Circuit board testing device

Abstract

The utility model relates to the technical field of testing, and discloses a circuit board testing device, which comprises a base; the lifting structure is movably arranged on the base in the vertical direction; the lower module is detachably and fixedly arranged on the base, and the top of the lower module is used for positioning the position of a circuit board to be tested in the horizontal direction; the upper module is positioned above the lower module and is detachably and fixedly arranged on the lifting structure; at least one of the upper module and the lower module is fixedly provided with a probe; the upper module can be driven by the lifting structure to extrude the circuit board to be tested from top to bottom, and can be driven by the lifting structure to be separated from the circuit board to be tested from bottom to top. According to the utility model, the whole probe is replaced by replacing special parts so as to adapt to the test requirements of different circuit boards to be tested, the operation is simple and convenient, the cost of general parts can be saved, and the storage space and the storage management cost are reduced.

Description

Technical Field

[0001] This utility model relates to the field of testing technology, and in particular to a circuit board testing device. Background Technology

[0002] In the electronics manufacturing industry, circuit boards (PCBA, ordinary soldered circuit boards, etc.) are an indispensable component. They carry various electronic components and connect power, signal, and ground wires, thereby enabling the functions of electronic products.

[0003] During circuit board manufacturing, some faulty connections may exist. It's necessary to test the circuit's performance, such as power-on / off switching and the quality of electronic components, during the board fabrication process. Therefore, several test points are reserved in various local circuits of the circuit board. By checking the voltage or signal waveforms at these test points, the normal operation of that local circuit and electronic components can be confirmed. During the testing process, appropriate testing equipment needs to be designed to fix and test the circuit board.

[0004] However, since the appearance and structure of various circuit boards are different, the test point locations are also different. Therefore, usually one test rack can only test the corresponding model of circuit board. When there are multiple models of circuit boards, multiple test racks are needed to test them separately, which increases the production material and storage management costs.

[0005] Therefore, to reduce production material and storage management costs, a universal test fixture has emerged on the market, capable of testing various types of circuit boards. It works by creating mounting holes in a probe plate with probes for contacting the circuit board. The probes are fixed in these holes, and when testing different types of circuit boards, the probes are installed in different mounting holes, aligning them with pre-drilled test points on the circuit board. However, the probes are small, making them difficult to remove from their original positions when changing locations. Furthermore, some probe tips are quite sharp, easily scratching users during repositioning. The replacement process is overly complex, cumbersome, time-consuming, and labor-intensive. Summary of the Invention

[0006] This application provides a circuit board testing device that allows for the replacement of all probes by changing specialized components, thus adapting to the testing needs of different circuit boards under test, and is easy to operate.

[0007] This application provides a circuit board testing device. The technical solution adopted is as follows:

[0008] A circuit board testing device includes: a base; a lifting structure movably disposed on the base in a vertical direction; a lower module detachably fixed to the base, the top of the lower module being used to position the circuit board under test in a horizontal direction; an upper module located above the lower module and detachably fixed to the lifting structure; at least one of the upper module and the lower module is fixed with a probe; the upper module can press the circuit board under test from top to bottom under the action of the lifting structure, and can detach from the circuit board under test from bottom to top under the action of the lifting structure.

[0009] As can be seen from the above, the existing circuit board testing device is divided into two sets of components. One set consists of dedicated components, including an upper module and a lower module, which are specifically designed for different circuit boards under test (TBTs) to match the TBTs, especially in terms of the probe distribution and the test point distribution on the TBTs. The other set consists of general-purpose components, including a base and a lifting structure, which are designed with structures that match and connect with the dedicated components. Both the upper and lower modules, which are adapted to different TBTs, can be detached. When different TBTs need to be tested, only the upper and lower modules adapted to the TBTs need to be installed on the general-purpose components, without having to change the position of the probes one by one. Therefore, the operation required to match different TBTs is relatively simple. The upper module, driven by the lifting structure, presses the TBT placed on the lower module, which plays a positioning role for the TBT and ensures that the probes are connected to the test points on the TBT for subsequent testing. When it is necessary to remove the TBT, the lifting structure drives the upper module to detach from the TBT from the bottom up, and the TBT can be removed. Therefore, by using specialized and general-purpose components together, it is possible to test different circuit boards under test. In other words, a set of general-purpose components can be paired with multiple sets of specialized components that are compatible with different circuit boards under test. This helps to improve the utilization rate of general-purpose components, save costs, and also save storage space and storage management costs.

