Semiconductor element testing device and carrier plate assembly thereof

Abstract

The utility model discloses a semiconductor element testing device and a carrier plate assembly thereof. The testing device comprises a machine table, an electronic module, a first connector module and the carrier plate assembly. The electronic module and the first connector module are located in the machine. The carrier plate assembly comprises a support group, a second connector module and a pre-pressing elastic element. The support set can be lifted on the machine table. The second connector module is arranged between the support group and the first connector module, is fixed on the support group and is aligned with the first connector module. The pre-pressing elastic elements are distributed between the support set and the second connector module and abut against the support set and the second connector module respectively. When the second connector module and the support group descend to the first connector module and compress the pre-pressing elastic element, the second connector module is inserted into the first connector module through the elastic force of the pre-pressing elastic element. By means of the structure, the probability of poor connection performance between the first connector module and the second connector module can be reduced, and therefore the accuracy of the detection result of the device to be detected is improved.

Description

Technical Field

[0001] This utility model relates to a semiconductor device testing apparatus, and more particularly to a semiconductor device testing apparatus and its carrier board assembly capable of providing insertion preload to the device under test. Background Technology

[0002] In the electrical testing of electronic components, the electrical testing module is usually integrated into the testing machine to perform a series of tests on the device under test on the testing machine.

[0003] However, when the testing head of the testing machine is moved down to a testing platform, and the multiple testing terminals of the testing head are connected to the multiple electrical contacts of the device under test on the testing platform, a slight gap error between the testing head and the device under test in reality will cause poor connection performance between the testing terminals of the testing head and the electrical contacts of the device under test, thus affecting the accuracy of the testing results of the device under test.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, requiring further improvement. Therefore, effectively addressing these inconveniences and shortcomings is a crucial research and development issue and a pressing goal for improvement in related fields. Utility Model Content

[0005] This invention proposes a semiconductor element testing device and its carrier assembly to solve the problems of the prior art.

[0006] According to one embodiment of the present invention, a semiconductor device testing apparatus includes a machine base, at least one electronic module, a first connector module, and a carrier assembly. The electronic module is located within the machine base. The first connector module is fixed to the machine base and has a first connection interface electrically connected to the electronic module. The carrier assembly includes a support group, a second connector module, and multiple pre-compression elastic elements. The support group is vertically locating on the machine base to support a circuit board under test. The second connector module is located between the support group and the first connector module, fixed to one side of the support group, and vertically aligned with the first connector module. The second connector module has a second connection interface electrically connected to the circuit board under test. These pre-compression elastic elements are symmetrically distributed between the support group and the second connector module. Each pre-compression elastic element abuts against the support group and the second connector module respectively. When the second connector module descends with the support group to the first connector module and compresses these pre-compression elastic elements, the second connector module pushes the second connection interface into the first connection interface through the restoring elastic force of these pre-compression elastic elements.

[0007] According to one or more embodiments of the present invention, in the above-described semiconductor device testing apparatus, the second connector module further includes a carrier plate and a plurality of fixing bolts. The carrier plate includes a plate body and a plurality of through holes. The plate body is located between the support assembly and the first connector module, and these through holes are symmetrically distributed on the plate body. These fixing bolts pass through these through holes respectively and fix the plate body to the side of the support assembly facing the second connector module, and there is a spatial gap between the plate body and the support assembly.

[0008] According to one or more embodiments of the present invention, in the above-described semiconductor device testing apparatus, each fixing bolt includes a column and a head. The column is slidably located within one of the through holes, allowing the plate to move relative to the column. One end of the column is locked to the side of the support assembly facing the second connector module. The head is integrally connected to the end of the column opposite to the support assembly, located on the side of the support plate opposite to the spatial interval, and the size of the head is larger than the size of the through hole. Each pre-compression elastic element includes a helical compression spring located within the spatial interval, with its two opposite ends elastically abutting against the support assembly and the plate, respectively. The long axis of the helical compression spring is parallel to the long axis of the column and surrounds the column.

