Computer cooling device

Abstract

The utility model provides a computer heat dissipation device which comprises a first side box plate and a second side box plate which are arranged on the two sides of a machine frame body, an air inlet mechanism for air inlet heat dissipation is arranged in the middle of the second side box plate, a heat dissipation mechanism for air draft heat dissipation is arranged on the side face of one side box plate, the first side box plate comprises a first side baffle, and the first side baffle is connected with the machine frame body through screws. A plurality of assembling cylinders are distributed on one side face of the side baffle in an array mode. The heat dissipation mechanism comprises a heat dissipation cylinder, a mounting frame, a motor, a rotating rod and vortex blades, a ventilation opening is formed in the end of the heat dissipation cylinder, and the heat dissipation cylinder is in threaded connection with the assembly cylinder. According to the computer heat dissipation device, air is exhausted outwards to dissipate heat through the ventilation openings in the ends of the heat dissipation cylinders, flowing air can be gathered at the ends of the heat dissipation cylinders, the heat dissipation mechanisms can be freely assembled in distribution in cooperation with the assembly cylinders distributed in an array mode, fixed-point heat dissipation is conducted on hardware needing heat dissipation, heat dissipation of the computer heat dissipation device is more targeted, and the heat dissipation efficiency is improved. And the heat dissipation effect is better.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation equipment technology, specifically to a computer heat dissipation device. Background Technology

[0002] Computer cooling devices are important components that ensure the stable operation of computer hardware and extend its service life. During computer operation, they can dissipate heat from the computer hardware and keep the computer running within a safe temperature range.

[0003] The prior art disclosed in patent number CN 221946458 U includes a chassis, which includes three side plates and a bottom plate. The top of the bottom plate has a plurality of first grooves that are linearly and evenly formed. The top of the bottom plate has two second grooves that communicate with the first grooves. Each first groove is provided with a heat dissipation plate. Each second groove is slidably installed with a limit plate. By setting multiple heat dissipation plates, the entire side of the chassis can be cooled by airflow, resulting in a wider heat dissipation coverage and improved heat dissipation effect.

[0004] The aforementioned patent documents disclose a computer heat dissipation device to solve the problem of small heat dissipation coverage of computers. Although the computer heat dissipation device of the aforementioned patent can increase the heat dissipation area of ​​the computer, it has been found in the actual operation of the computer that different parts of the computer have different heat dissipation requirements. Simultaneous large-area heat dissipation is difficult to achieve the expected heat dissipation effect, which is not conducive to the stable operation of the computer.

[0005] In summary, there is a current need for a computer cooling device that can provide targeted heat dissipation. Utility Model Content

[0006] In view of the shortcomings of the prior art, this utility model provides a computer heat dissipation device, which solves the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A computer heat dissipation device includes a side panel 1 and a side panel 2 on both sides of the main body of the chassis. The side panel 2 has an air intake mechanism for heat dissipation in the middle and a heat dissipation mechanism for exhaust heat dissipation on the side of the side panel 1. The side panel 1 includes a side baffle 1, which is screwed to the main body of the chassis. Multiple assembly cylinders are arrayed on the side of the side baffle 1.

[0009] The heat dissipation mechanism includes a heat dissipation cylinder, a mounting bracket, a motor, a rotating rod, and vortex blades. A vent is provided at the end of the heat dissipation cylinder. The heat dissipation cylinder is threadedly connected to the assembly cylinder. A mounting bracket is provided inside the heat dissipation cylinder. A motor is provided on the side of the mounting bracket. A rotating rod is provided at the output end of the motor. Multiple sets of vortex blades are provided on the outside of the rotating rod.

[0010] Furthermore, the mounting bracket engages and slides with the heat sink, and a mounting cylinder is provided on the outside of the mounting bracket, with the mounting cylinder threadedly connected to the end of the heat sink.

[0011] Furthermore, the assembly cylinder has a cylinder cover on its side, which is engaged with the assembly cylinder.

[0012] Furthermore, the second side panel includes a second side baffle, a second mounting opening is provided in the middle of the second side baffle, a retaining strip is provided on the inner side of the second mounting opening, and the second mounting opening is engaged with the air inlet mechanism.

[0013] Furthermore, the air intake mechanism includes an air intake mounting plate, an air intake mesh, a ventilation fan, and a locking plate. The air intake mounting plate has an air intake mesh in the middle, a ventilation fan is provided on the inner side of the middle of the air intake mesh, and a locking plate is provided on the inner side of the air intake mounting plate. The locking plate and the locking strip are engaged accordingly.

[0014] Furthermore, the frame body has a first mounting port in the middle, the frame body and the second mounting port have the same structure, and a cover is provided on the outside of the first mounting port.

