Radio frequency chip gland device and detection equipment thereof

Abstract

The utility model relates to the technical field of chip detection, and discloses a radio frequency chip gland device and detection equipment thereof. The radio frequency chip gland device comprises a lower pressing plate and a replaceable pressing block assembly. Double fork arms are arranged on the lower pressing plate, and a rectangular opening formed by the double fork arms is located right above the chip to be tested; the middle part of the pressing block assembly is a crimping end, and the crimping end is matched with a chip of a specific specification. The two ends of the pressing block assembly are assembling ends, the assembling ends can be detachably assembled with the double fork arms, and the shell and the pins of the to-be-tested chip are pressed and covered by the crimping ends through the downward pressing action of the downward pressing plate in the assembling process. According to the radio frequency chip testing device, only different pressing block assemblies need to be replaced on the hollow double fork arms of the lower pressing plate, updating of the testing device for different radio frequency chips can be completed, universal detachable assembling of each pressing block assembly and the lower pressing plate can be achieved, other inherent devices of the testing device do not need to be changed, and the machining cost of the device is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, specifically to an RF chip capping device and its testing equipment. Background Technology

[0002] During the production of radio frequency chips, due to the complexity of the manufacturing process and the precision of the processing, some chips may not achieve the expected performance. In order to verify whether the performance of these chips is qualified, it is necessary to perform soldering tests on the chips.

[0003] like Figure 1 As shown, the currently used traditional RF chip testing equipment consists of a hinged, flip-up latch plate 4 on one side of the test bench 2 housing, with a rubber block 5 adhered to the inside of the latch plate 4. By rotating the latch plate 4 until it is locked to the other side of the test bench 2, the rubber block 5 is compressed and deformed when it comes into contact with the chip under test, causing the chip's housing and pins to fit into a preset position on the microstrip board 203, and then detection is performed using an input signal. Although this method can provide a certain degree of fixation, it requires re-manufacturing the testing equipment for different chip models. The dimensions and installation positions of the latch plate and rubber block need to be redesigned, and even the slots on the test bench may need to be modified. The large number of replacement parts increases processing costs, which urgently needs to be addressed. Utility Model Content

[0004] To address the high processing costs inherent in existing RF chip testing technologies, this application provides an RF chip capping device and its testing equipment.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] This application discloses an RF chip capping device, including a lower pressure plate and a replaceable pressure block assembly; the lower pressure plate is provided with double forks, and the rectangular opening formed by the double forks is located directly above the chip under test; the middle part of the pressure block assembly is a crimping end, which is adapted to a chip of a specific specification; the two ends of the pressure block assembly are assembly ends, which can be detachably assembled with the double forks, and during assembly, the lower pressure plate presses down to cover the shell and pins of the chip under test.

[0007] As a further improvement of this application, the clamping block assembly includes a pin clamping block and a housing clamping block mounted on the double fork arm. The housing clamping block and the pin clamping block are separate structures and act on the pins and housing of the chip under test, respectively.

[0008] As a further improvement of this application, both the pin clamping block and the housing clamping block have windows in the middle for observing the chip under test; the bottom of the housing clamping block has a rectangular frame-shaped protrusion that extends into the window of the pin clamping block and acts on the housing of the chip under test; the bottom of the pin clamping block has two rows of comb teeth symmetrically arranged, each comb tooth acting on one of the pins of the chip under test.

[0009] As a further improvement of this application, the double fork arms are horizontally arranged, and the projection range of the rectangular opening formed by the double fork arms on the horizontal plane is greater than the projection range of the crimping end on the horizontal plane.

[0010] As a further improvement of this application, both the pin clamping block and the housing clamping block are straight plate structures, and both ends are provided with integrally connected wing-shaped folding plates as their respective assembly ends. During assembly, a sunken pressing end structure is formed at the rectangular opening, that is, the height of the pressing end is lower than that of the double fork arm.