[0009] According to one or more embodiments of the present invention, in the above-described semiconductor device testing apparatus, the first connector module includes a base. The first connection interface includes at least one first adapter bracket and at least one first adapter unit, the first adapter bracket being fixed to the base, and the first adapter unit being fixed to the first adapter bracket. The carrier plate further includes at least one fixing groove. The fixing groove is formed on the plate body. The second connection interface includes at least one second adapter bracket and at least one second adapter unit. The second adapter bracket is fixed within the fixing groove, and the second adapter unit is fixed to the second adapter bracket and is pluggably connected to the first adapter unit.

[0010] According to one or more embodiments of the present invention, the semiconductor device testing apparatus further includes a lifting guide module. The lifting guide module includes a movable frame, a handle structure, and multiple limiting seats. The movable frame is located between the support assembly and the first connector module, and has a through slot to accommodate the support assembly. The handle structure is located on one side of the movable frame and is fixedly connected to the movable frame. These limiting seats are located on two opposite sides of the movable frame and face each other. An inclined sliding groove is recessed on the inner surface of each facing side of these limiting seats. Multiple sliding blocks protrude from two opposite outer sides of the support assembly, and these sliding blocks are slidably located within these inclined sliding grooves. When the movable frame and limiting seats are pulled horizontally by the handle structure, the second connector module can be vertically raised and lowered along with the support assembly by the guidance of the inclined sliding grooves.

[0011] According to one or more embodiments of the present invention, in the above-described semiconductor device testing apparatus, each inclined slide includes an inlet and an inclined channel area. The inlet is opened on the top surface of the corresponding limiting seat to allow the sliding block to enter the inclined slide. The inclined channel area connects to the inlet and gradually tilts from the top surface of the limiting seat toward the first connector module and the direction opposite to the handle structure, so as to guide the support assembly to move vertically.

[0012] According to one embodiment of the present invention, a carrier assembly is adapted to be mounted on a semiconductor device testing apparatus, and the carrier assembly includes a support group, a second connector module, and a plurality of pre-compression elastic elements. The support group is located above a first connection interface of a first connector module of the semiconductor device testing apparatus and is vertically movable within the semiconductor device testing apparatus to support a circuit board under test. The second connector module is fixed to one side of the support group and has a second connection interface electrically connected to the circuit board under test. These pre-compression elastic elements are symmetrically distributed between the support group and the second connector module, and each pre-compression elastic element connects the support group and the second connector module respectively. When the second connector module descends with the support group to the first connector module and compresses these pre-compression elastic elements, the second connector module pushes the second connection interface into the first connection interface through the restoring elastic force of these pre-compression elastic elements.

[0013] According to one or more embodiments of the present invention, in the above-described carrier assembly, the second connector module further includes a carrier plate and a plurality of fixing bolts. The carrier plate includes a plate body and a plurality of through holes. The plate body is located between the support assembly and the first connector module, and these through holes are symmetrically distributed on the plate body. These fixing bolts pass through these through holes respectively and fix the plate body to the side of the support assembly facing the second connector module, and there is a spatial gap between the plate body and the support assembly.

[0014] According to one or more embodiments of the present invention, in the above-described carrier plate assembly, each fixing bolt includes a column and a head. The column is slidably located within one of the through holes, allowing the plate to move relative to the column. One end of the column is locked to the side of the support assembly facing the second connector module. The head is integrally connected to the end of the column opposite to the support assembly, located on the side of the carrier plate opposite to the spatial interval, and the size of the head is larger than the size of the through hole. Each preloaded elastic element includes a helical compression spring. The helical compression spring is located within the spatial interval, with its two opposite ends elastically abutting against the support assembly and the plate, respectively. The long axis of the helical compression spring is parallel to the long axis of the column and surrounds the column.

[0015] According to one or more embodiments of the present invention, in the above-described carrier plate assembly, the carrier plate further includes at least one fixing groove. The fixing groove is formed on the plate body, and the second connection interface includes at least one adapter bracket and at least one adapter unit. The adapter bracket is fixed in the fixing groove, and the adapter unit is fixed on the adapter bracket.

