Multi-shaft parallel stacked polishing equipment

Abstract

The utility model discloses a multi-shaft parallel stacked polishing device, which is used for polishing a middle frame of a mobile phone and comprises a polishing mechanism with a plurality of groups of polishing components; the material clamping mechanism is provided with clamping assemblies with the number corresponding to that of the polishing assemblies, and the clamping assemblies are connected with middle frame nesting jigs; the polishing mechanism and the material clamping mechanism have opposite moving directions, and the multiple middle frames are connected to the periphery of the middle frame nesting jig in a mutually stacked mode. The problem that an existing mobile phone middle frame polishing process is low in single-machine productivity efficiency is solved.

Description

Technical Field

[0001] This application relates to a polishing apparatus, and more particularly to a multi-axis parallel stacked polishing apparatus. Background Technology

[0002] As the 3C industry develops, the requirements for product appearance are increasing, such as the need to polish the mid-frame of mobile phones to achieve a mirror finish. Existing traditional polishing processes have low single-unit production efficiency, require too many production machines, and result in high maintenance and labor costs. Therefore, improvements are proposed. Utility Model Content

[0003] This utility model discloses a multi-axis parallel stacked polishing device, which solves the problem of low single-machine production efficiency in the existing mobile phone mid-frame polishing process.

[0004] A multi-axis parallel stacked polishing device for polishing the mid-frame of a mobile phone, comprising:

[0005] A polishing mechanism, comprising several sets of polishing components;

[0006] The material clamping mechanism has clamping components corresponding to the number of polishing components, and a middle frame nested fixture is connected to the clamping components;

[0007] The polishing mechanism and the material clamping mechanism have opposite directions of movement, and several of the middle frames are stacked and connected to the outer periphery of the middle frame nested fixture.

[0008] In this application, multiple sets of corresponding polishing components and clamping components are used to increase the number of workstations that can be polished simultaneously on a single machine; and a nested fixture for the middle frame is set to fix multiple middle frames for simultaneous polishing, further improving the production capacity efficiency of a single polishing component, thereby solving the problem of low efficiency of existing polishing equipment.

[0009] Several alternative methods are provided below, but they are not intended as additional limitations on the overall solution above. They are merely further additions or optimizations. Provided there are no technical or logical contradictions, each alternative method can be combined individually with respect to the overall solution above, or multiple alternative methods can be combined with each other.

[0010] Optionally, the nested fixture for the middle frame includes an upper mold, a lower mold, and a fixed shaft. The fixed shaft passes through the inside of the middle frame, and the upper mold and the lower mold are respectively connected to both ends of the fixed shaft to restrict the middle frame from falling off from both ends of the fixed shaft and to provide mutual clamping force for multiple middle frames.

[0011] Optionally, the clamping components act on the upper mold and the lower mold respectively to clamp the nested fixture of the middle frame, and form a pivot for the rotation of the nested fixture of the middle frame.

[0012] Optionally, the fixed shaft is composed of several detachable carrier blocks connected in sequence, and each carrier block has a connection structure that adapts to the inner circumference of the middle frame and is connected to a middle frame accordingly.

[0013] Optionally, each of the carrier blocks has an upper end and a lower end, and the upper and lower ends of two adjacent carrier blocks are detachably connected.

[0014] Optionally, the carrier block has at least one through hole extending through its upper and lower ends, and a positioning pin is provided at one end of the through hole, with adjacent carrier blocks connected by the positioning pin and the through hole.

[0015] Optionally, the clamping assembly acts on the upper mold and the lower mold respectively, and provides the upper mold and the lower mold with a clamping force toward the carrier block.

[0016] Optionally, the polishing mechanism has a liftable polishing component fixing frame for adjusting the abutment height between the polishing component and the clamping component, and each polishing component is horizontally distributed in a straight line on the polishing component fixing frame.

[0017] Optionally, the material clamping mechanism has a movable clamping component fixing frame for moving the clamping components closer to the polishing component, and each of the clamping components is horizontally distributed along a straight line on the clamping component fixing frame.

[0018] Optionally, the polishing equipment further includes a base, and the clamping component holder is connected to the polishing component holder on the base.

