Multi-heat dissipation structure of computer chip

Abstract

The utility model discloses a computer chip multiple heat dissipation structure which comprises a case, a heat exchange box is fixedly connected to the inner wall of the case, a flowing groove is formed in the heat exchange box, a liquid inlet is fixedly connected to the right side of the heat exchange box, and a liquid outlet is fixedly connected to the side, away from the liquid inlet, of the heat exchange box. The filter screen is placed on one side of the liquid inlet and one side of the liquid outlet, the first guide pipe and the backflow pipe make contact with the filter screen, the fixed sleeve is rotated to rotate on the surfaces of the liquid inlet and the liquid outlet, and therefore the first guide pipe and the backflow pipe are fixed to the heat exchange box, the water pump is started, and cooling liquid is pumped into the heat exchange box. And the copper column transfers heat generated by the working of the chip body to the heat exchange box and exchanges heat with the cooling liquid, so that the heat is taken out from the liquid outlet, the heat dissipation of the bottom of the chip body is realized, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, specifically a multi-layer heat dissipation structure for computer chips. Background Technology

[0002] As we all know, a computer chip is a thin film made of silicon material. A chip is made up of hundreds of microcircuits connected together. It is small in size and is covered with microcircuits that generate pulse current. During the use of a computer, the computer generates a lot of heat due to continuous high-load computing and processing.

[0003] According to CN216161069U, a multi-layer heat dissipation structure for a computer chip is disclosed. In use, a heat-conducting box is installed on the top of the chip, and a heat sink is installed on the top of the heat-conducting box. Pipes are connected to the heat sink and the protective cover respectively. The heat generated by the chip is transferred from the bottom of the heat-conducting box to the top of the heat-conducting box, and then dissipated by multiple cooling fans. The pipes transfer the heat to the outside of the chassis.

[0004] The aforementioned cooling fan and other structures can dissipate the heat generated by the chip. However, since the heat sink is installed on top of the chip, the cooling fan can only transfer the heat generated by the chip from its top to the outside when it is working, resulting in low heat dissipation efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a multi-layer heat dissipation structure for computer chips to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-layer heat dissipation structure for a computer chip, including a chassis, a heat exchange box fixedly connected to the inner wall of the chassis, a flow channel opened inside the heat exchange box, a liquid inlet fixedly connected to the right side of the heat exchange box, a liquid outlet fixedly connected to the side of the heat exchange box away from the liquid inlet, filters provided on the side of the liquid inlet and the liquid outlet away from the heat exchange box, a fixing sleeve threadedly connected to the surface of the liquid inlet and the liquid outlet, a first conduit provided inside the fixing sleeve, a water pump fixedly connected to the side of the first conduit away from the fixing sleeve, and a copper column fixedly connected to the top of the heat exchange box.

[0007] As a further preferred embodiment of this technical solution, the flow channel adopts an S-shaped structure, the surfaces of the inlet and outlet are provided with external threads, the filter screen is located inside the fixed sleeve, the water pump and the chassis are fixedly connected, and the number of copper columns is set to multiple.

[0008] As a further preferred embodiment of this technical solution, a second conduit is fixedly connected to the back of the water pump, a heat sink is fixedly connected to the end of the second conduit away from the water pump, a return pipe is fixedly connected to the side of the heat sink near the heat exchange box, a first cooling fan is fixedly connected to the side of the heat sink near the heat exchange box, and a first dust cover is provided on the side of the first cooling fan away from the heat sink.

[0009] As a further preferred embodiment of this technical solution, the heat sink and the chassis are fixedly connected, the return pipe is located inside the fixed sleeve, and the number of the first cooling fans is set to two.

[0010] As a further preferred embodiment of this technical solution, a mounting bracket is fixedly connected to the inner wall of the chassis, and a limiting groove is formed on the top of the mounting bracket, with the chip body disposed inside the limiting groove.

[0011] As a further preferred embodiment of this technical solution, the inner wall of the chassis is fixedly connected to an installation sleeve, the top of the installation sleeve is provided with a protective shell, the top of the protective shell is threaded with a fixing screw, the inner wall of the protective shell is fixedly connected to a second cooling fan, and the top of the protective shell is fixedly connected to a second dust cover.

[0012] As a further preferred embodiment of this technical solution, the number of mounting sleeves is set to four, the number of fixing screws corresponds to the number of mounting sleeves, and the fixing screws and mounting sleeves are threadedly connected.

[0013] This invention provides a multi-layer heat dissipation structure for computer chips, which has the following advantages:

[0014] (1) This utility model places the filter screen on one side of the liquid inlet and liquid outlet, so that the first conduit and return pipe are in contact with the filter screen. The fixed sleeve is rotated so that it rotates on the surface of the liquid inlet and liquid outlet, thereby fixing the first conduit and return pipe on the heat exchange box. The water pump is started to pump the coolant into the heat exchange box and it flows in the flow tank. The copper pillar transfers the heat generated by the chip body to the heat exchange box and exchanges heat with the coolant, thereby carrying the heat out from the liquid outlet to achieve heat dissipation at the bottom of the chip body, thereby improving the heat dissipation efficiency.