[0015] This invention provides a computer heat dissipation device. Compared with the prior art, it has the following advantages:

[0016] By drawing air outward through the vents at the end of the heat sink, the flowing air can be gathered at the end of the heat sink. Combined with the array of assembled cylinders, the heat dissipation mechanism can be freely assembled, allowing for targeted cooling of the hardware that needs cooling. This makes the computer cooling device more targeted and improves the cooling effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of a computer heat dissipation device according to the present invention is shown;

[0019] Figure 2 This diagram shows a side view of the overall structure of the present invention.

[0020] Figure 3 A side view of the overall cross-sectional structure of this utility model is shown;

[0021] Figure 4 A schematic diagram of the disassembly and assembly of the heat dissipation mechanism of this utility model is shown;

[0022] Figure 5 A schematic diagram of the heat dissipation mechanism of this utility model is shown;

[0023] Figure 6 A schematic diagram showing the separation of the heat dissipation mechanism of this utility model is provided.

[0024] Figure 7 A schematic diagram of the air intake mechanism of this utility model is shown;

[0025] The following components are shown in the diagram: 1. Main frame; 11. Cover; 12. Mounting port one; 2. Side panel one; 21. Side baffle one; 22. Assembly cylinder; 23. Cylinder cover; 3. Side panel two; 31. Side baffle two; 32. Mounting port two; 33. Clip; 4. Heat dissipation mechanism; 41. Heat dissipation cylinder; 411. Ventilation opening; 42. Mounting bracket; 43. Motor; 44. Rotating rod; 45. Vortex; 46. Mounting cylinder; 5. Air inlet mechanism; 51. Air inlet mounting plate; 52. Air inlet mesh; 53. Ventilation fan; 54. Clip. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] Example 1

[0028] To address the technical problems described in the background section, the following computer cooling device is provided:

[0029] Combination Figures 1-6As shown, this utility model provides a computer heat dissipation device, including a chassis body 1 with side panels 2 and 3 on both sides. The side panel 3 has an air intake mechanism 5 for heat dissipation in the middle, and a heat dissipation mechanism 4 for exhaust heat dissipation on the side of the side panel 2. The side panel 2 includes a side baffle 21, which is screwed to the chassis body 1. Multiple mounting cylinders 22 are arranged in an array on the side of the side baffle 21. The heat dissipation mechanism 4 includes a heat dissipation cylinder 41, a mounting bracket 42, a motor 43, a rotating rod 44, and a vortex blade 45. A ventilation port 411 is opened at the end of the heat dissipation cylinder 41. The heat dissipation cylinder 41 is threadedly connected to the mounting cylinder 22. The threaded connection of the cylinder 22 facilitates the installation of the heat dissipation mechanism 4 inside the assembly cylinder 22. The inner side of the heat dissipation cylinder 41 is provided with a mounting bracket 42, and the side of the mounting bracket 42 is provided with a motor 43. The output end of the motor 43 is provided with a rotating rod 44, and the outer side of the rotating rod 44 is provided with multiple sets of vortex blades 45. When the motor 43 drives the rotating rod 44 and the vortex blades 45 to rotate, the vent 411 can draw air outward and gather the flowing air at the end of the heat dissipation cylinder 41. With the array distribution of the assembly cylinders 22, the distribution of the heat dissipation mechanism 4 can be freely assembled, and it can perform targeted heat dissipation on the hardware that needs heat dissipation, thereby making the heat dissipation of the computer heat dissipation device more targeted and the heat dissipation effect better.

[0030] In this embodiment, the mounting bracket 42 engages and slides with the heat sink 41. The mounting bracket 42 is provided with a mounting cylinder 46 on its outer side. The mounting cylinder 46 is threadedly connected to the end of the heat sink 41. Through the threaded connection between the mounting cylinder 46 and the heat sink 41, the vortex 45 and the heat sink 41 can be pulled out from the machine frame body 1 after the heat dissipation mechanism 4 has been used for a long time, so as to facilitate the cleaning of the heat dissipation mechanism 4 and maintain the heat dissipation effect of the heat dissipation mechanism 4.

[0031] In this embodiment, the side of the assembly cylinder 22 is provided with a cylinder cover 23, which is engaged with the assembly cylinder 22. The cylinder cover 23 can block the assembly cylinder 22 without the heat dissipation mechanism 4.

[0032] The implementation principle of this embodiment is as follows: When the computer heat dissipation device is used, the heat dissipation mechanism 4 can be installed in the arrayed assembly cylinder 22 according to the heat dissipation requirements of the internal hardware of the chassis body 1. Then, the motor 43 in the heat dissipation mechanism 4 drives the rotating rod 44 and the vortex blade 45 to rotate, so that the ventilation port 411 at the end of the heat dissipation cylinder 41 generates suction, which gathers the air flowing inside the chassis body 1 and flows at the end of the heat dissipation cylinder 41. In this way, the hardware that needs to be cooled can be cooled at a fixed point, thereby making the heat dissipation of the computer heat dissipation device more targeted and the heat dissipation effect better.

