Fixing substrate for chip test circuit board

By setting up a cold air channel and an adjustable air outlet on the chip test circuit board mounting base, the problem of poor heat dissipation of the chip test circuit board is solved, achieving efficient and low-cost heat dissipation.

CN223650691UActive Publication Date: 2025-12-09SHENZHEN COMOS INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520347715.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2025-12-09
Estimated Expiration
2035-02-28

AI Technical Summary

Technical Problem

Existing chip test circuit boards have poor heat dissipation after being fixed to a substrate, which affects the lifespan of the test circuit board and the chip test results. Existing heat dissipation solutions are complex in structure and expensive.

Method used

A fixed substrate for chip test circuit board was designed, which is equipped with a through-type platform and a cold air channel. The air outlet of the adjustable air outlet in the through hole blows cold air to the test base for heat dissipation through the cold air channel. The structure is simple and low cost.

Benefits of technology

It effectively removes heat generated during testing, extends circuit board life, simplifies operation procedures, and reduces costs.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223650691U_ABST
    Figure CN223650691U_ABST
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Abstract

The utility model relates to the field of chip test equipment, and discloses a fixed substrate for a chip test circuit board, which comprises a fixed substrate, a sinking table which is through front and back is arranged on the fixed substrate, a plurality of test board fixing structures are arranged on the sinking table, and receding grooves which are through front and back are arranged at positions corresponding to the test board fixing structures on the fixed substrate. A cold air channel is formed in the fixed base plate, a through hole extending to the cold air channel is formed in each receding groove, and an air outlet head capable of adjusting the direction of an air outlet is arranged in each through hole. Cold air can be blown to the part, where the testing seat is fixed, of each chip testing circuit board on the fixed substrate, heat generated during testing is continuously taken away, the overall structure is simple, cost is low, and testing operation is convenient.
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Description

Technical Field

[0001] This utility model relates to chip testing equipment, and in particular to a fixed substrate for chip testing circuit boards. Background Technology

[0002] Chip testing is an indispensable process step in chip manufacturing and packaging, used to perform various performance tests on the chip. These tests include, but are not limited to, electrical parameter testing, functional testing, analog testing, radiation testing, reliability testing, timing testing, power consumption testing, and electromagnetic compatibility testing. Through these tests, it can be ensured that the chip can function properly in practical applications and meet design requirements.

[0003] Existing chip testing often utilizes chip test benches, which mount several chip test circuit boards. Each test board has a corresponding chip test socket, and the circuit boards connect to the testing system to perform various tests on the chip. For ease of installation, maintenance, and management, several test circuit boards are grouped together and fixed to a mounting substrate. Some types of chips have high power consumption and continuously generate heat during testing, especially the test sockets on the test circuit boards used for chip positioning. After being fixed to the substrate, heat dissipation is slow, resulting in poor heat dissipation and affecting the lifespan of the test circuit boards or the chip test results. One existing solution is to install a heat dissipation mechanism on each test socket, which effectively dissipates heat; however, this method is complex, costly, and requires more attention to operational precautions and constraints. Utility Model Content

[0004] This utility model provides a fixing substrate for chip test circuit boards, which solves the technical problem that the heat dissipation of the chip test circuit board is poor after it is fixed to the fixing substrate, which will affect the life of the test circuit board or the chip test results.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a fixing substrate for chip test circuit boards, including a fixing substrate, a through-type platform on the fixing substrate, multiple test board fixing structures on the platform, and corresponding through-type clearance grooves on the fixing substrate for each test board fixing structure. A cold air channel is provided inside the fixing substrate, and each clearance groove has a through hole extending into the cold air channel. An adjustable air outlet is provided in each through hole. Cold air can be blown onto the portion of each chip test circuit board on the fixing substrate that holds the test fixture, continuously removing the heat generated during testing. The overall structure is simple, low-cost, and easy to operate.

[0006] Furthermore, the test board fixing structure includes two limiting posts on both sides of the clearance groove and two sets of fixing threaded holes symmetrically arranged on both sides of the two limiting posts. The chip test circuit board can be fixed in two directions on the test board fixing structure, which facilitates the adjustment of the chip test circuit board during actual operation.

[0007] Furthermore, the through hole is located at the center between the two sets of fixing threaded holes. This allows for effective heat dissipation from cold air for the chip test circuit board fixed in two directions.

[0008] Furthermore, the lower end of the through hole is provided with a first thread, the air outlet is cylindrical and its lower end is provided with a second thread that matches the first thread, the upper part of the outer cylindrical surface of the air outlet is provided with an annular groove, a sealing ring is provided in the annular groove, the upper end face of the air outlet is provided with a rotary drive structure, and the upper and lower ends of the air outlet are provided with connected air outlet structures. Adjusting the air outlet direction of the air outlet structure is simple and convenient.

[0009] Furthermore, the air outlet structure includes a connecting cavity and an inclined groove cavity. The connecting cavity is located at the lower end of the air outlet and communicates with the cold air channel. One end of the inclined groove cavity is connected to the connecting cavity, and the other end extends obliquely to the upper surface of the air outlet. The air outlet structure is simple, easy to manufacture and process, and uses few raw materials.