[0016] Thus, through the above architecture, the semiconductor component testing device and its carrier board assembly of this utility model can reduce the probability of poor connection performance between the first connector module and the second connector module, thereby improving the accuracy of the test results of the device under test.

[0017] The above description is only used to illustrate the problem that this utility model intends to solve, the technical means to solve the problem, and the effects it produces. The specific details of this utility model will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this utility model more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a perspective view of the semiconductor device testing apparatus according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 A partial exploded view of a semiconductor device testing apparatus;

[0021] Figure 3 for Figure 1 A cross-sectional view of the semiconductor component testing device along line segment AA;

[0022] Figure 4 for Figure 2 A perspective view of the first connector module;

[0023] Figure 5 for Figure 1 A three-dimensional view of the carrier plate assembly;

[0024] Figure 6 To observe from another direction Figure 5 A three-dimensional view of the carrier plate assembly;

[0025] Figures 7A to 7C for Figure 2 A schematic diagram of the continuous operation of the first connection interface and the second connection interface;

[0026] Figure 8A and Figure 8B for Figure 2 A schematic diagram illustrating the principle of the support assembly paired with the lifting guide module.

[0027] [Symbol Explanation]

[0028] 10: Semiconductor Component Testing Equipment

[0029] 100: Machine

[0030] 200: Electronic Module

[0031] 300: First connector module

[0032] 310: Base

[0033] 311: Receiving slot

[0034] 320: First connection interface

[0035] 321: First adapter bracket

[0036] 322: First adapter unit

[0037] 323: Through-hole

[0038] 400: Carrier assembly

[0039] 410: Circuit board under test

[0040] 420: Stent assembly

[0041] 421: Carrier Frame

[0042] 421A: Top surface

[0043] 421B: Bottom surface

[0044] 422: Sliding Block

[0045] 423: Extended Framework

[0046] 424: Penetration

[0047] 500: Second connector module

[0048] 510: Bearing plate

[0049] 511:Plate body

[0050] 512: Perforation

[0051] 513: Fixing slot

[0052] 520: Fixed bolt

[0053] 521: Column

[0054] 522: Head

[0055] 530: Second connection interface

[0056] 531: Second adapter bracket

[0057] 532: Second adapter unit

[0058] 600: Preloaded elastic element

[0059] 700: Lifting Guide Module

[0060] 710: Moving Box

[0061] 711: Through-groove

[0062] 712: First side

[0063] 713: Second side

[0064] 720: Handle Structure

[0065] 730: Limiting seat

[0066] 731: Top surface

[0067] 732: Inner side

[0068] 740: Inclined chute

[0069] 741: Entrance

[0070] 742: Inclined Passage Area

[0071] AA: line segment

[0072] C1, C2: Wire

[0073] D1: First Direction

[0074] D2: Second Direction

[0075] G: Spatial Interval

[0076] X, Y, Z: Axes Detailed Implementation

[0077] The following describes several embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, those skilled in the art should understand that these practical details are not essential in some embodiments of the present invention and therefore should not be used to limit the present invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in a simplified schematic manner in the drawings. Additionally, for ease of viewing, the dimensions of the components in the drawings are not drawn to scale.

[0078] Figure 1 This is a perspective view of the semiconductor element testing device 10 according to an embodiment of the present invention. Figure 2 for Figure 1A partial exploded view of the semiconductor device testing apparatus 10. Figure 3 for Figure 1 A cross-sectional view of the semiconductor device testing apparatus 10 along line segment AA. (See figure) Figures 1 to 3 As shown, the semiconductor device testing apparatus 10 includes a base 100, one or more electronic modules 200, a first connector module 300, and a carrier assembly 400. The electronic modules 200 are fixed within the base 100. The first connector module 300 is fixed to the base 100. In this embodiment, the first connector module 300 includes a base 310 and a first connection interface 320. The base 310 is fixed within the base 100, and the first connection interface 320 is located on the base 310 and electrically connects to the electronic modules 200. The carrier assembly 400 includes a support group 420, a second connector module 500, and multiple pre-compression elastic elements 600. The support group 420 is vertically detachable on the base 100 and can support a circuit board 410 under test. The second connector module 500 is located between the support group 420 and the first connector module 300 and is fixed to one side of the support group 420. In this embodiment, the second connector module 500 is vertically aligned with the first connector module 300, meaning that the orthographic projection of the second connector module 500 along the Z-axis onto the machine tool 100 overlaps with the first connector module 300. For example, the second connector module 500 includes a second connection interface 530. The second connection interface 530 is electrically connected to the circuit board under test 410 for removable electrical connection to the first connection interface 320. These pre-compression elastic elements 600 are symmetrically distributed between the support assembly 420 and the second connector module 500. The two opposite ends of each pre-compression elastic element 600 abut against the support assembly 420 and the second connector module 500, respectively.