[0010] Furthermore, it also includes a test circuit; the lower module is fixedly provided with the probe; the lower module is fixedly provided with a first conductive connector, the first conductive connector being electrically connected to the probe fixedly provided on the lower module; the base is fixedly provided with a second conductive connector, the second conductive connector being electrically connected to the test circuit; the first conductive connector and the second conductive connector are detachably plugged into each other to detachably fix the lower module to the base and to electrically connect the test circuit to the probe fixedly provided on the lower module.

[0011] As can be seen from the above, the lower module is installed on the base through the detachable insertion and connection of the first conductive connector and the second conductive connector, which can complete the mechanical installation and positioning. It is simple and convenient to install and remove, saving time and effort. At the same time, the probe fixed on the lower module can complete the electrical connection with the test circuit through the insertion of the first conductive connector and the second conductive connector. It serves two purposes and simplifies the layout of the circuit and the setting of mechanical components.

[0012] Furthermore, the lower module includes a first adapter circuit board, the first conductive connector is located on the first adapter circuit board and is fixed to the lower module through the first adapter circuit board; the base includes a second adapter circuit board, the second conductive connector is located on the second adapter circuit board and is fixed to the base through the second adapter circuit board.

[0013] As can be seen from the above, setting up the first and second adapter circuit boards facilitates the installation of the first and second conductive connectors, while simultaneously achieving electrical and mechanical connections.

[0014] Furthermore, the test circuit is electrically connected to the second adapter circuit board via pin headers and sockets; and / or the probes fixed to the lower module are electrically connected to the first adapter circuit board via pin headers and sockets.

[0015] As can be seen from the above, using pin headers and sockets to achieve electrical connections between the testing device and probes simplifies the circuitry and makes the overall circuit layout more orderly, preventing it from appearing messy.

[0016] Furthermore, the base is box-shaped, and the test circuit is located in the cavity of the base.

[0017] As can be seen above, hiding the test circuit inside the box-shaped base makes the entire device more compact and simple, while also making it easier to access and store.

[0018] Furthermore, the first conductive connector and the second conductive connector are inserted and mated in the vertical direction.

[0019] Furthermore, the first conductive connector and the second conductive connector form a conductive connector assembly, the conductive connector assembly including at least one of a backplane connector, a strip connector, and a D-type connector.

[0020] As can be seen from the above, the conductive plug assembly composed of the first conductive plug and the second conductive plug directly uses the existing connector structure, reducing design costs.

[0021] Furthermore, the lower module includes a carrier plate for placing the circuit board under test. The top of the carrier plate has a positioning groove for accommodating the circuit board under test. The cross-sectional shape of the positioning groove is adapted to the shape of the circuit board under test. A probe fixed to the lower module is disposed on the carrier plate with its tip facing upward and protruding into the positioning groove. The tip of the probe is lower than the top of the groove wall of the positioning groove.

[0022] As can be seen from the above, the circuit board under test (TBD) can be submerged in the positioning groove, which helps to position the TBD horizontally, thus improving the accuracy of the TBD's horizontal positioning and ensuring that the probe and the test point of the TBD are aligned vertically. At the same time, with the probe located in the positioning groove, it is less likely to snag on external objects during storage or use, and external objects are less likely to damage the probe. Therefore, the positioning groove provides a certain degree of protection for the probe.

[0023] Furthermore, the upper module includes a pressure plate and a pressure bar fixedly connected to the pressure plate, and the pressure plate is detachably connected to the lifting structure; or the upper module only includes a pressure bar, and the pressure bar is detachably connected to the lifting structure.

[0024] As can be seen above, the pressure bar moves down under the action of the lifting structure to press the positioning plate to be tested, which plays a role in pressing and positioning the circuit board to be tested, so that the test points on it can make good contact with the probe. The arrangement of the pressure bar needs to be adapted to the circuit board to be tested. Therefore, after changing different circuit boards to be tested, the upper module also needs to be replaced at the same time to achieve a better positioning effect on the circuit board to be tested.

[0025] Furthermore, the detachable installation method includes at least one of plug-in, threaded connection, snap-fit, or magnetic attraction.

[0026] As can be seen from the above, the above-mentioned detachable installation method has a relatively simple structure, is easy to design, and is simple and convenient to operate, allowing for quick assembly and disassembly of modules.

