High-speed optical module high-temperature testing device adopting ceramic heating device
By using ceramic heating devices to directly contact the optical module for heat conduction, a uniform thermal field is formed, which solves the problems of weak temperature regulation capability and long preheating time in existing high-speed optical module high-temperature testing devices, and realizes fast and stable temperature control and efficient testing process.
Patent Information
- Application Number
- CN202520125639.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing high-speed optical module high-temperature testing devices suffer from problems such as weak temperature regulation capability, complex control, easy damage to optical modules, and long preheating time, which affect efficiency.
Using ceramic heating devices as the heat source, heat is conducted directly to the optical module to form a uniform thermal field, which, combined with temperature control components, enables rapid temperature adjustment and stable control.
It achieves rapid and stable temperature regulation, reduces energy consumption, simplifies the test system structure, improves test efficiency, and reduces costs.
Smart Images

Figure CN223650136U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of optical module testing technology, specifically referring to a high-speed optical module high-temperature testing device using a ceramic heating device. Background Technology
[0002] With the rapid development of artificial intelligence technologies such as large-scale models, the business demand for data centers and computing centers is growing rapidly. Artificial intelligence servers use high-speed optical modules for massive data exchange, especially 400G, 800G and above high-speed optical modules, which are quickly becoming the mainstream products in the market.
[0003] High-speed optical modules of 400G, 800G, and above are complex in function and have high performance requirements. They often operate within a wide temperature range; for example, industrial-grade modules require temperatures from -40℃ to 85℃, while commercial-grade modules require temperatures from 0℃ to 70℃. High-speed optical modules involve complex structures including metal components, printed circuit boards, chips, and laser devices. The temperature characteristics of each component differ, and there are also variations between different manufacturers and product batches. Therefore, testing high-speed optical modules as a whole under high-temperature conditions is a crucial step in evaluating their performance and reliability.
[0004] Heat flow meters are commonly used high-temperature testing platforms, with market prices ranging from several hundred thousand yuan per unit. In practical applications, they need to be combined with testing fixtures compatible with high-speed optical modules of specific sizes to ensure the integrity of the modules. While heat flow meters are relatively mature commercial products, they have several drawbacks:
[0005] First, heat flow meters are expensive, requiring customized sealing fixtures, resulting in high overall testing equipment costs. Second, heat flow meters heat flowing air, but air has poor heat conduction. While this ensures a stable and adjustable internal temperature within the sealing fixture, it consumes a significant amount of electricity during operation, hindering energy conservation and emission reduction, and also increasing testing costs. Finally, heat flow meters are not designed for high-speed optical modules of a specific size, resulting in a large size for both the heat flow meter and the sealing fixture, requiring considerable space in laboratories or production areas, which is a significant limitation for companies with limited space.
[0006] Besides commercially available heat flow meters, high-temperature testing equipment also utilizes other heat sources. For example, the publication CN212092316U, "High-Temperature Testing Fixtures," discloses a temperature-controlled optical module testing fixture using thermoelectric semiconductor devices (TECs). The TECs are used in conjunction with a heat sink, with thermal grease applied between the two surfaces to fill the gap. The disadvantages of TECs are their relatively weak temperature regulation capabilities; in high-temperature environments, regulation requires the use of a heat sink, making temperature control complex. Finally, TECs cannot directly conduct heat to the optical module, potentially damaging it.
[0007] The patent application CN217084145U, entitled "A High-Temperature Testing Device for Optical Modules," discloses a high-temperature testing device for optical modules that uses a high-temperature, high-pressure gas heat source. This technical solution uses a cylinder to push the optical module, reducing the loss of internal high-temperature gas and saving time in handling the optical module. However, the disadvantage is that the optical module needs a long preheating time to heat up in the high-temperature gas environment. The longer the high-temperature testing time for a single optical module, the lower the testing efficiency and the higher the cost of maintaining the high-temperature environment.
[0008] The technical solution provided by this utility model avoids the shortcomings of the prior art described above. It adopts a ceramic heating device and takes advantage of the following: it can form a uniformly distributed heat field, can directly contact the high-speed optical module for heat conduction, has a fast heating speed, and the temperature is stable and controllable. Utility Model Content
[0009] The technical problem this invention aims to solve is that the high-speed optical module high-temperature testing device has weak temperature regulation capability, complex temperature control, is prone to burning out the optical module, and has a long preheating time, which affects its efficiency.
[0010] The technical solution adopted by this utility model is as follows:
[0011] This utility model proposes a high-speed optical module high-temperature testing device using a ceramic heating device, including a test box and a control panel. The test box is located on one side of the control panel and also includes a ceramic heating plate located on the bottom wall of the test box. An optical module access dock is fixedly connected to the upper part of the ceramic heating plate. A first fan and a second fan are connected through the back panel of the test box adjacent to the control panel.
[0012] Furthermore, a first high-speed optical module and a second high-speed optical module are provided above the ceramic heating plate.
[0013] Furthermore, depending on whether the first high-speed optical module or the second high-speed optical module is commercial grade or industrial grade, the maximum operating temperature is 70°C for commercial grade and 85°C for industrial grade.
[0014] Furthermore, the upper part of the ceramic heating plate is provided with a first testing station, a second testing station, and a third testing station.
[0015] Furthermore, the optical module access dock is equipped with a test connection line, and the optical module access dock is equipped with a first test connector, a second test connector and a third test connector, which correspond to the first test station, the second test station and the third test station respectively.
[0016] Furthermore, a temperature control component is fixedly connected to the side of the control panel, and the ceramic heating plate is electrically connected to the temperature control component via a temperature control connection line.