[0079] Figure 4 for Figure 2 A perspective view of the first connector module 300. (See figure.) Figure 2 and Figure 4As shown, the first connection interface 320 includes a plurality of first adapter brackets 321. These first adapter brackets 321 are respectively fixed to the base 310. For example, the top surface of the base 310 has a recessed receiving groove 311. These first adapter brackets 321 are elongated, and the long axis of each first adapter bracket 321 extends along the Y-axis. These first adapter brackets 321 are arranged sequentially side-by-side in the receiving groove 311 along the X-axis. Each first adapter bracket 321 can accommodate a plurality of first adapter units 322. These first adapter units 322 are respectively fixed to a plurality of through holes 323 in the first adapter bracket 321. These first adapter units 322 are linearly arranged on the first adapter bracket 321, and these first adapter units 322 are linearly arranged along the Y-axis, and the long axis of the first adapter bracket 321 is parallel to the Y-axis. Each first adapter unit 322 is electrically connected to the electronic module 200 via a wire C1. Figure 2 ).

[0080] Figure 5 for Figure 1 A perspective view of the carrier plate assembly 400. Figure 6 To observe from another direction Figure 5 A perspective view of the carrier plate assembly 400. (See image below.) Figure 2 and Figure 5 As shown, more specifically, the support assembly 420 includes a carrier frame 421 and an extension frame 423. The carrier frame 421 has opposing top surfaces 421A and bottom surfaces 421B. Figure 2 The top surface 421A of the carrier frame 421 is used to lay the circuit board under test 410 flat, meaning that the circuit board under test 410 extends along the XY (axis) plane. The extension frame 423 is fixedly connected to the bottom surface 421B of the carrier frame 421 and the second connector module 500. For example, the extension frame 423 is stepped and extends from the bottom surface 421B of the carrier frame 421 towards the first connector module 300 (e.g., along the Z-axis). Figure 2 ).

[0081] Figures 7A to 7C They are respectively Figure 2 A schematic diagram illustrating the continuous operation of the first connection interface 320 and the second connection interface 530. (See diagram below.) Figure 2 and Figure 7AAs shown, the second connector module 500 further includes a carrier plate 510 and a plurality of retaining bolts 520. The carrier plate 510 is located between the support assembly 420 and the first connection interface 320 and is fixed to the extension frame 423. The second connection interface 530 is located on the carrier plate 510 and is electrically connected to the circuit board under test 410. For example, the carrier plate 510 includes a plate body 511 and a plurality of through holes 512. The plate body 511 is located between the extension frame 423 and the first connector module 300. These through holes 512 are symmetrically distributed on the plate body 511. More specifically, for example, the plate body 511 extends along the XY plane and is parallel to the circuit board under test 410. These retaining bolts 520 pass through these through holes 512 respectively and fix the plate body 511 to the side of the extension frame 423 facing the plate body 511, such that there is a spatial gap G between the plate body 511 and the extension frame 423.

[0082] More specifically, each retaining bolt 520 includes a post 521 and a head 522. The post 521 is slidably located within one of the through holes 512, allowing the plate 511 to move relative to the post 521. One end of the post 521 is locked to the side of the extension frame 423 facing the plate 511. The head 522 is integrally connected to the end of the post 521 facing away from the extension frame 423, located on the side of the support plate 510 facing away from the spatial interval G, and the size of the head 522 is larger than the size of the through hole 512.