[0027] Furthermore, the lifting structure includes a mounting plate for mounting the upper module, the thickness direction of the mounting plate being parallel to the vertical direction, and the upper module being located below the mounting plate.

[0028] Furthermore, the mounting plate has a hollowed-out center.

[0029] As can be seen above, the cutout on the mounting plate exposes the upper module, making it convenient for users to perform functional tests on the circuit board under test through the upper module. For example, button components can be installed on the upper module, and the button components are exposed through the cutout. Users can operate the button components to test the buttons on the circuit board under test, or directly press the buttons on the circuit board under test through the cutout.

[0030] Furthermore, the mounting plate is made of a transparent material.

[0031] As can be seen above, it is convenient to observe the test status of the circuit board under test during the test, such as whether the LEDs, digital tubes and other components on the circuit board under test are working properly.

[0032] Furthermore, a spring element is provided between the base and the lifting structure, the spring element being used to force the lifting structure to remain separated from the lower module when the lifting structure is in a free state.

[0033] As can be seen from the above, the elastic component protects the circuit board and / or probe under test. It prevents the lifting structure from causing the upper module to collide with the circuit board placed on the lower module or the probe fixed to the lower module under its own weight or external force. Therefore, it provides a certain degree of protection for the circuit board and probe. Simultaneously, unless the operator operates the device, the circuit board and probe will not come into contact, thus preventing the formation of a circuit loop and avoiding damage to the circuit board if power is applied unprepared.

[0034] Furthermore, the base has a downwardly recessed mounting groove, the bottom end of the lower module is recessed within the mounting groove, and the top end of the lower module protrudes outside the mounting groove.

[0035] As can be seen from the above, this installation of the lower module not only hides the bottom of the lower module, making the overall device more compact and simpler in appearance, but also makes it easier for staff to disassemble and assemble the lower module by holding the top of the lower module. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of an embodiment of the circuit board testing device of this utility model;

[0037] Figure 2 This is a partial structural schematic diagram of an embodiment of the circuit board testing device of this utility model, mainly used to illustrate the combination of the base and the lifting structure;

[0038] Figure 3 This is a partial structural diagram of an embodiment of the circuit board testing device of this utility model, mainly used to illustrate the combination of the upper module and the lower module;

[0039] Figure 4 for Figure 3 A structural diagram of the lower and middle modules;

[0040] Figure 5 This is a partial structural schematic diagram of an optional embodiment of the circuit board testing device of this utility model, mainly used to illustrate the combination of the upper module and the lower module.

[0041] The parts referred to by the numbers in the attached diagram are as follows: 1-base, 2-lower module, 3-upper module, 4-lifting structure, 5-test circuit, 6-circuit board under test, 7-first ribbon cable, 8-first pin header, 11-mounting slot, 12-second adapter circuit board, 13-second conductive connector, 14-protrusion, 15-box body, 16-cover plate, 18-mounting post, 21-probe, 22-carrier plate, 23-first adapter circuit board, 24-first conductive connector, 25-recess, 26-notch, 27-quick-lock screw, 31-pressure plate, 32-pressure rod, 33-protrusion, 34-button assembly, 35-extension post, 36-through hole, 41-mounting plate, 42-window, 51-handle operation assembly, 52-support plate, 53-guide post, 54-support post, 55-elastic element, 221-extension wall, 222-positioning slot. Detailed Implementation

[0042] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0043] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0045] Example

[0046] This application embodiment Figures 1 to 5 A unified spatial rectangular coordinate system (right-handed system) is adopted to represent the relative orientation relationship between the features. The Z-axis direction is the vertical direction, which is also the lifting direction of the upper module 3.

[0047] See Figures 1 to 2 The circuit board testing device includes a box-shaped base 1, a lower module 2 detachably fixed to the base 1, a lifting structure 4 movably disposed on the base 1 along the Z-axis, and an upper module 3 detachably fixed to the lifting structure 4.

[0048] Specifically, the base 1 has a housing 15 and a cover plate 16, which together form a cavity for accommodating the test circuit 5. One end of the cover plate 16 along the Y-axis is hinged to the housing 15. The cover plate 16 can be flipped by turning the hinge to allow for inspection and maintenance of the test circuit 5 placed inside the cavity. Alternatively, in other embodiments of this application, the base 1 may also be a frame structure.