[0010] Furthermore, two connecting channels are symmetrically arranged on both sides of the cold air channel. This makes the entire test platform neater, prevents the connecting air pipes from becoming tangled, and avoids the reduction in air velocity at the air outlet on the rear fixed base plate caused by directly using the cold air channel to deliver cold air.

[0011] Furthermore, the cold air channel includes a first main channel that runs horizontally through the fixed substrate and a first air inlet and a first air outlet extending from both ends of the upper surface of the fixed substrate into the fixed substrate and communicating with the first main channel. Removable plugs are provided at both ends of the first main channel. Regular cleaning and maintenance can be performed to avoid contamination of the test circuit board.

[0012] Furthermore, the connecting channel includes a second main channel that horizontally penetrates the fixed substrate, and a second air inlet and a second air outlet that extend from both ends of the upper surface of the fixed substrate into the fixed substrate and communicate with the second main channel. Removable plugs are provided at both ends of the second main channel. Regular cleaning and maintenance can be performed to avoid contamination of the test circuit board. Attached Figure Description

[0013] Figure 1 This is a front view schematic diagram of the present invention;

[0014] Figure 2 A front view illustration intended to steal the spotlight;

[0015] Figure 3 This is a front view schematic diagram of the vertical cross-section of the air outlet.

[0016] The components are labeled as follows: fixed base plate 100, recessed platform 101, clearance groove 120, through hole 121, limiting post 131, fixed threaded hole 132, first air inlet 151, first air outlet 152, second air inlet 161, second air outlet 162, plug 170, air outlet head 200, second thread 201, annular groove 202, rotary drive structure 203, connecting cavity 204, inclined groove cavity 205, and sealing ring 210. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] like Figure 1 The chip test circuit board fixing substrate shown includes a fixing substrate 100, characterized in that: a through-type platform 101 is provided on the fixing substrate 100, a plurality of test board fixing structures are provided on the platform 101, a through-type relief groove 120 is provided at the corresponding position of the test board fixing structures on the fixing substrate 100, a cold air channel is provided in the fixing substrate 100, a through hole 121 extending into the cold air channel is provided in each relief groove 120, and an air outlet head 200 with adjustable air outlet direction is provided in the through hole 121. In practice, the fixed substrate 100 is fixed to the test bench with bolts. When the heat generated by the test socket part of the chip on the chip test circuit board affects the life of the test circuit board or the chip test results, the cold air channel is connected to the external cold air mechanism, and the air outlet of the air outlet 200 is adjusted to face the test socket on the chip test circuit board. At this time, the cold air blows through the through hole 121 towards the part of the fixed test socket on each chip test circuit board on the fixed substrate 100, continuously removing the heat generated during the test. Compared with setting a cooling device on the test socket on each chip test circuit board, the overall structure is simpler, the cost is lower, and the test operation is more convenient.

[0019] Based on the above, such as Figure 1 As shown, the test board fixing structure includes two limiting posts 131 on both sides of the relief groove 120 and two sets of fixing threaded holes 132 symmetrically arranged on both sides of the two limiting posts. The chip test circuit board can be fixed in two directions on the test board fixing structure, which facilitates the adjustment of the chip test circuit board during actual operation. The air outlet of the air outlet 200 is adjustable in direction, so it can be adjusted along with the fixing of the chip test circuit board.

[0020] Based on the above, such as Figure 1As shown, the through hole 121 is located at the center between the two sets of fixing threaded holes 132. This effectively allows for heat dissipation from cold air onto the chip test circuit board fixed in two directions.

[0021] Based on the above, such as Figures 1 to 3 As shown, the lower end of the through hole 121 is provided with a first thread, the air outlet 200 is cylindrical and the lower end is provided with a second thread 201 that matches the first thread, the upper part of the outer cylindrical surface of the air outlet 200 is provided with an annular groove 202, a sealing ring 210 is provided in the annular groove 202, the upper end face of the air outlet 200 is provided with a rotary drive structure 203, and the upper and lower ends of the air outlet 200 are provided with a connected air outlet structure. In this specific embodiment, the rotary drive structure 203 is a "I"-shaped screwdriver rotating groove, and the air outlet structure extends obliquely from one side of the screwdriver rotating groove at the upper end of the air outlet 200 to the lower end of the air outlet structure; by driving the rotary drive structure 203 to drive the air outlet 200 to rotate, the direction of the cold air blown out by the air outlet structure can be adjusted. In specific operation, the rotary drive structure 203 can be adjusted with a "I"-shaped screwdriver before fixing the chip test circuit board. Adjusting the air outlet direction of the air outlet structure is simple and convenient.

