Detection equipment suitable for multi-pin radio frequency chip

Abstract

The utility model relates to the technical field of chip detection, and discloses detection equipment suitable for a multi-pin radio frequency chip. The device comprises a pin pressing block and a microstrip plate. Comb teeth are arranged at the bottom of the pin pressing block; the comb teeth are in one-to-one correspondence with the pins of the to-be-tested chip in number, and the projection positions of the comb teeth on the horizontal plane are mutually matched; and the pin pressing block is arranged above the microstrip plate and can do linear motion along the vertical direction, so that each comb tooth independently presses the corresponding pin to enable the pin to be in close contact with the microstrip plate. According to the utility model, aiming at the distributed pins of the chip, a comb-tooth-shaped dispersion structure capable of pressing the pins downwards is adopted, and independent pressure is applied to each pin, so that the pressure can be uniformly distributed, the pins and the micro-strip plate are contacted more tightly, and the detection reliability is ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically a testing device suitable for multi-pin radio frequency chips. Background Technology

[0002] During the production of radio frequency chips, due to the complexity of the manufacturing process and the precision of the processing, some chips may not achieve the expected performance. In order to verify whether the performance of these chips is qualified, it is necessary to perform soldering tests on the chips.

[0003] like Figure 1 As shown, the currently used traditional RF chip testing equipment consists of a hinged, rotatable latch plate 4 on one side of the test stage 2 housing, with a rubber block 5 adhered to the inside of the latch plate 4. By rotating the latch plate 4 until it is locked to the other side of the test stage 2, the rubber block 5 is deformed upon contact with the chip under test, causing the chip's housing and pins to adhere to a preset position on the microstrip board 203. Then, an input signal is used for testing. This method of fixing has the following drawbacks: it not only cannot control the pressure applied to the chip, but also easily leads to uneven force on the chip's pins in contact with the microstrip board, resulting in poor contact and making it difficult to guarantee the reliability of the test. Utility Model Content

[0004] To address the technical problems existing in the prior art, this utility model provides a testing device suitable for multi-pin RF chips. This testing device uses a comb-shaped distributed structure that can press down on the distributed pins of the chip, applying independent pressure to each pin. This allows for uniform pressure distribution, resulting in tighter contact between the pins and the microstrip board, thus ensuring the reliability of the testing.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] This utility model discloses a testing device suitable for multi-pin radio frequency chips, including a pin clamping block and a microstrip board; the bottom of the pin clamping block is provided with comb teeth, the number of comb teeth corresponds one-to-one with the number of pins of the chip under test and their projection positions on the horizontal plane match each other; the pin clamping block is set above the microstrip board and can move linearly in the vertical direction, so that each comb tooth independently presses down on the corresponding pin to make the pin and the microstrip board in close contact.

[0007] As a further improvement to the above solution, the testing device also includes a lower pressure plate; the lower pressure plate is slidably mounted on a slide rail that is relatively fixed to the microstrip plate and extends in the vertical direction, and the lower pressure plate achieves linear movement on the slide rail by being driven by a linear drive device, and the pin pressure block is fixedly mounted on the bottom of the lower pressure plate.

[0008] As a further improvement to the above solution, the top of the pressure plate is slidably connected to a first guide post driven by the linear drive device, and a first elastic element is provided between the end of the pressure plate and the first guide post to provide elastic support force when the comb teeth press down on the pin.

[0009] As a further improvement to the above solution, the linear drive device includes an elbow clamp and a support base; the support base is fixed relative to the microstrip plate; the elbow clamp is fixedly installed on the support base, the telescopic end of the elbow clamp is arranged perpendicular to the base plate, and the telescopic end is coaxially fixedly connected to the first guide post.

[0010] As a further improvement to the above solution, a screw is coaxially threaded to the bottom of the first guide post; the screw penetrates the through hole in the lower pressure plate, and the lower surface of the lower pressure plate abuts against the tightened end of the screw.

[0011] As a further improvement to the above solution, the testing device also includes a housing pressure block mounted on the lower pressure plate; the bottom of the housing pressure block is provided with a protrusion, which matches the contour projection of the housing of the chip under test on the horizontal plane, so as to press down the housing with the linear movement of the lower pressure plate.