[0049] See Figure 3 , Figure 4 The lower module 2, from top to bottom (along the negative Z-axis), includes a carrier plate 22 for placing the circuit board 6 under test, a first adapter circuit board 23 fastened to the negative Z-axis end of the carrier plate 22 by fastening screws, and a first conductive connector 24 fixed to the negative Z-axis end of the first adapter circuit board 23. A probe 21 is also fixed on the carrier plate 22. The distribution of the probes 21 corresponds to the test points on the circuit board 6 under test. The positive Z-axis end of the probe 21 is exposed on the positive Z-axis side of the carrier plate 22, and the negative Z-axis end extends to the negative Z-axis side of the carrier plate 22 and connects to one end of a first ribbon cable 7. The other end of the first ribbon cable 7 is connected to a first row of pins 8. The pins of the first row of pins 8 are inserted into the first adapter circuit board 23 and electrically connected to the first conductive connector 24 through the first adapter circuit board 23. The positive Z-axis end of the probe 21 is a needle tip. Unlike existing technologies that use a carrier plate specifically for placing the circuit board under test (PCB 6) and a pin plate specifically for mounting the probes 21, the carrier plate 22 in this application is used for both placing the PCB 6 and mounting the probes 21, resulting in a simpler and more compact structure. Furthermore, existing technologies mount the PCB 6 and probes 21 on different components (e.g., mounting the PCB 6 on the carrier plate and the probes 21 on the pin plate), which makes it difficult to guarantee the relative positional accuracy between the PCB 6 and probes 21 (the combination of the carrier plate and the pin plate can lead to the accumulation of processing errors, resulting in relatively large errors). In contrast, this application mounts both the PCB 6 and probes 21 on the carrier plate 22, thus ensuring the relative positional accuracy between the PCB 6 and probes 21.

[0050] The carrier plate 22 includes a plate body and an extension wall 221 (i.e., the groove wall of the positioning groove 222 described later) protruding along the positive Z-axis at the positive Z-axis end of the plate body. The extension wall 221 and the plate body form a positioning groove 222 for accommodating the circuit board 6 under test. The cross-sectional shape of the positioning groove 222 is adapted to the shape of the circuit board 6 under test. The extension wall 221 is integrally formed with the plate body. The positioning groove 222 plays a positioning role in the horizontal direction of the circuit board 6 under test, preventing the circuit board 6 under test from sliding during testing and affecting the contact between the probe 21 and the test point, thus affecting the test results. The probe 21, fixed on the carrier plate 22, has its tip pointing upwards and protruding into the positioning groove 222. The tip of the probe 21 is lower than the top of the groove wall of the positioning groove 222, that is, the tip of the probe 21 is lower than the top of the extension wall 221. The circuit board 6 under test can sink into the positioning groove 222 and be positioned in the horizontal direction.

[0051] In this embodiment, a test circuit 5 is fixedly installed inside the cavity of the base 1. The cover plate 16 has an opening communicating with the interior of the box body 15, so that the positive Z-axis end of the base 1 forms a mounting groove 11 recessed along the negative Z-axis. The negative Z-axis end of the cover plate 16 has multiple mounting posts 18 extending along the negative Z-axis, and each mounting post 18 is distributed around the opening. The second adapter circuit board 12 is fixed to the mounting posts 18 by screws. Each screw passes through the second adapter circuit board 12 from bottom to top and is threaded to the corresponding mounting post 18. A second conductive connector 13 is fixedly installed on the second adapter circuit board 12. The test circuit 5 is connected to one end of a second ribbon cable (not shown in the figure), and the other end of the second ribbon cable is connected to a second row of pins (not shown in the figure). The pins of the second row of pins are inserted into the second adapter circuit board 12 and are electrically connected to the second conductive connector 13 through the second adapter circuit board 12. The second adapter circuit board 12, the second conductive connector 13, the second ribbon cable, and the second row of pins are all hidden inside the base 1, that is, placed inside the box cavity, making the structure of the base 1 more compact and the appearance simpler. At the same time, it also protects the second adapter circuit board 12, the second row of pins, the second row of nuts, and the second conductive connector 13 on it, making it easier to store later, less likely to be damaged by external objects, and extending the service life of the device.