[0083] For example, there are four pre-compression elastic elements 600, symmetrically located on two opposite sides of the plate 511, and each pre-compression elastic element 600 includes a helical compression spring located within the spatial interval G, with the two opposite ends of the helical compression spring elastically abutting against the extension frame 423 of the support assembly 420. Figure 2 The plate 511 of the support plate 510 is connected to the column 521. The long axis of the helical compression spring is parallel to the long axis of the column 521 (e.g., the Z-axis), and the column 521 passes through the interior of the helical compression spring, meaning that the helical compression spring surrounds the column 521. The helical compression spring is, for example, made of metal or other similar materials. However, this invention is not limited to springs, and the preloaded elastic element 600 may also be other similar elements.

[0084] return Figure 5 and Figure 6 As shown, the support plate 510 also includes a plurality of fixing grooves 513, which are formed on the plate body 511. For example, these fixing grooves 513 are arranged sequentially side by side on the plate body 511 along the X-axis direction. Figure 6 Furthermore, these fixing grooves 513 are elongated, with the long axis of each fixing groove 513 extending along the Y-axis and parallel to the long axis of the plate 511.

[0085] The second connection interface 530 includes a plurality of second adapter brackets 531. Each second adapter bracket 531 is fixed within one of the fixing slots 513. For example, these second adapter brackets 531 are elongated, and the major axis of each second adapter bracket 531 extends along the Y-axis. A plurality of second adapter units 532 can be configured on each second adapter bracket 531. These second adapter units 532 are fixed to the second adapter bracket 531 and are linearly arranged on the second adapter bracket 531. Each second adapter unit 532 is coaxially aligned with one of the first adapter units 322 along the Z-axis and is pluggably connected to the first adapter unit 322.

[0086] It should be understood that each first adapter unit 322 and the corresponding second adapter unit 532 are complementary in format. In this embodiment, the first adapter unit 322 is a male connector and the second adapter unit 532 is a female connector. However, the present invention is not limited thereto.

[0087] like Figure 2 and Figure 5 As shown, each second adapter unit 532 is electrically connected to an electrical contact (not shown) of the circuit board under test 410 via a wire C2. More specifically, the extension frame 423 further has a through-hole 424, one end of which is connected to the second adapter unit 532, and the other end is soldered to the electrical contact of the circuit board under test 410 via the through-hole 424.

[0088] like Figure 7A and Figure 7B As shown, when the second connector module 500 descends with the bracket assembly 420 to the first connector module 300 ( Figure 2 When the second connector module 500 presses against the first connection interface 320 of the first connector module 300, the second adapter units 532 of the second connection interface 530 are respectively connected to the first adapter units 322 of the first connection interface 320. At this time, the first connector module 300 compresses the pre-compressed elastic elements 600 (i.e., reduces the spatial interval G), so that the pre-compressed elastic elements 600 begin to store restoring elastic force.

[0089] Next, as Figure 7B and Figure 7C As shown, when the second connector module 500 no longer presses against the first connector module 300, the second connector module 500 uses the restoring elastic force of these pre-compressed elastic elements 600 to push the second adapter units 532 further into the first adapter units 322 respectively.

[0090] like Figure 2 and Figure 3As shown, the semiconductor device testing apparatus 10 further includes a lifting guide module 700. The lifting guide module 700 is located on the machine base 100 and includes a movable frame 710, a handle structure 720, and multiple (e.g., two) limiting seats 730. The movable frame 710 is movably located on the machine base 100. The movable frame 710 is situated between the support assembly 420 and the first connector module 300. The movable frame 710 has a through slot 711 that accommodates the support assembly 420. The movable frame 710 has a first side 712 and a second side 713 facing each other. The handle structure 720 is located on the first side 712 of the movable frame 710 and is fixedly connected to the movable frame 710. The limiting seats 730 are respectively located opposite each other on the movable frame 710; in other words, the limiting seats 730 face each other. The inner surfaces 732 of the mutually facing limiting seats 730 are each recessed with an inclined groove 740. Multiple sliding blocks 422 are respectively protruding from the two opposite outer sides of the carrier frame 421. These sliding blocks 422 are slidably located within these inclined grooves 740.