[0011] As a further improvement of this application, the wing-shaped baffles of both the pin clamp and the housing clamp are detachably assembled with the double fork arm by bolts.

[0012] As a further improvement to this application, both the pin clamp and the housing clamp are made of insulating material.

[0013] This application also discloses an RF chip testing device, including a test stage, a linear drive device, and the aforementioned cover device; the top of the test stage is a microstrip board on which the chip under test is placed; the cover device is mounted on a lower pressure plate located above the microstrip board; the linear drive device is used to drive the lower pressure plate to perform a pressing action, so that the cover device covers the housing and pins of the chip under test to make close contact with the microstrip board.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This application only requires replacing different pressure block components on the hollow double fork arm of the lower pressure plate to complete the update of the test equipment for different RF chips. Each pressure block component can be universally and detachably assembled with the double fork arm structure of the lower pressure plate without modifying other inherent components of the test equipment, thus reducing the processing cost of the equipment. The double fork arm structure can ensure that the crimping end remains centered and is not obstructed, which facilitates the operation and observation of the chip under test.

[0016] 2. This application employs a separate design for the pressure block assembly, with separate pressure caps applied to the chip's housing and pins. For the central housing of the chip, a frame-shaped protrusion structure is used to apply uniform and stable pressure around the housing. For the distributed pins of the chip, a comb-like, dispersed structure is used to press down on the pins, ensuring that pressure is applied evenly to each pin and that each pin makes closer contact with the microstrip board, thus improving the reliability of the detection.

[0017] 3. This application achieves detachable assembly of the pressure block assembly and the lower pressure plate by using screws, which is more convenient to replace than the traditional method of bonding rubber blocks and disassembling hinges; by designing wing-shaped folding plates at both ends of the pressure block, the recessed structure formed at the rectangular opening during assembly keeps the height of the pressing end lower than the double fork arm, ensuring that the double fork arm will not interfere with the microstrip plate and test stage below. Attached Figure Description

[0018] Figure 1 This is a simplified diagram illustrating the traditional technique of using a clip plate and a rubber block to press the chip under test.

[0019] Figure 2 This is a three-dimensional structural diagram of a detection device suitable for multi-pin radio frequency chips according to a preferred embodiment of the present invention.

[0020] Figure 3 for Figure 2 Three-dimensional structural diagram of the main framework.

[0021] Figure 4 for Figure 2 A three-dimensional structural diagram of the test bench.

[0022] Figure 5 for Figure 2 A three-dimensional structural diagram of the linear drive unit in conjunction with components such as the lower pressure plate.

[0023] Figure 6 for Figure 5 A three-dimensional structural diagram of the components such as the middle and lower pressure plates, pressure block assembly, and first guide post when they are in combination.

[0024] Figure 7 for Figure 5 Exploded view of the middle and lower pressure plates and pressure block assembly

[0025] Figure 8 for Figure 5 A three-dimensional structural diagram of the middle and lower pressure plates and the first guide post from another perspective.

[0026] Figure 9 for Figure 6 A three-dimensional structural diagram of the middle pin pressure block.

[0027] Figure 10 for Figure 9 A three-dimensional structural diagram of the pin clamping block from another perspective.

[0028] Figure 11 for Figure 6 Three-dimensional structural diagram of the middle shell pressure block.

[0029] In the diagram: 1. Main frame; 101. Base plate; 102. Support plate; 103. Back plate; 104. Shaft fixing plate; 105. Optical axis; 106. Rubber pad; 2. Test platform; 201. Box body; 202. Connector; 203. Microstrip board; 204. Limiting plate; 3. Linear drive device; 301. Elbow clamp; 302. Support seat; 303. Lower pressure plate; 3031. Double fork arm; 300. Pressure block assembly; 304. Pin pressure block; 3040. Comb teeth; 305. Housing pressure block; 3050. Protrusion; 306. Linear bearing; 3071. First guide post; 3072. Second guide post; 308. First elastic element; 309. Second elastic element; 4. Buckle plate; 5. Rubber block. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please see Figures 2 to 8 This embodiment provides a testing device suitable for multi-pin RF chips, which mainly includes a main frame 1, a test bench 2, a linear drive device 3, and a cover device.

