Wireless sensor data acquisition gateway equipment
By using paraffin-based phase change materials and heat pipes in the wireless sensor data acquisition gateway device, the problem of insufficient heat dissipation of the device is solved, and efficient multi-heat source collaborative heat dissipation is achieved to protect internal components.
Patent Information
- Application Number
- CN202520669602.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-04-10
AI Technical Summary
Existing wireless sensor data acquisition gateway devices are inadequate in terms of heat dissipation, failing to meet the collaborative heat dissipation requirements of multiple heat sources, which can easily damage internal electronic components.
The internal heat-generating elements are encased in paraffin-based phase change material and combined with heat pipes, thermally conductive copper sheets, heat sinks, cooling fans, thermally conductive silicone pads, heat dissipation fins, and ventilation holes to achieve efficient heat dissipation.
By absorbing instantaneous high heat with paraffin-based phase change materials, heat pipes dissipate heat, thermally conductive copper sheets and heat sinks accelerate heat dissipation, cooling fans enhance heat dissipation efficiency, thermally conductive silicone pads and fins expand the heat absorption area, and ventilation holes improve airflow, rapid heat dissipation is achieved inside the equipment, preventing component damage.
Smart Images
Figure CN223652283U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of Internet of Things (IoT) communication technology, specifically relating to a wireless sensor data acquisition gateway device. Background Technology
[0002] A wireless sensor data acquisition gateway is a smart hardware device used in Internet of Things (IoT) systems to connect and manage multiple sensor devices. Its main functions include data acquisition, transmission, processing, and protocol conversion, ensuring that sensor data can be efficiently and securely transmitted to cloud platforms or other systems. It aggregates and processes information collected by wireless sensor nodes for monitoring and control, and can communicate with a large number of sensors.
[0003] Existing wireless sensor data acquisition gateway devices still have some shortcomings. Most gateway devices use fans or natural ventilation for heat dissipation, which cannot meet the collaborative heat dissipation requirements of multiple heat sources (such as CPU, wireless module, and power module), and are prone to damage to internal electronic components. To address this, we propose a wireless sensor data acquisition gateway device. Utility Model Content
[0004] The purpose of this invention is to provide a wireless sensor data acquisition gateway device to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a wireless sensor data acquisition gateway device, comprising a gateway device body, wherein a paraffin-based phase change material and a heat pipe are disposed on the inner side of the gateway device body, a thermally conductive copper sheet is disposed on the upper inner side of the gateway device body, a heat sink is disposed on the top of the thermally conductive copper sheet, a cover plate is disposed on the top of the gateway device body, a heat dissipation channel is disposed on the surface of the cover plate, and a cooling fan is disposed on the inner side of the heat dissipation channel.
[0006] Preferably, the outer side of the inner heating element of the gateway device body is wrapped with a paraffin-based phase change material, the heat pipe is U-shaped and the bottom is located on the upper surface of the paraffin-based phase change material, and the bottom of the heat-conducting copper sheet is in contact with the top of the heat pipe.
[0007] Preferably, the heat dissipation channel is connected to the inner side of the gateway device body, and a cooling fan is fixedly installed on the inner side of the heat dissipation channel.
[0008] Preferably, heat dissipation holes are provided on both sides of the gateway device body, and thermal conductive silicone pads are installed inside the heat dissipation holes. Multiple sets of heat dissipation fins are installed side by side on the outer side of the thermal conductive silicone pads.
[0009] Preferably, the back of the gateway device body has multiple sets of ventilation holes vertically arranged, and a second dustproof net is installed inside the ventilation holes.
[0010] Preferably, a first dustproof net is fixedly installed inside the heat dissipation channel, and the first dustproof net is located above the cooling fan.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. By wrapping the core heat-generating area inside the gateway device body with paraffin-based phase change material, the instantaneous high heat generated by the internal heat-generating elements can be absorbed. The heat can be conducted from the paraffin-based phase change material layer to the outside of the gateway device body through the heat pipes, thermally conductive copper sheets, heat sinks and cooling fans.
[0013] 2. The thermally conductive silicone pads can actively absorb heat from the inside of the gateway device from both sides. The multiple heat dissipation fins increase the heat absorption area, allowing the heat on the surface of the thermally conductive silicone pads to be dissipated to the outside more quickly. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall exploded structure of this utility model;
[0015] Figure 2 This is a front structural diagram of the present invention;
[0016] Figure 3 This is a schematic diagram of the rear structure of this utility model.