[0012] As a further improvement to the above solution, multiple second guide posts are fixedly connected to both sides of the lower pressure plate, and the housing pressure block is simultaneously slidably connected to the multiple second guide posts. A second elastic element is provided between the housing pressure block and the end of each second guide post to provide elastic support force when the protrusion presses down on the housing.

[0013] As a further improvement to the above solution, the testing equipment also includes a main frame; the main frame includes a base plate, a support plate, a back plate, a shaft fixing plate, an optical axis, and rubber pads; the base plate is arranged horizontally, and multiple rubber pads are provided and evenly distributed on the lower surface of the base plate; the back plate is vertically fixedly installed on the upper surface of the base plate; the support plate is fixedly connected to one side of the back plate to reinforce it with the base plate, and the shaft fixing plate is fixed to the other side of the back plate; the optical axis is fixedly installed between the base plate and the shaft fixing plate, and two optical axes are arranged in parallel to form the slide rail; the lower pressure plate is slidably connected to the optical axis through a linear bearing.

[0014] As a further improvement to the above solution, the testing equipment also includes a test platform; the test platform includes a housing, a connector, and a limiting plate; the housing is fixedly mounted on a base plate; the microstrip board is fixedly mounted on the housing; the connector is mounted on both sides of the housing and soldered to the microstrip board; the limiting plate is fixedly mounted on the microstrip board, and the limiting plate has a limiting groove for embedding the chip under test.

[0015] As a further improvement to the above solution, windows are provided in the middle of both the pin clamping block and the housing clamping block.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. This utility model targets the distributed pins of a chip, employing a comb-shaped distributed structure capable of pressing down on the pins, applying independent pressure to each pin, which can make the pressure evenly distributed, allowing the pins to make closer contact with the microstrip board, and ensuring the reliability of the detection.

[0018] 2. The pin clamping block of this utility model acts on the pins of the chip, and the housing clamping block acts on the housing of the chip. By setting both the pin clamping block and the housing clamping block on the guide post with elastic element, when they come into contact with their respective objects, the elastic element can provide appropriate downward pressure, and the chip will not be damaged due to excessive pressure.

[0019] 3. This utility model can be used for different chips. Only the pressure block and elastic element need to be replaced to make the testing equipment universal, which reduces the processing cost of the equipment. Attached Figure Description

[0020] Figure 1 This is a simplified diagram illustrating the traditional technique of using a clip plate and a rubber block to press the chip under test.

[0021] Figure 2 This is a three-dimensional structural diagram of a detection device suitable for multi-pin radio frequency chips according to a preferred embodiment of the present invention.

[0022] Figure 3 for Figure 2 Three-dimensional structural diagram of the main framework.

[0023] Figure 4 for Figure 2 A three-dimensional structural diagram of the test bench.

[0024] Figure 5 for Figure 2 A three-dimensional structural diagram of the linear drive unit in conjunction with components such as the lower pressure plate.

[0025] Figure 6 for Figure 5 A three-dimensional structural diagram of the components such as the middle and lower pressure plates, pressure block assembly, and first guide post when they are in combination.

[0026] Figure 7 for Figure 5 Exploded view of the middle and lower pressure plates and pressure block assembly

[0027] Figure 8 for Figure 5 A three-dimensional structural diagram of the middle and lower pressure plates and the first guide post from another perspective.

[0028] Figure 9 for Figure 6 A three-dimensional structural diagram of the middle pin pressure block.

[0029] Figure 10 for Figure 9 A three-dimensional structural diagram of the pin clamping block from another perspective.

[0030] Figure 11 for Figure 6 Three-dimensional structural diagram of the middle shell pressure block.

[0031] In the diagram: 1. Main frame; 101. Base plate; 102. Support plate; 103. Back plate; 104. Shaft fixing plate; 105. Optical axis; 106. Rubber pad; 2. Test platform; 201. Box body; 202. Connector; 203. Microstrip board; 204. Limiting plate; 3. Linear drive device; 301. Elbow clamp; 302. Support seat; 303. Lower pressure plate; 3031. Double fork arm; 300. Pressure block assembly; 304. Pin pressure block; 3040. Comb teeth; 305. Housing pressure block; 3050. Protrusion; 306. Linear bearing; 3071. First guide post; 3072. Second guide post; 308. First elastic element; 309. Second elastic element; 4. Buckle plate; 5. Rubber block. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 2 to 8 This embodiment provides a testing device suitable for multi-pin RF chips, which mainly includes a main frame 1, a test bench 2, a linear drive device 3, and a cover device.