[0032] Specifically, the pressure capping device includes a lower pressure plate 303 and a replaceable pressure block assembly 300; the lower pressure plate 303 is provided with double forks 3031, and the rectangular opening formed by the double forks 3031 is located directly above the chip under test; the middle part of the pressure block assembly 300 is a pressing end, which is adapted to a chip of a specific specification; the two ends of the pressure block assembly 300 are assembly ends, which can be detachably assembled with the double forks 3031, and during assembly, the pressing end presses the shell and pins of the chip under test by the pressing action of the lower pressure plate 303.

[0033] The top of the test bench 2 is a microstrip board 203 on which the chip to be tested is placed; the pressure cap device is installed on the pressure plate 303 located above the microstrip board 203; the linear drive device 3 is used to drive the pressure plate 303 to perform the pressing action.

[0034] The main frame 1 may include a base plate 101, a support plate 102, a back plate 103, a shaft fixing plate 104, an optical axis 105, and rubber pads 106. The base plate 101 is arranged horizontally, and multiple rubber pads 106 are provided and evenly distributed on the lower surface of the base plate 101 to provide a stable plane. The back plate 103 is vertically fixed to the upper surface of the base plate 101 by screws; the support plate 102 is fixedly connected to one side of the back plate 103 to reinforce it with the base plate 101, and the shaft fixing plate 104 is fixed to the other side of the back plate 103; the optical axis 105 is fixedly installed between the base plate 101 and the shaft fixing plate 104, and two optical axes 105 are arranged in parallel to form a slide rail.

[0035] The test station 2 may include a housing 201, a connector 202, a microstrip board 203, and a limiting plate 204. The housing 201 is fixedly mounted on the base plate 101. The microstrip board 203 is fixedly mounted on the housing 201. The connector 202 is mounted on both sides of the housing 201 and soldered to the microstrip board 203. The connector 202 has two sets, namely input (in) and output (out). The limiting plate 204 is fixedly mounted on the microstrip board 203, and the limiting plate 204 has a limiting slot for embedding the chip under test. In some embodiments, the limiting slot may adopt a redundant design, that is, it is compatible with chips of various specifications. It is mainly used to provide a basic limit for the chip on the horizontal plane so that the pressure cap device above can accurately position the chip.

[0036] One side of the lower pressure plate 303 is fixed to the linear bearing 306 by a retaining ring, and the lower pressure plate 303 can be slidably connected to the optical axis 105 through the linear bearing 306. A horizontal double fork arm 3031 is provided on the side of the lower pressure plate 303 away from the two optical axes 105. The double fork arm 3031 is composed of two parallel columnar arms. The pressing end of the pressure block assembly 3 is provided in the rectangular opening between the two columnar arms. The projection range of the pressing end on the horizontal plane is smaller than the projection range of the rectangular opening.

[0037] The linear drive device 3 is used to drive the lower pressure plate 303 to slide on the slide rail. In this embodiment, the linear drive device 3 includes an elbow clamp 301 and a support base 302; the support base 302 is fixed relative to the microstrip plate 203. In this embodiment, the support base 302 can be fixedly connected to the side of the back plate 103 near the optical axis 105 by bolts; the elbow clamp 301 is fixedly installed on the support base 302 by bolts, and the telescopic end of the elbow clamp 301 is arranged perpendicular to the base plate 101, and the telescopic end is coaxially fixedly connected to the first guide post 3071.

[0038] The elbow clamp 301 can be manually operated by the operator. By rotating the hinged handle, the first guide post 3071 is driven to move linearly through a transmission relationship. The elbow clamp 301 can be a readily available type, and its principle will not be elaborated here. Of course, in other embodiments, the elbow clamp 301 can be replaced with other manual or electric power sources, such as a lead screw and slider mechanism, a cylinder, or a linear motor, as long as it can drive the first guide post 3071 to move linearly and provide a certain self-locking function.