[0022] Based on the above, such as Figures 1 to 3 As shown, the air outlet structure includes a connecting cavity 204 and an inclined groove cavity 205. The connecting cavity 204 is located at the lower end of the air outlet 200 and is connected to the cold air channel. One end of the inclined groove cavity 205 is connected to the connecting cavity 204, and the other end extends obliquely to the upper surface of the air outlet 200. The air outlet 200 has a simple structure, is easy to manufacture and process, and uses few raw materials.

[0023] Based on the above, such as Figure 1 As shown, two connecting channels are symmetrically arranged on both sides of the cold air channel. In specific implementations, when using multiple fixed base plates 100, cold air can be transmitted through the connecting channels, making the entire test platform neater, the connecting air pipes less prone to confusion, and avoiding the reduction in air velocity at the air outlet 200 on the rear fixed base plate caused by directly transmitting cold air through the cold air channel.

[0024] Based on the above, such as Figure 1As shown, the cold air channel includes a first main channel that runs horizontally through the fixed substrate 100, and a first air inlet 151 and a first air outlet 152 extending from both ends of the upper surface of the fixed substrate 100 into the fixed substrate 100 and communicating with the first main channel, respectively. Removable plugs 170 are provided at both ends of the first main channel. In this specific embodiment, the two ends of the first main channel and the plugs 170 are fixed by threads, and the plugs 170 are provided with a sealing ring structure to prevent air leakage. Connecting the air duct to the fixed substrate 100 is more convenient, and the plugs 170 can be periodically removed to clean and maintain the first main channel, the first air inlet 151, and the first air outlet 152, avoiding contamination of the test circuit board.

[0025] Based on the above, such as Figure 1 As shown, the connecting channel includes a second main channel that horizontally penetrates the fixed substrate 100 and a second air inlet 161 and a second air outlet 162 extending from both ends of the upper surface of the fixed substrate 100 into the fixed substrate 100 and communicating with the second main channel, respectively. Removable plugs 170 are provided at both ends of the second main channel. In this specific embodiment, the two ends of the second main channel and the plugs 170 are fixed by threads, and the plugs 170 are provided with a sealing ring structure to prevent air leakage. Connecting the air duct to the fixed substrate 100 is more convenient, and the plugs 170 can be periodically removed to clean and maintain the second main channel connection, the second air inlet 161, and the second air outlet 162, avoiding contamination of the test circuit board.

[0026] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A fixing substrate for a chip test circuit board, comprising a fixing substrate (100), characterized in that: The fixed substrate (100) is provided with a recessed platform (101) that extends from front to back. Multiple test board fixing structures are provided on the recessed platform (101). Each test board fixing structure on the fixed substrate (100) is provided with a clearance groove (120) that extends from front to back. A cold air channel is provided inside the fixed substrate (100). Each clearance groove (120) is provided with a through hole (121) that extends into the cold air channel. An air outlet head (200) with an adjustable air outlet direction is provided inside the through hole (121).

2. The fixing substrate for the chip test circuit board according to claim 1, characterized in that: The test plate fixing structure includes two limiting posts (131) on both sides of the relief groove (120) and two sets of fixing threaded holes (132) symmetrically arranged on both sides of the two limiting posts.

3. The fixing substrate for the chip test circuit board according to claim 2, characterized in that: The through hole (121) is located at the center between the two sets of fixed threaded holes (132).

4. The fixing substrate for the chip test circuit board according to claim 3, characterized in that: The lower end of the through hole (121) is provided with a first thread, the air outlet (200) is cylindrical and the lower end is provided with a second thread (201) that matches the first thread, the upper part of the outer cylindrical surface of the air outlet (200) is provided with an annular groove (202), a sealing ring (210) is provided in the annular groove (202), the upper end face of the air outlet (200) is provided with a rotary drive structure (203), and the upper and lower ends of the air outlet (200) are provided with a connected air outlet structure.

5. The fixing substrate for the chip test circuit board according to claim 4, characterized in that: The air outlet structure includes a connecting cavity (204) and an inclined groove cavity (205). The connecting cavity (204) is located at the lower end of the air outlet (200) and is connected to the cold air channel. One end of the inclined groove cavity (205) is connected to the connecting cavity (204) and the other end extends obliquely to the upper surface of the air outlet (200).

6. The fixing substrate for the chip test circuit board according to claim 3, characterized in that: Two connecting channels are symmetrically arranged on both sides of the cold air duct.

7. The fixing substrate for the chip test circuit board according to claim 1, characterized in that: The cold air channel includes a first main channel that runs horizontally through the fixed substrate (100) and a first air inlet (151) and a first air outlet (152) that extend from both ends of the upper surface of the fixed substrate (100) into the fixed substrate (100) and communicate with the first main channel. The two ends of the first main channel are provided with detachable plugs (170).

8. The fixing substrate for the chip test circuit board according to claim 6, characterized in that: The communication channel includes a second main channel that runs horizontally through the fixed substrate (100) and a second air inlet (161) and a second air outlet (162) that extend from both ends of the upper surface of the fixed substrate (100) into the fixed substrate (100) and communicate with the second main channel. The two ends of the second main channel are provided with detachable plugs (170).