[0034] Specifically, the pressure capping device includes a lower pressure plate 303 and a pressure block assembly 300; the lower pressure plate 303 is provided with a double fork arm 3031; the middle part of the pressure block assembly 300 is a pressing end, which is adapted to a chip of a specific specification; the two ends of the pressure block assembly 300 are assembly ends, which can be detachably assembled with the double fork arm 3031, and during assembly, the pressing end presses the shell and pins of the chip under test by the pressing action of the lower pressure plate 303.

[0035] The top of the test bench 2 is a microstrip board 203 on which the chip to be tested is placed; the pressure capping device is installed on the pressure plate 303 located above the microstrip board 203; the linear drive device 3 is used to drive the pressure plate 303 to perform the pressing action.

[0036] The main frame 1 may include a base plate 101, a support plate 102, a back plate 103, a shaft fixing plate 104, an optical axis 105, and rubber pads 106. The base plate 101 is arranged horizontally, and multiple rubber pads 106 are provided and evenly distributed on the lower surface of the base plate 101 to provide a stable plane. The back plate 103 is vertically fixed to the upper surface of the base plate 101 by screws; the support plate 102 is fixedly connected to one side of the back plate 103 to reinforce it with the base plate 101, and the shaft fixing plate 104 is fixed to the other side of the back plate 103; the optical axis 105 is fixedly installed between the base plate 101 and the shaft fixing plate 104, and two optical axes 105 are arranged in parallel to form a slide rail.

[0037] The test station 2 may include a housing 201, a connector 202, a microstrip board 203, and a limiting plate 204. The housing 201 is fixedly mounted on the base plate 101. The microstrip board 203 is fixedly mounted on the housing 201. The connector 202 is mounted on both sides of the housing 201 and soldered to the microstrip board 203. The connector 202 has two sets, namely input (in) and output (out). The limiting plate 204 is fixedly mounted on the microstrip board 203, and the limiting plate 204 has a limiting slot for embedding the chip under test. In some embodiments, the limiting slot may adopt a redundant design, that is, it is compatible with chips of various specifications. It is mainly used to provide a basic limit for the chip on the horizontal plane so that the pressure cap device above can accurately position the chip.

[0038] One side of the lower pressure plate 303 is fixed to the linear bearing 306 by a retaining ring, and the lower pressure plate 303 can be slidably connected to the optical axis 105 through the linear bearing 306. A horizontal double fork arm 3031 is provided on the side of the lower pressure plate 303 away from the two optical axes 105. The double fork arm 3031 is composed of two parallel columnar arms. The pressing end of the pressure block assembly 3 is provided in the rectangular area between the two columnar arms. The projection range of the pressing end on the horizontal plane is smaller than the projection range of the rectangular area.

[0039] The linear drive device 3 is used to drive the lower pressure plate 303 to slide on the slide rail. In this embodiment, the linear drive device 3 includes an elbow clamp 301 and a support base 302; the support base 302 is fixed relative to the microstrip plate 203. In this embodiment, the support base 302 can be fixedly connected to the side of the back plate 103 near the optical axis 105 by bolts; the elbow clamp 301 is fixedly installed on the support base 302 by bolts, and the telescopic end of the elbow clamp 301 is arranged perpendicular to the base plate 101, and the telescopic end is coaxially fixedly connected to the first guide post 3071.

[0040] The elbow clamp 301 can be manually operated by the operator. By rotating the hinged handle, the first guide post 3071 is driven to move linearly through a transmission relationship. The elbow clamp 301 can be a readily available type, and its principle will not be elaborated here. Of course, in other embodiments, the elbow clamp 301 can be replaced with other manual or electric power sources, such as a lead screw and slider mechanism, a cylinder, or a linear motor, as long as it can drive the first guide post 3071 to move linearly and provide a certain self-locking function.

[0041] Please combine Figures 9 to 11 Both the pin clamping block 304 and the housing clamping block 305 are straight plate structures, and both ends are provided with integrally connected wing-shaped folding plates as their respective assembly ends. The bottom of the lower clamping plate 303 is fixedly assembled with the pin clamping block 304, while the top is slidably assembled with the housing clamping block 305. In this embodiment, the pin clamping block 304 and the housing clamping block 305 are arranged overlappingly but do not interfere with each other. The pin clamping block 304 is used to press the pins of the chip under test, and the housing clamping block 305 is used to press the housing of the chip under test.