[0015] (2) In this utility model, after the coolant exchanges heat with the copper column, it re-enters the heat sink through the return pipe. The heat sink has multiple interconnected circuits inside, which allows the coolant to flow in the circuits. At the same time, the first cooling fan is started to accelerate the air flow at the heat sink, so that the heat inside the coolant after the exchange can be dissipated, thereby realizing the reuse of the coolant. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the protective shell of this utility model;

[0018] Figure 3 This is a schematic diagram of the heat exchange box and copper column structure of this utility model;

[0019] Figure 4 This is a schematic cross-sectional view of the heat exchange box of this utility model.

[0020] In the diagram: 1. Chassis; 2. Heat exchange box; 3. Flow channel; 4. Liquid inlet; 5. Liquid outlet; 6. Filter screen; 7. Fixing sleeve; 8. First conduit; 9. Water pump; 10. Copper pillar; 11. Second conduit; 12. Heat sink; 13. Return pipe; 14. First cooling fan; 15. First dust cover; 16. Mounting bracket; 17. Limiting groove; 18. Chip body; 19. Mounting sleeve; 20. Protective shell; 21. Fixing screw; 22. Second cooling fan; 23. Second dust cover. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] This utility model provides a technical solution: such as Figure 1 and Figure 4 As shown in this embodiment, a multi-layer heat dissipation structure for a computer chip includes a chassis 1. A heat exchange box 2 is fixedly connected to the inner wall of the chassis 1. A flow channel 3 is provided inside the heat exchange box 2. An inlet 4 is fixedly connected to the right side of the heat exchange box 2. An outlet 5 is fixedly connected to the side of the heat exchange box 2 away from the inlet 4. A filter screen 6 is provided on the side of the inlet 4 and the outlet 5 away from the heat exchange box 2. A fixing sleeve 7 is threadedly connected to the surface of the inlet 4 and the outlet 5. A first conduit 8 is provided inside the fixing sleeve 7. A water pump 9 is fixedly connected to the side of the first conduit 8 away from the fixing sleeve 7. A copper column 10 is fixedly connected to the top of the heat exchange box 2.

[0023] By placing the filter screen 6 on one side of the inlet 4 and outlet 5, the first conduit 8 and return pipe 13 are brought into contact with the filter screen 6. The fixing sleeve 7 is rotated to make it rotate on the surface of the inlet 4 and outlet 5, thereby fixing the first conduit 8 and return pipe 13 on the heat exchange box 2. The water pump 9 is started to pump the coolant into the heat exchange box 2. Since the filter screen 6 is set between the first conduit 8 and the inlet 4, impurities and foreign objects in the coolant are captured, preventing them from accumulating in the flow channel 3 and causing blockage. The coolant flows in the flow channel 3, and the copper pillar 10 transfers the heat generated by the chip body 18 to the heat exchange box 2 and exchanges heat with the coolant, thereby carrying the heat out from the outlet 5 to achieve heat dissipation at the bottom of the chip body 18. The flow channel 3 adopts an S-shaped structure, which can increase the residence time of the coolant in the heat exchange box 2, thereby improving the heat dissipation efficiency.

[0024] The flow channel 3 adopts an S-shaped structure, the inlet 4 and outlet 5 are provided with external threads, the filter screen 6 is located inside the fixed sleeve 7, the water pump 9 is fixedly connected to the casing 1, and multiple copper columns 10 are provided.

[0025] A second conduit 11 is fixedly connected to the back of the water pump 9. A heat sink 12 is fixedly connected to the end of the second conduit 11 away from the water pump 9. A return pipe 13 is fixedly connected to the side of the heat sink 12 near the heat exchange box 2. A first cooling fan 14 is fixedly connected to the side of the heat sink 12 near the heat exchange box 2. A first dust cover 15 is provided on the side of the first cooling fan 14 away from the heat sink 12.

[0026] After the coolant exchanges heat with the copper pillar 10, it re-enters the heat sink 12 through the return pipe 13. The heat sink 12 has multiple interconnected circuits inside, allowing the coolant to flow within the circuits. At the same time, the first cooling fan 14 is activated to increase the airflow speed at the heat sink 12, so that the heat inside the exchanged coolant can be dissipated, thereby achieving the reuse of the coolant. A first dust cover 15 is provided on one side of the first cooling fan 14 to reduce the adhesion of dust and other substances.

[0027] The heat sink 12 is fixedly connected to the chassis 1, the return pipe 13 is located inside the fixed sleeve 7, and there are two first cooling fans 14.

[0028] A mounting bracket 16 is fixedly connected to the inner wall of the chassis 1. A limiting groove 17 is opened on the top of the mounting bracket 16, and a chip body 18 is arranged inside the limiting groove 17.