[0039] Please combine Figures 9 to 11 Both the pin clamping block 304 and the housing clamping block 305 are straight plate structures, and both ends are provided with integrally connected wing-shaped folding plates as their respective assembly ends. During assembly, a recessed pressing end structure is formed at the rectangular opening, that is, the height of the pressing end is lower than that of the double fork arm 3031. The bottom of the lower pressure plate 303 is fixedly assembled with the pin clamping block 304, and the top is slidably assembled with the housing clamping block 305. In this embodiment, the pin clamping block 304 and the housing clamping block 305 are overlapped but do not interfere with each other. The pin clamping block 304 is used to press the pins of the chip under test, and the housing clamping block 305 is used to press the housing of the chip under test.

[0040] The pin clamping block 304 has two rows of comb teeth 3040 at its bottom. Each comb tooth 3040 corresponds one-to-one with the number of pins on the chip under test (DUT), and their projection positions on the horizontal plane are matched. The pin clamping block 304 is located above the microstrip board 203 and can be driven by the linear drive device 3 to move linearly along the vertical direction, allowing each comb tooth 3040 to independently press down on its corresponding pin, ensuring tight contact between the pin and the microstrip board 203. Because each comb tooth 3040 can independently press on the pin of the DUT, the force on each pin is more uniform, resulting in tighter contact with the microstrip board 203 and preventing poor contact.

[0041] The first guide post 3071 is coaxially threaded with a screw at its bottom; the screw passes through a through hole in the lower pressure plate 303, and the lower surface of the lower pressure plate 303 abuts against the screw's tightened end. The lower pressure plate 303 is essentially "hung" on the screw, so the top of the lower pressure plate 303 and the first guide post 3071 are slidable, and a first elastic element 308 is provided between the lower pressure plate 303 and the end of the first guide post 3071 to provide elastic support when the comb teeth 3040 press down on the pin.

[0042] In this embodiment, the first elastic element 308 is a spring sleeved on the outside of the screw. When the comb teeth 3040 start to contact the pressing pin, the lower pressure plate 303 approaches the limit position. At this time, the first guide post 3071 can be pressed down further. The first elastic element 308 is deformed by the compression at the end of the first guide post 3071, providing a reaction force to the lower pressure plate 303, and providing appropriate downward pressure for the pin pressing block 304 on the lower pressure plate 303.

[0043] The bottom of the housing pressure block 305 is provided with a rectangular frame-shaped protrusion 3050. The protrusion 3050 matches the contour projection of the housing of the chip under test on the horizontal plane, so as to press down the housing with the linear movement of the lower pressure plate 303.

[0044] Two second guide posts 3072 are fixedly connected to both sides of the lower pressure plate 303. These second guide posts 3072 are inverted bolts, with their threaded ends passing through the housing pressure block 305 and fixed to the lower pressure plate 303. The housing pressure block 305 is slidably connected to multiple second guide posts 3072, and a second elastic element 309 is provided between the housing pressure block 305 and the end of each second guide post 3072 to provide elastic support when the protrusion 3050 presses down on the housing. The second elastic element 309 can also be a spring, sleeved on the outside of the corresponding second guide post 3072.

[0045] In this embodiment, when the protrusion 3050 of the housing pressure block 305 contacts the housing of the chip under test, the housing pressure block 305 approaches its limit position and tends to stop. At this time, since there is still a compression space between the second guide post 3072 on the lower pressure plate 303 and the housing pressure block 305, the lower pressure plate 303 can also carry the second guide post 3072 downward a small distance. The second elastic member 309 is deformed by the end of the second guide post 3072, providing a reaction force to the housing pressure block 305, and providing appropriate downward pressure on the protrusion 3050 on the housing pressure block 305 for the pin.

