Heat dissipation structure of three-frequency combiner

Abstract

The utility model relates to the field of combiners, and discloses a three-frequency combiner heat dissipation structure, which comprises a combiner shell and a shell sealing plate, the top surface of the combiner shell is fixedly provided with the shell sealing plate through arranged bolts, and the bottom surface of the shell sealing plate is provided with a heat dissipation mechanism for heat dissipation of the combiner shell. The heat dissipation mechanism comprises a rectangular groove, a heat dissipation rectangular plate, a heat dissipation sheet, a heat absorption plate and a refrigeration sheet, heat generated in the operation process of components in the combiner shell can be absorbed by the heat absorption plate and the refrigeration sheet, and the refrigeration sheet can transmit the conducted heat to the heat dissipation rectangular plate and the heat dissipation sheet which are in contact with the refrigeration sheet; the radiating fins can further conduct the received heat to the outside air by means of the large radiating surface area and the good heat conduction performance, so that the heat can be gradually dissipated out from the interior of the combiner shell, and the purpose of overall heat dissipation of the combiner shell is achieved.

Description

Technical Field

[0001] This application belongs to the field of combiner technology, specifically a heat dissipation structure for a three-frequency combiner. Background Technology

[0002] A tri-band combiner is a key device in wireless communication systems. It combines signals from three different frequency bands, allowing these signals to be transmitted through the same feeder. This reduces the number of feeders required, lowering system cost and complexity. Internally, it typically contains multiple filters and couplers. Through specific circuit design, it filters and combines the three input frequency band signals while minimizing mutual interference between signals. It is widely used in mobile communication base stations, indoor distribution systems, and other scenarios to ensure efficient and stable transmission of signals from different frequency bands.

[0003] Existing tri-frequency combiners generally use a casing for heat dissipation. However, traditional heat dissipation methods have many problems. First, the heat dissipation capacity of the casing is limited. When the combiner operates for a long time or is under high load, the heat generated inside cannot be dissipated in a timely and effective manner. As heat accumulates, the internal temperature of the combiner gradually increases, which in turn affects the performance and stability of the components in the combiner. High-temperature environments may cause changes in the electrical parameters of the components, such as increased resistance and capacitor drift. This will not only reduce the signal processing capability of the combiner, but may also shorten the service life of the components and increase the failure rate of the equipment. Therefore, a heat dissipation structure for tri-frequency combiners is provided. Utility Model Content

[0004] The purpose of this application is to provide a heat dissipation structure for a three-frequency combiner in order to solve the problems mentioned above.

[0005] The technical solution adopted in this application is as follows: a heat dissipation structure for a three-frequency combiner, including a combiner housing and a housing sealing plate. The housing sealing plate is fixedly installed on the top surface of the combiner housing by bolts. The bottom surface of the housing sealing plate is provided with a heat dissipation mechanism for dissipating heat from the combiner housing.

[0006] The heat dissipation mechanism includes a rectangular groove, a heat dissipation rectangular plate, heat sinks, a heat absorption plate, and a cooling plate. The bottom surface of the housing sealing plate has a rectangular groove, and the heat dissipation rectangular plate is arranged inside the rectangular groove. Multiple heat sinks are fixedly installed on the top surface of the housing sealing plate, and the bottom ends of the multiple heat sinks are fixed to the top surface of the heat dissipation rectangular plate. The bottom surface of the heat dissipation rectangular plate is fixedly installed with a heat absorption plate by screws. The bottom surface of the heat dissipation rectangular plate is provided with a cooling plate, which is located between the heat dissipation rectangular plate and the heat absorption plate.

[0007] In a preferred embodiment, a fixing bracket is fixedly installed on the bottom surface of the combiner housing, and a plurality of fixing holes are provided on the top surface of the fixing bracket.

[0008] In a preferred embodiment, a signal input connector is fixedly mounted on the front side of the combiner housing.

[0009] In a preferred embodiment, a rubber base pad is fixedly installed on the bottom surface of the fixed bracket.

[0010] In a preferred embodiment, three signal output connectors are fixedly mounted on the rear side of the combiner housing.

[0011] In a preferred embodiment, the fixing bracket is made of aluminum alloy.

[0012] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0013] 1. In this application, due to the adoption of the above-mentioned scheme, the heat generated by the internal components of the combiner housing during operation is absorbed by the heat absorption plate. At this time, since the cooling end of the cooling chip is closely attached to one side of the heat absorption plate, based on the principle of heat conduction, the heat absorbed by the heat absorption plate will be continuously conducted to the cooling chip along the part where the two are attached. Subsequently, the cooling chip will transfer this conducted heat to the heat dissipation rectangular plate and heat sink in contact with it. The heat sink, with its large heat dissipation surface area and good thermal conductivity, will further conduct the received heat to the outside air, so that the heat can be gradually dissipated from the inside of the combiner housing, achieving the purpose of overall heat dissipation of the combiner housing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this application;

[0015] Figure 2 This is a schematic diagram of the fixed support structure of this application;

[0016] Figure 3 This is a schematic diagram of the heat absorber structure of this application;

[0017] Figure 4 This is a schematic diagram of the cooling chip structure of this application.

