Visible component detection supporting assembly with horizontal adjusting assembly
By using a formed element detection support component with a horizontal adjustment element, the chip leveling process is simplified, costs are reduced, and the accuracy and stability of microscopic imaging are improved, solving the problem of vertical orthogonality adjustment between the microscope and the detection chip.
Patent Information
- Application Number
- CN202520151635.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-01-22
AI Technical Summary
In existing technologies, it is difficult to maintain the perpendicularity and orthogonality between the microscope and the detection chip, which leads to complex chip level adjustment during imaging, high cost, and difficulty in meeting accuracy requirements.
A formed element detection support assembly with a horizontal adjustment component is adopted, including a chip carrier module, a carrier support component, and a horizontal adjustment component. The horizontality of the chip is adjusted by four sets of adjustment components (adjusting bolt A, locking bolt B, and elastic support component), and the chip insertion status is ensured by the position detection component.
It simplifies the chip leveling process, reduces equipment manufacturing and maintenance costs, improves adjustment efficiency and accuracy, and ensures the stability and consistency of microscopic imaging.
Smart Images
Figure CN223650824U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of medical device technology, and in particular relates to a formed element detection support component with a horizontal adjustment component. Background Technology
[0002] Medical testing devices for formed elements are high-precision, highly complex medical instruments, including sophisticated microscopic imaging systems and image analysis and processing systems. Due to their complexity, these systems require numerous sensors, control devices, and detection components. The challenge lies in how to design these components to reduce development complexity.
[0003] The equipment cost and maintenance cost, while ensuring the ability to meet the micron-level precision adjustment functions during the microscope imaging process, present a huge technical challenge; in particular, the microscope needs to be kept in a perpendicular and orthogonal state with the detection chip to ensure clear and consistent microscopic imaging and maintain the consistency of the imaged samples.
[0004] The adjustment requires high precision, and the orthogonal deviation must be as small as possible, necessitating fine-tuning of each component to ensure orthogonality. Existing technologies employ complex microscope adjustment structures to maintain orthogonality. While the microscope's verticality can be adjusted, the chip's horizontality cannot. Any dimensional errors in the chip's support mechanism, resulting in an uneven chip, will cause problems in the imaging process. Achieving micron-level precision chip horizontality adjustment at the lowest cost is a key technical challenge for mass production. Summary of the Invention
[0005] The formed element detection support component with horizontal adjustment component of this application simplifies the chip leveling process, eliminating the need for repeated adjustments. By adjusting the four support points, the chip's levelness is ensured, facilitating production debugging and significantly reducing adjustment time, equipment manufacturing and maintenance costs. At the same time, it can guarantee micron-level precision adjustment of the chip's horizontal direction during microscope imaging.
[0006] The solution to the above-mentioned technical problem is a formed element detection support assembly with a horizontal adjustment component, including a chip carrier module, a carrier support assembly, and a horizontal adjustment component. The carrier support assembly is used to support the detection chip. The chip carrier module is connected to the carrier support assembly through the horizontal adjustment component. The horizontal adjustment component is used to adjust the perpendicularity between the chip carrier module and the microscope assembly. The horizontal adjustment component includes four sets of adjustment components. Each set of adjustment components includes an elastic support component, an adjusting bolt A, and a locking bolt B. The chip carrier module includes an adjusting screw hole A and a locking screw hole B. The carrier support assembly includes a support screw hole C. The adjusting bolt A is connected to the support screw hole C through the adjusting screw hole A, connecting the chip carrier module and the carrier support assembly. The elastic support component is located between the chip carrier module and the carrier support assembly. The adjusting bolt A adjusts the deformation of the elastic support component. The locking bolt B interferes with the adjusting bolt A through the locking screw hole B, fixing the adjusting bolt A and preventing the adjusting bolt A from loosening after adjustment.
[0007] The elastic support component is a deformable washer, which can deform under the adjustment pressure of adjusting bolt A.
[0008] Deformable washers are made of copper or soft iron.
[0009] The elastic support component includes a top ball and a spring; the load-bearing support component includes a spring hole D; the spring is placed in the spring hole D, and the top ball is supported by the spring, pressing against the chip load-bearing module.
[0010] The chip carrier module includes a chip slot for inserting a detection chip.
[0011] The chip carrier module includes a chip spring, which supports the bottom of the detection chip and ensures that the detection chip is in close contact with the chip slot.
[0012] The formed element detection support assembly with horizontal adjustment component also includes a position detection component; the position detection component is used to detect whether the detection chip is inserted.