[0091] Figure 8A and Figure 8B for Figure 2 A schematic diagram illustrating the principle of the bracket assembly 420 paired with the lifting guide module 700. (See attached diagram.) Figure 8A As shown, each inclined slide 740 includes an inlet 741 and an inclined channel area 742. The inlet 741 is located on the top surface 731 of the corresponding limiting seat 730, allowing the sliding block 422 to enter the corresponding inclined slide 740. The inclined channel area 742 connects to the inlet 741 and gradually tilts downwards and towards the second side 713 from the top surface 731 of the limiting seat 730, thereby guiding the entire support assembly 420 to move vertically up and down.

[0092] Thus, as Figure 8A and Figure 8B As shown, when the user pulls the moving frame 710 in the direction facing the first side 712 of the moving frame 710 (e.g., the first direction D1) via the handle structure 720, the limiting seats 730 of the lifting guide module 700 can move laterally in the first direction D1 along with the moving frame 710. Thus, the sliding block 422 in the inclined slide groove 740 is guided by the inclined channel area 742, causing the entire support assembly 420 to move vertically downwards along the Z-axis. This allows each second adapter unit 532 of the second connector module 500 to vertically insert into the corresponding first adapter unit 322 (e.g., ...). Figure 7B(State of being). Conversely, when the user pushes the moving frame 710 in the direction facing the second side 713 of the moving frame 710 (such as the second direction D2) through the handle structure 720, the entire support assembly 420 will move vertically upward along the Z-axis, thereby causing each second adapter unit 532 of the second connector module 500 to rise vertically and disengage from the corresponding first adapter unit 322.

[0093] Thus, through the above architecture, the semiconductor component testing device and its carrier board assembly of this utility model can reduce the probability of poor connection performance between the first connector module and the second connector module, thereby improving the accuracy of the test results of the device under test.

[0094] Finally, the embodiments disclosed above are not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention, and all such modifications and refinements will be protected under the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A semiconductor device testing apparatus, characterized in that, include: One machine; An electronic module is located inside the machine. A first connector module, fixed to the machine base, having a first connection interface electrically connected to the electronic module; and A carrier board assembly, comprising: A support frame, which can be raised and lowered on the machine platform, is used to support a circuit board to be tested; A second connector module is located between the bracket assembly and the first connector module, fixed to one side of the bracket assembly and vertically aligned with the first connector module. The second connector module has a second connection interface, which is electrically connected to the circuit board under test. as well as Multiple pre-compression elastic elements are symmetrically distributed between the support assembly and the second connector module, each of the multiple pre-compression elastic elements abutting against the support assembly and the second connector module respectively. When the second connector module descends with the bracket assembly to the first connector module and compresses the plurality of pre-compression elastic elements, the second connector module pushes the second connection interface into the first connection interface through the restoring elastic force of the plurality of pre-compression elastic elements.

2. The semiconductor device testing apparatus as described in claim 1, characterized in that, The second connector module further includes: A support plate includes a plate body and a plurality of through holes. The plate body is located between the bracket assembly and the first connector module, and the plurality of through holes are symmetrically distributed on the plate body. as well as Multiple fixing bolts pass through the multiple perforations and fix the plate to the side of the bracket assembly facing the second connector module, wherein there is a spatial gap between the plate and the bracket assembly.

3. The semiconductor device testing apparatus as described in claim 2, characterized in that, Each of the plurality of fixing bolts comprises: A column, slidably positioned within one of the plurality of through-holes, allows the plate to move relative to the column, wherein one end of the column is locked to the side of the bracket assembly facing the second connector module; and A head, integrally connected to the end of the column relative to the support assembly, located on the side of the bearing plate opposite the spatial interval, and the size of the head is larger than the size of one of the through holes; and Each of the plurality of pre-compression elastic elements includes a helical compression spring located within the spatial interval, and the two opposite ends of the helical compression spring elastically abut against the bracket assembly and the plate, respectively. The long axis of the helical compression spring is parallel to the long axis of the column and surrounds the column.