[0052] Alternatively, in other embodiments of this application, the test circuit 5 may not be installed on the base 1 or lifting structure 4, but may be set as an independent part outside the base 1, lifting structure 4, lower module 2, upper module 3, etc. The probe 21 of the lower module 2 can be connected to the test circuit 5 through pin headers and ribbon cables. More specifically, a third conductive connector can be provided on the lower module 2, and the probe 21 can be electrically connected to the third conductive connector. A fourth conductive connector can be provided on the test circuit 5, and the third conductive connector can be electrically connected to the fourth conductive connector through pin headers and ribbon cables to realize the electrical connection between the probe 21 and the test circuit 5.

[0053] In this embodiment, the first pin header 8 can be fixed to the first adapter circuit board 23 by means of soldering or the like, and similarly, the second pin header can be fixed to the second adapter circuit board 12 by means of soldering or the like.

[0054] In this application, when installing the lower module 2, the negative Z-axis end of the lower module 2 is submerged in the mounting slot 11 through the opening, while the positive Z-axis end of the lower module 2 protrudes out of the mounting slot 11. At this time, the first conductive connector 24 and the second conductive connector 13 are inserted and engaged, completing the installation of the lower module 2 on the base 1. The signal is transmitted sequentially between the test circuit 5, the second ribbon cable, the second pin header, the second adapter circuit board 12, the second conductive connector 13, the first conductive connector 24, the first adapter circuit board 23, the first pin header 8, the first ribbon cable 7, the probe 21, and the circuit board under test 6. When the lower module 2 needs to be replaced, simply hold the positive Z-axis end of the lower module 2 and lift it slightly to separate the first conductive connector 24 from the second conductive connector 13, thereby removing the lower module 2 from the mounting slot 11. The installation and removal of the lower module 2 is quick, simple, and convenient, saving time and effort.

[0055] The first conductive connector 24 and the second conductive connector 13 form a conductive connector assembly. In this embodiment, the first conductive connector 24 is a female connector, and the second conductive connector 13 is a simple horn connector. Alternatively, in other embodiments of this application, the conductive connector assembly can also be at least one of a backplane connector, a strip connector, and a D-type connector. All of the above connectors are existing connectors, and compatible ones can be purchased for installation according to design requirements, reducing production and mold costs.

[0056] To prevent incorrect installation of the lower module 2, a first anti-mistake structure is provided for the mating of the lower module 2 and the base 1. This first anti-mistake structure includes a protrusion 14 protruding along the Y-axis or X-axis and a recess 25 that mates with the protrusion 14. One edge of the lower module 2 and the wall of the mounting groove 11 have a protrusion 14, and the other has a recess 25. In this embodiment, the lower module 2 has a recess 25 on its positive Y-axis end, recessed along the negative Y-axis. The recess 25 is located at corresponding positions on the carrier plate 22 and the first adapter circuit board 23. The mounting groove 11 has a protrusion 14 on its wall along the positive Y-axis, corresponding to the recess 25, protruding along the negative Y-axis. When installing the lower module 2, first determine the direction of the recess 25, and then insert the lower module 2 into the mounting groove 11 in the direction that matches the protrusion 14.

[0057] In this embodiment of the application, in order to make the lines more compact, both the first cable 7 and the second cable are IDC cables. The IDC cables are very short and are relatively close to the interior of the lower module 2 and / or the upper module 3. There is relatively little movement and pulling, the connection method is simple and reliable, and it does not appear messy.

[0058] See Figure 1 , Figure 2 The lifting structure 4 includes a mounting plate 41 for mounting the upper module 3. The thickness direction of the mounting plate 41 is parallel to the Z-axis direction, and the upper module 3 is located at the negative Z-axis end of the mounting plate 41.

[0059] Specifically, the upper module 3 is positioned above the lower module 2 via a mounting plate 41. The upper module 3 includes a pressure plate 31 and a pressure rod 32 fixedly connected (e.g., locked with screws). The pressure plate 31 is detachably locked to the mounting plate 41 via quick-lock screws 27. The pressure rod 32, driven by the mounting plate 41, presses the circuit board 6 under test from top to bottom (along the negative Z-axis). The circuit board 6 under test can abut against the probe 21, ensuring good contact between the probe 21 and the test point on the circuit board 6, improving test accuracy, and preventing the circuit board 6 from moving and affecting the test. After the test is completed, when the tested circuit board needs to be removed, the pressure rod 32, driven by the mounting plate 41, can detach from the circuit board 6 from bottom to top (along the positive Z-axis). The pressure rod 32 can be a glue pillar, or an elastic layer can be provided at the lower end of the pressure rod 32 to protect the circuit board 6 under test and reduce the possibility of the pressure rod 32 damaging the circuit board 6. Alternatively, in other embodiments of this application, the mounting method of the pressure plate 31 and the mounting plate 41 can be at least one of plug-in, snap-fit, or magnetic attraction. When testing different circuit boards 6 under test, if it is necessary to replace the upper module 3 with a matching one, it is only necessary to remove the pressure plate 31 from the mounting plate 41 and install the matching pressure plate 31. Alternatively, in other embodiments of this application, in order to reduce the material cost and weight of the pressure plate 31, through holes 36 can be provided on the pressure plate 31, and the through holes 36 can cover the entire pressure plate 31.