[0013] The position detection component is mounted and fixed on the load-bearing support assembly.
[0014] The load-bearing support assembly includes mounting holes E, which are used to mount and fix the load-bearing support assembly to the external slide assembly.
[0015] The support assembly includes a position detection contact, which is used to detect the sliding position of the support assembly on the slide assembly.
[0016] The technical advantages of the above solution are: the coordination of adjusting bolt A and locking bolt B makes the leveling adjustment operation simpler and more reliable. The vertical and horizontal bolts form an I-shaped support, ensuring a more stable and durable state after adjustment.
[0017] The technical effect of the above solution is that the four sets of adjustment components can maintain the independent control of the four angles in the horizontal direction, which can be adjusted independently, improve adjustment efficiency, and avoid repeated adjustments.
[0018] The technical advantages of the above solution are: Deformable washers simplify the adjustment structure and reduce costs. Deformable washers, made of copper or soft iron, are readily available and inexpensive. The use of highly elastic washers or soft metal shims creates a compressible, tight-fitting support relationship, buffering the effects of external vibrations and resulting in a more stable and durable adjusted state.
[0019] The technical effect of the above technical solution is that the setting of the top ball and spring provides a more flexible way to adjust the deformation stroke.
[0020] The technical effects of the above technical solution are: the chip slot is used to insert the detection chip, which facilitates chip fixation and stabilizes the chip when adjusting its level.
[0021] The technical advantages of the above solution are: the position detection component ensures the chip insertion status and facilitates chip level adjustment. The position detection component is fixedly mounted on the support assembly, facilitating installation and testing.
[0022] The technical effect of the above technical solution is that the mounting hole E is used to install and fix the load-bearing support component to the external slide assembly, which facilitates the overall motion support.
[0023] The technical effect of the above solution is that the position detection contact is used to detect the sliding position of the support component on the slide assembly, which facilitates position adjustment and management. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of a formed element detection support component with a horizontal adjustment element and its application scenario;
[0025] Figure 2 This is a schematic diagram of the combined state of the formed element detection support component with horizontal adjustment assembly;
[0026] Figure 3 This is a schematic diagram of the disassembled state of the formed element detection support component with horizontal adjustment assembly;
[0027] Figure 4 This is a schematic diagram of the disassembled state of the formed element detection support component with horizontal adjustment assembly;
[0028] Figure 5 This is a schematic diagram of the load-bearing support components;
[0029] Figure 6 This is a schematic diagram of the chip carrier module;
[0030] Figure 7 This is a schematic diagram of the application status of a formed element detection support component with a horizontal adjustment element.
[0031] Figure 8 This is a schematic diagram of the application status of a formed element detection support component with a horizontal adjustment element. Detailed Implementation
[0032] The contents of this application will be further described in detail below with reference to the accompanying drawings.
[0033] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0034] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.
[0035] like Figures 1 to 3A formed element detection support assembly with a horizontal adjustment component includes a chip carrier module, a carrier support assembly, and a horizontal adjustment component. The carrier support assembly supports the detection chip. The chip carrier module is connected to the carrier support assembly via the horizontal adjustment component. The horizontal adjustment component adjusts the perpendicularity between the chip carrier module and the microscope assembly. The horizontal adjustment component includes four sets of adjustment components. Each set of adjustment components includes an elastic support component, an adjusting bolt A, and a locking bolt B. The chip carrier module includes an adjusting screw hole A and a locking screw hole B. The carrier support assembly includes a support screw hole C. The adjusting bolt A connects to the carrier support assembly via the adjusting screw hole A and the support screw hole C. The elastic support component is located between the chip carrier module and the carrier support assembly. The adjusting bolt A adjusts the deformation of the elastic support component. The locking bolt B interferes with the adjusting bolt A via the locking screw hole B, fixing the adjusting bolt A and preventing it from loosening after adjustment.
[0036] like Figure 3 Adjusting bolt A passes through adjusting screw hole A and enters support screw hole C; adjusting screw hole A can be a through hole, and support screw hole C can be a threaded hole, allowing for a fixed connection with adjusting bolt A. Locking bolt B can pass through locking screw hole B and interfere with adjusting bolt A to fix adjusting bolt A. Locking bolt B is not shown in the figure. Four sets of adjusting components are symmetrically arranged. One set of adjusting components is used to adjust one angle, and the four sets of adjusting components each handle one angle adjustment, ultimately ensuring that the chip-carrying plane of the chip carrier module is perpendicular to the microscope assembly, thus ensuring that the detection chip is perpendicular to the microscope assembly. Figure 8 As shown, this illustrates an application scenario for a formed element detection support component with a horizontal adjustment element.