4. The semiconductor device testing apparatus as described in claim 2, characterized in that, The first connector module includes a base, and the first connection interface includes at least one first adapter bracket and at least one first adapter unit. The first adapter bracket is fixed to the base, and the first adapter unit is fixed to the first adapter bracket. as well as The carrier plate also includes at least one fixing groove formed on the plate body. The second connection interface includes at least one second adapter bracket and at least one second adapter unit. The second adapter bracket is fixed in the fixing groove, and the second adapter unit is fixed on the second adapter bracket and is pluggably connected to the first adapter unit.

5. The semiconductor device testing apparatus as described in claim 2, characterized in that, Also includes: A lifting guide module includes a movable frame, a handle structure, and multiple limiting seats. The movable frame is located between the support assembly and the first connector module and has a through slot that accommodates the support assembly. The handle structure is located on one side of the movable frame and is fixedly connected to the movable frame. The multiple limiting seats are located on two opposite sides of the movable frame and face each other. The inner surfaces of the multiple limiting seats facing each other are respectively provided with multiple inclined sliding grooves. The support assembly has multiple sliding blocks protruding from its two opposite outer sides, and these sliding blocks are slidably located within the multiple inclined grooves. When the moving frame and the limiting seat are pulled horizontally by the handle structure, the second connector module can be vertically raised and lowered along with the bracket assembly by the guidance of the multiple inclined slides.

6. The semiconductor device testing apparatus as described in claim 5, characterized in that, Each of the plurality of inclined slides comprises: An inlet is provided on the top surface of the corresponding limiting seat, allowing the sliding block to enter one of the plurality of inclined grooves; and An inclined channel area, connecting the entrance, gradually tilts from the top surface of the limiting seat toward the first connector module and away from the handle structure, to guide the bracket assembly to move vertically up and down.

7. A carrier assembly suitable for mounting on a semiconductor device testing apparatus, characterized in that, include: A support assembly is located above a first connection interface of a first connector module of the semiconductor component testing apparatus and is vertically movable within the semiconductor component testing apparatus to support a circuit board under test. A second connector module is fixed to one side of the bracket assembly. The second connector module has a second connection interface, which is electrically connected to the circuit board under test. as well as Multiple pre-compression elastic elements are symmetrically distributed between the support assembly and the second connector module, and each of the multiple pre-compression elastic elements is connected to the support assembly and the second connector module respectively. When the second connector module descends with the bracket assembly to the first connector module and compresses the plurality of pre-compression elastic elements, the second connector module pushes the second connection interface into the first connection interface through the restoring elastic force of the plurality of pre-compression elastic elements.

8. The carrier assembly as claimed in claim 7, characterized in that, The second connector module further includes: A support plate includes a plate body and a plurality of through holes. The plate body is located between the bracket assembly and the first connector module, and the plurality of through holes are symmetrically distributed on the plate body. as well as Multiple fixing bolts pass through the multiple perforations and fix the plate to the side of the bracket assembly facing the second connector module, so that there is a spatial gap between the plate and the bracket assembly.

9. The carrier plate assembly as claimed in claim 8, characterized in that, Each of the plurality of fixing bolts comprises: A column, slidably positioned within one of the plurality of through-holes, allows the plate to move relative to the column, wherein one end of the column is locked to the side of the bracket assembly facing the second connector module; and A head, integrally connected to the end of the column relative to the support assembly, located on the side of the bearing plate opposite the spatial interval, and the size of the head is larger than the size of one of the through holes; and Each of the plurality of pre-compression elastic elements includes a helical compression spring located within the spatial interval, and the two opposite ends of the helical compression spring elastically abut against the bracket assembly and the plate, respectively. The long axis of the helical compression spring is parallel to the long axis of the column and surrounds the column.

10. The carrier assembly as claimed in claim 8, characterized in that, The support plate further includes at least one fixing groove formed on the plate body; and The second connection interface includes at least one adapter bracket and at least one adapter unit, the adapter bracket being fixed in the fixing slot and the adapter unit being fixed on the adapter bracket.

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