[0019] The beneficial effects of this application are as follows:

[0020] This application sets up multiple polishing components to form a multi-axis polishing device that operates simultaneously. Each polishing component is then equipped with a corresponding clamping component to fix the middle frame for polishing. At the same time, the clamping component further improves polishing efficiency by clamping a nested fixture with multiple overlapping middle frames. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this application;

[0022] Figure 2 This is a partial structural diagram of this application;

[0023] Figure 3 This is a partial structural diagram of this application;

[0024] Figure 4 This is a schematic diagram showing the connection relationship between the nested fixture and the middle frame in this application;

[0025] Figure 5 This is a schematic diagram of the structure of the carrier block in this application.

[0026] The annotations in the figure are explained as follows:

[0027] 1. Polishing mechanism; 11. Polishing component; 12. Polishing component fixing frame; 2. Material clamping mechanism; 21. Clamping component; 211. Upper clamping part; 212. Lower clamping part; 22. Middle frame nested fixture; 221. Upper mold; 222. Lower mold; 223. Carrier block; 224. Through hole; 23. Clamping component fixing frame; 3. Base; 4. Middle frame. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] It should be noted that when a component is said to be "connected" to another component, it can be directly connected to the other component or it can be connected to a component in between. When a component is said to be "set on" another component, it can be directly set on the other component or it may be set to a component in between.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] refer to Figure 1 and Figure 2 This application discloses a multi-axis parallel stacked polishing device for polishing the mid-frame of a mobile phone, comprising a polishing mechanism 1 and a material clamping mechanism 2. The polishing mechanism 1 has several sets of polishing components 11, with adjacent polishing components 11 equidistantly distributed along a straight line at the same horizontal height. The material clamping mechanism 2 has clamping components 21 corresponding to the number of polishing components 11, used to clamp and fix the mid-frame of the mobile phone. The polishing components 11 and clamping components 21 are arranged in a one-to-one correspondence and are mutually adapted.

[0032] Furthermore, the clamping component 21 clamps both ends of the middle frame nesting fixture 22, which is used to connect the middle frame. Specifically, the inner periphery of the middle frame is nested and fixed on the outer periphery of the middle frame nesting fixture 22, and the length of the middle frame nesting fixture 22 can be matched with the number of middle frames. It can be a single middle frame or multiple middle frames nested overlapping on the outer periphery of the middle frame nesting fixture 22, such as two.

[0033] Furthermore, the two ends of the nested fixture 22 are clamped by the clamping components 21, and a pivot is formed at the contact point with the clamping components 21, which can be rotated after polishing on one side of the middle frame, thus achieving adjustment without disassembly.

[0034] like Figure 1 As shown, in some embodiments, the polishing mechanism 1 has a liftable polishing component fixing frame 12 for adjusting the abutment height between the polishing component 11 and the clamping component 21, and each polishing component 11 is horizontally distributed in a straight line on the polishing component fixing frame 12.

[0035] Furthermore, in some embodiments, the polishing component holder 12 can be connected to the polishing component 11 by a rotatable connection, so that the polishing component 11 can form a certain angle with the clamping component 21, thereby making the polishing angle more comprehensive.

[0036] refer to Figures 2 to 5 In some embodiments, the material clamping mechanism 2 has a movable clamping component fixing frame 23 for moving the clamping components 21 closer to the polishing component 11, and each clamping component 21 is horizontally distributed along a straight line on the clamping component fixing frame 23.

[0037] Furthermore, such as Figure 3 As shown, the clamping assembly 21 has an upper clamping member 211 and a lower clamping member 212 that can move close to each other, which act on the upper and lower ends of the middle frame nested fixture 22, respectively.

[0038] The upper clamping component 211 is driven by a cylinder and can move toward the lower clamping component 212 to clamp the middle frame nested fixture 22. The lower clamping component 212 can be driven by a motor as a power source, and the lower clamping component 212 drives the middle frame nested fixture 22 to rotate.

[0039] refer to Figure 3 and Figure 4 In some embodiments, the nested fixture 22 for the middle frame includes an upper mold 221, a lower mold 222, and a fixed shaft located between the upper mold 221 and the lower mold 222. The fixed shaft is used to pass through the middle frame, and the upper mold 221 and the lower mold 222 are used to limit the middle frame located on the fixed shaft from the upper and lower ends to prevent the middle frame from falling off.

[0040] In one embodiment, the aforementioned fixed shaft is composed of a plurality of detachable carrier blocks 223 connected in sequence. Each carrier block 223 has a connecting structure that adapts to the inner circumference of the middle frame and is connected to one middle frame. By using multiple detachably connected carrier blocks 223, it is convenient to adjust the length of the fixed shaft formed by stacking the carrier blocks 223 according to the number of middle frames, avoiding the need to set multiple sets of fixed shafts of different lengths and saving costs.

