Pressure head and sorting tester

Abstract

The utility model relates to a pressure head and a sorting tester, air holes communicated with an airflow channel are arranged on a pressing surface of the pressure head, and the air holes comprise first air holes uniformly distributed around the center of the pressing surface. The first air hole can adsorb and fix the chip on the pressing surface through negative pressure air flow in the air flow channel for testing, and after testing is completed, the first air hole can effectively desorb the chip through positive pressure air flow in the air flow channel. The first air holes are uniformly distributed around the center of the hold-down surface, so that the air flow blown out of the first air holes can be effectively prevented from being concentrated, the air flow blown out of the first air holes can be diffused in a relatively large range, high-speed air flow is prevented from being formed between the chip and the hold-down surface, and the Bernoulli phenomenon is avoided. Moreover, the ratio of the area of the heat transfer area to the total area of the hold-down surface is not lower than the preset ratio, so that the heat transfer efficiency between the pressure head and the chip is ensured. Therefore, the pressure head can facilitate desorption on the premise of ensuring the temperature control effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a pressure head and sorting tester. Background Technology

[0002] When testing electronic components such as chips, a pressure head is used to press the chip into place, thereby fixing the chip and controlling its temperature. The pressure head uses negative pressure to adsorb the chip, and after testing, air is blown onto the chip surface through the adsorption holes to detach the chip. To ensure efficient heat transfer between the pressure head and the chip for temperature control, the pore size of the adsorption holes is small, thus increasing the contact area between the chip and the pressure head. However, this can cause the gas blown onto the chip through the adsorption holes to easily form a high-speed flow between the chip and the pressure head, resulting in the Bernoulli phenomenon. This increases the lift force on the chip, and when the lift force exceeds the chip's own weight, the chip will levitate below the pressure head, making effective detachment impossible. Utility Model Content

[0003] Therefore, it is necessary to provide a pressure head and sorting test machine that can facilitate desorption while ensuring temperature control, in order to address the above problems.

[0004] A pressure head has a pressure holding surface on one side, and an airflow channel is formed inside the pressure head. The pressure holding surface has pores communicating with the airflow channel. The pores adsorb the target object through negative pressure airflow in the airflow channel or break the adsorption state through positive pressure airflow. The pores include a first pore evenly distributed around the center of the pressure holding surface. The area of ​​the pressure holding surface without the pores constitutes a heat transfer area, and the ratio of the area of ​​the heat transfer area to the total area of ​​the pressure holding surface is not less than a preset ratio.

[0005] In one embodiment, the first vent is configured as a circular vent, and the centers of the plurality of first vents are equally spaced on a circumcircle centered at the center of the pressing surface.

[0006] In one embodiment, the first vent is configured as a circular vent, and the centers of the plurality of first vents are equally spaced on a circumcircle centered at the center of the pressing surface. The vents also include a second vent, which is located within the area enclosed by the circumcircle.

[0007] In one embodiment, the second vent is configured as a circular hole with a diameter equal to that of the first vent, and a plurality of the second vents are evenly distributed within the area enclosed by the circumscribed circle.

[0008] In one embodiment, the second vent is configured as a circular hole with a diameter larger than that of the first vent, and one of the second vents is concentrically arranged with the circumcircle.

[0009] In one embodiment, the first vent is configured as an annular hole, and the annular hole is concentrically positioned with the center of the pressing surface.

[0010] In one embodiment, the annular hole is connected to the airflow channel through a plurality of circular through holes, and the plurality of circular through holes are equally spaced along the extension direction of the annular hole.

[0011] In one embodiment, the pressure head includes a first module and a second module, the airflow channel is formed in the first module, the pressure holding surface and the air hole are disposed in the second module, the first module and the second module are spliced ​​together and the air hole is connected to the airflow channel.

[0012] In one embodiment, the preset ratio is not less than 80%.

[0013] A sorting and testing machine includes a pressure head as described in any of the preferred embodiments above.