[0060] Similarly, to avoid incorrect installation orientation of module 3, the pressure plate 31 and mounting plate 41 are fitted with a second anti-mistake structure. This second anti-mistake structure includes a protruding post 33 along the Z-axis and a recessed groove (not shown in the figure) along the Z-axis. One of the pressure plate 31 and mounting plate 41 has a protruding post 33, and the other has a groove. In this embodiment, the positive Z-axis end of the pressure plate 31 has a protruding post 33 integrally formed with the pressure plate 31, and the negative Z-axis end of the mounting plate 41 has a groove corresponding to the protruding post 33 along the positive Z-axis. When installing the pressure plate 31, first determine the position of the protruding post 33, then place the pressure plate 31 against the negative Z-axis end of the mounting plate 41. At this time, the protruding post 33 can be inserted into the groove, which also serves to position the pressure plate 31, allowing the user to accurately install the pressure plate 31 in one go. This ensures that the pressure bar 32 can properly abut against the corresponding position of the circuit board 6 under test, effectively preventing the pressure bar 32 from damaging the circuit board 6 under test.

[0061] Alternatively, in other embodiments of this application, the upper module 3 may only include pressure bars 32, which are detachably mounted to the mounting plate 41 by screws. This eliminates the cost of the pressure plate 31. Of course, the mounting method of the pressure bars 32 and the mounting plate 41 can also be at least one of plug-in, snap-fit, or magnetic attraction. The length of the pressure bars 32 is designed according to different circuit boards 6 under test. The main purpose of the pressure bars 32 is to press down on the circuit board 6 under test, positioning the circuit board 6 under test and ensuring good contact between the test points of the circuit board 6 under test and the probes 21. The number of pressure bars can be one, two, three, four, etc., and the number can be designed to be relatively small, so that disassembly and assembly can be relatively quick.

[0062] As can be seen from the above, in this embodiment, the existing circuit board testing device is divided into two sets of components. One set is a dedicated set of components, including an upper module 3 and a lower module 2, which are specifically designed for different circuit boards under test 6. The purpose is to match the circuit board under test 6, especially the distribution of probes 21 on it and the distribution of test points on the circuit board under test 6. The other set is a general set of components, including a base 1 and a lifting structure 4, which is designed with a structure that matches and connects with the dedicated set of components. Both the upper module 3 and the lower module 2, which are adapted to different circuit boards under test 6, can be detached. When different circuit boards under test 6 need to be tested, it is only necessary to install the upper module 3 and the lower module 2 adapted to the circuit board under test 6 on the general set of components, without having to change the position of the probes 21 one by one. Therefore, the operation required to match different circuit boards under test 6 is relatively simple. The upper module 3, driven by the lifting structure 4, presses the circuit board under test 6 placed on the lower module 2, which plays a positioning role for the circuit board under test 6 for subsequent testing. When it is necessary to remove the circuit board under test 6, the lifting structure 4 drives the upper module 3 to detach from the circuit board under test 6 from bottom to top, and the circuit board under test 6 can be removed. Therefore, by using dedicated components and general-purpose components together, the purpose of testing different circuit boards under test 6 can be achieved. In other words, a set of general-purpose components can be matched with multiple sets of dedicated components that are compatible with different circuit boards under test 6, which is conducive to improving the utilization rate of general-purpose components, saving costs, and also saving storage space and storage management costs.