[0046] It should be noted that both the first elastic element 308 and the second elastic element 309 can be replaced according to the different chip pressure resistance capabilities, thereby achieving compatibility with more chips and a wider range of applications. By selecting springs with different parameters based on the chip's pressure tolerance, the problem of uncontrollable chip pressure during testing is solved, avoiding the waste caused by damaging the chip due to excessive pressure.

[0047] When both the pin clamping block 304 and the housing clamping block 305 press down on their respective chip parts, the subsequent testing process can begin. The testing principle will not be elaborated here. Both the pin clamping block 304 and the housing clamping block 305 can be replaced according to the shape of different chips. This greatly saves the cost and processing time of re-manufacturing the testing equipment for each type of chip. Only a few parts need to be replaced to achieve universality.

[0048] In addition, both the pin clamping block 304 and the housing clamping block 305 have windows in the middle. Debugging personnel can use these windows to debug defective chips. Both the pin clamping block 304 and the housing clamping block 305 are made of insulating material, which will not interfere with the chip testing process.

[0049] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A radio frequency chip capping device, characterized in that, Includes a lower pressure plate (303) and a replaceable pressure block assembly (300); the lower pressure plate (303) is provided with a double fork arm (3031), and the rectangular opening formed by the double fork arm (3031) is located directly above the chip under test; The middle part of the pressure block assembly (300) is the crimping end, which is adapted to a chip of a specific specification; the two ends of the pressure block assembly (300) are the assembly ends, which can be detachably assembled with the double fork arm (3031), and during assembly, the pressing action of the lower pressure plate (303) causes the crimping end located in the center of the rectangular opening to press and cover the shell and pins of the chip under test.

2. The radio frequency chip capping device according to claim 1, characterized in that, The clamping block assembly (300) includes a pin clamping block (304) and a housing clamping block (305) mounted on the double fork arm (3031). The housing clamping block (305) and the pin clamping block (304) are separate structures and act on the pins and housing of the chip under test, respectively.

3. The radio frequency chip capping device according to claim 2, characterized in that, Both the pin clamping block (304) and the housing clamping block (305) have windows in the middle for observing the chip under test; the bottom of the housing clamping block (305) is provided with a rectangular frame-shaped protrusion (3050), which extends into the window opened by the pin clamping block (304) and acts on the housing of the chip under test; the bottom of the pin clamping block (304) is symmetrically provided with two rows of comb teeth (3040), each comb tooth (3040) acts on one of the pins of the chip under test.

4. The radio frequency chip capping device according to claim 3, characterized in that, The double fork arm (3031) is horizontally arranged, and the projection range of the rectangular opening formed by the double fork arm (3031) on the horizontal plane is greater than the projection range of the crimping end on the horizontal plane.

5. A radio frequency chip capping device according to claim 2, 3, or 4, characterized in that, Both the pin clamping block (304) and the housing clamping block (305) are straight plate structures, and both ends are provided with integrally connected wing-shaped folding plates as their respective assembly ends. During assembly, a sunken pressing end structure is formed at the rectangular opening, that is, the height of the pressing end is lower than the double fork arm (3031).

6. The radio frequency chip capping device according to claim 5, characterized in that, The wing-shaped flaps of the pin clamp (304) and the housing clamp (305) are detachably assembled with the double fork arm (3031) by bolts.

7. The radio frequency chip capping device according to claim 5, characterized in that, Both the pin clamp (304) and the housing clamp (305) are made of insulating material.

8. A radio frequency chip testing device, characterized in that, The device includes a test bench (2), a linear drive device (3), and an RF chip capping device as described in claim 1. The top of the test bench (2) is a microstrip board (203) on which the chip under test is placed. The capping device is mounted on a lower pressure plate (303) located above the microstrip board (203). The linear drive device (3) is used to drive the lower pressure plate (303) to perform a pressing action, so that the capping device presses the housing and pins of the chip under test to make close contact with the microstrip board (203).

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