[0018] The markings in the diagram are: 1. Combiner housing; 2. Housing sealing plate; 3. Heat dissipation mechanism; 301. Rectangular groove; 302. Heat dissipation rectangular plate; 303. Heat sink; 304. Heat absorption plate; 305. Cooling plate; 4. Fixing bracket; 5. Fixing round hole; 6. Signal input connector; 7. Rubber base pad; 8. Signal output connector. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] refer to Figure 1 , Figure 2 and Figure 3 A heat dissipation structure for a three-frequency combiner includes a combiner housing 1 and a housing sealing plate 2. The housing sealing plate 2 is fixedly installed on the top surface of the combiner housing 1 by bolts. The bottom surface of the housing sealing plate 2 is provided with a heat dissipation mechanism 3 for dissipating heat from the combiner housing 1. The housing sealing plate 2 facilitates sealing of the top of the combiner housing 1, improving the airtightness of the combiner housing 1. The heat dissipation mechanism 3 facilitates the dissipation of heat generated by the components installed inside the combiner housing 1, improving heat dissipation efficiency.

[0021] refer to Figure 1 , Figure 3 and Figure 4 The heat dissipation mechanism 3 includes a rectangular groove 301, a heat dissipation rectangular plate 302, heat sinks 303, a heat absorption plate 304, and a cooling plate 305. The bottom surface of the housing sealing plate 2 is provided with a rectangular groove 301, and the heat dissipation rectangular plate 302 is arranged inside the rectangular groove 301. Multiple heat sinks 303 are fixedly installed through the top surface of the housing sealing plate 2, and the bottom ends of the multiple heat sinks 303 are all fixed to the top surface of the heat dissipation rectangular plate 302. The rectangular groove 301 facilitates the installation of the heat dissipation rectangular plate 302, so that one end of the multiple heat sinks 303 located inside the combiner housing 1 can contact the top surface of the heat dissipation rectangular plate 302, thus facilitating the transfer of heat from the heat dissipation rectangular plate 302 to the heat sinks 303 for heat dissipation.

[0022] refer to Figure 1 , Figure 3 and Figure 4A heat-absorbing plate 304 is fixedly mounted on the bottom surface of the heat dissipation rectangular plate 302 by screws. A cooling plate 305 is mounted on the bottom surface of the heat dissipation rectangular plate 302, located between the heat dissipation rectangular plate 302 and the heat-absorbing plate 304. The heat-absorbing plate 304 can be easily installed and fixed by the screws. The cooling end of the cooling plate 305 is in close contact with one side of the heat-absorbing plate 304, while its heating end is in contact with one side of the heat dissipation rectangular plate 302. This structure allows the cooling plate 305 to efficiently transfer the heat absorbed by the heat-absorbing plate 304 to the heat dissipation rectangular plate 302 and the heat dissipation plate 303, thereby effectively dissipating the heat generated by the internal components of the combiner housing 1 during operation. This ensures that the internal temperature of the combiner is within a suitable range, maintaining its normal and stable working state and preventing adverse conditions such as performance degradation or damage to components due to overheating. The cooling plate 305 is a semiconductor cooling plate, and its model can be TEC1-12706 or various other types, which can be selected according to actual needs.

[0023] refer to Figure 1 , Figure 2 and Figure 3 A fixing bracket 4 is fixedly installed on the bottom surface of the combiner housing 1. The fixing bracket 4 is made of aluminum alloy. Multiple fixing holes 5 are opened on the top surface of the fixing bracket 4, and a rubber base pad 7 is fixedly installed on the bottom surface of the fixing bracket 4. The fixing bracket 4 and multiple fixing holes 5 make it easy for personnel to install and fix the combiner housing 1 with locking bolts, thereby improving stability. Moreover, the fixing bracket 4 made of aluminum alloy can significantly improve the strength, corrosion resistance and lightweight effect of the bracket, thereby enhancing the stability of the overall structure, extending the service life and reducing the overall weight.

