin sensor 540 includes a light emitter 541, a light receiver 542, and a light blocker 543. The light receivers 542 are arranged at a relative interval. The light blocker 543 is connected to the mounting carrier 519, and when the mounting carrier 519 is rotated to the origin position, the light blocker 543 can conduct or block the light path between the light emitter 541 and the light receiver 542.

[0100] In this embodiment, the origin sensor 540 is configured to include a light emitter 541, a light receiver 542, and a light blocker 543. The light blocker 543 connects or blocks the optical path between the light emitter 541 and the light receiver 542 to trigger a reset signal for the mounting carrier 519 and the processing head 530 to their origin positions. This achieves non-contact detection of the origin reset of the mounting carrier 519 and the processing head 530, reducing the impact on them. The light blocker 543 can be a disc-shaped structure as described below, with a light-passing port 545 on its periphery. This port 545 connects the optical path between the light emitter 541 and the light receiver 542, thereby triggering the reset signal for the mounting carrier 519 and the processing head 530 to their origin positions. Of course, the light-blocking component 543 can also be a long strip structure, so as to trigger the positioning signal of the mounting carrier 519 and the processing head 530 to reset to the original position by blocking the optical path between the light emitter 541 and the light receiver 542.

[0101] In one embodiment of this application, the light-blocking member 543 is a disc-shaped structure, and the edge of the light-blocking member 543 is provided with a light-passing port 545. When the light-blocking member 543 rotates with the mounting carrier 519, the light-passing port 545 can pass between the light emitter 541 and the light receiver 542 to conduct the optical path between the light emitter 541 and the light receiver 542.

[0102] In this embodiment, the light-blocking member 543 is configured as a disc-shaped structure. This allows for a more regular shape, facilitating its molding and processing. Simultaneously, it also ensures a more balanced force distribution on the mounting carrier 519, thereby improving the stability of the mounting carrier 519 in rotating the light-blocking member 543. The light-blocking member 543 can be fitted onto the mounting carrier 519 to increase the contact area between the two, thus enhancing the stability of the connection.

[0103] Please refer to the reference. Figure 1 and Figure 2 In one embodiment of this application, the light-blocking member 543 is disposed at the end of the mounting carrier 519 away from the processing head 530.

[0104] In this embodiment, the light-blocking member 543 is placed at the end of the mounting carrier 519 away from the processing head 530, which can reduce its impact on the installation of the processing head 530 and the driven gear 515 described below on the mounting carrier 519.

[0105] Please refer to Figure 13 In one embodiment of this application, the mounting carrier 519 is a circular shaft structure.

[0106] In this embodiment, the mounting carrier 519 is configured as a circular shaft structure, which allows its side circumference to be adapted to the rotation trajectory, thereby reducing the volume of the mounting carrier 519 and improving the ease of its installation.

[0107] Please refer to the reference. Figures 1 to 6 In one embodiment of this application, the drive mechanism 511 includes a drive member 512 and a transmission assembly 513; the transmission assembly 513 is tractively connected to the drive member 512 and the mounting carrier 519, so that the drive member 512 drives the mounting carrier 519 to rotate through the transmission assembly 513.

[0108] The driving component 512 can be used to increase the driving force. The driving component 512 can be a motor, or it can be a rotary cylinder, as long as it can provide rotational driving force. The transmission assembly 513 can be used to transmit the drive force of the driving component 512 to the mounting carrier 519, thereby indirectly driving the mounting carrier 519. The transmission assembly 513 can be the driving gear 514 and driven gear 515 described below. Alternatively, the transmission assembly 513 can be a combination of a driving pulley, a driven pulley, and a belt. This application does not limit the structural type of the transmission assembly 513, as long as it can achieve transmission.

[0109] In this embodiment, the drive mechanism 511 is configured to include a drive member 512 and a transmission assembly 513, so that the drive member 512 and the mounting carrier 519 do not need to be directly connected, thereby reducing the requirements for the installation position of the drive member 512 and improving the convenience of its installation arrangement. In addition, the transmission assembly 513 can also have a suitable rotation ratio so that the processing head 530 has a suitable rotational processing rate.

[0110] Please refer to the reference. Figure 5 and Figure 12 In one embodiment of this application, the transmission assembly 513 includes a drive gear 514 and a driven gear 515. The drive gear 514 is connected to the drive member 512 and can be driven to rotate by the drive member 512; the driven gear 515 is connected to the mounting carrier 519 and meshes with the drive gear 514.

[0111] In this embodiment, the transmission assembly 513 is configured to include a driving gear 514 and a driven gear 515. Gear transmission has the advantages of stability and reliability, thereby improving the stability of the rotational movement of the processing head 530. Furthermore, gear transmission has the advantage of compact distribution, which helps to reduce the overall size of the transmission assembly 513, thus improving the convenience of its installation and arrangement. The driving gear 514 can be directly connected to the drive member 512, or it can be connected to the mounting shaft 518 as described below. The driven gear 515 can be sleeved on the mounting carrier 519, or it can be directly connected to the end face of the mounting carrier 519. Additionally, the driven gear 515 and the mounting carrier 519 can be connected by a key or by screws, etc.

[0112] In one embodiment of this application, the transmission ratio between the driving gear 514 and the driven gear 515 is less than 1.

[0113] In this embodiment, the transmission ratio between the driving gear 514 and the driven gear 515 is set to be less than 1, which enables the transmission assembly 513 to have a deceleration effect, thereby preventing the machining head 530 from being affected by the excessive rotation speed of the driving component 512.