[0037] In some embodiments, the elastic support component is a deformable washer, which can deform under the adjusting pressure of adjusting bolt A. The deformable washer is made of copper or soft iron.
[0038] like Figure 1 The elastic support component includes a top ball and a spring; the load-bearing support component includes a spring hole D; the spring is not shown in the figure, but it is set in the spring hole D to support the top ball. With the spring in the spring hole D, the top ball is supported by the spring and presses against the chip carrier module.
[0039] like Figure 6 The chip carrier module includes a chip slot for inserting a detection chip.
[0040] like Figure 6 The chip carrier module includes a chip spring, which supports the bottom of the detection chip and ensures that the detection chip is in close contact with the chip slot.
[0041] like Figure 3 and Figure 5 In an embodiment of the formed element detection support assembly with a horizontal adjustment component, a position detection component is further included; the position detection component is used to detect whether the detection chip is inserted. The position detection component is mounted and fixed on the support assembly.
[0042] like Figure 3 , Figure 5 and Figure 7 The load-bearing support assembly includes mounting holes E, which are used to mount and fix the load-bearing support assembly to the external slide assembly.
[0043] like Figure 3 and Figure 5 The support assembly includes a position detection contact, which is used to detect the sliding position of the support assembly on the slide assembly.
[0044] While this application has been described and illustrated with reference to preferred embodiments and several alternatives, it is not intended to be limited to the specific descriptions herein. Other alternatives or equivalent components may also be used to practice this application.
Claims
1. A formed element detection support assembly with a horizontal adjustment component, characterized in that, This includes the chip carrier module, the carrier support component, and the horizontal adjustment component; The support assembly is used to support the testing chip; The chip carrier module is connected to the carrier support component via a horizontal adjustment component; The horizontal adjustment component is used to adjust the perpendicularity between the chip carrier module and the microscope component; The horizontal adjustment assembly includes four sets of adjustment components; Each adjustment assembly includes an elastic support assembly, adjustment bolt A, and locking bolt B; The chip carrier module includes an adjustment screw hole A and a locking screw hole B; The load-bearing support assembly includes a support screw hole C; Adjusting bolt A is connected to support bolt C through adjusting screw hole A, connecting the chip carrier module to the carrier support assembly; The flexible support component is located between the chip carrier module and the carrier support component; Adjusting bolt A adjusts the deformation of the elastic support assembly; The locking bolt B interferes with the adjusting bolt A through the locking screw hole B, thereby fixing the adjusting bolt A.
2. The formed element detection support assembly with a horizontal adjustment component according to claim 1, characterized in that, The elastic support component is a deformable washer, which can deform under the adjustment pressure of adjusting bolt A.
3. The formed element detection support assembly with a horizontal adjustment component according to claim 2, characterized in that, The deformable gasket is made of copper or soft iron.
4. The formed element detection support assembly with a horizontal adjustment component according to claim 1, characterized in that, The elastic support assembly includes a top ball and a spring; the load-bearing support assembly includes a spring hole D. The spring is placed in the spring hole D, and the top bead is supported by the spring, pressing against the chip carrier module.
5. The formed element detection support assembly with a horizontal adjustment component according to claim 1, characterized in that, The chip carrier module includes a chip slot for inserting a detection chip.
6. The formed element detection support assembly with a horizontal adjustment component according to claim 5, characterized in that, The chip carrier module includes a chip spring, which supports the bottom of the detection chip and ensures that the detection chip is in close contact with the chip slot.
7. The formed element detection support assembly with a horizontal adjustment component according to claim 5, characterized in that, It also includes a position detection component; the position detection component is used to detect whether the detection chip has been inserted.
8. The formed element detection support assembly with a horizontal adjustment component according to claim 7, characterized in that, The position detection component is mounted and fixed on the load-bearing support assembly.
9. The formed element detection support assembly with a horizontal adjustment component according to claim 1, characterized in that, The load-bearing support assembly includes mounting holes E, which are used to mount and fix the load-bearing support assembly to the external slide assembly.
10. The formed element detection support assembly with a horizontal adjustment component according to claim 9, characterized in that, The support assembly includes a position detection contact, which is used to detect the sliding position of the support assembly on the slide assembly.