[0024] refer to Figure 1 , Figure 2 and Figure 3 A signal input connector 6 is fixedly installed on the front side of the combiner housing 1, and three signal output connectors 8 are fixedly installed on the rear side of the combiner housing 1. The signal input connector 6 on the front side of the combiner housing 1 serves as a key channel for external signals to enter the interior of the combiner housing 1, ensuring that external signals from different sources or frequency bands can be smoothly transmitted. When these signals enter the combiner housing 1, specialized internal components will perform a series of fine processing operations according to preset combining rules and filtering algorithms, such as integrating, optimizing, and adjusting the frequency of different signals. The processed signals will be accurately output through the three carefully arranged signal output connectors 8, thereby achieving an efficient signal processing flow and meeting the needs of multi-signal combining output to adapt to various application scenarios such as signal transmission, distribution, or further processing, ensuring the stable and smooth operation of communication systems and other related facilities.

[0025] The implementation principle of the heat dissipation structure embodiment of the three-frequency combiner in this application is as follows: First, external signals from different sources and different frequency bands will enter the combiner housing 1 through the signal input connector 6 installed on the front side. Then, the corresponding components inside the housing 1 will perform a series of complex and precise processing operations according to predetermined rules and algorithms. After processing, the signal will be output to the outside through the signal output connector 8 installed on the rear side, thereby realizing the orderly transmission and processing of the entire signal and ensuring that it can be successfully applied to subsequent communication, transmission and other related links.

[0026] Meanwhile, when the various components inside the combiner housing 1 are in operation, they inevitably generate a certain amount of heat. When the cooling chip 305 is activated, a corresponding heat dissipation process is initiated. First, the heat generated by the components inside the combiner housing 1 during operation is absorbed by the heat absorption plate 304. This is thanks to the heat absorption plate 304's excellent heat absorption performance and reasonable installation layout, which allows it to promptly capture the heat emitted from the surroundings. Then, because the cooling end of the cooling chip 305 is tightly attached to one side of the heat absorption plate 304... Based on the principle of heat conduction, the heat absorbed by the heat-absorbing plate 304 will be continuously conducted to the cooling plate 305 along the part where the two are in contact. Then, the cooling plate 305 will transfer the conducted heat to the heat dissipation rectangular plate 302 and the heat sink 303 in contact with it. The heat sink 303, with its large heat dissipation surface area and good thermal conductivity, will further conduct the received heat to the outside air, so that the heat can be gradually dissipated from the inside of the combiner housing 1, and finally achieve the purpose of heat dissipation of the combiner housing 1 as a whole.

[0027] The overall structure of the device is relatively simple. It can effectively dissipate the heat generated by the internal components of the combiner housing 1 during operation to the external environment, thereby ensuring that the internal temperature of the combiner housing 1 is always under a relatively suitable temperature environment. This avoids adverse effects on the performance and service life of the components due to excessive temperature, and ensures that the combiner can operate stably and reliably for a long time, meeting many needs in actual application scenarios.

[0028] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation structure for a three-frequency combiner, comprising a combiner housing (1) and a housing sealing plate (2), characterized in that: The top surface of the combiner housing (1) is fixedly installed with a housing sealing plate (2) by bolts, and the bottom surface of the housing sealing plate (2) is provided with a heat dissipation mechanism (3) for dissipating heat from the combiner housing (1). The heat dissipation mechanism (3) includes a rectangular groove (301), a heat dissipation rectangular plate (302), heat sinks (303), a heat absorption plate (304), and a cooling plate (305). The bottom surface of the housing sealing plate (2) is provided with a rectangular groove (301). The rectangular groove (301) is provided with a heat dissipation rectangular plate (302). Multiple heat sinks (303) are fixedly installed on the top surface of the housing sealing plate (2), and the bottom ends of the multiple heat sinks (303) are fixed to the top surface of the heat dissipation rectangular plate (302). The bottom surface of the heat dissipation rectangular plate (302) is fixedly installed with a heat absorption plate (304) by screws. The bottom surface of the heat dissipation rectangular plate (302) is provided with a cooling plate (305), and the cooling plate (305) is located between the heat dissipation rectangular plate (302) and the heat absorption plate (304).

2. The heat dissipation structure of a three-frequency combiner as described in claim 1, characterized in that: A fixing bracket (4) is fixedly installed on the bottom surface of the combiner housing (1), and a plurality of fixing round holes (5) are opened on the top surface of the fixing bracket (4).

3. The heat dissipation structure of a three-frequency combiner as described in claim 1, characterized in that: A signal input connector (6) is fixedly installed on the front side of the combiner housing (1).

4. The heat dissipation structure of a three-frequency combiner as described in claim 2, characterized in that: A rubber pad (7) is fixedly installed on the bottom surface of the fixed bracket (4).

5. The heat dissipation structure of a three-frequency combiner as described in claim 1, characterized in that: Three signal output connectors (8) are fixedly installed on the rear side of the combiner housing (1).

6. The heat dissipation structure of a three-frequency combiner as described in claim 2, characterized in that: The fixed bracket (4) is made of aluminum alloy.

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