[0017] In the diagram: 1. Gateway device body; 2. Paraffin-based phase change material; 3. Heat pipe; 4. Thermally conductive copper sheet; 5. Heat sink; 6. Cover plate; 7. Heat dissipation channel; 8. First dustproof mesh; 9. Cooling fan; 10. Heat dissipation hole; 11. Thermally conductive silicone pad; 12. Heat dissipation fins; 13. Ventilation hole; 14. Second dustproof mesh. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Please see Figure 1-3This utility model provides a technical solution: a wireless sensor data acquisition gateway device, including a gateway device body 1, a paraffin-based phase change material 2 and a heat pipe 3 on the inner side of the gateway device body 1, a thermally conductive copper sheet 4 on the upper inner side of the gateway device body 1, a heat sink 5 on the top of the thermally conductive copper sheet 4, a cover plate 6 on the top of the gateway device body 1, a heat dissipation channel 7 on the surface of the cover plate 6, and a cooling fan 9 on the inner side of the heat dissipation channel 7.
[0020] Specifically, the inner heating element of the gateway device body 1 is wrapped with a paraffin-based phase change material 2. The heat pipe 3 is U-shaped and its bottom is located on the upper surface of the paraffin-based phase change material 2. The bottom of the thermally conductive copper sheet 4 is in contact with the top of the heat pipe 3. The heat dissipation channel 7 is connected to the inner side of the gateway device body 1. A cooling fan 9 is fixedly installed inside the heat dissipation channel 7. Heat dissipation holes 10 are opened through both sides of the gateway device body 1. Thermally conductive silicone pads 11 are installed inside the heat dissipation holes 10. Multiple sets of heat dissipation fins 12 are installed side by side on the outer side of the thermally conductive silicone pads 11. Multiple sets of ventilation holes 13 are vertically opened on the back of the gateway device body 1. A second dustproof net 14 is installed inside the ventilation holes 13. A first dustproof net 8 is fixedly installed inside the heat dissipation channel 7. The first dustproof net 8 is located above the cooling fan 9.
[0021] In this embodiment, a paraffin-based phase change material 2 is wrapped around the core heating area inside the gateway device body 1, which can absorb the instantaneous high heat generated by the internal heating element. The heat can be conducted from the paraffin-based phase change material 2 layer to the upper inner side of the gateway device body 1 through the heat pipe 3, and then absorbed by the heat-conducting copper sheet 4 and the heat sink 5. The heat absorbed by the surface of the heat sink 5 can be discharged to the outside through the heat dissipation channel 7 by the rotating cooling fan 9, so as to achieve the effect of rapid heat dissipation inside the device.
[0022] The thermally conductive silicone pad 11 can actively absorb heat from both sides inside the gateway device body 1. The multiple heat dissipation fins 12 increase the heat absorption area, allowing the heat on the surface of the thermally conductive silicone pad 11 to be discharged to the outside more quickly. The ventilation holes 13 increase the efficiency of airflow inside the gateway device body 1. The first dustproof net 8 and the second dustproof net 14 prevent external dust from entering the interior of the gateway device body 1 through the ventilation holes 13 and the heat dissipation channel 7.
[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A wireless sensor data acquisition gateway device, comprising a gateway device body (1), characterized in that: The inner side of the gateway device body (1) is provided with a paraffin-based phase change material (2) and a heat pipe (3). A thermally conductive copper sheet (4) is provided on the upper inner side of the gateway device body (1). A heat sink (5) is provided on the top of the thermally conductive copper sheet (4). A cover plate (6) is provided on the top of the gateway device body (1). A heat dissipation channel (7) is provided on the surface of the cover plate (6). A cooling fan (9) is provided on the inner side of the heat dissipation channel (7).
2. The wireless sensor data acquisition gateway device according to claim 1, characterized in that: The inner heating element of the gateway device body (1) is wrapped with a paraffin-based phase change material (2). The heat pipe (3) is U-shaped and its bottom is located on the upper surface of the paraffin-based phase change material (2). The bottom of the heat-conducting copper sheet (4) is in contact with the top of the heat pipe (3).
3. The wireless sensor data acquisition gateway device according to claim 1, characterized in that: The heat dissipation channel (7) is connected to the inside of the gateway device body (1), and a cooling fan (9) is fixedly installed on the inside of the heat dissipation channel (7).
4. The wireless sensor data acquisition gateway device according to claim 1, characterized in that: The gateway device body (1) has heat dissipation holes (10) through both sides of its surface. A thermally conductive silicone pad (11) is installed inside the heat dissipation hole (10), and multiple sets of heat dissipation fins (12) are installed side by side on the outside of the thermally conductive silicone pad (11).
5. The wireless sensor data acquisition gateway device according to claim 1, characterized in that: The back of the gateway device body (1) has multiple sets of ventilation holes (13) vertically opened, and a second dustproof net (14) is installed inside the ventilation holes (13).
6. The wireless sensor data acquisition gateway device according to claim 1, characterized in that: A first dustproof net (8) is fixedly installed inside the heat dissipation channel (7), and the first dustproof net (8) is located above the cooling fan (9).