[0042] The pin clamping block 304 has two rows of comb teeth 3040 at its bottom. Each comb tooth 3040 corresponds one-to-one with the number of pins on the chip under test (DUT), and their projection positions on the horizontal plane are matched. The pin clamping block 304 is located above the microstrip board 203 and can be driven by the linear drive device 3 to move linearly along the vertical direction, allowing each comb tooth 3040 to independently press down on its corresponding pin, ensuring tight contact between the pin and the microstrip board 203. Because each comb tooth 3040 can independently press on the pin of the DUT, the force on each pin is more uniform, resulting in tighter contact with the microstrip board 203 and preventing poor contact.

[0043] The first guide post 3071 is coaxially threaded with a screw at its bottom; the screw passes through a through hole in the lower pressure plate 303, and the lower surface of the lower pressure plate 303 abuts against the screw's tightened end. The lower pressure plate 303 is essentially "hung" on the screw, so the top of the lower pressure plate 303 and the first guide post 3071 are slidable, and a first elastic element 308 is provided between the lower pressure plate 303 and the end of the first guide post 3071 to provide elastic support when the comb teeth 3040 press down on the pin.

[0044] In this embodiment, the first elastic element 308 is a spring sleeved on the outside of the screw. When the comb teeth 3040 start to contact the pressing pin, the lower pressure plate 303 approaches the limit position. At this time, the first guide post 3071 can be pressed down further. The first elastic element 308 is deformed by the compression at the end of the first guide post 3071, providing a reaction force to the lower pressure plate 303, and providing appropriate downward pressure for the pin pressing block 304 on the lower pressure plate 303.

[0045] The bottom of the housing pressure block 305 is provided with a rectangular frame-shaped protrusion 3050. The protrusion 3050 matches the contour projection of the housing of the chip under test on the horizontal plane, so as to press down the housing with the linear movement of the lower pressure plate 303.

[0046] Two second guide posts 3072 are fixedly connected to both sides of the lower pressure plate 303. These second guide posts 3072 are inverted bolts, with their threaded ends passing through the housing pressure block 305 and fixed to the lower pressure plate 303. The housing pressure block 305 is slidably connected to multiple second guide posts 3072, and a second elastic element 309 is provided between the housing pressure block 305 and the end of each second guide post 3072 to provide elastic support when the protrusion 3050 presses down on the housing. The second elastic element 309 can also be a spring, sleeved on the outside of the corresponding second guide post 3072.

[0047] In this embodiment, when the protrusion 3050 of the housing pressure block 305 contacts the housing of the chip under test, the housing pressure block 305 approaches its limit position and tends to stop. At this time, since there is still a compression space between the second guide post 3072 on the lower pressure plate 303 and the housing pressure block 305, the lower pressure plate 303 can also carry the second guide post 3072 downward a small distance. The second elastic member 309 is deformed by the end of the second guide post 3072, providing a reaction force to the housing pressure block 305, and providing appropriate downward pressure on the protrusion 3050 on the housing pressure block 305 for the pin.

[0048] It should be noted that both the first elastic element 308 and the second elastic element 309 can be replaced according to the different chip pressure resistance capabilities, thereby achieving compatibility with more chips and a wider range of applications. By selecting springs with different parameters based on the chip's pressure tolerance, the problem of uncontrollable chip pressure during testing is solved, avoiding the waste caused by damaging the chip due to excessive pressure.

[0049] When both the pin clamping block 304 and the housing clamping block 305 press down on their respective chip parts, the subsequent testing process can begin. The testing principle will not be elaborated here. Both the pin clamping block 304 and the housing clamping block 305 can be replaced according to the shape of different chips. This greatly saves the cost and processing time of re-manufacturing the testing equipment for each type of chip. Only a few parts need to be replaced to achieve universality.

[0050] In addition, both the pin clamping block 304 and the housing clamping block 305 have windows in the middle. Debugging personnel can use these windows to debug defective chips. Both the pin clamping block 304 and the housing clamping block 305 are made of insulating material, which will not interfere with the chip testing process.