[0033] Example 2

[0034] like Figures 3-7 As shown, based on the above embodiments, this embodiment further provides the following:

[0035] To further improve the heat dissipation effect of the computer cooling device, this embodiment provides the following design:

[0036] Side panel 2 3 includes side baffle 2 31. Side baffle 2 31 has an installation port 2 32 in the middle. The installation port 2 32 has a retaining strip 33 inside. The installation port 2 32 is engaged with the air intake mechanism 5. The installation port 2 32 is designed to facilitate the installation of the air intake mechanism 5 on the side of side panel 2 3. The air intake mechanism 5 includes an air intake mounting plate 51, an air intake mesh 52, a ventilation fan 53, and a retaining plate 54. The air intake mounting plate 51 has an air intake mesh 52 in the middle. The air intake mesh 52 has a ventilation fan 53 inside the middle. The ventilation fan 53 can supply air to the machine frame body 1. The air intake mounting plate 51 has a retaining plate 54 inside. The retaining plate 54 is engaged with the retaining strip 33. The engagement of the retaining plate 54 and the retaining strip 33 allows the air intake mechanism 5 to be disassembled and cleaned on the side of the installation port 2 32.

[0037] In this embodiment, the frame body 1 has a mounting port 12 in the middle. The frame body 1 and the mounting port 32 have the same structure. The mounting port 12 has a cover 11 on the outside. The mounting port 12 can be configured to install different numbers of air intake mechanisms 5 according to the heat dissipation requirements inside the frame body 1, so as to increase the heat dissipation air intake inside the frame body 1.

[0038] The implementation principle of this embodiment 2 is as follows: When the air intake mechanism 5 is installed on the mounting port 12 or the mounting port 32, the ventilation fan 53 can send external air into the frame body 1 to dissipate heat from the hardware, while cooperating with the heat dissipation mechanism 4 to dissipate heat from the hardware.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A computer heat dissipation device, characterized in that: The frame body (1) has a side box plate 1 (2) and a side box plate 2 (3) on both sides. The side box plate 2 (3) has an air intake mechanism (5) for air intake and heat dissipation in the middle. The side box plate 1 (2) has a heat dissipation mechanism (4) for exhaust and heat dissipation on the side. The side box plate 1 (2) includes a side baffle 1 (21). The side baffle 1 (21) is screwed to the frame body (1). The side baffle 1 (21) has multiple assembly cylinders (22) arranged in an array on the side. The heat dissipation mechanism (4) includes a heat dissipation cylinder (41), a mounting bracket (42), a motor (43), a rotating rod (44), and a vortex (45). The heat dissipation cylinder (41) has a ventilation port (411) at its end. The heat dissipation cylinder (41) is threadedly connected to the assembly cylinder (22). The mounting bracket (42) is provided inside the heat dissipation cylinder (41). The motor (43) is provided on the side of the mounting bracket (42). The rotating rod (44) is provided at the output end of the motor (43). Multiple sets of vortex (45) are provided on the outside of the rotating rod (44).

2. The computer heat dissipation device according to claim 1, characterized in that: The mounting bracket (42) engages and slides with the heat sink (41). The mounting bracket (42) has a mounting cylinder (46) on its outer side, and the mounting cylinder (46) is threadedly connected to the end of the heat sink (41).

3. A computer heat dissipation device according to claim 1, characterized in that: The assembly cylinder (22) has a cylinder cover (23) on its side, and the cylinder cover (23) is engaged with the assembly cylinder (22).

4. A computer heat dissipation device according to claim 1, characterized in that: The second side panel (3) includes a second side baffle (31), and a second mounting port (32) is provided in the middle of the second side baffle (31). A retaining strip (33) is provided on the inner side of the second mounting port (32), and the second mounting port (32) is engaged with the air inlet mechanism (5).

5. A computer heat dissipation device according to claim 4, characterized in that: The air intake mechanism (5) includes an air intake mounting plate (51), an air intake mesh (52), a ventilation fan (53), and a clamping plate (54). The air intake mounting plate (51) has an air intake mesh (52) in the middle, and a ventilation fan (53) is provided on the inner side of the middle of the air intake mesh (52). The clamping plate (54) is provided on the inner side of the air intake mounting plate (51), and the clamping plate (54) is engaged with the clamping strip (33).

6. A computer heat dissipation device according to claim 1, characterized in that: The frame body (1) has an installation port one (12) in the middle. The frame body (1) and the installation port two (32) have the same structure. The installation port one (12) has a cover (11) on the outside.

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