[0017] The beneficial effects of this utility model by adopting the above structure are as follows:
[0018] Compared to traditional heat flow meters, ceramic heating plates offer advantages such as direct heat conduction, uniform heat field, fast temperature adjustment, small temperature difference error, and support for dry burning. This facilitates the expansion of testing stations, simplifies the structure of the testing system, saves energy, reduces costs, and improves testing efficiency, demonstrating promising market application and expansion prospects. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of a high-speed optical module high-temperature testing device using a ceramic heating device, according to an embodiment of the present invention.
[0020] Among them, 100 is the test box; 101 is the ceramic heating plate; 102 is the temperature control component; 103 is the temperature control connection cable; 104 is the control panel; 105 is the test connection cable; 106 is the optical module access dock; 107 is the first test connector; 108 is the second test connector; 109 is the third test connector; 110 is the first high-speed optical module; 111 is the second high-speed optical module; 112 is the first fan; 113 is the second fan; 114 is the first test station; 115 is the second test station; and 116 is the third test station. Detailed Implementation
[0021] like Figure 1 As shown, the present invention proposes a high-speed optical module high-temperature testing device using a ceramic heating device, comprising a test chamber 100 and a control panel 104. The test chamber 100 is located on one side of the control panel 104, and also includes a ceramic heating plate 101 located on the bottom wall of the test chamber 100. An optical module access dock 106 is fixedly connected to the upper part of the ceramic heating plate 101. A first fan 112 and a second fan 113 are provided through the back panel of the test chamber 100 adjacent to the control panel 104 to regulate the ambient temperature inside the test chamber 100 and prevent the test device from being damaged due to excessive temperature.
[0022] A first high-speed optical module 110 and a second high-speed optical module 111 are disposed above the ceramic heating plate 101. The ceramic heating plate 101 sets the heating temperature of the first high-speed optical module 110 and the second high-speed optical module 111 according to the high-temperature test requirements. The test chamber 100 is the high-temperature environment for testing the first high-speed optical module 110 and the second high-speed optical module 111. It should be noted that the operating temperature range of commercial-grade optical modules is 0℃ to 70℃, and the operating temperature range of industrial-grade optical modules is -40℃ to 85℃. The operating temperature range is 70℃ for commercial-grade optical modules and 85℃ for industrial-grade optical modules. The ceramic heating plate 101 can provide a high-temperature test environment through heating.
[0023] The upper part of the ceramic heating plate 101 is provided with a first test station 114, a second test station 115 and a third test station 116 in sequence;
[0024] In Embodiment 1, the first high-speed optical module 110 is directly mounted on the first test station 114, and the second high-speed optical module 111 is directly mounted on the third test station 116.
[0025] The optical module access dock 106 is provided with a test connection line 105. The optical module access dock 106 is provided with a first test connector 107, a second test connector 108 and a third test connector 109, which correspond to the first test station 114, the second test station 115 and the third test station 116 respectively.
[0026] In the second embodiment, specifically, the first high-speed optical module 110 to be tested is installed at the first test station 114 and connected to the first test connector 107; the second high-speed optical module 111 to be tested is installed at the third test station 116 and connected to the third test connector 109.
[0027] A temperature control component 102 is fixedly connected to the side of the control panel 104. The ceramic heating plate 101 is electrically connected to the temperature control component 102 through a temperature control connection line 103. The control panel 104 controls the test temperature of the ceramic heating plate 101 through the temperature control component 102. The control panel 104 provides temperature setting and other functions for testers.
[0028] In this embodiment, only the case with three test stations is given. In fact, this invention can be easily extended to the case with any number of test stations, which greatly improves the testing efficiency.
[0029] The above is the entire usage process of a high-speed optical module high-temperature testing device that uses ceramic heating elements.
[0030] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.
Claims
1. A high-speed optical module high-temperature testing device using a ceramic heating element, comprising a test chamber (100) and a control panel (104), wherein the test chamber (100) is located on one side of the control panel (104), characterized in that: It also includes a ceramic heating plate (101) located on the bottom wall of the test box (100), and an optical module access dock (106) is fixedly connected to the upper part of the ceramic heating plate (101). The test box (100) has a first fan (112) and a second fan (113) running through it on the back panel adjacent to the control panel (104).
2. The high-speed optical module high-temperature testing device using a ceramic heating device according to claim 1, characterized in that: A first high-speed optical module (110) and a second high-speed optical module (111) are provided above the ceramic heating plate (101).
3. The high-speed optical module high-temperature testing device using a ceramic heating device according to claim 2, characterized in that: The first high-speed optical module (110) and the second high-speed optical module (111) have different operating temperatures depending on whether they are commercial or industrial grade. The commercial grade has a maximum operating temperature of 70°C, and the industrial grade has a maximum operating temperature of 85°C.
4. The high-speed optical module high-temperature testing device using a ceramic heating device according to claim 3, characterized in that: The ceramic heating plate (101) has a first test station (114), a second test station (115) and a third test station (116) arranged sequentially on its upper part.
5. A high-speed optical module high-temperature testing device using a ceramic heating element according to claim 4, characterized in that: The optical module access dock (106) is provided with a test connection line (105), and the optical module access dock (106) is provided with a first test connector (107), a second test connector (108) and a third test connector (109), which correspond to the first test station (114), the second test station (115) and the third test station (116) respectively.
6. A high-speed optical module high-temperature testing device using a ceramic heating element according to claim 5, characterized in that: A temperature control component (102) is fixedly attached to the side of the control panel (104), and the ceramic heating plate (101) is electrically connected to the temperature control component (102) through a temperature control connection line (103).
Citation Information
Patent Citations
High-temperature test tool
CN212092316U
High-temperature testing device for optical module
CN217084145U