[0014] The aforementioned pressure head and sorting tester utilize a first air hole that allows negative pressure airflow within the airflow channel to adsorb and fix the chip onto the holding surface for testing. After testing, positive pressure airflow through the first air hole effectively desorbs the chip. Because the first air holes are uniformly distributed around the center of the holding surface, they effectively prevent the airflow from concentrating, allowing it to disperse over a wide area and avoiding the formation of high-speed airflow between the chip and the holding surface, thus preventing the Bernoulli phenomenon. Furthermore, the ratio of the heat transfer area to the total area of ​​the holding surface is not less than a preset ratio, ensuring efficient heat transfer between the pressure head and the chip. Therefore, the aforementioned pressure head facilitates chip desorption while maintaining effective temperature control. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the pressure head in the first embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the pressure head in the second embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the pressure head in the third embodiment of the present invention;

[0019] Figure 4 This is a schematic diagram of the pressure head in the fourth embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram of the pressure head in the fifth embodiment of the present invention;

[0021] Figure 6 A schematic diagram of the simulation results for the pressure head in the first embodiment;

[0022] Figure 7 A schematic diagram of the simulation results for the pressure head in the second embodiment;

[0023] Figure 8 A schematic diagram of the simulation results for the pressure head in the third embodiment;

[0024] Figure 9 A schematic diagram of the simulation results for the pressure head in the fourth embodiment;

[0025] Figure 10 This is a schematic diagram of the simulation results for the pressure head in the fifth embodiment. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] Please see Figures 1 to 5 This utility model provides a pressure head 100. Furthermore, this utility model also provides a sorting and testing machine (not shown), and the sorting and testing machine includes the pressure head 100.

[0033] When testing electronic components such as chips, the aforementioned sorting and testing machine can press and fix the chips using the pressure head 100. Furthermore, the pressure head 100 is generally made of a metal or other good thermal conductor, and is equipped with heating and cooling devices that conduct heat rapidly between the pressure head 100 and the pressed chip. Therefore, the pressure head 100 can also heat or cool the pressed chip, thereby achieving the purpose of chip temperature control.

[0034] A pressing head 100 has a pressing surface 101 on one side, which is used to directly contact the chip when the pressing head 100 presses the chip. The pressing surface 101 is generally rectangular to match the shape of the chip. Furthermore, an airflow channel (not shown) is formed inside the pressing head 100, and an air hole 102 communicating with the airflow channel is opened on the pressing surface 101. Specifically, in one embodiment, the pressing head 100 includes a first module 110 and a second module 120. The airflow channel is formed in the first module 110, and the pressing surface 101 and the air hole 102 are disposed in the second module 120. The first module 110 and the second module 120 are spliced ​​together, and the air hole 102 communicates with the airflow channel. The first module 110 and the second module 120 can be separately formed and then assembled into a complete pressing head 200 by welding and bonding, which makes the forming process more convenient.

[0035] The pressure head 100 can be connected to a vacuum pump (not shown) and an air blowing device (not shown), thereby creating a negative pressure airflow or a positive pressure airflow within the airflow channel. The air vent 102 adsorbs the target object, such as a chip, through the negative pressure airflow within the airflow channel, and can break the adsorption state through the positive pressure airflow within the airflow channel, thereby causing the adsorbed chip to be desorbed.

[0036] The vents 102 include first vents 1021 uniformly distributed around the center of the pressure holding surface 101. The area of ​​the pressure holding surface 101 without vents 102 constitutes a heat transfer region, and the ratio of the area of ​​the heat transfer region to the total area of ​​the pressure holding surface 101 is not less than a preset ratio. The larger the ratio of the heat transfer region area to the total area of ​​the pressure holding surface 101, the larger the actual contact area between the pressure holding surface 101 and the chip, and the higher the heat transfer efficiency between the pressure head 100 and the chip. Therefore, controlling the ratio of the heat transfer region area to the total area of ​​the pressure holding surface 101 above the aforementioned preset ratio ensures the heat transfer efficiency between the pressure head 100 and the chip. Optionally, the aforementioned preset ratio is not less than 80%.

[0037] During testing, evacuating the airflow channel creates a negative pressure airflow, which allows the chip to be adsorbed and fixed to the holding surface 101 through the first air hole 1021. After the test is completed, blowing positive pressure airflow into the airflow channel allows the chip to be effectively detached. Because the first air holes 1021 are evenly distributed around the center of the holding surface 101, the airflow blowing out of the first air holes 1021 can be effectively prevented from concentrating. The airflow blowing out of the first air holes 1021 can be dispersed over a large range, avoiding the formation of high-speed airflow between the chip and the holding surface 101, thereby avoiding the Bernoulli phenomenon and allowing the chip to be successfully detached.

[0038] Please refer to it again. Figure 1 In the first embodiment, the first vent 1021 is a circular vent, and the centers of the plurality of first vents 1021 are evenly distributed on a circumcircle centered at the center of the holding surface 101. The vent diameters of the plurality of first vents 1021 are generally the same. After the test is completed, the positive pressure airflow entering the pressure head 100 flows through the gas channel to the first vent 1021, and after being split, it is blown out of the plurality of first vents 1021 to detach the chip from the holding surface 101. After being split, the flow rate of the positive pressure airflow is significantly reduced, thereby avoiding the Bernoulli phenomenon and allowing the chip to be successfully de-adsorbed.