[0063] More specifically, the lower template is mechanically connected to the base 1 via the first conductive connector 24 and the second conductive connector 13. The probe 21 on the lower template is electrically connected to the test circuit 5 via the first ribbon cable 7, the first pin header 8, the first adapter circuit board 23, the first conductive connector 24, the second conductive connector 13, the second ribbon cable, the second pin header, and the second adapter circuit board 12. Mechanically, the lower module 2 can be disassembled and assembled very quickly and easily. The detachable installation method of the upper module 3 and the mounting plate 41 can also be designed to make the disassembly and assembly of the upper module 3 very quick and convenient, such as the method described in the embodiments of this application.

[0064] Alternatively, in other embodiments of this application, see [link to other embodiments]. Figure 5 Some circuit boards under test (PCBs) 6 require pressing buttons during testing to check performance parameters. Therefore, the mounting plate 41 is designed with a hollowed-out section in the middle. Specifically, the mounting plate 41 has a window 42 extending through it along the Z-axis, allowing users to easily operate the buttons on the PCBs under test 6. For example, a button assembly 34 for controlling the buttons on the PCBs under test 6 is provided on the pressure plate 31 that is compatible with the pressure plate 31. The button assembly 34 on the pressure plate 31 is exposed, allowing users to easily press it to operate the buttons on the PCBs under test 6. An extension post 35 extends along the negative Z-axis from the pressure plate 31, corresponding to the button assembly 34, for contacting the buttons on the PCBs under test 6. To protect the buttons on the PCBs under test 6, the end of the extension post 35 has an elastic layer. Alternatively, users can directly operate the buttons on the PCBs under test 6 through the hollowed-out section of the mounting plate 41. For example, users can use their fingers or a pressing stick to press the buttons on the PCBs under test 6 directly through the hollowed-out section of the mounting plate 41.

[0065] In order to facilitate the observation of the test status of the circuit board under test 6 during testing, such as whether the LED lights, digital tubes, etc. on the circuit board under test 6 are working properly, the mounting plate 41 is made of transparent material, such as PC plastic (polycarbonate), glass, acrylic, ABS plastic, PVC plastic, PET plastic and other light-transmitting materials.

[0066] In the embodiments of this application, see Figure 1The mounting plate 41 is mounted on the base 1 via a lifting assembly. The lifting assembly includes a support column 54 fixed to the negative Y-axis side of the base 1, a support plate 52 fixed to the positive Y-axis end of the support column 54, a handle operating assembly 51 fixed to the support plate 52, and a guide column 53 fixed to the base 1. The handle operating assembly 51 can drive the mounting plate 41 to move along the Z-axis, thereby driving the pressure bar 32 to press down or detach from the circuit board 6 under test. A spring element 55 is sleeved on the guide post 53. One end of the spring element 55 abuts against the positive Z-axis end of the base 1, and the other end abuts against the negative Z-axis end of the mounting plate 41. The spring element 55 is used to force the mounting plate 41 to remain separated from the carrier plate 22 of the lower module 2 when the mounting plate 41 is in a free state. The elastic force of the spring element 55 is greater than the weight of the mounting plate 41, the upper module 3, and the handle operation component 51, which can prevent the mounting plate 41 from falling freely under its own weight and hitting the circuit board under test 6, thus damaging the circuit board under test 6, due to errors when operating the handle operation component 51. At the same time, it can also prevent operator error or accidental contact of corresponding components. As long as the operator does not operate the device, the circuit board under test 6 and the probe 21 will not come into contact, and a circuit loop will not be formed, thus preventing damage to the circuit board under test 6 when power is applied without preparation. In this embodiment, the spring element 55 is a spring. Alternatively, in other embodiments of this application, the spring element 55 can also be an elastic sleeve or a torsion spring, etc.

[0067] To facilitate the removal of the circuit board 6 to be tested from the positioning groove 222, the extension wall 221 is provided with at least one notch 26 for the operator's fingers or the fingers or tools of a robotic arm to access the circuit board 6 in the positioning groove 222. Of course, the notch 26 also facilitates placing the circuit board 6 into the positioning groove 222. In this embodiment, a preferred method is to provide notches 26 along the positive Z-axis on the end faces of any two opposite walls of the extension wall 221, allowing two fingers of the operator or two fingers or tools of a robotic arm to respectively insert into the notches 26 to remove the circuit board 6. Alternatively, in other embodiments of this application, a notch 26 may be provided on each wall of the extension wall 221, allowing different operators to remove the circuit board 6 according to their own habits.