[0051] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A testing device suitable for multi-pin radio frequency chips, characterized in that, It includes a pin clamping block (304) and a microstrip board (203); the bottom of the pin clamping block (304) is provided with comb teeth (3040), the number of comb teeth (3040) corresponds one-to-one with the number of pins of the chip under test and their projection positions on the horizontal plane are matched with each other; the pin clamping block (304) is set above the microstrip board (203) and can move linearly in the vertical direction, so that each comb tooth (3040) independently presses down on the corresponding pin so that the pin and the microstrip board (203) are in close contact.

2. The detection device for multi-pin RF chips according to claim 1, characterized in that, It also includes a lower pressure plate (303); the lower pressure plate (303) is slidably mounted on a slide rail that is relatively fixed to the microstrip plate (203) and extends in the vertical direction. The lower pressure plate (303) achieves linear movement on the slide rail by the drive of a linear drive device (3). The pin pressure block (304) is fixedly mounted on the bottom of the lower pressure plate (303).

3. The detection device for multi-pin RF chips according to claim 2, characterized in that, The top of the pressure plate (303) is slidably connected to a first guide post (3071) driven by the linear drive device (3), and a first elastic element (308) is provided between the end of the pressure plate (303) and the first guide post (3071) for providing elastic support force when the comb teeth (3040) press down on the pin.

4. The detection device for multi-pin RF chips according to claim 3, characterized in that, The linear drive device (3) includes an elbow clamp (301) and a support base (302); the support base (302) is fixed relative to the microstrip plate (203); the elbow clamp (301) is fixedly installed on the support base (302), the telescopic end of the elbow clamp (301) is arranged perpendicular to the base plate (101), and the telescopic end is coaxially fixedly connected to the first guide post (3071).

5. The detection device for multi-pin RF chips according to claim 4, characterized in that, A screw is coaxially threaded to the bottom of the first guide post (3071); the screw penetrates the through hole in the lower pressure plate (303), and the lower surface of the lower pressure plate (303) abuts against the tightened end of the screw.

6. A detection device suitable for multi-pin RF chips according to any one of claims 2 to 5, characterized in that, It also includes a housing pressure block (305) mounted on the lower pressure plate (303); the bottom of the housing pressure block (305) is provided with a protrusion (3050), the protrusion (3050) matches the contour projection of the housing of the chip under test on the horizontal plane, so as to press down the housing with the linear movement of the lower pressure plate (303).

7. A detection device for multi-pin RF chips according to claim 6, characterized in that, Multiple second guide posts (3072) are fixedly connected to both sides of the lower pressure plate (303). The housing pressure block (305) is slidably connected to the multiple second guide posts (3072). A second elastic element (309) is provided between the housing pressure block (305) and the end of each second guide post (3072) for providing elastic support force when the protrusion (3050) presses down on the housing.

8. A testing device for multi-pin RF chips according to claim 7, characterized in that, It also includes a main frame (1); the main frame (1) includes a base plate (101), a support plate (102), a back plate (103), a shaft fixing plate (104), an optical axis (105), and rubber pads (106); the base plate (101) is arranged in a horizontal direction, and multiple rubber pads (106) are provided and evenly distributed on the lower surface of the base plate (101); the back plate (103) is vertically fixedly installed on the upper surface of the base plate (101); the support plate (102) is fixedly connected to one side of the back plate (103) to achieve reinforcement with the base plate (101), and the shaft fixing plate (104) is fixed on the other side of the back plate (103); the optical axis (105) is fixedly installed between the base plate (101) and the shaft fixing plate (104), and two optical axes (105) are arranged in parallel to form the slide rail; the lower pressure plate (303) is slidably connected to the optical axis (105) through a linear bearing (306).

9. A detection device for multi-pin RF chips according to claim 8, characterized in that, It also includes a test bench (2); the test bench (2) includes a housing (201), a connector (202) and a limiting plate (204); the housing (201) is fixedly mounted on the base plate (101); the microstrip board (203) is fixedly mounted on the housing (201); the connector (202) is mounted on both sides of the housing (201) and welded to the microstrip board (203); the limiting plate (204) is fixedly mounted on the microstrip board (203), and the limiting plate (204) has a limiting groove for embedding the chip under test.

10. A detection device for multi-pin RF chips according to claim 6, characterized in that, Both the pin clamping block (304) and the housing clamping block (305) have windows in the middle.

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