[0039] The following simulation is performed using the case where three first air holes 1021 are set, and the diameters of the circumscribed circles are set to 1.4658 mm and 1.7658 mm respectively, to simulate the pressure distribution on the chip surface and the flow velocity distribution at the chip center cross section when a positive pressure airflow is blown into the gas channel. The specific simulation results are as follows. Figure 6 As shown. Figure 6 The left side corresponds to the simulation result with a circumscribed circle diameter of 1.4658 mm, and the right side corresponds to the simulation result with a circumscribed circle diameter of 1.7658 mm.

[0040] As can be seen, the pressure on the chip surface is greater than 0, indicating that the chip can be successfully desorbed under positive pressure airflow without sticking. Moreover, the heat transfer area accounts for more than 80% in both cases, thus ensuring the heat transfer efficiency between the pressure head 100 and the chip.

[0041] Please refer to it again. Figure 2 In the second embodiment, the first vent 1021 is configured as a circular vent, and the centers of the plurality of first vents 1021 are evenly distributed on the circumcircle centered at the center of the pressure surface 101. Similarly, the pressure head 100 in the second embodiment can also achieve the purpose of diverting and slowing down the positive pressure airflow entering the gas flow channel, thereby avoiding the Bernoulli phenomenon.

[0042] The second embodiment differs from the first embodiment in that the diameter of the first vent 1021 is smaller and the number of vents is greater. For example, if the first embodiment has 3 first vents 1021, the second embodiment has 10 first vents 1021.

[0043] The following simulation is performed using a case where 10 first air holes 1021 are set, each with a diameter of 0.4 mm, and the diameter of the circumscribed circle is set to 2.1 mm. The simulation results are as follows: Figure 7 As shown.

[0044] As can be seen, the chip surface pressure is greater than 0, indicating that the chip can be successfully desorbed under positive pressure airflow without sticking. Moreover, the heat transfer area accounts for more than 80% of the total area, thus ensuring the heat transfer efficiency between the pressure head 100 and the chip.

[0045] Furthermore, in another embodiment, the first vent 1021 is configured as a circular vent, and the centers of the plurality of first vents 1021 are evenly distributed on a circumcircle centered at the center of the bearing surface 101. Moreover, the vent 102 also includes a second vent 1022, which is located within the area enclosed by the circumcircle. The positive pressure airflow from the second vent 1022 can interfere with the positive pressure airflow from the first vent 1021, thereby further reducing the gas flow velocity between the chip and the bearing surface to avoid the Bernoulli phenomenon.

[0046] Please refer to it again. Figure 3 In the third embodiment, the second vent 1022 is configured as a circular hole with a diameter equal to that of the first vent 1021, and a plurality of second vents 1022 are evenly distributed in the area enclosed by the outer circle.

[0047] The following simulation is performed using a case where 10 first air holes 1021 and 7 second air holes 1022 are provided, with the diameter of both first air holes 1021 and second air holes 1022 being 0.4 mm, and the diameter of the circumscribed circle being 2.1 mm. The simulation results are as follows: Figure 8 As shown.

[0048] As can be seen, the chip surface pressure is greater than 0, indicating that the chip can be successfully desorbed under positive pressure airflow without sticking. Moreover, the heat transfer area accounts for more than 80% of the total area, thus ensuring the heat transfer efficiency between the pressure head 100 and the chip.

[0049] Please refer to it again. Figure 4In the fourth embodiment, the second vent 1022 is configured as a circular hole with a diameter larger than that of the first vent 1021, and one second vent 1022 is concentrically arranged with the outer circle.

[0050] The following simulation is performed using a case where 10 first air holes 1021 and 1 second air hole 1022 are provided, with the diameter of the first air hole 1021 being 0.4 mm and the diameter of the second air hole 1022 being 1.5 mm, and the diameter of the circumscribed circle being 2.1 mm. The simulation results are as follows: Figure 9 As shown.

[0051] As can be seen, the chip surface pressure is greater than 0, indicating that the chip can be successfully desorbed under positive pressure airflow without sticking. Moreover, the heat transfer area accounts for more than 80% of the total area, thus ensuring the heat transfer efficiency between the pressure head 100 and the chip.