[0068] Alternatively, in other embodiments of this application, a probe 21 may also be provided on the pressure plate 31. Specifically, the negative Z-axis end of the pressure plate 31 has a mounting portion integral with the pressure plate 31 for mounting the probe 21. One end of the probe 21 faces the negative Z-axis. The negative Z-axis end of the pressure plate 31 is also provided with a fifth conductive connector. The fifth conductive connector is electrically connected to the probe 21 on the pressure plate 31 via a ribbon cable, and the ribbon cable can be hidden inside the mounting portion. The fifth conductive connector is electrically connected to the test circuit 5 via another ribbon cable. The probe 21 on the pressure plate 31 is provided to meet the testing needs of the circuit board 6 under test.

[0069] In summary, the above description is only a preferred embodiment of the present utility model. All equivalent changes and modifications made within the scope of the patent application of the present utility model shall fall within the scope of the patent of the present utility model.

Claims

1. A circuit board testing device, characterized in that, include: Base; A lifting structure is movably mounted on the base in the vertical direction; The lower module is detachably fixed to the base, and the top of the lower module is used to position the circuit board under test in the horizontal direction. The upper module is located above the lower module and is detachably fixed to the lifting structure; At least one of the upper module and the lower module is fixed with a probe; The upper module can press the circuit board under test from top to bottom under the action of the lifting structure, and can also detach from the circuit board under test from bottom to top under the action of the lifting structure.

2. The circuit board testing device according to claim 1, characterized in that, It also includes test circuitry; The probe is fixedly mounted on the lower module; The lower module is fixedly provided with a first conductive connector, which is electrically connected to a probe fixedly provided in the lower module. The base is fixedly provided with a second conductive connector, which is electrically connected to the test circuit. The first conductive connector and the second conductive connector are detachably plugged into each other to detachably fix the lower module to the base and to electrically connect the test circuit to the probe fixed to the lower module.

3. The circuit board testing device according to claim 2, characterized in that, The lower module includes a first adapter circuit board, and the first conductive connector is located on the first adapter circuit board and is fixed to the lower module through the first adapter circuit board; The base includes a second adapter circuit board, the second conductive connector is located on the second adapter circuit board, and is fixed to the base via the second adapter circuit board.

4. The circuit board testing device according to claim 3, characterized in that, The test circuit is electrically connected to the second adapter circuit board via pin headers and sockets; and / or The probes fixed to the lower module are electrically connected to the first adapter circuit board via pin headers and sockets.

5. A circuit board testing device according to claim 2, characterized in that, The base is box-shaped, and the test circuit is located in the box cavity of the base; The first conductive connector and the second conductive connector are inserted and mated in the vertical direction.

6. The circuit board testing device according to claim 2, characterized in that, The first conductive connector and the second conductive connector together form a conductive connector assembly, which includes at least one of a backplane connector, a strip connector, and a D-type connector.

7. A circuit board testing apparatus according to any one of claims 1 to 6, characterized in that, The lower module includes a carrier plate for placing the circuit board under test. The top of the carrier plate has a positioning groove for accommodating the circuit board under test. The cross-sectional shape of the positioning groove is adapted to the shape of the circuit board under test. The probe fixed to the lower module is disposed on the carrier plate with its tip facing upward and protruding into the positioning groove; The tip of the probe is below the top of the wall of the positioning groove.

8. A circuit board testing apparatus according to any one of claims 1 to 6, characterized in that, The upper module includes a pressure plate and a pressure bar fixedly connected to the pressure plate. The pressure plate is connected to the lifting structure via a detachable installation method; or The upper module includes only a pressure bar, and the pressure bar is connected to the lifting structure by a detachable installation method; The detachable installation method includes at least one of plug-in, threaded connection, snap-fit, or magnetic attraction.

9. A circuit board testing apparatus according to any one of claims 1 to 6, characterized in that, The lifting structure includes a mounting plate for mounting the upper module, the thickness direction of the mounting plate is parallel to the vertical direction, and the upper module is located below the mounting plate; The mounting plate has a hollowed-out center; The mounting plate is made of a transparent material; A spring element is provided between the base and the lifting structure, which is used to force the lifting structure to remain separated from the lower module when the lifting structure is in a free state.

10. A circuit board testing apparatus according to any one of claims 1 to 6, characterized in that, The base has a downwardly recessed mounting groove, the bottom end of the lower module is recessed within the mounting groove, and the top end of the lower module protrudes outside the mounting groove.

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