[0114] Please refer to the reference. Figure 5 and Figure 12 In one embodiment of this application, the transmission assembly 513 further includes a mounting shaft 518, a worm gear 517, and a worm 516. The drive gear 514 is mounted on the mounting shaft 518; the worm gear 517 is mounted on the mounting shaft 518; the worm 516 is connected to the drive member 512 and can be driven to rotate by the drive member 512, and the worm 516 also meshes with the worm gear 517.

[0115] In this embodiment, the arrangement of the worm gear 517 and worm 516 can further improve the speed reduction effect of the transmission assembly 513, while also giving it a better self-locking function. The drive gear 514 and worm gear 517 can be sleeved on the mounting shaft 518, or they can be directly connected to the end face of the mounting shaft 518. Furthermore, the drive gear 514 and worm gear 517 can be connected to the mounting shaft 518 via a key or screws, etc.

[0116] Please refer to Figure 12 In one embodiment of this application, the mounting shaft 518 is disposed near one of the opposite sides of the driven gear 515, and the worm gear 516 is disposed near the other of the opposite sides of the driven gear 515.

[0117] In this embodiment, the mounting shaft 518 and the worm gear 516 are respectively positioned close to opposite sides of the driven gear 515, which further improves the compactness of the transmission assembly 513 and reduces its overall size. Of course, in other embodiments, the worm gear 516 can also be positioned on the side of the mounting shaft 518 away from the driven gear 515.

[0118] In one embodiment of this application, in order to improve the stability of installation convenience, the processing module 500 may further include a support carrier 527, on which the drive component 512, mounting shaft 518, worm gear 516, mounting carrier 519 and processing head sensor 560 may be mounted.

[0119] This application also proposes a laser processing device, which includes a processing module 500. The specific structure of the processing module 500 is as described in the above embodiments. Since this laser processing device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The laser processing device may include a housing and a laser processing module. In this case, the processing module 500 and the laser processing module may be installed at different positions on the housing. Of course, the processing module 500 and the laser processing module may also be optionally installed at the same position on the housing. Further, the laser processing device may also include an XY-axis drive device as described above, which can drive the processing module 500 and / or the laser processing module to slide along the X-axis and / or Y-axis directions. The X-axis and Y-axis directions may be two intersecting horizontal directions. In this case, the rotation axis of the processing head 530 may be perpendicular to the X-axis and Y-axis directions.

[0120] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A processing module, characterized in that, The processing module is applied to processing equipment and includes: Module body; A processing head, the processing head being mounted on the module body, the processing head being provided with an identification structure; and A processing head sensor is disposed on the module body. The processing head sensor cooperates with the identification structure to identify the type of the processing head by detecting the identification structure.

2. The processing module as described in claim 1, characterized in that, The module body is provided with a first wall and a second wall, and the second wall and the first wall are arranged at an angle to enclose and form an installation space. The processing head is located within the installation space, with one end of the processing head mounted on the module body and arranged side-by-side with the second wall surface; The processing head sensor is located on the side of the module body away from the second wall and is positioned opposite to the processing head.

3. The processing module as described in claim 1, characterized in that, The processing head includes: The main rod has a machining section at one end and is mounted on the module body at the other end; and A sleeve is fitted onto the main body rod, and both ends of the main body rod extend out from the openings at both ends of the sleeve; The inner side of the sleeve and the side circumferential surface of the main rod form a receiving cavity, and the identification structure is installed in the receiving cavity.

4. The processing module as described in claim 1, characterized in that, The identification structure includes a magnet, and the processing head sensor is a Hall sensor. Different magnets on the processing head provide different magnetic field signals to the Hall sensor.

5. The processing module as described in claim 4, characterized in that, The identification structures on each of the processing heads are positioned differently in the circumferential direction of the processing head, but are equal in shape and size, so that the relative distance between the identification structure and the processing head sensor is different when different types of processing heads are installed on the module body.

6. The processing module as described in claim 5, characterized in that, On a projection plane perpendicular to the axis of the processing head, a first line connecting the center point of the identification structure and the center point of the processing head forms an angle with a second line connecting the center point of the processing head sensor and the center point of the processing head. The angle is different when different processing heads are installed on the module body. And / or, the identification structures on each of the processing heads are located at the same height on the processing heads.

7. The processing module as described in any one of claims 1 to 6, characterized in that, The module body is provided with a positioning part, and the processing head is provided with a mating part. The mating part and the positioning part cooperate to position the orientation of the processing head in the circumferential direction.

8. The processing module as described in claim 7, characterized in that, One of the positioning part and the mating part is a positioning groove, and the other is a positioning head, which is inserted into the positioning groove.

9. The processing module as described in claim 7, characterized in that, The module body includes: A support carrier, wherein the processing head sensor is disposed on the support carrier; A drive mechanism, wherein the drive mechanism is disposed on the support carrier; and A mounting carrier is connected to the drive mechanism, which is configured to drive the mounting carrier to rotate. The processing head is mounted on the mounting carrier, and the mounting carrier is provided with the positioning part.

10. The processing module as described in claim 9, characterized in that, The processing module also includes an origin sensor, which is located on the support carrier; The origin sensor is electrically connected to the drive mechanism and is configured to detect whether the mounting carrier has rotated to the origin position.

11. A processing equipment, characterized in that, Includes the processing module as described in any one of claims 1 to 10.

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