[0041] Furthermore, each carrier block 223 has a relative upper end and a lower end, and the upper and lower ends of two adjacent carrier blocks 223 are detachably connected.

[0042] Furthermore, such as Figure 4 As shown, the carrier block 223 has at least one through hole 224 penetrating its upper and lower ends, and a positioning pin (not shown in the figure) is provided at one end of the through hole 224. The positioning pin is a short rod with the same upper and lower diameters. One end of the positioning pin extends into the partial through hole 224, and the other end of the positioning pin extends into the through hole 224 of the adjacent carrier block 223.

[0043] In some embodiments, the positioning pin can be in the form of a long rod, which passes through the through holes 224 provided on multiple carrier blocks 223 in sequence to connect multiple carrier blocks 223 in series.

[0044] The upper mold 221 and the lower mold 222 are pushed from the upper and lower ends toward the middle by the clamping assembly 21, thereby clamping the adjacent carrier block 223 and the middle frame 4 nested on the outer periphery of the carrier block 223.

[0045] To ensure that the polishing structure 1 and the material clamping mechanism 2 are at the same height, the polishing equipment also includes a base 3, and the clamping component fixing frame 23 and the polishing component fixing frame 12 are connected to the base 3.

[0046] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification. When technical features of different embodiments are embodied in the same drawing, it can be regarded as the drawing also disclosing examples of combinations of the various embodiments involved.

[0047] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A multi-axis parallel stacked polishing device for polishing the mid-frame of a mobile phone, characterized in that, include: Polishing mechanism (1), with several sets of polishing components (11); The material clamping mechanism (2) has clamping components (21) corresponding to the number of polishing components (11), and a middle frame nested fixture (22) is connected to the clamping components (21). The polishing mechanism (1) and the material clamping mechanism (2) have opposite directions of movement, and a plurality of the middle frames are stacked and connected to the outer periphery of the middle frame nested fixture (22); The nested fixture (22) for the middle frame includes an upper mold (221), a lower mold (222) and a fixed shaft. The fixed shaft passes through the inside of the middle frame. The upper mold (221) and the lower mold (222) are respectively connected to the two ends of the fixed shaft to restrict the middle frame from falling off the two ends of the fixed shaft and to provide mutual clamping force for multiple middle frames.

2. The multi-axis parallel stacked polishing equipment according to claim 1, characterized in that, The clamping assembly (21) acts on the upper mold (221) and the lower mold (222) respectively to clamp the middle frame nested fixture (22) and form a pivot for the middle frame nested fixture (22) to rotate.

3. The multi-axis parallel stacked polishing equipment according to claim 2, characterized in that, The fixed shaft is composed of several detachable carrier blocks (223) connected in sequence. Each carrier block (223) has a connection structure that is adapted to the inner circumference of the middle frame and is connected to a middle frame.

4. The multi-axis parallel stacked polishing equipment according to claim 3, characterized in that, Each of the carrier blocks (223) has an upper end and a lower end, and the upper and lower ends of two adjacent carrier blocks (223) are detachably connected.

5. A multi-axis parallel stacked polishing device according to claim 4, characterized in that, The carrier block (223) has at least one through hole (224) penetrating its upper and lower ends, and a positioning pin is provided at one end of the through hole (224). Two adjacent carrier blocks (223) are connected by the positioning pin and the through hole (224).

6. The multi-axis parallel stacked polishing equipment according to claim 5, characterized in that, The clamping assembly (21) acts on the upper mold (221) and the lower mold (222) respectively, and provides the upper mold (221) and the lower mold (222) with a clamping force toward the carrier block (223).

7. The multi-axis parallel stacked polishing equipment according to claim 1, characterized in that, The polishing mechanism (1) has a liftable polishing component fixing frame (12) for adjusting the abutment height between the polishing component (11) and the clamping component (21). Each polishing component (11) is horizontally distributed on the polishing component fixing frame (12) along a straight line.

8. A multi-axis parallel stacked polishing device according to claim 1, characterized in that, The material clamping mechanism (2) has a movable clamping component fixing frame (23) for moving the clamping component (21) closer to the polishing component (11). Each clamping component (21) is horizontally distributed along a straight line on the clamping component fixing frame (23).

9. A multi-axis parallel stacked polishing device according to claim 8, characterized in that, The polishing equipment also includes a base (3), and the clamping component fixing frame (23) and the polishing component fixing frame (12) are connected to the base (3).

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