[0029] An installation sleeve 19 is fixedly connected to the inner wall of the chassis 1. A protective shell 20 is provided at the top of the installation sleeve 19. A fixing screw 21 is threadedly connected to the top of the protective shell 20. A second cooling fan 22 is fixedly connected to the inner wall of the protective shell 20. A second dust cover 23 is fixedly connected to the top of the protective shell 20.

[0030] There are four mounting sleeves 19, and the number of fixing screws 21 corresponds to the number of mounting sleeves 19. The fixing screws 21 and mounting sleeves 19 are threaded together.

[0031] This invention provides a multi-layer heat dissipation structure for computer chips, the specific working principle of which is as follows:

[0032] In use, place the filter screen 6 on one side of the liquid inlet 4 and the liquid outlet 5, so that the first conduit 8 and the return pipe 13 are in contact with the filter screen 6. Rotate the fixing sleeve 7 so that it rotates on the surface of the liquid inlet 4 and the liquid outlet 5, thereby fixing the first conduit 8 and the return pipe 13 on the heat exchange box 2. Start the water pump 9 to pump the coolant into the heat exchange box 2 and let it flow in the flow tank 3. The copper column 10 transfers the heat generated by the chip body 18 to the heat exchange box 2 and exchanges heat with the coolant, thereby carrying the heat out from the liquid outlet 5. The coolant re-enters the heat sink 12 through the return pipe 13. The heat sink 12 has multiple interconnected loops, allowing the coolant to flow within these loops. Simultaneously, the first cooling fan 14 is activated to increase the airflow speed at the heat sink 12, dissipating the heat inside the exchanged coolant. The coolant then re-enters the water pump 9 through the second conduit 11 for heat exchange. At the same time, the second cooling fan 22 is activated to increase the airflow speed at the top of the chip body 18, thereby achieving simultaneous heat dissipation on both sides of the chip body 18 and improving the heat dissipation effect.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer heat dissipation structure for a computer chip, comprising a chassis (1), characterized in that: A heat exchange box (2) is fixedly connected to the inner wall of the casing (1). A flow channel (3) is opened inside the heat exchange box (2). An inlet (4) is fixedly connected to the right side of the heat exchange box (2). An outlet (5) is fixedly connected to the side of the heat exchange box (2) away from the inlet (4). A filter screen (6) is provided on the side of the inlet (4) and outlet (5) away from the heat exchange box (2). A fixing sleeve (7) is threadedly connected to the surface of the inlet (4) and outlet (5). A first conduit (8) is provided inside the fixing sleeve (7). A water pump (9) is fixedly connected to the side of the first conduit (8) away from the fixing sleeve (7). A copper column (10) is fixedly connected to the top of the heat exchange box (2).

2. The multi-layer heat dissipation structure for a computer chip according to claim 1, characterized in that: The flow channel (3) adopts an S-shaped structure. The surfaces of the inlet (4) and outlet (5) are provided with external threads. The filter screen (6) is located inside the fixed sleeve (7). The water pump (9) is fixedly connected to the chassis (1). The number of copper columns (10) is set to multiple.

3. The multi-layer heat dissipation structure for a computer chip according to claim 1, characterized in that: A second conduit (11) is fixedly connected to the back of the water pump (9). A heat sink (12) is fixedly connected to the end of the second conduit (11) away from the water pump (9). A return pipe (13) is fixedly connected to the side of the heat sink (12) near the heat exchange box (2). A first cooling fan (14) is fixedly connected to the side of the heat sink (12) near the heat exchange box (2). A first dust cover (15) is provided on the side of the first cooling fan (14) away from the heat sink (12).

4. The multi-layer heat dissipation structure for a computer chip according to claim 3, characterized in that: The heat sink (12) and the chassis (1) are fixedly connected. The return pipe (13) is located inside the fixed sleeve (7). There are two first cooling fans (14).

5. The multi-layer heat dissipation structure for a computer chip according to claim 1, characterized in that: The inner wall of the chassis (1) is fixedly connected to a mounting bracket (16), and a limiting groove (17) is opened on the top of the mounting bracket (16). The chip body (18) is arranged inside the limiting groove (17).

6. The multi-layer heat dissipation structure for a computer chip according to claim 1, characterized in that: The inner wall of the chassis (1) is fixedly connected to an installation sleeve (19), the top of the installation sleeve (19) is provided with a protective shell (20), the top of the protective shell (20) is threadedly connected with a fixing screw (21), the inner wall of the protective shell (20) is fixedly connected to a second cooling fan (22), and the top of the protective shell (20) is fixedly connected to a second dust cover (23).

7. The multi-layer heat dissipation structure for a computer chip according to claim 6, characterized in that: The number of mounting sleeves (19) is set to four, and the number of fixing screws (21) corresponds to the number of mounting sleeves (19). The fixing screws (21) and mounting sleeves (19) are threaded together.

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