[0052] Please refer to it again. Figure 5 In the fifth embodiment, the first vent 1021 is configured as an annular hole, and the annular hole is concentric with the center of the pressing surface 101. The annular first vent 1021 provides more uniform air output, thereby enabling a more balanced force on the chip surface and helping to ensure the stability of the chip during desorption.

[0053] Furthermore, in this embodiment, the annular hole, which serves as the first air hole 1021, is connected to the airflow channel through a plurality of circular through holes 103, and the plurality of circular through holes 103 are equally spaced along the extension direction of the annular hole.

[0054] The multiple circular through holes 103 generally have the same diameter, and their centers are distributed on the same circumcircle centered on the center of the pressure surface 101. After the positive pressure airflow enters the pressure head 100, it will flow along the airflow channel, and when it approaches the annular hole, it will be split by the multiple circular through holes 103, and then enter the annular hole respectively, and finally be blown out of the annular hole to the chip, which can further improve the uniformity of the air output from the first air hole 1021.

[0055] The following simulation uses a case where the inner diameter of the annular hole is 1.7 mm, the outer diameter is 2.5 mm, and there are 10 circular through holes 103, each with a diameter of 0.4 mm, as an example. The simulation results are as follows: Figure 10 As shown.

[0056] As can be seen, the chip surface pressure is greater than 0, indicating that the chip can be successfully desorbed under positive pressure airflow without sticking. Moreover, the heat transfer area accounts for more than 80% of the total area, thus ensuring the heat transfer efficiency between the pressure head 100 and the chip.

[0057] The aforementioned pressure head 100 and sorting tester utilize a first air hole 1021. This first air hole 1021 allows the chip to be adsorbed and fixed onto the holding surface 101 by negative pressure airflow within the airflow channel for testing. After testing, positive pressure airflow through the first air hole 1021 effectively desorbs the chip. Because the first air holes 1021 are uniformly distributed around the center of the holding surface 101, the concentrated airflow from the first air holes 1021 is effectively prevented. The airflow from the first air holes 1021 can disperse over a large area, avoiding the formation of high-speed airflow between the chip and the holding surface 101, thus preventing the Bernoulli phenomenon. Furthermore, the ratio of the area of ​​the heat transfer region to the total area of ​​the holding surface 101 is not less than a preset ratio, ensuring efficient heat transfer between the pressure head 100 and the chip. Therefore, the aforementioned pressure head 100 facilitates chip desorption while ensuring effective temperature control.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A pressure head, wherein a pressure holding surface is provided on one side, characterized in that, An airflow channel is formed inside the pressure head, and air holes communicating with the airflow channel are opened on the pressure holding surface. The air holes adsorb the target object through negative pressure airflow in the airflow channel or break the adsorption state through positive pressure airflow. The air holes include a first air hole evenly distributed around the center of the pressure holding surface. The area of ​​the pressure holding surface without the air holes constitutes a heat transfer area, and the ratio of the area of ​​the heat transfer area to the total area of ​​the pressure holding surface is not less than a preset ratio.

2. The pressure head according to claim 1, characterized in that, The first vent is configured as a circular vent, and the centers of the plurality of first vents are equally spaced on a circumcircle centered at the center of the pressing surface.

3. The pressure head according to claim 1, characterized in that, The first air hole is a circular hole, and the centers of the plurality of first air holes are equally spaced on a circumcircle centered on the center of the pressing surface. The air hole also includes a second air hole, which is located in the area enclosed by the circumcircle.

4. The pressure head according to claim 3, characterized in that, The second vent is configured as a circular hole with a diameter equal to that of the first vent, and a plurality of the second vents are evenly distributed within the area enclosed by the outer circle.

5. The pressure head according to claim 3, characterized in that, The second vent is configured as a circular hole with a diameter larger than that of the first vent, and one of the second vents is concentrically arranged with the circumscribed circle.

6. The pressure head according to claim 1, characterized in that, The first air hole is configured as an annular hole, and the annular hole is concentrically arranged with the center of the pressing surface.

7. The pressure head according to claim 6, characterized in that, The annular hole is connected to the airflow channel through multiple circular through holes, and the multiple circular through holes are equally spaced along the extension direction of the annular hole.

8. The pressure head according to any one of claims 1 to 7, characterized in that, The pressure head includes a first module and a second module. The airflow channel is formed in the first module, and the pressure holding surface and the air hole are disposed in the second module. The first module and the second module are spliced ​​together and the air hole is connected to the airflow channel.

9. The pressure head according to claim 1, characterized in that, The preset ratio is not less than 80%.

10. A sorting and testing machine, characterized in that, Including the pressure head as described in any one of claims 1 to 9 above.

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